Patent Inventor: Konstantinos I. Papathomas
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Encapsulant of epoxy or cyanate ester resin, reactive flexibilizer and thermoplastic
Inventor: Papathomas | Patent Number: 7560501
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Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
Inventor: Curcio, et al. | Patent Number: 7402254
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Electronic package with epoxy or cyanate ester resin encapsulant
Inventor: Papathomas | Patent Number: 7384682
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Encapsulant composition and electronic package utilizing same
Inventor: Papathomas | Patent Number: 7321005
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Encapsulant composition and electronic package utilizing same
Inventor: Papathomas | Patent Number: 7192997
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Solid via layer to layer interconnect
Inventor: Curcio, et al. | Patent Number: 7076869
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Cap attach surface modification for improved adhesion
Inventor: Buchwalter, et al. | Patent Number: 7064013
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Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same
Inventor: Farquhar, et al. | Patent Number: 7014731
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Formation of multisegmented plated through holes
Inventor: Farquhar, et al. | Patent Number: 6996903
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Method of making and interconnect structure
Inventor: Boyko, et al. | Patent Number: 6931726
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Tamper-responding encapsulated enclosure having flexible protective mesh structure
Inventor: Farquhar, et al. | Patent Number: 6929900
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Laminate circuit structure and method of fabricating
Inventor: Japp, et al. | Patent Number: 6820332
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Cap attach surface modification for improved adhesion
Inventor: Buchwalter, et al. | Patent Number: 6803256
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Flowable compositions and use in filling vias and plated through-holes
Inventor: Johansson, et al. | Patent Number: 6794040
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Lead protective coating composition, process and structure thereof
Inventor: Papathomas, et al. | Patent Number: 6790473
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Die attachment with reduced adhesive bleed-out
Inventor: Appelt, et al. | Patent Number: 6734569
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Resin composition with a polymerizing agent and method of manufacturing prepreg and other laminate structures therefrom
Inventor: Japp, et al. | Patent Number: 6734259
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Formation of multisegmented plated through holes
Inventor: Farquhar, et al. | Patent Number: 6700078
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Tamper-responding encapsulated enclosure having flexible protective mesh structure
Inventor: Farquhar, et al. | Patent Number: 6686539
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Interconnect structure and method of making same
Inventor: Boyko, et al. | Patent Number: 6660945
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Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
Inventor: Curcio, et al. | Patent Number: 6645607
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Method and article for filling apertures in a high performance electronic substrate
Inventor: Farquhar, et al. | Patent Number: 6599833
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Printed wiring board structure with z-axis interconnections
Inventor: Jones, et al. | Patent Number: 6593534
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Hole fill composition and method for filling holes in a substrate
Inventor: Farquhar, et al. | Patent Number: 6589639
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Method for filling high aspect ratio via holes in electronic substrates
Inventor: Curcio, et al. | Patent Number: 6581280
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Structure for high speed printed wiring boards with multiple differential impedance-controlled layer
Inventor: Miller, et al. | Patent Number: 6570102
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Process for filling apertures in a circuit board or chip carrier
Inventor: Appelt, et al. | Patent Number: 6534245
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Halogen free triazines, bismaleimide/epoxy polymers, prepregs made therefrom for circuit boards and resin coated articles, and use
Inventor: Japp, et al. | Patent Number: 6534179
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Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same
Inventor: Farquhar, et al. | Patent Number: 6534160
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Method of controlling the spread of an adhesive on a circuitized organic substrate
Inventor: Konrad, et al. | Patent Number: 6524654
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Solid via layer to layer interconnect
Inventor: Curcio, et al. | Patent Number: 6504111
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Flip chip package with improved cap design and process for making thereof
Inventor: Farquhar, et al. | Patent Number: 6501171
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Multilayer capacitance structure and circuit board containing the same and method of forming the same
Inventor: Japp, et al. | Patent Number: 6496356
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Composite laminate circuit structure and methods of interconnecting the same
Inventor: Lauffer, et al. | Patent Number: 6479093
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Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
Inventor: Curcio, et al. | Patent Number: 6465084
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Laminate circuit structure and method of fabricating
Inventor: Japp, et al. | Patent Number: 6459047
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Process for reducing extraneous metal plating
Inventor: Konrad, et al. | Patent Number: 6455139
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Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
Inventor: Curcio, et al. | Patent Number: 6452117
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Plate for liquid crystal display, method and polymeric compositions
Inventor: Day, et al. | Patent Number: 6444407
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Treatment solution for reducing adhesive resin bleed
Inventor: Konrad, et al. | Patent Number: 6432182
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Method and article for filling apertures in a high performance electronic substrate
Inventor: Farquhar, et al. | Patent Number: 6429527
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Flowable compositions and use in filling vias and plated through-holes
Inventor: Johansson, et al. | Patent Number: 6427325
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Formation of multisegmented plated through holes
Inventor: Farquhar, et al. | Patent Number: 6426470
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Method for preventing adhesive bleed onto surfaces
Inventor: Appelt, et al. | Patent Number: 6420253
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Composite laminate circuit structure and methods of interconnecting the same
Inventor: Lauffer, et al. | Patent Number: 6388204
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Cap attach surface modification for improved adhesion
Inventor: Buchwalter, et al. | Patent Number: 6369452
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Multilayer capacitance structure and circuit board containing the same
Inventor: Japp, et al. | Patent Number: 6343001
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High optical contrast resin composition and electronic package utilizing same
Inventor: Johansson, et al. | Patent Number: 6337375
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Process for reducing extraneous metal plating
Inventor: Konrad, et al. | Patent Number: 6296897
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Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the same
Inventor: Farquhar, et al. | Patent Number: 6254972
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Structure for preventing adhesive bleed onto surfaces
Inventor: Appelt, et al. | Patent Number: 6252307
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Process for filling apertures in a circuit board or chip carrier
Inventor: Appelt, et al. | Patent Number: 6225031
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High optical contrast resin composition and electronic package utilizing same
Inventor: Johansson, et al. | Patent Number: 6190759
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Substrate having high optical contrast and method of making same
Inventor: Farquhar, et al. | Patent Number: 6187417
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Encapsulating a solder joint with a photo cured epoxy resin or cyanate
Inventor: Papathomas, et al. | Patent Number: 6129955
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Method of controlling the spread of an adhesive on a circuitized organic substrate
Inventor: Konrad, et al. | Patent Number: 6099959
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Flowable compositions and use in filling vias and plated through-holes
Inventor: Johansson, et al. | Patent Number: 6090474
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Film composition and method for a planar surface atop a plated through hole
Inventor: Fletcher, et al. | Patent Number: 6037096
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Organic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion rates
Inventor: Appelt, et al. | Patent Number: 5900675
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Solder interconnection
Inventor: Papathomas | Patent Number: 5623006
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Method of preparing a printed circuit board
Inventor: Bhatt, et al. | Patent Number: 5557844
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Method of sealing a soldered joint between a semiconductor device and a substrate
Inventor: Papathomas | Patent Number: 5536765
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Method for making printed circuit boards with selectivity filled plated through holes
Inventor: Bhatt, et al. | Patent Number: 5487218
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Triazine polymer and use thereof
Inventor: Papathomas | Patent Number: 5468790
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Trifunctional cyanate esters, polymers thereof; use and preparation thereof
Inventor: Papathomas | Patent Number: 5422184
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Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
Inventor: Cibulsky, et al. | Patent Number: 5378306
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Triazine thin film adhesives
Inventor: Papathomas, et al. | Patent Number: 5319244
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Dicyanate prepolymers, use and preparation thereof
Inventor: Papathomas | Patent Number: 5312887
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Trifunctional cyanate esters, polymers thereof; use and preparation thereof
Inventor: Papathomas | Patent Number: 5292861
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Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof
Inventor: Cibulsky, et al. | Patent Number: 5288542
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Triazine networks with homogeneous and oriented structures and method for making same
Inventor: Barclay, et al. | Patent Number: 5136011