Patent Inventor: Ludwig Heitzer
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Plastic housing and semiconductor component with said plastic housing
Inventor: Bauer, et al. | Patent Number: 7919857
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Method for manufacturing an electronic component and corresponding electronic component
Inventor: Bauer, et al. | Patent Number: 7834460
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Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
Inventor: Bauer, et al. | Patent Number: 7749864
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Electronic circuit in a package-in-package configuration and production method
Inventor: Bauer, et al. | Patent Number: 7714416
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Module with a shielding and/or heat dissipating element
Inventor: Heitzer, et al. | Patent Number: 7683460
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Electronic circuit in a package-on-package configuration and method for producing the same
Inventor: Bauer, et al. | Patent Number: 7662664
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Method for applying a structure of joining material to the back surfaces of semiconductor chips
Inventor: Bauer, et al. | Patent Number: 7592236
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Method for coating a structure comprising semiconductor chips
Inventor: Bauer, et al. | Patent Number: 7547645
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Semiconductor device with semiconductor chip and adhesive film and method for producing the same
Inventor: Bauer, et al. | Patent Number: 7470601
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Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip
Inventor: Bauer, et al. | Patent Number: 7294916