Patent Inventor: Ronald Patrick Huemoeller
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Wafer level package fabrication method
Inventor: Huemoeller, et al. | Patent Number: 8119455
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Semiconductor package including top-surface terminals for mounting another semiconductor package
Inventor: Hiner, et al. | Patent Number: 8110909
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Semiconductor package including top-surface terminals for mounting another semiconductor package
Inventor: Hiner, et al. | Patent Number: 8026587
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Semiconductor package including a top-surface metal layer for implementing circuit features
Inventor: Scanlan, et al. | Patent Number: 8018068
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Thin substrate fabrication method and structure
Inventor: Huemoeller, et al. | Patent Number: 8017436
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Bumped chip package fabrication method and structure
Inventor: Huemoeller, et al. | Patent Number: 7994045
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Embedded passive component network substrate fabrication method
Inventor: Karim, et al. | Patent Number: 7958626
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Embedded die metal etch stop fabrication method and structure
Inventor: Huemoeller, et al. | Patent Number: 7951697
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Electronic component package comprising fan-out traces
Inventor: Huemoeller, et al. | Patent Number: 7932595
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Flip chip bump structure and fabrication method
Inventor: Huemoeller, et al. | Patent Number: 7932170
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Metal etch stop fabrication method and structure
Inventor: Huemoeller, et al. | Patent Number: 7923645
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Method and structure for creating embedded metal features
Inventor: Huemoeller, et al. | Patent Number: 7911037
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Ultra thin package and fabrication method
Inventor: Rusli, et al. | Patent Number: 7842541
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Shielded trace structure and fabrication method
Inventor: Huemoeller, et al. | Patent Number: 7832097
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Method of fabricating an embedded circuit pattern
Inventor: Rusli, et al. | Patent Number: 7752752
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Direct-write wafer level chip scale package
Inventor: Berry, et al. | Patent Number: 7723210
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Electronic component package comprising fan-out and fan-in traces
Inventor: Huemoeller, et al. | Patent Number: 7714431
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Two-sided fan-out wafer escape package
Inventor: Huemoeller, et al. | Patent Number: 7692286
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Semiconductor package including top-surface terminals for mounting another semiconductor package
Inventor: Hiner, et al. | Patent Number: 7671457
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Substrate having stiffener fabrication method
Inventor: Huemoeller, et al. | Patent Number: 7670962
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Semiconductor package including a top-surface metal layer for implementing circuit features
Inventor: Scanlan, et al. | Patent Number: 7633765
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Wafer level package utilizing laser-activated dielectric material
Inventor: Rusli, et al. | Patent Number: 7632753
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Embedded metal features structure
Inventor: Huemoeller, et al. | Patent Number: 7589398
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Embedded electronic component package
Inventor: Huemoeller, et al. | Patent Number: 7572681
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Buildup dielectric and metallization process and semiconductor package
Inventor: Huemoeller, et al. | Patent Number: 7548430
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Semiconductor package substrate fabrication method
Inventor: Huemoeller, et al. | Patent Number: 7501338
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Two-sided wafer escape package
Inventor: Huemoeller, et al. | Patent Number: 7420272
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Method for making an integrated circuit substrate having embedded back-side access conductors and vias
Inventor: Hiner, et al. | Patent Number: 7399661
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Semiconductor package and substrate having multi-level vias fabrication method
Inventor: Huemoeller, et al. | Patent Number: 7365006
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Stacked embedded leadframe
Inventor: Huemoeller, et al. | Patent Number: 7361533
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Method for making an integrated circuit substrate having embedded passive components
Inventor: Huemoeller, et al. | Patent Number: 7334326
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Method for making an integrated circuit substrate having laser-embedded conductive patterns
Inventor: Huemoeller, et al. | Patent Number: 7312103
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Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
Inventor: Huemoeller, et al. | Patent Number: 7297562
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Two-sided wafer escape package
Inventor: Huemoeller, et al. | Patent Number: 7247523
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Wafer level package and fabrication method
Inventor: Huemoeller, et al. | Patent Number: 7192807
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Embedded leadframe semiconductor package
Inventor: Sheridan, et al. | Patent Number: 7190062
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Method of manufacturing a semiconductor package
Inventor: Hiner, et al. | Patent Number: 7185426
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Semiconductor package and substrate having multi-level vias
Inventor: Huemoeller, et al. | Patent Number: 7145238
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Integrated circuit substrate having laser-exposed terminals
Inventor: Hiner, et al. | Patent Number: 7028400
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Integrated circuit substrate having embedded passive components and methods therefor
Inventor: Huemoeller, et al. | Patent Number: 6987661
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Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate
Inventor: Huemoeller, et al. | Patent Number: 6967124
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Integrated circuit substrate having laminated laser-embedded circuit layers
Inventor: Hiner, et al. | Patent Number: 6930257
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Integrated circuit substrate having laser-embedded conductive patterns and method therefor
Inventor: Huemoeller, et al. | Patent Number: 6930256
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Wafer level package and fabrication method
Inventor: Huemoeller, et al. | Patent Number: 6905914
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Integrated circuit substrate having embedded wire conductors and method therefor
Inventor: Huemoeller, et al. | Patent Number: 6831371
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Solderable injection-molded integrated circuit substrate and method therefor
Inventor: Huemoeller, et al. | Patent Number: 6784376
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Integrated circuit having multiple power/ground connections to a single external terminal
Inventor: Huemoeller, et al. | Patent Number: 6747352
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Semiconductor package having substrate with laser-formed aperture through solder mask layer
Inventor: Huemoeller, et al. | Patent Number: 6534391