Patent International Class: H05K 3/28
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Method of manufacturing a piezoelectric actuator
Inventor: Schroder, et al. | Patent Number: 8132304
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Method of fabricating circuit configuration member
Inventor: Tomikawa, et al. | Patent Number: 7877868
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Secure electronic entity such as a passport
Inventor: Launay | Patent Number: 7834275
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Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board
Inventor: Hiew, et al. | Patent Number: 7830666
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Method of manufacturing a micromachined polymer beam structure
Inventor: Tai, et al. | Patent Number: 7774930
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Apparatus and method for manufacturing semiconductor device
Inventor: Kimino | Patent Number: 7651724
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Method of manufacturing wiring substrate having terminated buses
Inventor: Otsuka, et al. | Patent Number: 7631422
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Printed circuit board with soldering lands
Inventor: Urisu | Patent Number: 7414301
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Memory card and its manufacturing method
Inventor: Park, et al. | Patent Number: 7220915
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System and method for dissipating heat from an electronic board
Inventor: Rubenstein, et al. | Patent Number: 6967843
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Clockspring with flat cable
Inventor: Schilson, et al. | Patent Number: 6966787
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Ultraviolet curable resin composition and photo solder resist including the same
Inventor: Hashimoto | Patent Number: 6964813
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Expansion board apparatus and removing method
Inventor: Fujii, et al. | Patent Number: 6963491
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Method of treating epoxy resin-cured product
Inventor: Shibata, et al. | Patent Number: 6962628
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Display device
Inventor: Ogawa, et al. | Patent Number: 6961110
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Solder mask and structure of a substrate
Inventor: Ding, et al. | Patent Number: 6960822
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Thermosetting resin compositions containing maleimide and/or vinyl compounds
Inventor: Dershem, et al. | Patent Number: 6960636
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Method of manufacturing piezoelectric component
Inventor: Morita, et al. | Patent Number: 6957475
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Hybrid integrated circuit device
Inventor: Mizutani, et al. | Patent Number: 6956252
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Method for manufacturing circuit device
Inventor: Kobayashi, et al. | Patent Number: 6955942
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Method for plugging holes in a printed circuit board
Inventor: Lee, et al. | Patent Number: 6954985
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Circuit device manufacturing method
Inventor: Usui, et al. | Patent Number: 6953712
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Pressure-welded structure of flexible circuit boards
Inventor: Ueda | Patent Number: 6952250
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Edge-sealed substrates and methods for effecting the same
Inventor: Akhavain, et al. | Patent Number: 6951778
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Method for manufacturing circuit devices
Inventor: Igarashi, et al. | Patent Number: 6949470
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Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them
Inventor: Saijo, et al. | Patent Number: 6949412
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Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
Inventor: Bernards, et al. | Patent Number: 6946027
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PC adapter cards and method of manufacturing the same
Inventor: Sanemitsu | Patent Number: 6945466
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Substrate and fabrication method of the same
Inventor: Huang, et al. | Patent Number: 6943439
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Flexible printed circuit board
Inventor: Kageyama, et al. | Patent Number: 6943302
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Curable coatings having low permeable to sulfur-bearing gases
Inventor: Liu, et al. | Patent Number: 6942926
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Method for producing printed wiring board
Inventor: Shimizu, et al. | Patent Number: 6941648
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Innovative solder ball pad structure to ease design rule, methods of fabricating same and substrates, electronic device assemblies and systems employing same
Inventor: Lee | Patent Number: 6940179
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Method and apparatus for molding, module electronic devices and a module electronic device molded thereby
Inventor: Morinaga, et al. | Patent Number: 6940159
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Protective coating for an electronic device
Inventor: Vinciarelli, et al. | Patent Number: 6940022
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Electronic part mounting substrate, electronic part, and semiconductor device
Inventor: Noguchi, et al. | Patent Number: 6936769
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Printed circuit board having permanent solder mask
Inventor: Maa, et al. | Patent Number: 6933448
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Method of fabricating printed circuit board with mixed metallurgy pads
Inventor: Arrington, et al. | Patent Number: 6931722
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Tape carrier package
Inventor: Kang | Patent Number: 6930384
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Method for the production of an electronic component
Inventor: Heinz, et al. | Patent Number: 6929975
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Method for fabricating surface acoustic wave filter package
Inventor: Kim, et al. | Patent Number: 6928719
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Substrate for semiconductor package
Inventor: Lai, et al. | Patent Number: 6927485
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Printed circuit board having through-hole protected by barrier and method of manufacturing the same
Inventor: Yamaguchi, et al. | Patent Number: 6927347
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Electronic component-use material and electronic component using it
Inventor: Iwasaki | Patent Number: 6927272
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Ultrasonic manufacturing apparatus
Inventor: Kurita, et al. | Patent Number: 6926187
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Semiconductor chip and wiring board with bumps formed on pads/land and on passivation/insulation film and manufacturing method of the same
Inventor: Ohara | Patent Number: 6924553
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Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board
Inventor: Matsuda | Patent Number: 6924440
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Liquid level sending unit with flexible sensor board
Inventor: Sabatino | Patent Number: 6923057
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Optical communication module
Inventor: Kobinata, et al. | Patent Number: 6921922
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Interlayer connection structure of multilayer wiring board, method of manufacturing method of forming land thereof
Inventor: Terunuma, et al. | Patent Number: 6921869
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Solder protective coating and fluxless joining of flip chip devices on laminates with plated solder
Inventor: Bernier, et al. | Patent Number: 6921015
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Electrical assembly and method for manufacturing the electrical assembly
Inventor: Topp, et al. | Patent Number: 6919507
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Conformal sealing film
Inventor: Glovatsky | Patent Number: 6916994
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Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins
Inventor: Kumagai, et al. | Patent Number: 6916865
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Thermosetting resin compositions containing maleimide and/or vinyl compounds
Inventor: Dershem, et al. | Patent Number: 6916856
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Diode-laser curing of liquid epoxide encapsulants
Inventor: Hoult, et al. | Patent Number: 6913794
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Methods for forming and protecting electrical interconnects and resultant assemblies
Inventor: Akhavain, et al. | Patent Number: 6913343
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Microelectronic packaging and methods for thermally protecting package interconnects and components
Inventor: Rumer, et al. | Patent Number: 6911726
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Flexible printed circuit
Inventor: Okada, et al. | Patent Number: 6911605
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IC card and manufacturing method thereof
Inventor: Kim, et al. | Patent Number: 6910636
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Chip carrier film, method of manufacturing the chip carrier film and liquid crystal display using the chip carrier film
Inventor: Nakahara, et al. | Patent Number: 6908790
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Promoting adhesion between a polymer and a metallic substrate
Inventor: Angelopoulos, et al. | Patent Number: 6908684
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Permanent resist, permanent resist-laminated substrate and process for producing the same
Inventor: Yoshida, et al. | Patent Number: 6905810
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Technique for connector to printed circuit board decoupling to eliminate flexure
Inventor: Brandenburg, et al. | Patent Number: 6905349
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Method of manufacturing a semiconductor device having a flexible wiring substrate
Inventor: Tomihara | Patent Number: 6902955
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Multi-layer wiring circuit board and method for producing the same
Inventor: Yamazaki, et al. | Patent Number: 6902949
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Flexible printed wiring board with semiconductor chip and releasing layer
Inventor: Sakata | Patent Number: 6900989
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Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
Inventor: Babb, et al. | Patent Number: 6900383
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Ball grid array resistor network
Inventor: Ernsberger, et al. | Patent Number: 6897761
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Programmable multi-chip module
Inventor: Kautz, et al. | Patent Number: 6897078
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Ultraviolet-curable resin composition and photosolder resist ink containing the composition
Inventor: Daido, et al. | Patent Number: 6896967
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Method of fabricating circuit substrate
Inventor: Ho, et al. | Patent Number: 6896173
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Dyed fluoropolymers
Inventor: Parent, et al. | Patent Number: 6894105
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Method of manufacturing multi-layer printed wiring board
Inventor: Nakayama, et al. | Patent Number: 6893576
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Apparatus for encasing array packages
Inventor: Thummel | Patent Number: 6893244
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Granular matter filled weapon guidance electronics unit
Inventor: Zimmerman, et al. | Patent Number: 6892646
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Method for manufacturing wired circuit board
Inventor: Fujii, et al. | Patent Number: 6889426
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Potted hybrid integrated circuit
Inventor: Ishikawa, et al. | Patent Number: 6888259
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Multilayer flexible wiring circuit board and its manufacturing method
Inventor: Nakamura, et al. | Patent Number: 6887560
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Semiconductor copper bond pad surface protection
Inventor: Ellis, et al. | Patent Number: 6885104
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IC card
Inventor: Maruyama, et al. | Patent Number: 6882541
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Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
Inventor: Farnworth | Patent Number: 6881607
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Underfilling material for semiconductor package
Inventor: Gotoh, et al. | Patent Number: 6881591
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Process for bonding conductor tracks to plastics surfaces
Inventor: Platz | Patent Number: 6881291
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Lamp on sheet and manufacturing method thereof
Inventor: Lin | Patent Number: 6880955
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Method and apparatus for surface processing of printed wiring board
Inventor: Uratsuji, et al. | Patent Number: 6878296
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Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
Inventor: Farnworth | Patent Number: 6875632
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Shielding device used for various components mounted on circuit board aligned with selectively cut areas
Inventor: McFadden, et al. | Patent Number: 6873031
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Flexible circuit board
Inventor: Leu, et al. | Patent Number: 6866368
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Warpage-preventive circuit board and method for fabricating the same
Inventor: Chang, et al. | Patent Number: 6864434
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Volumetrically efficient electronic circuit module
Inventor: Youker, et al. | Patent Number: 6862191
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Resins curable with actinic energy ray, process for the production thereof, and photocurable and thermosetting resin composition
Inventor: Nishikubo, et al. | Patent Number: 6861500
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Inkjet cartridge and method of identifying color of ink thereof by flexible printed circuit board
Inventor: Chen, et al. | Patent Number: 6860592
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Cable-enrolling conductive thin-film sheet and manufacturing method thereof
Inventor: Murakami, et al. | Patent Number: 6858804
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Laminated multilayer package
Inventor: Pai, et al. | Patent Number: 6856008
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Manufacturing method of multilayer substrate
Inventor: Kondo, et al. | Patent Number: 6855625
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Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device
Inventor: Ashida | Patent Number: 6853092
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Electronic device and method of manufacturing the same, and electronic instrument
Inventor: Hashimoto | Patent Number: 6853080
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Configuration having an electronic device electrically connected to a printed circuit board
Inventor: Hedler, et al. | Patent Number: 6852931
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Thermosetting resin compositions containing maleimide and/or vinyl compounds
Inventor: Dershem, et al. | Patent Number: 6852814