Patent Inventor: Robert E. Simons

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Dehumidifying and re-humidifying apparatus and method for an electronics rack
Inventor: Campbell, et al. | Patent Number: 8144467

Apparatus and method for providing in situ cooling of computer data centers during service calls
Inventor: Campbell, et al. | Patent Number: 8141621

Compliant conduction rail assembly and method facilitating cooling of an electronics structure
Inventor: Campbell, et al. | Patent Number: 8094453

Cooling apparatus with thermally conductive porous material and jet impingement nozzle(s) extending therein
Inventor: Campbell, et al. | Patent Number: 8081461

Condenser block structures with cavities facilitating vapor condensation cooling of coolant
Inventor: Campbell, et al. | Patent Number: 8059405

Redundant assembly for a liquid and air cooled module
Inventor: Campbell, et al. | Patent Number: 8051897

Liquid-cooled electronics apparatus and methods of fabrication
Inventor: Campbell, et al. | Patent Number: 8027162

Method of fabricating a heat exchanger with angled secondary fins extending from primary fins
Inventor: Campbell, et al. | Patent Number: 8020298

Condenser structures with fin cavities facilitating vapor condensation cooling of coolant
Inventor: Campbell, et al. | Patent Number: 8018720

Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
Inventor: Campbell, et al. | Patent Number: 8014150

Apparatus and method for facilitating cooling of an electronics rack
Inventor: Campbell, et al. | Patent Number: 7990709

Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem
Inventor: Campbell, et al. | Patent Number: 7983040

Cooling apparatus with cold plate formed in situ on a surface to be cooled
Inventor: Campbell, et al. | Patent Number: 7978473

Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof
Inventor: Campbell, et al. | Patent Number: 7978472

Thermally conductive composite interface, cooled electronic assemblies employing the same, and methods of fabrication thereof
Inventor: Campbell, et al. | Patent Number: 7967062

High performance dual-in-line memory (DIMM) array liquid cooling assembly and method
Inventor: Campbell, et al. | Patent Number: 7965509

Hybrid air and liquid coolant conditioning unit for facilitating cooling of one or more electronics racks of a data center
Inventor: Campbell, et al. | Patent Number: 7963119

Apparatus and method for facilitating immersion-cooling of an electronic subsystem
Inventor: Campbell, et al. | Patent Number: 7961475

Multi-fluid cooling of an electronic device
Inventor: Campbell, et al. | Patent Number: 7948757

Liquid cooling apparatus and method for cooling blades of an electronic system chassis
Inventor: Campbell, et al. | Patent Number: 7944694

Method of fabricating a thermal spreader having thermal conduits
Inventor: Chu, et al. | Patent Number: 7918025

Open flow cold plate for liquid cooled electronic packages
Inventor: Campbell, et al. | Patent Number: 7916483

Method of fabricating a thermal spreader having thermal conduits
Inventor: Chu, et al. | Patent Number: 7913387

System and method for standby mode cooling of a liquid-cooled electronics rack
Inventor: Campbell, et al. | Patent Number: 7907406

Dehumidifying and re-humidifying air cooling for an electronics rack
Inventor: Campbell, et al. | Patent Number: 7905096

Direct jet impingement-assisted thermosyphon cooling apparatus and method
Inventor: Campbell, et al. | Patent Number: 7885074

Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow
Inventor: Campbell, et al. | Patent Number: 7885070

Monitoring method and system for determining airflow rate through and heat removal rate of an air-conditioning unit
Inventor: Campbell, et al. | Patent Number: 7878007

Dual-chamber fluid pump for a multi-fluid electronics cooling system and method
Inventor: Campbell, et al. | Patent Number: 7841385

Cooling apparatuses with discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
Inventor: Campbell, et al. | Patent Number: 7830664

Apparatus for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
Inventor: Chu, et al. | Patent Number: 7830657

Cooling system and method utilizing thermal capacitor unit(s) for enhanced thermal energy transfer efficiency
Inventor: Campbell, et al. | Patent Number: 7788941

Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof
Inventor: Campbell, et al. | Patent Number: 7787248

Cooling apparatus, cooled electronic module and methods of fabrication employing a manifold structure with interleaved coolant inlet and outlet passageways
Inventor: Campbell, et al. | Patent Number: 7762314

Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled
Inventor: Campbell, et al. | Patent Number: 7731079

Hybrid immersion cooled server with integral spot and bath cooling
Inventor: Campbell, et al. | Patent Number: 7724524

Monitoring method and system for determining rack airflow rate and rack power consumption
Inventor: Campbell, et al. | Patent Number: 7707880

Multi-fluid cooling system and method with freeze protection for cooling an electronic device
Inventor: Campbell, et al. | Patent Number: 7665325

System of facilitating cooling of electronics racks of a data center employing multiple cooling stations
Inventor: Campbell, et al. | Patent Number: 7660121

Temperature-based monitoring method and system for determining first and second fluid flow rates through a heat exchanger
Inventor: Campbell, et al. | Patent Number: 7657347

Auto-locating system and method for data center mapping and monitoring
Inventor: Campbell, et al. | Patent Number: 7642914

Method of assembling a cooling system for a multi-component electronics system
Inventor: Campbell, et al. | Patent Number: 7641101

Liquid cooling apparatus and method for facilitating cooling of an electronics system
Inventor: Campbell, et al. | Patent Number: 7639499

Conductive heat transport cooling system and method for a multi-component electronics system
Inventor: Campbell, et al. | Patent Number: 7639498

Method and air-cooling unit with dynamic airflow and heat removal adjustability
Inventor: Campbell, et al. | Patent Number: 7630795

Coolant control unit and cooled electronics system employing the same
Inventor: Campbell, et al. | Patent Number: 7609519

Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing
Inventor: Campbell, et al. | Patent Number: 7593227

Liquid-based cooling system for cooling a multi-component electronics system
Inventor: Campbell, et al. | Patent Number: 7518871

Methods for fabricating a cooled electronic module employing a thermally conductive return manifold structure sealed to the periphery of a surface to be cooled
Inventor: Campbell, et al. | Patent Number: 7511957

Cooled electronics system employing air-to-liquid heat exchange and bifurcated air flow
Inventor: Campbell, et al. | Patent Number: 7492593

Cooling apparatus with discrete cold plates disposed between a module enclosure and electronics components to be cooled
Inventor: Campbell, et al. | Patent Number: 7486514

Apparatus for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region
Inventor: Campbell, et al. | Patent Number: 7486512

Method of facilitating cooling of electronics racks of a data center employing multiple cooling stations
Inventor: Campbell, et al. | Patent Number: 7477514

Method of fabrication for a thermal spreader using thermal conduits
Inventor: Chu, et al. | Patent Number: 7459112

Liquid-based cooling apparatus for an electronics rack
Inventor: Campbell, et al. | Patent Number: 7450385

Liquid-based cooling system for cooling a multi-component electronics system
Inventor: Campbell, et al. | Patent Number: 7420808

Conductive heat transport cooling system and method for a multi-component electronics system
Inventor: Campbell, et al. | Patent Number: 7408776

Hybrid cooling system for a multi-component electronics system
Inventor: Campbell, et al. | Patent Number: 7405936

Hybrid cooling system and method for a multi-component electronics system
Inventor: Campbell, et al. | Patent Number: 7400505

Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
Inventor: Campbell, et al. | Patent Number: 7400504

Cooled electronics system and method employing air-to-liquid heat exchange and bifurcated air flow
Inventor: Campbell, et al. | Patent Number: 7397661

Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
Inventor: Campbell, et al. | Patent Number: 7385817

Apparatus and method for facilitating cooling of an electronics rack employing a heat exchange assembly mounted to an outlet door cover of the electronics rack
Inventor: Chu, et al. | Patent Number: 7385810

Isolation valve and coolant connect/disconnect assemblies and methods of fabrication for interfacing a liquid cooled electronics subsystem and an electronics housing
Inventor: Campbell, et al. | Patent Number: 7380409

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus
Inventor: Campbell, et al. | Patent Number: 7375962

Jet orifice plate with projecting jet orifice structures for direct impingement cooling apparatus
Inventor: Campbell, et al. | Patent Number: 7362574

Transpiration cooled heat sink and a self contained coolant supply for same
Inventor: Chu, et al. | Patent Number: 7353861

Coolant control unit, and cooled electronics system and method employing the same
Inventor: Campbell, et al. | Patent Number: 7349213

Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region
Inventor: Campbell, et al. | Patent Number: 7349209

Cooling apparatus, cooled electronic module, and methods of fabrication thereof employing thermally conductive, wire-bonded pin fins
Inventor: Campbell, et al. | Patent Number: 7301770

Cooling apparatuses and methods employing discrete cold plates compliantly coupled between a common manifold and electronics components of an assembly to be cooled
Inventor: Campbell, et al. | Patent Number: 7298618

Cooling apparatus and method employing discrete cold plates disposed between a module enclosure and electronics components to be cooled
Inventor: Campbell, et al. | Patent Number: 7298617

Apparatus and method for facilitating cooling of an electronics rack employing a closed loop heat exchange system
Inventor: Campbell, et al. | Patent Number: 7286351

Apparatus and method for facilitating cooling of an electronics rack by mixing cooler air flow with re-circulating air flow in a re-circulation region
Inventor: Campbell, et al. | Patent Number: 7283358

Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated coolant inlet and outlet manifold
Inventor: Campbell, et al. | Patent Number: 7277283

Cooling apparatus for an electronics subsystem employing a coolant flow drive apparatus between coolant flow paths
Inventor: Campbell, et al. | Patent Number: 7274566

Multi-element heat exchange assemblies and methods of fabrication for a cooling system
Inventor: Campbell, et al. | Patent Number: 7272005

Method, system and program product for automatically checking coolant loops of a cooling system for a computing environment
Inventor: Chu, et al. | Patent Number: 7270174

Cooling apparatus, cooled electronic module and methods of fabrication thereof employing an integrated manifold and a plurality of thermally conductive fins
Inventor: Campbell, et al. | Patent Number: 7233494

Electronic device cooling assembly and method employing elastic support material holding a plurality of thermally conductive pins
Inventor: Campbell, et al. | Patent Number: 7206203

Cooling apparatus and method for an electronics module employing an integrated heat exchange assembly
Inventor: Campbell, et al. | Patent Number: 7184269

Cooling system and method employing multiple dedicated coolant conditioning units for cooling multiple electronics subsystems
Inventor: Chu, et al. | Patent Number: 7106590

Condensate removal system and method for facilitating cooling of an electronics system
Inventor: Chu, et al. | Patent Number: 7104081

Cooling system and method employing at least two modular cooling units for ensuring cooling of multiple electronics subsystems
Inventor: Chu, et al. | Patent Number: 7088585

Cooling system and method employing auxiliary thermal capacitor unit for facilitating continuous operation of an electronics rack
Inventor: Campbell, et al. | Patent Number: 7086247

Integrated cooling unit
Inventor: Chu, et al. | Patent Number: 7059389

Thermal dissipation assembly and fabrication method for electronics drawer of a multiple-drawer electronics rack
Inventor: Chu, et al. | Patent Number: 7012807

Method, system and program product for monitoring rate of volume change of coolant within a cooling system
Inventor: Chu, et al. | Patent Number: 7000467

Cooling system and method employing a closed loop coolant path and micro-scaled cooling structure within an electronics subsystem of an electronics rack
Inventor: Campbell, et al. | Patent Number: 6973801

Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover
Inventor: Chu, et al. | Patent Number: 6967841

Electronic device substrate assembly with multilayer impermeable barrier and method of making
Inventor: Chu, et al. | Patent Number: 6940712

Method for combined air and liquid cooling of stacked electronics components
Inventor: Chu, et al. | Patent Number: 6924981

Thermal spreader using thermal conduits
Inventor: Chu, et al. | Patent Number: 6821625

Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader
Inventor: Chu, et al. | Patent Number: 6820684

Method and system for cooling electronics racks using pre-cooled air
Inventor: Chu, et al. | Patent Number: 6819563

Thermal dissipation assembly employing thermoelectric module with multiple arrays of thermoelectric elements of different densities
Inventor: Chu, et al. | Patent Number: 6804966

Method and apparatus for combined air and liquid cooling of stacked electronics components
Inventor: Chu, et al. | Patent Number: 6775137

Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication
Inventor: Chu, et al. | Patent Number: 6767766

Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use
Inventor: Chu, et al. | Patent Number: 6714412

Two stage cooling system employing thermoelectric modules
Inventor: Chu, et al. | Patent Number: 6705089

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