Patent Inventor: Bernhard P. Lange

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High power integrated circuit device having bump pads
Inventor: Wiktor, et al. | Patent Number: 8154117

High current semiconductor device system having low resistance and inductance
Inventor: Coyle, et al. | Patent Number: 8039956

Semiconductor device having firmly secured heat spreader
Inventor: Lange, et al. | Patent Number: 7635613

Non-pull back pad package with an additional solder standoff
Inventor: Lange, et al. | Patent Number: 7608484

Bond capillary design for ribbon wire bonding
Inventor: Lange, et al. | Patent Number: 7578422

Flip chip package with advanced electrical and thermal properties for high current designs
Inventor: Lange, et al. | Patent Number: 7476976

Semiconductor assembly and packaging for high current and low inductance
Inventor: Lange | Patent Number: 7361977

Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
Inventor: Lange, et al. | Patent Number: 7335536

Bond capillary design for ribbon wire bonding
Inventor: Lange, et al. | Patent Number: 7216794

Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages
Inventor: Lange | Patent Number: 7074653

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