Patent International Class: H01L 23/10

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Thermal resistor, semiconductor device using the same, and electric device
Inventor: Kise | Patent Number: 8148812

Surface mount package with ceramic sidewalls
Inventor: Medeiros, III | Patent Number: 8143717

Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer
Inventor: Chiang, et al. | Patent Number: 8138597

Planar array contact memory cards
Inventor: Coteus, et al. | Patent Number: 8138592

Housed active microstructures with direct contacting to a substrate
Inventor: Reinert | Patent Number: 8129838

Electronic component package and method of manufacturing the same, and electronic component device
Inventor: Murayama | Patent Number: 8129830

Discrete stress isolator attachment structures for MEMS sensor packages
Inventor: Eskridge | Patent Number: 8129801

Package with heat transfer
Inventor: Sirinorakul, et al. | Patent Number: 8125077

Semiconductor package system with substrate heat sink
Inventor: Kim, et al. | Patent Number: 8125076

Methods and materials useful for chip stacking, chip and wafer bonding
Inventor: Apanius, et al. | Patent Number: 8120168

Methods for manufacturing thermally enhanced flip-chip ball grid arrays
Inventor: Kim, et al. | Patent Number: 8115301

Load driving device
Inventor: Shiraki, et al. | Patent Number: 8102047

Module with silicon-based layer
Inventor: Otremba, et al. | Patent Number: 8093713

Heat sink base for LEDS
Inventor: Shi | Patent Number: 8089085

Thermal spacer for stacked die package thermal management
Inventor: Hu | Patent Number: 8084856

Surface mount package with high thermal conductivity
Inventor: Medeiros, III | Patent Number: 8080872

Die-warpage compensation structures for thinned-die devices, and methods of assembling same
Inventor: Hu | Patent Number: 8080870

Printed circuit board, memory module having the same and fabrication method thereof
Inventor: Hwang, et al. | Patent Number: 8076772

Semiconductor device having metal cap divided by slit
Inventor: Ando | Patent Number: 8076771

Light-emitting device and electronic apparatus
Inventor: Gomi | Patent Number: 8063562

Semiconductor device and heat sink with 3-dimensional thermal conductivity
Inventor: Kuroda, et al. | Patent Number: 8063484

On-chip temperature gradient minimization using carbon nanotube cooling structures with variable cooling capacity
Inventor: Dimitrakopoulos, et al. | Patent Number: 8063483

Semiconductor device and method of forming an interconnect structure for 3-D devices using encapsulant for structural support
Inventor: Marimuthu, et al. | Patent Number: 8049328

Semiconductor light emitting device
Inventor: Sugimoto, et al. | Patent Number: 8049318

Semiconductor device package and method of assembly thereof
Inventor: Herbsommer, et al. | Patent Number: 8049312

Power module substrate, method for manufacturing power module substrate, and power module
Inventor: Kitahara, et al. | Patent Number: 8044500

Thermally enhanced semiconductor package and method of producing the same
Inventor: Kanth, et al. | Patent Number: 8039951

Heat conductive plate structure
Inventor: Wang, et al. | Patent Number: 8030759

Semiconductor module and method for fabricating semiconductor module
Inventor: Kitabatake | Patent Number: 8030758

Forming a semiconductor package including a thermal interface material
Inventor: Renavikar, et al. | Patent Number: 8030757

Plastic ball grid array package with integral heatsink
Inventor: Lee, et al. | Patent Number: 8030756

Integrated circuit package system with a heat sink
Inventor: Lee, et al. | Patent Number: 8030755

Integrated circuit package system using heat slug
Inventor: Yu, et al. | Patent Number: 8022531

Thermally enhanced semiconductor package
Inventor: Railkar, et al. | Patent Number: 8018051

Package with heat transfer
Inventor: Sirinorakul, et al. | Patent Number: 8013437

Thermal management of LED-based lighting systems
Inventor: Van Laanen, et al. | Patent Number: 8011799

Guiding apparatus
Inventor: Ye | Patent Number: 8009428

Semiconductor chip package assembly method and apparatus for countering leadfinger deformation
Inventor: Feng, et al. | Patent Number: 8008131

Micro-chimney and thermosiphon die-level cooling
Inventor: Chrysler, et al. | Patent Number: 8006747

Chip package structure and manufacturing method thereof
Inventor: Tain, et al. | Patent Number: 8004079

Semiconductor device and method of mounting semiconductor die to heat spreader on temporary carrier and forming polymer layer and conductive layer over the die
Inventor: Oh, et al. | Patent Number: 8003496

Organic light emitting display device and method of fabricating the same
Inventor: Park | Patent Number: 7999372

Flip chip interconnection structure
Inventor: Pendse | Patent Number: 7994636

Power semiconductor module
Inventor: Soda, et al. | Patent Number: 7994635

Wafer assembly comprising MEMS wafer with polymerized siloxane attachment surface
Inventor: McAvoy, et al. | Patent Number: 7986039

Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive
Inventor: Celik, et al. | Patent Number: 7968999

Thermal enhanced upper and dual heat sink exposed molded leadless package
Inventor: Wu, et al. | Patent Number: 7968982

Electric circuit device, electric circuit module, and power converter
Inventor: Tokuyama, et al. | Patent Number: 7961472

Semiconductor chip assembly with post/base heat spreader and vertical signal routing
Inventor: Wang, et al. | Patent Number: 7948076

Semiconductor module molded by resin with heat radiation plate opened outside from mold
Inventor: Noritake, et al. | Patent Number: 7944045

Forming compliant contact pads for semiconductor packages
Inventor: Zhou, et al. | Patent Number: 7939922

Micromechanical device with microfluidic lubricant channel
Inventor: Chen, et al. | Patent Number: 7932569

Semiconductor integrated circuit device and fabrication method thereof
Inventor: Yoshioka | Patent Number: 7930658

Semiconductor device, electronic component module, and method for manufacturing semiconductor device
Inventor: Nakagoshi | Patent Number: 7928559

Semiconductor device mounted on heat sink having protruded periphery
Inventor: Takahashi, et al. | Patent Number: 7923826

Semiconductor package and fabrication method thereof
Inventor: Lee | Patent Number: 7919853

Load driving semiconductor apparatus
Inventor: Ukai, et al. | Patent Number: 7915729

Subassembly that includes a power semiconductor die and a heat sink having an exposed surface portion thereof
Inventor: Chiang, et al. | Patent Number: 7915728

Hermetic seal and hermetic connector reinforcement and repair with low temperature glass coatings
Inventor: Lower, et al. | Patent Number: 7915527

Semiconductor device having reduced thermal interface material (TIM) degradation and method therefor
Inventor: Galloway, et al. | Patent Number: 7906845

Adjustable threaded cores for LED thermal management
Inventor: Storch | Patent Number: 7898077

Structure and methods of processing for solder thermal interface materials for chip cooling
Inventor: Furman, et al. | Patent Number: 7898076

High frequency package device with internal space having a resonant frequency offset from frequency used
Inventor: Takagi | Patent Number: 7888797

Method for direct heat sink attachment
Inventor: Chainer | Patent Number: 7888792

Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof
Inventor: Shim, et al. | Patent Number: 7888184

Semiconductor device thermal connection
Inventor: Drake, et al. | Patent Number: 7880298

Semiconductor chip having conductive member for reducing localized voltage drop
Inventor: Jao, et al. | Patent Number: 7880297

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
Inventor: Kwon, et al. | Patent Number: 7868443

Ball grid array package system
Inventor: Chow, et al. | Patent Number: 7863732

Heat-dissipating structure and heat-dissipating semiconductor package having the same
Inventor: Chen, et al. | Patent Number: 7863731

Die-up ball grid array package with die-attached heat spreader
Inventor: Zhao, et al. | Patent Number: 7859101

Cooling device for a light-emitting semiconductor device and a method of manufacturing such a cooling device
Inventor: De Graff, et al. | Patent Number: 7855449

Semiconductor device, method of manufacturing the same, and production equipment of the same
Inventor: Hayami, et al. | Patent Number: 7852900

Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
Inventor: Kozaka, et al. | Patent Number: 7851904

Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface
Inventor: Dubin, et al. | Patent Number: 7847394

Integrated heat spreader, heat sink or heat pipe with pre-attached phase change thermal interface material and method of making an electronic assembly
Inventor: Rumer, et al. | Patent Number: 7846778

Stud bumps as local heat sinks during transient power operations
Inventor: Gurrum, et al. | Patent Number: 7838988

Low compressive force, non-silicone, high thermal conducting formulation for thermal interface material and package
Inventor: Iruvanti, et al. | Patent Number: 7816785

Wafer level hermetically sealed MEMS device
Inventor: Receveur, et al. | Patent Number: 7816745

Power semiconductor module for inverter circuit system
Inventor: Tokuyama, et al. | Patent Number: 7812443

High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same
Inventor: Kwon, et al. | Patent Number: 7812442

Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method
Inventor: Bertrand, et al. | Patent Number: 7808099

Integrated circuit package and fabricating method thereof
Inventor: Chen, et al. | Patent Number: 7804169

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same
Inventor: Jeon, et al. | Patent Number: 7800219

Package unit
Inventor: Iwakiri | Patent Number: 7800218

Transceiver device
Inventor: Yasooka | Patent Number: 7795729

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
Inventor: Zhao, et al. | Patent Number: 7791189

Heat spreader having single layer of diamond particles and associated methods
Inventor: Sung | Patent Number: 7791188

Heat sink package
Inventor: Eom, et al. | Patent Number: 7786570

Optoelectronic semiconductor package and method for attaching heat dissipation element thereto
Inventor: Lin, et al. | Patent Number: 7781885

Low voltage drop and high thermal performance ball grid array package
Inventor: Zhong, et al. | Patent Number: 7781882

Thermally enhanced wafer level package
Inventor: Lee, et al. | Patent Number: 7772691

Circuit device and manufacturing method thereof
Inventor: Igarashi, et al. | Patent Number: 7768132

Apparatus and methods for cooling semiconductor integrated circuit package structures
Inventor: Colgan, et al. | Patent Number: 7768121

Heat spreader and semiconductor device using the same
Inventor: Takashima | Patent Number: 7768120

Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package
Inventor: Hussin, et al. | Patent Number: 7759171

Liquid metal thermal interface material system
Inventor: Macris, et al. | Patent Number: 7755184

Stacked die package with stud spacers
Inventor: Lin, et al. | Patent Number: 7750450

Multichip package, methods of manufacture thereof and articles comprising the same
Inventor: Campbell, et al. | Patent Number: 7745898

Semiconductor die package including heat sinks
Inventor: Gomez | Patent Number: 7737548

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