Patent International Class: H01L 23/4

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Packaged electronic devices with face-up die having TSV connection to leads and die pad
Inventor: Bonifield, et al. | Patent Number: 8154134

Semiconductor device having a chip-size package
Inventor: Takahashi, et al. | Patent Number: 8154124

Chip-mounted film package
Inventor: Kang, et al. | Patent Number: 8154120

Interconnect and test assembly including an interconnect
Inventor: Sangalang, et al. | Patent Number: 8154113

Semiconductor device with plate-shaped component
Inventor: Kawano, et al. | Patent Number: 8143716

Wafer integrated with permanent carrier and method therefor
Inventor: Han, et al. | Patent Number: 8125073

Electronic component for surface mounting
Inventor: Kobayakawa, et al. | Patent Number: 8106508

Semiconductor device and method of forming wafer level ground plane and power ring
Inventor: Badakere, et al. | Patent Number: 8097943

Seal ring for preventing crack propagation in integrated circuit devices
Inventor: Parhami | Patent Number: 8093719

Semiconductor device
Inventor: Zudock, et al. | Patent Number: 8093711

Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures
Inventor: Ong | Patent Number: 8093694

Pass-through 3D interconnect for microelectronic dies and associated systems and methods
Inventor: Pratt, et al. | Patent Number: 8084854

Hybrid integrated circuit device, and method for fabricating the same, and electronic device
Inventor: Moriyama, et al. | Patent Number: 8084852

Integrated circuit package having security feature and method of manufacturing same
Inventor: Bhate, et al. | Patent Number: 8076776

Semiconductor package and method for making the same
Inventor: Shen | Patent Number: 8076775

Semiconductor fingerprint apparatus with flat touch surface
Inventor: Chou | Patent Number: 8072060

Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die
Inventor: Shim, et al. | Patent Number: 8072059

Embedded integrated circuit package system and method of manufacture thereof
Inventor: Ong, et al. | Patent Number: 8067832

Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die
Inventor: Do, et al. | Patent Number: 8062929

Through-silicon via with scalloped sidewalls
Inventor: Kuo, et al. | Patent Number: 8049327

Preventing access to stub traces on an integrated circuit package
Inventor: Zeta | Patent Number: 8049324

Semiconductor device
Inventor: Hasebe, et al. | Patent Number: 8044509

3D integration of vertical components in reconstituted substrates
Inventor: Baleras, et al. | Patent Number: 8039306

Micromechanical device which has cavities having different internal atmospheric pressures
Inventor: Gonska, et al. | Patent Number: 8035209

Semiconductor device and semiconductor package including the same
Inventor: Lee, et al. | Patent Number: 8035194

Method of manufacturing semiconductor package and semiconductor plastic package using the same
Inventor: Ikeguchi, et al. | Patent Number: 8030752

Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates
Inventor: Lee, et al. | Patent Number: 8030751

Through-silicon via structures including conductive protective layers
Inventor: Yoon, et al. | Patent Number: 8026592

Integrated circuit packaging system with increased connectivity and method of manufacture thereof
Inventor: Dahilig, et al. | Patent Number: 8022539

Package for high power density devices
Inventor: Hauenstein | Patent Number: 8018056

Virtual wire assembly having hermetic feedthroughs
Inventor: Dalton, et al. | Patent Number: 8013433

Stacked electronic component and manufacturing method thereof
Inventor: Yoshimura, et al. | Patent Number: 8008763

Semiconductor chip package and printed circuit board having through interconnections
Inventor: Lee, et al. | Patent Number: 8004081

Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof
Inventor: Ito, et al. | Patent Number: 8004077

Optical semiconductor device and method of manufacturing optical semiconductor device
Inventor: Shimokawa, et al. | Patent Number: 7999281

Stackable semiconductor package
Inventor: Yoshida, et al. | Patent Number: 7982306

Integrated circuit package including a three-dimensional fan-out / fan-in signal routing
Inventor: Railkar, et al. | Patent Number: 7982305

Saw debris reduction in MEMS devices
Inventor: Ridley, et al. | Patent Number: 7977786

Integrated circuit package system with interference-fit feature
Inventor: Bathan, et al. | Patent Number: 7977778

Semiconductor device and method of manufacturing semiconductor device
Inventor: Higuchi | Patent Number: 7977771

Semiconductor package
Inventor: Kim | Patent Number: 7968918

Electronic device, electronic apparatus mounted with electronic device, article equipped with electronic device and method of producing electronic device
Inventor: Kobayashi, et al. | Patent Number: 7960215

Semiconductor package with patterning layer and method of making same
Inventor: Kim, et al. | Patent Number: 7956453

Chip scale package for power devices and method for making the same
Inventor: Jiang | Patent Number: 7944048

Semiconductor device having improved contact interface reliability and method therefor
Inventor: Chung, et al. | Patent Number: 7944043

Functional device package with metallization arrangement for improved bondability of two substrates
Inventor: Hata, et al. | Patent Number: 7939938

Crosstalk reduction in electrical interconnects using differential signaling
Inventor: Chen, et al. | Patent Number: 7939930

Power transistor and power semiconductor device
Inventor: Otremba | Patent Number: 7936048

Integrated audio codec with silicon audio transducer
Inventor: Bazarjani, et al. | Patent Number: 7929714

Composite multi-layer substrate and module using the substrate
Inventor: Miyazaki, et al. | Patent Number: 7928560

Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing
Inventor: Kubota, et al. | Patent Number: 7923835

LED-based light source having improved thermal dissipation
Inventor: Ng | Patent Number: 7923831

Semiconductor device having lands disposed inward and outward of an area of a wiring board where electrodes are disposed
Inventor: Danno | Patent Number: 7919858

Integrated circuit packaging system with exposed terminal interconnects and method of manufacturing thereof
Inventor: Trasporto, et al. | Patent Number: 7919850

Package substrate and device for optical communication
Inventor: Kodama, et al. | Patent Number: 7919849

Edge seal for thru-silicon-via technology
Inventor: Davis, et al. | Patent Number: 7919834

Semiconductor device
Inventor: Hasebe, et al. | Patent Number: 7911054

Panel-shaped semiconductor module
Inventor: Nakata | Patent Number: 7910947

Wafer level incapsulation chip and encapsulation chip manufacturing method
Inventor: Jeong, et al. | Patent Number: 7906841

Integrated circuit micro-module
Inventor: Smeys, et al. | Patent Number: 7902661

Substrate for semiconductor device and manufacturing method thereof
Inventor: Lee, et al. | Patent Number: 7902660

Hybrid integrated circuit device, and method for fabricating the same, and electronic device
Inventor: Moriyama, et al. | Patent Number: 7902656

Semiconductor package having resin substrate with recess and method of fabricating the same
Inventor: Jang, et al. | Patent Number: 7898075

Semiconductor device and semiconductor module employing thereof
Inventor: Matsui, et al. | Patent Number: 7898073

Semiconductor plastic package and fabricating method thereof
Inventor: Shin, et al. | Patent Number: 7893527

Semiconductor device and manufacturing method thereof
Inventor: Obara | Patent Number: 7892893

Semiconductor package with passive elements embedded within a semiconductor chip
Inventor: Yang | Patent Number: 7884465

3D electronic packaging structure having a conductive support substrate
Inventor: Yew, et al. | Patent Number: 7884464

Potential-free housing leadthrough
Inventor: Wollitzer | Patent Number: 7880294

Wafer integrated with permanent carrier and method therefor
Inventor: Han, et al. | Patent Number: 7880293

Integrated circuit package and integrated circuit module
Inventor: Park, et al. | Patent Number: 7880291

Embedded power gating
Inventor: Zelikson, et al. | Patent Number: 7880284

Semiconductor input control device
Inventor: Vaganov, et al. | Patent Number: 7880247

Semiconductor substrate and method of connecting semiconductor die to substrate
Inventor: Yow, et al. | Patent Number: 7868449

Electrical component and production thereof
Inventor: Metzger | Patent Number: 7868448

Packaged microdevices and methods for manufacturing packaged microdevices
Inventor: Roberts, et al. | Patent Number: 7868440

Microelectronic devices and methods for manufacturing microelectronic devices
Inventor: Lake | Patent Number: 7863727

Integrated circuit packaging system with a protrusion on an inner stacking module and method of manufacture thereof
Inventor: Chow, et al. | Patent Number: 7863109

Integrated circuit packaging system having through silicon via with direct interconnects and method of manufacture thereof
Inventor: Choi, et al. | Patent Number: 7859099

Embedded integrated circuit package system
Inventor: Ong, et al. | Patent Number: 7859098

Semiconductor structure and semiconductor manufacturing method
Inventor: Huang, et al. | Patent Number: 7851895

Package and package assembly of power device
Inventor: Baek, et al. | Patent Number: 7847395

Integrated circuit micro-module
Inventor: Smeys, et al. | Patent Number: 7843056

High-frequency hermetically-sealed circuit package
Inventor: Yamamoto | Patent Number: 7838990

Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same
Inventor: Badakere, et al. | Patent Number: 7838395

Semiconductor module and method of manufacturing the same
Inventor: Park, et al. | Patent Number: 7834439

Via bottom contact and method of manufacturing same
Inventor: Chanda, et al. | Patent Number: 7830019

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer
Inventor: Do, et al. | Patent Number: 7829998

Semiconductor device and method for manufacturing semiconductor device
Inventor: Sugino, et al. | Patent Number: 7829992

Taped semiconductor device and method of manufacture
Inventor: Farnworth | Patent Number: 7829385

Method of manufacturing electronic component integrated substrate
Inventor: Kurashima, et al. | Patent Number: 7827681

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
Inventor: Kwon, et al. | Patent Number: 7825468

Semiconductor device and method for producing the same
Inventor: Yoshizawa, et al. | Patent Number: 7821121

Metal filled through via structure for providing vertical wafer-to-wafer interconnection
Inventor: Pogge, et al. | Patent Number: 7821120

Semiconductor package with reduced length interconnect and manufacturing method thereof
Inventor: Watanabe, et al. | Patent Number: 7812439

Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging
Inventor: Jadhav, et al. | Patent Number: 7812438

Substrate for mounting electronic component and electronic apparatus including the substrate
Inventor: Koyama | Patent Number: 7808104

Ceramic wiring board and process for producing the same, and semiconductor device using the same
Inventor: Nakamura, et al. | Patent Number: 7795732

Semiconductor device and method for manufacturing the same
Inventor: Kurita | Patent Number: 7795721

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component
Inventor: Goller | Patent Number: 7795717

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