Patent Inventor: Joseph Fjelstad
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Method of electrically connecting a microelectronic component
Inventor: Fjelstad | Patent Number: 8148205
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Method of electrically connecting a microelectronic component
Inventor: Fjelstad | Patent Number: 8148199
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Method of electrically connecting a microelectronic component
Inventor: Fjelstad | Patent Number: 8114711
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Microelectronic assemblies having compliant layers
Inventor: Fjelstad, et al. | Patent Number: 7872344
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Method of electrically connecting a microelectronic component
Inventor: Fjelstad | Patent Number: 7531894
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Method of electrically connecting a microelectronic component
Inventor: Fjelstad | Patent Number: 7528008
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Microelectronic assemblies having compliant layers
Inventor: Fjelstad, et al. | Patent Number: 7408260
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Methods of making microelectronic packages with conductive elastomeric posts
Inventor: Fjelstad | Patent Number: 7276400
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Structures and methods for wire bonding over active, brittle and low K dielectric areas of an IC chip
Inventor: Fjelstad | Patent Number: 7176580
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Methods for manufacturing resistors using a sacrificial layer
Inventor: Fjelstad | Patent Number: 7165316
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Method of electrically connecting a microelectronic component
Inventor: Fjelstad | Patent Number: 7138299
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Microelectronic assemblies having compliant layers
Inventor: Fjelstad, et al. | Patent Number: 7112879
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Semiconductor package having light sensitive chips
Inventor: Fjelstad | Patent Number: 7095054
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Methods for manufacturing resistors using a sacrificial layer
Inventor: Fjelstad | Patent Number: 7091820
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Connection component with peelable leads
Inventor: DiStefano, et al. | Patent Number: 7067742
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Resistor process
Inventor: Fjelstad | Patent Number: 7049929
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Method for making a microelectronic interposer
Inventor: DiStefano, et al. | Patent Number: 6978538
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Compliant package with conductive elastomeric posts
Inventor: Fjelstad | Patent Number: 6972495
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Method of making an electronic contact
Inventor: Fjelstad, et al. | Patent Number: 6938338
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Method of bonding a semiconductor die without an ESD circuit and a separate ESD circuit to an external lead, and a semiconductor device made thereby
Inventor: Segaram, et al. | Patent Number: 6933610
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Microelectronic elements with deformable leads
Inventor: Fjelstad | Patent Number: 6906422
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Semiconductor package having light sensitive chips
Inventor: Fjelstad | Patent Number: 6888168
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Stacked microelectronic assemblies and methods of making same
Inventor: Damberg, et al. | Patent Number: 6885106
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Methods and structures for electronic probing arrays
Inventor: Fjelstad | Patent Number: 6876212
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Methods for manufacturing resistors using a sacrificial layer
Inventor: Fjelstad | Patent Number: 6856235
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Microelectric packages having deformed bonded leads and methods therefor
Inventor: Fjelstad, et al. | Patent Number: 6848173
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Image forming apparatus with improved transfer efficiency
Inventor: Fjelstad, et al. | Patent Number: 6847107
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Microelectronic package having a compliant layer with bumped protrusions
Inventor: Fjelstad, et al. | Patent Number: 6847101
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Methods for manufacturing resistors using a sacrificial layer
Inventor: Fjelstad | Patent Number: 6821821
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Method of assembling a semiconductor chip package
Inventor: Smith, et al. | Patent Number: 6821815
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Methods for providing void-free layers for semiconductor assemblies
Inventor: Distefano, et al. | Patent Number: 6780747
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Microelectronic unit forming methods and materials
Inventor: Beroz, et al. | Patent Number: 6737265
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Methods of making microelectronic assemblies having conductive elastomeric posts
Inventor: Fjelstad | Patent Number: 6709899
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Electrical connection with inwardly deformable contacts
Inventor: DiStefano, et al. | Patent Number: 6706973
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Electrical connection with inwardly deformable contacts
Inventor: Distefano, et al. | Patent Number: 6700072
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Methods and structures for electronic probing arrays
Inventor: Fjelstad | Patent Number: 6690186
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Methods for providing void-free layers for semiconductor assemblies
Inventor: DiStefano, et al. | Patent Number: 6653172
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Compliant package with conductive elastomeric posts
Inventor: Fjelstad | Patent Number: 6635514
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Methods and structures for electronic probing arrays
Inventor: Fjelstad, et al. | Patent Number: 6586955
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Semiconductor packages having light-sensitive chips
Inventor: Fjelstad | Patent Number: 6583444
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Microelectronic component with rigid interposer
Inventor: Fjelstad, et al. | Patent Number: 6573609
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Microelectronic connector with planar elastomer sockets
Inventor: Fjelstad | Patent Number: 6541867
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Components with releasable leads and methods of making releasable leads
Inventor: Beroz, et al. | Patent Number: 6541845
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Method of assembling a semiconductor chip package
Inventor: Smith, et al. | Patent Number: 6518662
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Method of manufacturing connection components using a plasma patterned mask
Inventor: Fjelstad, et al. | Patent Number: 6518160
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Methods and structures for electronic probing arrays
Inventor: Fjelstad | Patent Number: 6499216
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Microelectronic assembly incorporating lead regions defined by gaps in a polymeric sheet
Inventor: Smith, et al. | Patent Number: 6486547
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Expandable interposer for a microelectronic package and method therefor
Inventor: Fjelstad | Patent Number: 6486003
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Laterally situated stress/strain relieving lead for a semiconductor chip package
Inventor: Distefano, et al. | Patent Number: 6468836
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Compliant microelectronic assemblies
Inventor: Fjelstad, et al. | Patent Number: 6465878
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Microelectronic assemblies having solder-wettable pads and conductive elements
Inventor: DiStefano, et al. | Patent Number: 6465747
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Method for providing void free layer for semiconductor assemblies
Inventor: DiStefano, et al. | Patent Number: 6458681
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Compliant package with conductive elastomeric posts
Inventor: Fjelstad | Patent Number: 6417029
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Semiconductor assemblies with reinforced peripheral regions
Inventor: Karavakis, et al. | Patent Number: 6373128
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Microelectronic unit forming methods and materials
Inventor: Beroz, et al. | Patent Number: 6361959
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Method of making connection component
Inventor: DiStefano, et al. | Patent Number: 6357112
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Microelectronic lead structures with dielectric layers
Inventor: Fjelstad, et al. | Patent Number: 6329607
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Method for fabricating microelectronic assemblies
Inventor: DiStefano, et al. | Patent Number: 6324754
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Methods for creating wear resistant contact edges
Inventor: Fjelstad | Patent Number: 6317974
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Microelectronic assembly fabrication with terminal formation from a conductive layer
Inventor: Smith, et al. | Patent Number: 6307260
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Microelectronic assembly with conductive terminals having an exposed surface through a dielectric layer
Inventor: Fjelstad | Patent Number: 6294830
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Method of making compliant microelectronic assemblies
Inventor: Fjelstad | Patent Number: 6284563
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Electrical connections with deformable contacts
Inventor: DiStefano, et al. | Patent Number: 6274820
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Methods of making microelectronic components having electrophoretically deposited layers
Inventor: DiStefano, et al. | Patent Number: 6266874
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Method for making a connection component for a semiconductor chip package
Inventor: Fjelstad | Patent Number: 6266872
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Laterally situated stress/strain relieving lead for a semiconductor chip package
Inventor: DiStefano, et al. | Patent Number: 6265759
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Components with releasable leads and methods of making releasable leads
Inventor: Beroz, et al. | Patent Number: 6261863
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Solder ball placement fixtures and methods
Inventor: Fjelstad | Patent Number: 6253992
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Electrical connection with inwardly deformable contacts
Inventor: Distefano, et al. | Patent Number: 6247228
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Electrical connections with deformable contacts
Inventor: DiStefano, et al. | Patent Number: 6239386
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Microelectric lead structures with plural conductors
Inventor: Smith, et al. | Patent Number: 6239384
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Low profile socket for microelectronic components and method for making the same
Inventor: Fjelstad | Patent Number: 6229100
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Method of fabricating a microelectronic assembly using sheets with gaps to define lead regions
Inventor: Smith, et al. | Patent Number: 6228686
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Fabrication of deformable leads of microelectronic elements
Inventor: Fjelstad | Patent Number: 6221750
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Microelectronic components with frangible lead sections
Inventor: Fjelstad, et al. | Patent Number: 6218213
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Apparatus for electrically testing bare printed circuits
Inventor: Fjelstad | Patent Number: 6211690
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Semiconductor chip package with fan-in leads
Inventor: Fjelstad, et al. | Patent Number: 6211572
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Microelectronic component with rigid interposer
Inventor: Bellaar, et al. | Patent Number: 6208025
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Method of making an electronic contact
Inventor: Fjelstad, et al. | Patent Number: 6205660
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Method of assembling a semiconductor chip package
Inventor: Smith, et al. | Patent Number: 6204091
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Coining tool and process of manufacturing same for making connection components
Inventor: Distefano, et al. | Patent Number: 6196042
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Semiconductor assemblies with reinforced peripheral regions
Inventor: Karavakis, et al. | Patent Number: 6157075
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Microelectronic connector with planar elastomer sockets
Inventor: Fjelstad | Patent Number: 6133072
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Method of encapsulating a microelectronic assembly utilizing a barrier
Inventor: Smith, et al. | Patent Number: 6130116
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Compliant wirebond packages having wire loop
Inventor: Fjelstad | Patent Number: 6107682
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Methods for providing void-free layers for semiconductor assemblies
Inventor: Distefano, et al. | Patent Number: 6107123
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Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads
Inventor: Fjelstad | Patent Number: 6093584
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Flexible connectors for microelectronic elements
Inventor: Fjelstad, et al. | Patent Number: 6086386
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Flexible contact post and post socket and associated methods therefor
Inventor: Distefano, et al. | Patent Number: 6007349
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Microelectronic component with rigid interposer
Inventor: Bellaar, et al. | Patent Number: 6002168
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Methods for manufacturing a semiconductor package having a sacrificial layer
Inventor: Fjelstad | Patent Number: 6001671
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Process of manufacturing compliant wirebond packages
Inventor: Fjelstad | Patent Number: 5989939
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Microelectronic assembly fabrication with terminal formation from a conductive layer
Inventor: Smith, et al. | Patent Number: 5989936
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Low profile socket for microelectronic components and method for making the same
Inventor: Fjelstad | Patent Number: 5983492
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Soldering with resilient contacts
Inventor: Fjelstad, et al. | Patent Number: 5980270
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Methods of making semiconductor assemblies with reinforced peripheral regions
Inventor: Karavakis, et al. | Patent Number: 5966587
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Microelectronic contacts with asperities and methods of making same
Inventor: Fjelstad, et al. | Patent Number: 5934914
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Connection component with releasable leads
Inventor: Fjelstad | Patent Number: 5904498
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Methods for providing void-free layers for semiconductor assemblies
Inventor: Distefano, et al. | Patent Number: 5834339
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Semiconductor connection component with frangible lead sections
Inventor: DiStefano, et al. | Patent Number: 5821609