Patents-244


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High Planarizing Method For Use In A Gate Last Process - Patent 8153526
From: Patents-244 | Date: 4/16/2012  | Views: 22

BACKGROUND The present disclosure relates generally to the manufacturing of semiconductor devices, and more particularly to a chemical-mechanical... ...  more>>

22 views language: English
Method And System For Continuous Large-area Scanning Implantation Process - Patent 8153513
From: Patents-244 | Date: 4/16/2012  | Views: 18

Embodiments in accordance with the present invention relate generally to techniques including methods and a structure for forming substrates,... ...  more>>

18 views language: English
Thinning Tungsten Layer After Through Silicon Via Filling - Patent 8153520
From: Patents-244 | Date: 4/16/2012  | Views: 26

BACKGROUND Tungsten deposition using chemical vapor deposition (CVD) techniques is an integral part of many semiconductor fabrication processes. ... ...  more>>

26 views language: English
24 views language: English
Bilayer Dielectric Interconnection Process - Patent 8153532
From: Patents-244 | Date: 4/16/2012  | Views: 21

BACKGROUND This invention describes a method for exposing contacts on separate HFETS, HBTs, HEMTs prior to the final metallization step of an... ...  more>>

21 views language: English
Surface Characteristics Of Graphite And Graphite Foils - Patent 8153528
From: Patents-244 | Date: 4/16/2012  | Views: 19

1. Field of the Invention The invention relates generally to preparation of non-silicon substrates for use in a photovoltaic device. 2. Description  ...  more>>

19 views language: English
Method Of Ball Grid Array Package Construction With Raised Solder Ball Pads - Patent 8153516
From: Patents-244 | Date: 4/16/2012  | Views: 22

1. Field of the Invention This invention relates generally to the field of integrated circuit packaging. 2. Description of the Related Art In the... ...  more>>

22 views language: English
Wafer-level Stack Package - Patent 8153521
From: Patents-244 | Date: 4/16/2012  | Views: 55

BACKGROUND 1. Field of the Invention Example embodiments relate to a wafer-level stack package and a method of manufacturing a wafer-level stack... ...  more>>

55 views language: English
20 views language: English
Method For Fabricating Semiconductor Device Using Spacer Patterning - Patent 8153519
From: Patents-244 | Date: 4/16/2012  | Views: 5

CROSS-REFERENCE TO RELATEDAPPLICATIONS The present application claims priority of Korean Patent Application No. 10-2010-0120617, filed on Nov. 30,... ...  more>>

5 views language:
9 views language: English
Method For Manufacturing Semiconductor Device - Patent 8153511
From: Patents-244 | Date: 4/16/2012  | Views: 4

1. Field of the Invention The present invention relates to a method for manufacturing a groove of a substrate and a method for cutting off a... ...  more>>

4 views language:
Methods Of Fabricating Strain Balanced Nitride Heterojunction Transistors - Patent 8153515
From: Patents-244 | Date: 4/16/2012  | Views: 6

The present invention relates to high frequency transistors and in particular relates to a high electron mobility transistor (HEMT) that incorporates  ...  more>>

6 views language: English