Patent Inventor: Thomas N. Marieb

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Copper alloys for interconnections having improved electromigration characteristics and methods of making same
Inventor: Marieb, et al. | Patent Number: 7220674

Copper alloys for interconnections having improved electromigration characteristics and methods of making same
Inventor: Marieb, et al. | Patent Number: 6977220

Copper alloys for interconnections having improved electromigration characteristics and methods of making same
Inventor: Marieb, et al. | Patent Number: 6800554

Interconnection alloy for integrated circuits
Inventor: Gardner, et al. | Patent Number: 6777810

Silicon wafer testing rig and a method for testing a silicon wafer wherein the silicon wafer is bent into a dome shape
Inventor: Marieb, et al. | Patent Number: 6100709

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