Patent Inventor: Chan Eon Park

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Low dielectric constant composite material containing nano magnetic particles, and optical and semiconductor devices using the low dielectric constant composite material
Inventor: Park, et al. | Patent Number: 6849926

Water-soluble polymeric adhesion promoter and production method
Inventor: Oh, et al. | Patent Number: 6531564

Poly(imide-siloxane) compound for tapeless LOC packaging
Inventor: Park, et al. | Patent Number: 6468664

Water-soluble polymeric adhesion promoter and production method
Inventor: Oh, et al. | Patent Number: 6455654

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