Patent International Class: C09K 13/0

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Polishing composition
Inventor: Etoh, et al. | Patent Number: 8147712

Adjuvant for controlling polishing selectivity and chemical mechanical polishing slurry
Inventor: Lee, et al. | Patent Number: 8147711

CMP slurry composition for forming metal wiring line
Inventor: Shin, et al. | Patent Number: 8137580

Alkaline aqueous solution composition used for washing or etching substrates
Inventor: Ishikawa | Patent Number: 8123976

Film-forming material and method of forming pattern
Inventor: MatsuMaru, et al. | Patent Number: 8101013

Compositions and methods for modifying a surface suited for semiconductor fabrication
Inventor: Hardy, et al. | Patent Number: 8092707

Polishing slurry and polishing method
Inventor: Koyama, et al. | Patent Number: 8075800

Aligned polymer organic TFT
Inventor: Sirringhaus, et al. | Patent Number: 8071180

Polishing slurry
Inventor: Ohta, et al. | Patent Number: 8062548

CMP slurry, preparation method thereof and method of polishing substrate using the same
Inventor: Paik, et al. | Patent Number: 8062547

Lapping composition and method using same
Inventor: Lombardi | Patent Number: 8057697

Compositions comprising tetrafluoropropene and carbon dioxide
Inventor: Singh, et al. | Patent Number: 8053404

Etchant composition, and methods of patterning conductive layer and manufacturing flat panel display device using the same
Inventor: Lee, et al. | Patent Number: 8052889

Wet etching solution
Inventor: La, et al. | Patent Number: 8043525

Chemical mechanical polishing composition and methods relating thereto
Inventor: Liu, et al. | Patent Number: 8025813

Composition for etching a metal hard mask material in semiconductor processing
Inventor: Mistkawi, et al. | Patent Number: 8025811

Selective barrier slurry for chemical mechanical polishing
Inventor: Bian | Patent Number: 7988878

Composition for surface modification of a heat sink and method for surface treatment of the heat sink for printed circuit boards using the same
Inventor: Lee, et al. | Patent Number: 7981317

Selective barrier metal polishing method
Inventor: Liu, et al. | Patent Number: 7981316

Method for kinetically controlled etching of copper
Inventor: Rath, et al. | Patent Number: 7976723

Etchant composition, and method of fabricating metal pattern and thin film transistor array panel using the same
Inventor: Choi, et al. | Patent Number: 7968000

Etchant and method for fabricating a thin film transistor substrate including conductive wires using the etchant and the resulting structure
Inventor: Park, et al. | Patent Number: 7955521

Copper-passivating CMP compositions and methods
Inventor: White, et al. | Patent Number: 7955520

Composition and method for planarizing surfaces
Inventor: Wang, et al. | Patent Number: 7955519

Polishing slurry
Inventor: Shiao, et al. | Patent Number: 7947195

Anticaking agent for iron and steel slag
Inventor: Hashimoto, et al. | Patent Number: 7938985

Aqueous polishing liquid and chemical mechanical polishing method
Inventor: Kato | Patent Number: 7906038

Compositions and methods for CMP of phase change alloys
Inventor: Dysard, et al. | Patent Number: 7897061

Cerium oxide sol and abrasive
Inventor: Ota, et al. | Patent Number: 7887714

Method and composition for electrochemically polishing a conductive material on a substrate
Inventor: Tran, et al. | Patent Number: 7879255

Microetching composition and method of using the same
Inventor: Feng, et al. | Patent Number: 7875558

Solution for the selective removal of metal from aluminum substrates
Inventor: Epton, et al. | Patent Number: 7846349

Multi-component barrier polishing solution
Inventor: Bian, et al. | Patent Number: 7842192

CMP slurry for metallic film, polishing method and method of manufacturing semiconductor device
Inventor: Minamihaba, et al. | Patent Number: 7842191

Polishing agent
Inventor: Hey, et al. | Patent Number: 7833435

Aqueous dispersion for CMP, polishing method and method for manufacturing semiconductor device
Inventor: Minamihaba, et al. | Patent Number: 7833431

Device having etched feature with shrinkage carryover
Inventor: Cao, et al. | Patent Number: 7829852

Solution for forming polishing slurry, polishing slurry and related methods
Inventor: Comeau, et al. | Patent Number: 7824568

Chemical assisted lapping and polishing of metals
Inventor: Wang, et al. | Patent Number: 7820068

Halide anions for metal removal rate control
Inventor: Li | Patent Number: 7820067

Polymeric barrier removal polishing slurry
Inventor: Thomas, et al. | Patent Number: 7785487

Chemical mechanical polishing slurries, their applications and method of use thereof
Inventor: Yu, et al. | Patent Number: 7776231

Chemical-mechanical polishing composition and method for using the same
Inventor: Schroeder, et al. | Patent Number: 7754098

Slurry for chemical mechanical polishing of aluminum
Inventor: Feller, et al. | Patent Number: 7731864

Fine treatment agent and fine treatment method using same
Inventor: Kikuyama, et al. | Patent Number: 7727415

Etchants for selectively removing dielectric materials
Inventor: Li, et al. | Patent Number: 7718084

Conductive hydrocarbon fluid
Inventor: Ward, et al. | Patent Number: 7708904

Method for immobilizing ligands and organometallic compounds on silica surface, and their application in chemical mechanical planarization
Inventor: Siddiqui, et al. | Patent Number: 7691287

Polishing composition
Inventor: Fujii, et al. | Patent Number: 7666238

Fluoroalkyl acid amide surfactants
Inventor: Foo | Patent Number: 7635789

Polishing slurry composition and method of using the same
Inventor: Roh, et al. | Patent Number: 7601273

Redox buffered hydrofluoric acid etchant for the reduction of galvanic attack during release etching of MEMS devices having noble material films
Inventor: Hankins | Patent Number: 7597819

Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
Inventor: Bernards, et al. | Patent Number: 7563315

Polishing slurries and methods for chemical mechanical polishing
Inventor: Chandra, et al. | Patent Number: 7553430

Chemical mechanical polishing composition
Inventor: Hou, et al. | Patent Number: 7550092

Metal polishing liquid and polishing method using it
Inventor: Akatsuka | Patent Number: 7544307

Method for isotropic etching of copper
Inventor: Cooper, et al. | Patent Number: 7537709

Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
Inventor: Dysard, et al. | Patent Number: 7531105

Etching liquid composition
Inventor: Ishikawa, et al. | Patent Number: 7507350

Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios
Inventor: Carter, et al. | Patent Number: 7504044

Compositions and methods for polishing copper
Inventor: Kelley, et al. | Patent Number: 7497967

Chemical mechanical polishing slurry composition for shallow trench isolation process of semiconductor
Inventor: Nam, et al. | Patent Number: 7497966

Polishing composition and rinsing composition
Inventor: Kawase, et al. | Patent Number: 7481949

Etching liquid
Inventor: Suzuki, et al. | Patent Number: 7473380

Method of forming a platinum pattern
Inventor: Lee | Patent Number: 7470623

Microetching composition and method of using the same
Inventor: Feng, et al. | Patent Number: 7456114

Polishing slurry and method of reclaiming wafers
Inventor: Suzuki, et al. | Patent Number: 7452481

Cleaning method and solution for cleaning a wafer in a single wafer process
Inventor: Verhaverbeke, et al. | Patent Number: 7449127

Etching reagent, and method for manufacturing electronic device substrate and electronic device
Inventor: Seki, et al. | Patent Number: 7442324

Potassium monopersulfate solutions
Inventor: Durante, et al. | Patent Number: 7442323

Abrasive-free chemical mechanical polishing compositions and methods relating thereto
Inventor: Ghosh, et al. | Patent Number: 7435356

Particulate or particle-bound chelating agents
Inventor: Small, et al. | Patent Number: 7427361

Etching solution for multiple layer of copper and molybdenum and etching method using the same
Inventor: Kim, et al. | Patent Number: 7416681

Self-cleaning colloidal slurry composition and process for finishing a surface of a substrate
Inventor: Benning, et al. | Patent Number: 7416680

Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions
Inventor: So, et al. | Patent Number: 7402261

Compositions for dissolution of low-k dielectric films, and methods of use
Inventor: Yates | Patent Number: 7399424

Method and composition for electrochemical mechanical polishing processing
Inventor: Liu, et al. | Patent Number: 7390429

Polishing fluid and polishing method
Inventor: Kurata, et al. | Patent Number: 7367870

Slurry for CMP and CMP method
Inventor: Minamihaba, et al. | Patent Number: 7364667

Chemical mechanical polishing systems and methods for their use
Inventor: Wang, et al. | Patent Number: 7354530

Method for roughening copper surfaces for bonding to substrates
Inventor: Bernards, et al. | Patent Number: 7351353

Process of removing residue from a precision surface using liquid or supercritical carbon dioxide composition
Inventor: Cotte, et al. | Patent Number: 7332436

Slurry for CMP, polishing method and method of manufacturing semiconductor device
Inventor: Minamihaba, et al. | Patent Number: 7332104

Dry-etching gas for semiconductor process and preparation method thereof
Inventor: Ji, et al. | Patent Number: 7319174

Chemical-mechanical planarization composition having ketooxime compounds and associated method for use
Inventor: Siddiqui, et al. | Patent Number: 7316977

Polymeric inhibitors for enhanced planarization
Inventor: Zhou, et al. | Patent Number: 7311856

Polishing slurry for chemical mechanical polishing and method for polishing substrate
Inventor: Haga, et al. | Patent Number: 7311855

Chemical mechanical planarization compositions for reducing erosion in semiconductor wafers
Inventor: Liu | Patent Number: 7300603

Selective barrier metal polishing solution
Inventor: Liu, et al. | Patent Number: 7300602

Passivative chemical mechanical polishing composition for copper film planarization
Inventor: Liu, et al. | Patent Number: 7300601

Additive composition, slurry composition including the same, and method of polishing an object using the slurry composition
Inventor: Kim, et al. | Patent Number: 7288212

Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same
Inventor: Kuriyama, et al. | Patent Number: 7285229

Chemical mechanical polishing composition and process
Inventor: Small, et al. | Patent Number: 7276180

Gas compositions
Inventor: Ko | Patent Number: 7273566

Chemical-mechanical polishing (CMP) slurry and method of planarizing computer memory disk surfaces
Inventor: Fang, et al. | Patent Number: 7267784

Package coating, processes of making, and packaging systems
Inventor: Jokela, et al. | Patent Number: 7261928

Acid blend for removing etch residue
Inventor: Torek, et al. | Patent Number: 7261835

Polishing system comprising a highly branched polymer
Inventor: Moeggenborg, et al. | Patent Number: 7255810

Polishing slurry for texturing
Inventor: Horie, et al. | Patent Number: 7255809

CMP slurry for forming aluminum film, CMP method using the slurry, and method for forming aluminum wiring using the CMP method
Inventor: Park, et al. | Patent Number: 7247256

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