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					        Dell Computer Corporation Confidential                                                          Document No. COR.40.WWP.SQ.0023 Rev 2.0


                                               PCBA Quality Process Audit
Information and Instructions
PURPOSE
1. This document was developed as an Audit Tool for SQEs to assess the PCBA Manufacturing Process used by a PCBA Supplier.
2. To communicate Dell's Manufacturing Capability expectations to PCBA Suppliers.
3. The document is intended to provide a roadmap for PCBA Manufacturing Capability improvement and thus improve the
   quality of the product delivered to Dell and the Dell Customer Experience.

SCOPE
The PCBA Audit Document is intended to be used for suppliers/manufacturers of PCBA Products.
This includes, Dell Designed Motherboards, OEM Motherboards, Graphics Cards, Comm Cards, Sound Cards, Dell Designed Peripherals, etc.

AUDIT STRUCTURE and QUESTIONS
The Audit breaks down the PCBA Manufacturing Process into individual process steps, each of which is represented by an individual worksheet.
Within each worksheet is contained a series of questions specifically pertaining to the process being examined.
These questions are focused on evaluating Process Disciplines, Control Methods, Process Capability/Technology, and Attention to Detail
in how a Process is set-up and operated. A green color code is used to highlight those questions which are considered Process Inputs,
and a yellow color is used to highlight those questions considered as Process Outputs.
Coupled with the above, the questions were devised and developed as closed questions with every attempt to avoid ambiguity.
Because of the closed nature of the questions, there can only be one of two answers to any question, i.e. Yes or No.
Thus, the score awarded for any question listed is binary. The criterion is either fully met or it is not.
If the Criterion is met, a score of 1 is obtained.
If the Criterion is not met, a score of 0 is obtained.
If there is any doubt as to the score to award for any given Criterion, than a score of zero shall be awarded.
Any Criterion that scores 1 shall be clearly demonstrated, followed, and be beyond reproach.

PCBA COMPLEXITY and CAPABILITY MATCHING
Under each worksheet, there are five product categories shown. All products supplied to Dell as a PCBA will fall into one of these categories:-
Hi MB: This category includes all Dell designed and OEM Motherboards that have an OFE of greater than 13000.
Lo MB: This category includes all Dell designed and OEM Motherboards that have an OFE of lower than 13000.
Portables: This category includes all Dell Designed and OEM Portable products.
Hi Periph: This category includes Graphics, and Hi End Comms & Raid cards, and Hi End Dell Designed Peripherals such as Sever Memory Boards, etc.
             A product is considered Hi End based either on its OFE count, or if it has greater than one BGA on a board.
Lo Periph: This category includes Comms, Sound, Storage, and Lo End Dell Designed Peripherals, such as Ctrl Pnl, ROMB Key, etc.
             A product is considered a Lo Periph if it contains one or no BGA devices. Typically Lo Periph products have a low OFE count.
An SQE will decide what product category to audit a supplier or potential supplier against, based on the product to be outsourced.
The supplier will complete by self assessment the Audit document by adding a score to the relevant column as determined by the product category.
During the process of the Audit, the SQE will enter the awarded score in the 'Actual' column. In this way the delta between self assessment and
the actual score is always known.
Once a supplier has passed the Audit for a particular product category, the supplier's process is approved for all products within that category,
and for all products in a lower complexity product category.
For the Hi MB category, all questions within each worksheet are considered 'Applicable'.
However, for less complex PCBAs, the full deployment of the Manufacturing Capability requirements for Hi MBs may not be necessary!
For this reason, the audit has been written to accommodate the matching of Manufacturing Capability with PCBA Complexity by allowing some
questions to be considered 'Not Applicable' depending on the Product Category into which each PCBA falls.
Every question deemed 'Not Applicable' to any particular Product Category has been predetermined by Dell SQE for that Product Category.
This 'Not Applicable' determination is indicated by an N/A in the appropriate Product Category column on each worksheet.
No additional questions, other than those that have been predetermined, can be considered 'Not Applicable', unless otherwise stated on the worksheet.

AUDIT RESULTS
The overall process average result determines the Audit score achieved for the PCBA Supplier assessed.
The pass mark for the Audit continues to remain at 80% for all PCBA Products irrespective of complexity. If an overall process average
score of equal or greater than 80% is achieved, a 'Pass' status is awarded as long as no individual processes have failed.
However, if one or more individual processes failed while the overall Audit score of equal or greater than 80% was achieved,
a 'Conditional Pass' status or a 'Fail' status may be awarded by the SQE at their discretion depending on the severity.

AUDITING AN EXISTING SUPPLIER
If the supplier/facility is being audited to assess its ability to supply current product, then the same Product Complexity Category
as the current product should be used on the PCBA Audit Checklist when conducting the audit.
However, if the supplier is being audited to assess its ability to supply a more complex PCBA than it is currently supplying, than the
Product Complexity Category to be completed should appropriately reflect the complexity for the product being assessed.
If a supplier/facility has multiple lines building product for Dell, the SQE should randomly select one line to be audited for the Product Complexity
Category under review. This one line should be followed from start to finish and the line results achieved will reflect the entire facility's score.
Suppliers who have passed the older version of the PCBA Process Audit may fail the updated version. This may occur as it has been six years
since the PCBA Process Audit has had a significant update, and process techniques have considerably changed.

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        Dell Computer Corporation Confidential                                                            Document No. COR.40.WWP.SQ.0023 Rev 2.0

If such a situation arises, then the Fail status should be considered "Conditional Fail", and the Supplier has 90 days to bridge to a 'Pass' Status.
A follow up audit will be arranged by SQE after 90 days to confirm Audit status.


AUDITING FOR NEW SUPPLIER SELECTION
If a new/potential supplier/facility is being audited to assess its ability to supply PCBA product in a particular Product Complexity Category,
then the category to be completed in the audit document should appropriately reflect the product complexity.
If a new supplier/facility has multiple lines, the manufacturing line selected for assessment must be representative of the manufacturing
line that the supplier intends to use to build Dell product. If no such line currently exists, the physical line which most closely matches the
expected capability is selected for audit. The SQE will not consider auditing a 'virtual' line based on some future installed capability.
Unlike existing suppliers, if a new/potential supplier/facility fails to meet the pass score, then the 'Fail' status is immediately awarded.
If a potential new supplier successfully bridges the process gaps, a 'Pass' status may only be awarded based on a Dell follow-up audit.
The 'Pass' status is then recorded on the suppliers record. However, the original 'Fail' status will also remain on the suppliers record.

ACTIONS FOR IMPROVEMENT
One purpose of the PCBA Process Audit document is to define the criteria that Dell expect to be satisfied for the manufacture of its PCBA products.
Dell also has another document which takes this a step further; the 'Best Known Practice Checklist'.
This document takes some of these critical criteria and defines the Best Known Practices in the industry to achieve these expectations.
Thus, the PCBA Process Audit document, coupled with the PCBA Best Known Practice Checklist, provide a detailed roadmap to improve
PCBA Manufacturing Capability and thus improve the quality of the product delivered to Dell and the Dell Customer Experience.
It is clear from the use of these tools that the opportunity for improvement is self evident from the questions that scored zero.
While striving for continuous improvement in all processes is encouraged, the expectation is that the supplier/facility will prioritize and target
those actions that will deliver the biggest immediate impact to VLRR and the Dell Customer Experience.

AUDIT BY SELF-ASSESSMENT
It is expected that the supplier will conduct a self assessment of its own facilities that supply Dell product before and after the official Dell visit.
The purpose of conducting such self assessments is to calibrate the site using the tool and to measure improvement going forward.
However, the official score awarded is that which is given by the Dell SQE at the time of the audit and none other.
Any claimed improvements in score will not be considered official until they have been physically validated by Dell SQE onsite at the supplier.
During the audit process, the Dell SQE may wish to review every question/criterion listed on the audit document, or the SQE may choose only
to focus on those questions for which the supplier awarded themselves a score of 1 by self-assessment. The path taken is left to SQE discretion.
However, the SQE is charged with the responsibility to search for evidence that each criterion is clearly demonstrated, followed, and beyond
reproach in the spirit of which the criterion was intended.

TRAINING
The PCBA Process Audit is very heavy in technical content.
SQEs who use this tool are considered within Dell as being sufficiently qualified to conduct this audit.
To obtain this qualification, an SQE will have participated in at least three audits and lead a fourth under supervision of a qualified auditor.
SQEs wishing to use this tool should contact their regional champion to arrange for training and qualification.

ADDITIONAL QUESTIONS
Please contact William Ryan at 512-725-1393 or william_d_ryan@dell.com.

REVISION HISTORY
A00 Initial Release. Oct 1996 (EMF Controlled Document)
A01 Minor corrections. Dec 1996. (EMF Controlled Document)
Rev 1.4 Addition of RMA and Test Update. Jan 1999. (Initial Release as a Corporate Document)
Rev 2.0 Extensive Review and Re-Write. July 2002.




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Dell Computer Corporation Confidential                                            Document No. COR.40.WWP.SQ.0023 Rev 2.0




                                         PCBA Quality Process Audit
Main Menu

                   SMT                        PTH                   Test                        General

               Paste Printing            Manual Assembly       In Circuit Test                General Process



                 Placement               Wave Soldering    Automatic Functional Test          Rework & Repair



                  Reflow                   Post Wave              Packing                      RMA Process



                                         Mechanical Assy




                                          Instructions            Results




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  Dell Computer Corporation Confidential                                                                                    Document No. COR.40.WWP.SQ.0023 Rev 2.0




                                            PCBA Quality Process Audit                                                                                Menu

Process Audit Results
                          Supplier Name:                                                     Building:                           Date:
                           Facility Name:                                             Line Assessed:
                                                                                                                                 Team:
                  Dell Product Reviewed:                                            Total # Dell Lines:


Audit Results                                                                                              Hi MB    Lo MB    Portables   Hi Periph Lo Periph
                                                          (Please type Y for the Product Type audited)       y

                          Self Score          Dell Score         Pass Score          Max Score              Outcome         Comments

1. Paste Printing             #REF!             #REF!                80%                100%               #REF!
2. Placement                  #REF!             #REF!                80%                100%               #REF!
3. Reflow                     #REF!             #REF!                80%                100%               #REF!
4. Manual                     #REF!             #REF!                80%                100%               #REF!
5. Wave Soldering             #REF!             #REF!                80%                100%               #REF!
6. Post Wave                  #REF!             #REF!                80%                100%               #REF!
7. Mech Assembly              #REF!             #REF!                80%                100%               #REF!
8. In Circuit Test            #REF!             #REF!                80%                100%               #REF!
9. Auto Fn Test               #REF!             #REF!                80%                100%               #REF!
10. Packing                   #REF!             #REF!                80%                100%               #REF!
11. General                   #REF!             #REF!                80%                100%               #REF!
12. Rework & Repair           #REF!             #REF!                80%                100%               #REF!
13. RMA Process               #REF!             #REF!                80%                100%               #REF!

                          Self Score        Dell Score           Pass Score            Result
  Overall Score             #REF!             #REF!                 80%                                   Enter Result
                                                                                                                            SQE Comments on Result

                                                1. Paste Printing
                                                100%
                         13. RMA Process                               2. Placement
                                                 80%

            12. Rework & Repair                  60%                              3. Reflow

                                                 40%

                                                 20%
                11. General                                                            4. Manual
                                                     0%



                  10. Packing                                                        5. Wave Soldering




                      9. Auto Fn Test                                        6. Post Wave

                                8. In Circuit Test               7. Mech Assembly




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Paste Printing
 #
1. Work Instructions
工作說明書
1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

1.10

1.11

1.12

1.13

1.14

2. Solder Paste
錫膏
2.1

2.2

2.3

2.4
2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

2.14

2.15

2.16

2.17

2.18

3. Stencil
鋼板
3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9
3.10
3.11
3.12

3.13

3.14

4. Squeegee
橡膠刷皮
4.1

4.2

4.3

4.4

4.5

5. Vacuum Blocks and Tooling
真空印版及工具
5.1

5.2

5.3

6. PCB
6.1

6.2

6.3

6.4

6.5

6.6

6.7

7. Machine Capability
機器能力
7.1

7.2

7.3

7.4

7.5

7.6

7.7

7.8

7.9

7.10

7.11

7.12

7.13

7.14

7.15

7.16

7.17

7.18

7.19

7.20

7.21

7.22

7.23
8. Solder Paste
錫膏
8.1

8.2

8.3

8.4

8.5

8.6
9. PCBA

9.1

9.2

9.3

9.4
                                                    PCBA Quality Process Audit
                                                                Add a 'Y' to the Box if the Process Was Assessed
Paste Printing
                                                   Audit Criterion
1. Work Instructions
工作說明書 a revision controlled Operator Work Instruction which contains unique details for the specific product
    Is there
     being built?
     是否有對所制產品的特殊細節進行描述且版本受控的工作說明書?
     Are Work Instructions readily available to the operator and are they followed at Paste Print?
     工作說明書是否立馬可取且得到落實?
     Is the Solder Paste specified in the Paste Printing program or on Work Instructions?
     在錫膏印刷程式或工作說明書中是否指明所用到的錫膏?
     Is the Solder Paste manufacturer, number, & mesh defined in the Paste Print Program or on Work Instructions?
     錫膏印刷程式或工作說明書中是否注明錫膏生產廠家,數量和網眼?
     Is the Stencil's identification specified on Work Instructions?
     在工作說明書中是否指明鋼板的標識?
     Is the Stencil's identification traceable to a specific PCB part number, revision level and board side?
     鋼板的標識是否能夠追溯到具體的PCB料號,版本及叛面?
     Is the Stencil loading orientation specified on the Stencil or on Work Instructions?
     在鋼板上或工作說明書上是否有注明鋼板的放置方向?
     Is the Squeegee in use specified in the Paste Print program or Work Instructions?
     錫膏印刷程式或工作說明書中是否注明所用到的橡膠刷子?
     Is the number, location, type and height of the Support Blocks/Pins specified on Work Instructions?
     工作說明書中是否指明了支撐印版/支撐腳的數量、位置、型號以及高度?
     Are all hand tools needed by the operator listed with their descriptions on Work Instructions?
     工作說明書中是否有列出操作員所使用的工具,且有相關描述?
     Has the use of metal tools for the application and/or removal of paste been specifically disallowed?
     是否有特別指明不可使用金屬工具來移除錫膏?
     Is the PCB part number and Revision specified on the Work Instruction or line set-up instructions?
     PCB料號和版本是否在工作程序書中或建立線體的指導書中具體說明?
     Is the PCB orientation to the Stencil identified in the Work Instructions or line set-up instructions?
     工作說明書中或建立線體的指導書中是否注明PCB對鋼板的方向?
     Is the machine Program Name specified on the Work Instruction or line set-up instructions?
     工作說明書中或建立線體的指導書中是否注明機器的程式名稱?
2. Solder Paste
錫膏
     Is there a Standard Operating Procedure for the cold storage of solder paste?
     是否對于錫膏的冷儲藏有一標準作業指導書?
     Is the Solder Paste FIFO controlled while in cold storage with min/max levels defined? A gravity feed rack is
     preferred.
     錫膏在界定的最低/最高水平的冷儲藏中是否進行先進先出管制?
     Does the cold storage unit have a temperature recorder, which can be read without opening the unit, to record
     temperature over time?
     冷儲藏器具是否能夠不打開器具但能讀出溫度?
     Is the temperature recorder linked to an alarm system to provide an indication of an unacceptable temperature
     status?
     溫度計錄器是否和一警扳系統相連以便在溫度處于不可接受的狀態下能予以提示?
     Is there a documented requirement to periodically check that the recorded temperature is within the required
     storage limits?
     是否有文件指明需定期對溫度進行檢查以確認在儲藏溫度界限內?temperature was outside the defined storage
     Is there evidence to demonstrate that action was taken when the
     limits?
     是否有證據證明在溫度超出界限時有采取矯正和預防措施?
     Is the cold storage expiration date of the Solder Paste specified on the Solder Paste container?
     錫膏瓶上是否注明在冷儲藏環境中的過期日期?
     Is the date and time that the Solder Paste has been removed from cold storage specified on its container?
     在錫膏瓶上是否注明從冷儲藏環境中取出的日期和時間? use, after removal from cold storage, specified on its
     Is the date and time that the Solder Paste is available for
     container?
     在錫膏瓶上是否注明從冷儲藏環境中取出後,錫膏可使用的日期和時間?
     Is the date and time that the Solder Paste expires at ambient temperature with its 'seal broken' documented and
     known?
     對于在正常環境/溫度下,封口破裂的錫膏之過期時間和日期有無文件記載並讓人知悉? in tact' documented and
     Is the date and time that the Solder Paste expires at ambient temperature with its 'seal
     known?
     對于在正常環境/溫度下,封口完整無損的錫膏之過期時間和日期有無文件記載並讓人知悉? this process is fully
     Is there evidence to demonstrate that this information has been correctly completed and that
     understood?
     是否有證據證明此信息被正確落實和理解?
     Are Screen Print Operators required to wear gloves when handling Solder Paste?
     當拿取錫膏的時候,是否要求作業員戴手套?
     Is there a specification readily available for the Solder Paste?
     是否有現成的錫膏規格?
     Is the mesh for the Solder Paste used suitable for the pitch technology used on the board being built?
     Is the maximum time that the Solder Paste is allowed to remain
     所使用有的錫膏印刷的網眼是否和制造中的PCB孔距相符合? on a board prior to reflow documented, known, &
     followed?
     在過回焊爐之前,錫膏允許留在板上的最長時間是否有文件指明?是否讓作業沒知曉?是否有在作業過程中遵守?
     Is the Solder Paste lot code recorded and fully and easily traceable to the individual product serial number
     product?
     錫膏批號是否有被記錄以便能完全/輕易地追蹤單個產品的序列號?
     Does the MQT/QMP include the requirement that changes to the Solder Paste used requires advance approval of
     Dell SQE?
     MQT/QMP是否包括任何關于錫膏的變更須事先經過Dell SQE的核準?
3. Stencil
鋼板 Are all Stencils adequately stored in a manner to avoid potential damage and to keep out foreign or airborne
     materials?
     鋼板是否充分保存以避免潛在危害以及防止空氣中的塵埃等物質? are visible when the stencil is in its rack or
     Are all Stencils identified with process proof labels or plates which
     mounted in the Printer?
     當鋼板放于架內或安放于印刷機上時,是否在明顯可見的位置處用制程標簽標識區分?
     Is the Stencil cleaned in a dedicated automatic stencil cleaner at the end of a production run or after a fixed time
     has elapsed?
     生產完成後或固定時間過去之後,是否用專門自動清洗鋼板的設備進行清洗?
     Is there a documented requirement to inspect a Stencil for damage once cleaned?
     清洗之後是否有文件規定須檢查其是否損壞?
     Is the evidence of cleaning and inspection documented?
     是否有清洗記錄及檢驗記錄? Cleaning process which identifies the chemicals, wash times, dry times, &
     Is there a documented Stencil
     consumables to be used?
     是否有文件化清洗鋼板程序以區分化學物質,清洗次數,干燥次數或所使用的耗材?
     Is there a documented Stencil Cleaner maintenance procedure which defines frequency for checking filters and
     solution levels?
     是否有一文件化鋼板清洗機保養程序且定義檢查過濾器的頻率及解決方法之水準? and records are adequate
     Is there evidence to demonstrate that the Stencil Cleaner's Maintenance procedure
     and up-to-date?
     是否有證據證明鋼板清洗機保養程序和記錄充分且為最新版本?
     Is there a documented requirement to periodically check the Stencil tension and is there evidence that this is done?
     是否有文件化需求要定期檢查鋼板的張力並且是否有證據證明此動作已執行?
     Is there a document which specifies Stencil ordering requirements with respect to size, thickness, ratio,
     orientation, identification, etc.?
     是否有一文件指明鋼板存放之順序需考慮其大小,厚度,比率,方向以及標識等?
     Is there a document which specifies the conditions for when Laser vs. Chemical Etched vs. Electroformed Nickel, should be us
     Is there evidence to demonstrate that the Stencil ordering requirements are followed?
     是否有證據證明鋼板存放之順序有被遵守執行?
     Is there a documented Stencil First Article procedure which checks, tension, thickness, aperture sizes, first print,
     etc.?
     是否有鋼板首件檢查程序注明需檢查張力,厚度,網眼大小,以及第一次印刷情況等?
     Is there evidence to demonstrate that the Stencil First Article procedure and records are adequate and up-to-
     date?
     是否有證據證明鋼板首件檢查程序和記錄是充分且為最新版的?
4. Squeegee
橡膠刷皮
     Are the Squeegees length, angle, style/durometer, defined to ensure correct Squeegee selection?
     橡膠刷皮的長度,角度,型號/硬度計是否有定義以確保橡膠刷皮之正確選擇? fully and easily traceable to the
     Is there evidence to demonstrate that the Squeegee used is correct and is
     product and stencil?
     是否有證據證明橡膠刷皮之選擇是正確的,並且能完全、輕易地追溯到產品及鋼板之選用?
     Are all Squeegees adequately stored in a manner to avoid potential damage?
     所有橡膠刷皮是否有充分保存以避免潛在損害?removal from the Printer and prior to storage, and periodically
     Are all Squeegees inspected for damage upon
     during use?
     從印刷機上取出存儲之前,橡膠刷皮是否檢查其損壞與否?在使用是否定時檢查?
     Is there a documented requirement to ensure the Squeegee is leveled prior to use?
     是否有文件需求在使用前要確保橡膠刷皮是水平的?

5. Vacuum Blocks and Tooling
真空印版及工具
     Is there a documented requirement to indicate that Blocks, Support Pins or Vacuum Blocks are needed for
     specific products?
     是否有文件表明在具體的產品生產中所需使用的印版,支撐腳或真空印版? and easily traceable to the product
     Are all Vacuum Blocks identified with a name or tooling number that is fully
     and board side?
     真空印版是否用名稱或工具編寫區分以追溯到產品和PCB板面?
     Are all Vacuum Blocks clean and adequately stored in a manner to avoid potential damage?
     真空印版是否清潔且適當存儲以避免潛在損害?
6. PCB
     Are there satisfactory methods in place to control PCB handling and exposure?
     是否有滿意之方式來控制拿取PCB並且控制暴露在空氣中?
     Does the PCB part number and Revision cross-reference to the PCBA part number and Revision?
     PCB料號和版本和PCBA的料號及版本是否相互對應?
     Is a unique tracking label or PPID label placed on the PCB for tracking purposes at Paste Print?
     在錫膏印刷時PCB上是否貼有追蹤標簽或PPID標簽以便追溯?
     Does the unique tracking label or PPID label date code specify the date the PCB was paste printed?
     在追蹤標簽上或PPID上是否注明PCB印刷的日期?
     Are misprinted PCBs cleaned in a dedicated automatic board cleaner?
     印錯的PCB板是否由一專門的自動清洗機清洗? which identifies the chemicals, wash times, dry times, &
     Is there a documented Board Cleaning process
     consumables to be used?
     是否有文件化清洗板子之程序以區分化學物質,清洗次數,干燥次數以及使用的 耗材?
     Are misprinted boards recorded in the Tracking System and their performance monitored throughout the
     remainder of the process ?
     印刷錯的板子是否在追溯體系里有記錄並在後續制程中亦得到監控?

7. Machine Capability
機器能力
    Is the Paste Printing technology suitable for the product being built? Minimum expected is Fiducial recognition
    with auto squeegee wipe.
    錫膏印刷技術和目前生產的產品相適應?(至少希望是帶有自動橡膠刷的基準點識別的機器)
    Is the Paste Printing operation automated with fiducial camera alignment?
    錫膏印刷是否由基準相機調整且自動印刷?
    Is contact printing with stainless steel stencils and squeegees being used?
    是不由不銹鋼鋼板接觸印刷且橡膠刷皮有被使用?
    Does the Printing machine have the capability to automatically wipe the Stencil?
    印刷機是否可以自行擦拭鋼板?
    Does the Printing machine use the automatic wipe capability?
    印刷機是否使用自動擦拭功能?
    Does the Printing machine have the capability to automatically clean the Stencil with solvent?
    印刷機是否可以使用溶劑自行清洗鋼板?
    Does the Printing machine use the automatic solvent clean capability?
    印刷機是否使用溶劑自行清洗鋼板功能?
    Does the Printing machine have vacuum Stencil clean capability?
    印刷機是否具有真空鋼板清洗能力?
    Does the Printing machine use vacuum Stencil clean?
    印刷機是否使用真空鋼板清洗功能?
    Is there a documented minimum frequency for stencil clean specified based on the technology used on the
    board?
    按照板子所利用到的科技,是否有文件規定最短時間的頻率?
    Are stencil wet and/or dry automatic clean rates specified for each product and shown in the program?
    每一種的自動濕洗或/和干洗比率是否有規定並可以在程式中顯示?
    Are all materials used to wipe the stencil specified as low lint or preferably lint free?
    是否有指明所用到的物料應該是低棉或非棉?
    Are changes to clean rates approved based only upon performance feedback?
    對于清洗比率的改變之核準是否僅僅根據機器運轉之反饋?
    Does the Printing machine have the capability to automatically dispense Solder Paste? Manual Dispense = 0
    印刷機是否有自動分配錫膏之能力?人工分配=0分
    Does the Printing machine use automatic Solder Paste dispense? Manual Dispense = 0
    印刷機是否采用自動分配錫膏之功能?人工分配=0分
    Does the Printing machine flag when the Solder Paste container is near empty? Manual Dispense = 0
    當錫膏快要用完的時候,錫膏印刷機是否有提示?
    Are all Printers enclosed in order to keep out foreign or airborne materials?
    是否所有印刷機都有被封住以防止外界或空氣中的物質灰塵?
    Are localized climate control units installed and in use on all Paste Printers?
    印刷機上是否都裝有局部氣候控制器並且在使用?
    Is the Printing machine programmable? If not score 0 for next 4 questions.
    印刷機是否可以編程?如果沒有,則以下4個問題均為0分.
    Is the machine Program Name revision controlled to show traceability of program changes?
    程式名版本是否受控以便顯示程式變更之追蹤/追溯?
    Is the machine Program Name traceable to the PCB and PCBA part number?
    程式名是否可以追溯到PCB和PCBA料號?
    Is access to the machine program password protected with restricted access?
    程式密碼有否限制和保護?
    Do program changes to critical parameters during machine control remain unsaved unless approved by a
    technician/engineer?
    在机器控制過程中關鍵參數的變更是否未存儲除非由技術員或工程師同意?
8. Solder Paste
錫膏
     Is automatic 2D/3D solder paste inspection deployed and effective? No 2D/3D = 0
     是否有采用2D/3D自動錫膏檢測?沒2D/3D,則0分.
     Can it be demonstrated that the machine calls are reviewed by the operator to determine if real or false? No
     2D/3D = 0
     是否可以証明机器的調用有經由操作員的檢查並判斷其正确与否?with 2D/3D vs the total # of apertures on the
     Is the 2D/3D coverage % calculated based on the total # of pads 沒有2D/3D, 為0分.
     stencil? No 2D/3D = 0
      2D/3D覆蓋率是否由2D/3D計算得來的所有銲點數和鋼板上所有孔徑數目相比較而計算得來?沒2D/3D,則0分.
     Are rejected boards automatically conveyed off the line post operator false call validation? No 2D/3D = 0
     拒收的板子是否可以自動從線上流出? 沒有2D/3D, 為0分.
     Are changes to 2D/3D coverage made based only on performance feedback?
     對于AOI覆蓋率的變更是否僅基于成效之反饋? 沒有2D/3D, 為0分.
     Is there a document which defines the effect of changing critical Paste Printing parameters on the quality of the
     output?
     是否有文件紀錄改變關鍵印刷參數對產品品質的影響?
9. PCBA
    Are outputted boards inspected for print quality to ensure process control? For Lo Periph only, review Paste
     Height Control. Award 1 if OK
     產出的板子是否經過檢驗以确認錫膏的印刷品質?對于Lo Periph, 是否檢查錫膏高度控制. 如果有, 1分.
     Is there a documented frequency for checking print quality?
     是否有文件規定檢查錫膏印刷的頻率?
     Is there evidence to demonstrate that this print quality inspection is conducted?
     是否有証据証明印刷品質的檢查動作有被執行?
     Is there a specification that defines output acceptably, available and used at the Paste Printer?
     錫膏印刷站現場是否有規格定義產品允收水准?
                                                                                                        Maximum Score
                                                                                                         Score Obtained
                                                                                                       Score Percentage
                                                                                                        Pass Percentage
                                                                                                              Outcome
  Hi MB      Lo MB     Portables Hi Periph Lo Periph      Actual

1 or 0 may only be entered. NA is not a valid response.




  Hi MB      Lo MB     Portables Hi Periph Lo Periph      Actual
Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual
med Nickel, should be used?




              Hi MB      Lo MB   Portables Hi Periph Lo Periph   Actual




              Hi MB      Lo MB   Portables Hi Periph Lo Periph   Actual




              Hi MB      Lo MB   Portables Hi Periph Lo Periph   Actual




              Hi MB      Lo MB   Portables Hi Periph Lo Periph   Actual
                                       NA

                                       NA

                                       NA

                                       NA

                                       NA

                                       NA




                                       NA




                                       NA

                                       NA

                                       NA




                             NA        NA




Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual
                                           NA

                                           NA

                                           NA

                                           NA

                                           NA



Hi MB     Lo MB     Portables Hi Periph Lo Periph   Actual




  94        94         94        93        78         94
   0         0          0         0         0          0
                                                      0%
 80%       80%       80%        80%       80%        80%
  Not       Not       Not        Not       Not        Not
Audited   Audited   Audited    Audited   Audited    Audited
Component Placement
 #
1. Work Instructions

1.1


1.2

1.3

1.4

1.5

1.6

1.7

1.8

2. Component Loading and Verification
2.1


2.2


2.3


2.4



2.5


2.6

2.7


2.8


2.9
2.10



2.11


2.12


2.13

3. Nozzles, Feeders, and Tooling

3.1

3.2


3.3

3.4

3.5

3.6


3.7

3.8

3.9

3.10

3.11



3.12


3.13
4. Moisture Sensitive Devices

4.1

4.2
4.3
4.4

4.5

4.6

4.7

4.8

4.9

4.10

4.11
5. Machine Capability

5.1

5.2

5.3

5.4


5.5

5.6


5.7

5.8

5.9

5.10

5.11
6. PCBA

6.1

6.2

6.3
6.4

6.5
7. Attrition Rates and Rejected Components

7.1

7.2

7.3

7.4

7.5


7.6

7.7

7.8

7.9

7.10

7.11
8. Process Capability

8.1

8.2

8.3
                                                      PCBA Quality Process Audit
                                                                   Add a 'Y' to the Box if the Process Was Assessed
Component Placement
                                                      Audit Criterion
1. Work Instructions
      Is there a revision controlled Operator Work Instruction which contains loading information for the specific product
      being built?
      對于生產的產品是否有一版本受控的工作指導書包括所有的上料信息?
      Are Work Instructions readily available to the operator and are they followed at Component Placement?
      工作說明書是否隨手可取并且在零件放置段別确實遵守?
      Are component part numbers and descriptions included on the Work Instructions?
      工作說明書上是否包含有零件料號和品名描述? to check at first-article that the correct components are being
      Are component descriptions sufficiently detailed
      used?
      首件檢查之零件品名描述是否具体以确認零件使用是正确的?
      Is the machine head/slot number for component loading specified for each part number on Work Instructions?
      每一料號的零件上料的机器頭/插槽號碼是否都在工作說明書上指明?
      Are the reference designators and the quantity per part number specified on Work Instructions?
      每一料號的參考資料和數量是否都在工作說明書上得以指明?
      Is the component feeder type/size specified on Work Instructions or otherwise for each component package
      type?
      工作說明書是否指明零件吸嘴型號/尺寸或者指明零件包裝型號?
      Is the machine Program Name specified on the Work Instruction or line set-up instructions?
      工作說明書上或線體架設說明書上是否指明机器程式名稱?
     Is there an Loading and Verification
2. Componentautomated bar coded component loading verification aid in order to reduce the probability of incorrect
      loading?
      是否有自動的上料确認BARCODE輔助系統以減少上料錯誤的可能性?
      Are the component loading verification aids hard linked to the placement program so that loading is verified
      against program data?
      上料 确認輔助系統是否和置件程式相連以依照程式數据再次确認上料之准确性?
      Can traceability of component lot codes be demonstrated for critical devices?
      對于關鍵零件是否可以追溯到零件批號?
      Is component loading/changes verified and cross checked by an individual other than the set-up operator at
      product changeover?
      零件上料以及變更是否有另外一個獨立的作業員進行确認而不僅僅是由線體設定作業員自行檢查?

      Is a component loading/changes verification log signed by the set-up operator and countersigned by the cross
      checker before start up?
      在開始之前, 零件上料/變更表是否由線體設定作業員簽字并且由另一名檢查且确認?
      Is the correct feeder loading base used to facilitate real to feeder loading?
      Are first-built boards verified against documentation for missing/misplaced components and for correct
      component polarity?
      首件板子是否根据文件檢查缺件/錯件和零件极性?
      Are first-articles conducted using AOI methods and complemented with description verification and value
      metering?
      首件檢查是否采用AOI方法輔以品名确認和數值量測?
      Are all Resistors & Capacitors measured for value and tolerance (one per part number) at first-article & at reel
      change?
      首件檢查和更換卷軸料盤的時候是否對電阻和電容的數值和公差進行量測(一個料號量測一個)?
     Is a first-article log signed to verify acceptance before start up?
     在開動之前,首件是否簽名确認符合允收標准?

     Is the orientation of Tantalum SMT capacitors, Diodes, etc in tape format, standardized and documented for
     polarity orientation?
     帶狀鉭質SMT電容,二极管等的极性方嚮是否有被標准化?文件化? indicator that can be used for each
     Is the IC tray loading polarity standardized for each type of polarity
     component?
     IC料盤上料极性是否有被標准化?使得不同的极性指示器可用于不同的零件?
     Is loading polarity referenced both from the tray and the component so as to ensure retrayed components are
     correctly loaded?
     上料极性是否可以從料盤和零件上予以標識以确保重新正确上料?
3. Nozzles, Feeders, and Tooling standardized nozzle diameter set-up selected for each type of placement
     Is there a document which details the
     equipment?
     是否有文件具体描述用于不同的置件設備的標准的吸嘴直徑?
     Are these standardized nozzle diameter set-up documents readily available for when nozzles need to be replaced
     or changed?
     當吸嘴需要更換/改變的時候, 標准吸嘴的直徑設定文件是否立馬可取?
     Is there a document which details the range of component XYZ body sizes that each selected nozzle type can
     successfully place?
     是否有文件具体描述零件的XYZ 本体大小使得選擇的吸嘴型號能順利置件?
     Is there a documented requirement to conduct daily nozzle centering and is there evidence that this is done?
     是否有文件說明每日需要檢查吸嘴是否居于中心?是否有証据証明此動作有被執行?
     Is each feeder identified with its own unique serial number?
     是否每一進料器是否都有自己特殊的序列號以便區分?
     Is there a documented Feeder Maintenance Program in use?
     是否有文件化的進料器保養計划?
     Are database records maintained for each feeder serial number for the purpose of tracking its maintenance
     history and performance?
     對每一序號的進料器的相關資料是否保存以追溯其保養歷史紀錄和其運作狀況?
     Is feeder maintenance history used to monitor feeder life so that problematic feeders can be removed from the
     process?
     進料器保養紀錄是否用于監測進料器的使用壽命使得有問題的進料器能從制程中移走?
     Is the number of feeder indexes counted and monitored for each unique feeder using control software?
     對于使用控制版本軟体的進料器的號碼索引是否計算和監測?
     Is this information used to flag that preventative maintenance is required after x number of indexes?
     此資訊是否用于提示在X次之后需要采取預防保養措施? or Support Pins are or are not needed for specific
     Is there a documented requirement to indicate that Blocks
     products?
     是否有文件指明對于特定的產品需不需要模塊或支撐腳?
     Is the No, location, type and height of Support Blocks/Pins identified on a product by product basis? Score NA if in
     3.11 there are not needed.
     支撐模塊或支撐腳的數量,型號,高度是否基于產品的不同而予以區分?如果3.11條不需要模塊或支撐腳, 則此為0分.
     Are the Support Pin locations identified for each product using templates/tooling or some other effective solution?
     Comment as above.
     對于使用模板/工具或其他有效解決方式的產品是否有區分支撐腳的位置?
4. Moisture Sensitive Devices
     Are components stored before and after loading in a manner which prevents damage?
     上料之前和上料之后零件是否适當存儲以預防損害?
     Are the Moisture Sensitive Devices (MSDs) readily known to the operator?
     作業員 是否知道哪些是潮濕敏感零件?
     Are MSDs time stamped at opening and their exposure time monitored against pre determined limits?
      Is there a flag to indicate that the exposure time has been exceed for any given device?
      是否有標記指明零件開封/暴露時間超過任何所給的零件?
      Can MSD control be demonstrated for MSD devices that need internal/external pre-programming?
      MSD控制是否可以証明MSD 需要內部/外部的預先調試/作業?
      Can MSD control be demonstrated for rejected devices and devices used for rework?
      MSD控制是否可以証明拒收的零件和需要重工的零件?
      Have MSD recovery methods been defined and adequate for all component types?
      MSD恢复方式是否有定義且充分適用于所有型號的零件?
      Does the control of Moisture Sensitive Components include those components on reels?
      對于潮濕敏感性零件的控制是否包括卷軸盤上的零件?
      Is the baking or hot room storage time and temperature documented and controlled for component recovery?
      烘烤室的存儲時間和溫度是否文件化並控制以使零件恢复?
      Has this time and temp been determined based on the component supplier's guidelines?
      這存儲時間和溫度是否依照供應商的指示決定?
      Is there evidence to demonstrate that the control process for MSDs is in use and effective?
      是否有証据証明對MSD的控制是有效的?
5. Machine Capability
      Are Component Placement Programs generated from CAD XY coordinate data?
      置件程式是否根据CAD XY數軸數据得來?
      Is there a standardized nomenclature for Shape Code definition?
      是否有定義標准的SHAPE CODE 命名方法?
      Can this nomenclature be used to determine the most appropriate shape code to allocate to a given part of given
      dimensions?
      此命名方法是否可以用來決定最恰當的SHAPE CODE以便分派給指定的零件/指定的尺寸? on the board?
      Are localized fiducials used for fine pitch devices when localized component fiducials exist
      當localized fiducial存于板上的時候, localized fiducials是否使用以改善小口徑?
      Has manual component moving been eliminated given correct CAD, nozzle set-up, Shape Code allocation, local
      fiducials, Cam speed, etc?
      通過正确的CAD, 吸嘴設定, SHAPE CODE 分派和LOCAL FIDUCIALS, CAM SPEED,
      是否將人工移動零件消除掉?
      Does the Fine Pitch placement machine have the capability to check lead Coplanarity in xyz?
      小口徑置件机器是否具有檢查XYZ零件腳共面的能力?
      Does the Fine Pitch placement machine use its coplanarity capability on all leads of 20 mil pitch or less? If no
      such device, score NA.
      小口徑置件机器是否使用檢查共面的能力來檢查小于20 MIL或更小距离的零件腳?如果沒有, 打分為N/A.
      Does the Fine Pitch placement machine have the capability to check ball arrays? If no such device, score NA.
      小口徑置件机器是否具有檢查BALL ARRAY的能力? array verification capability for all BGA devices? If no such
      Does the Fine Pitch placement machine use its ball 如果沒有, 為N/A
      device, score NA.
      小口徑置件机器是否使用其确認BALL ARRAY的能力來檢查BGA? 如果沒有, 為N/A
      Is the machine Program Name revision controlled to show traceability of program changes?
      机器程式名稱是否受版本控制以顯示對程式變更的追溯?
      Is the machine Program Name traceable to the PCB and PCBA part number?
      机器程式名稱是否可以追溯到PCB和PCBA料號?
6. PCBA outputted boards at least sample inspected pre reflow for placement positional accuracy and for missing
     Are
      components?
      在進入回焊之前, 生產出來的板子是否經過抽驗以檢查置件准确性或是否缺件?
      Is the frequency for this verification defined and documented, and is there evidence to suggest it is followed?
      此确認動作的頻率是否有定義且文件化? 是否有証据証明有被遵照執行?
      Is there a visual aid available which identifies the populated locations with polarity, and also the no-pop locations?
      是否有目視輔助工具來辨識板子上組裝的零件的极性, 以及那些沒有极性的位置?
      Is there a standard which defines placement accuracy acceptability?
      是否有一標准定義置件准确度之允收性?
      Is there evidence to demonstrate that action is taken to adjust the machines performance for when this standard
      is exceeded?
      是否有証据証明當超過標准的時候, 机器有被調整過?
      Is attrition rate and Rejected Components
7. Attrition Ratesmonitoring conducted systematically to ensure feeder and/or nozzle problems are captured real-
      time?
      是否有系統地對磨損率進行監測以确保進料器和吸嘴之問題能及時發現?
      Is there a documented frequency for checking attrition rates to ensure real-time process control?
      是否有文件化的檢查磨損頻率以确保及時制程控制?
      Is there a specification defined for acceptable attrition rates for the individual feeders and for the feeder average?
      是否有一規格定義個別的進料器和所有進料器的平均可允收的磨損率?nozzle skips per machine before it is shut
      Is there a specification defined for the maximum allowable number of
      down for repair?
      是否有規格定義在關機檢修之前最多可允許跳過的吸嘴數目?
      Are these specifications determined based on a percentage combined with the number of placements for a given
      time period?
      這些規格是否基于在固定時間內發生的百分率和置件的數量來決定?
      Is there evidence to demonstrate that attrition rate monitoring is conducted, effective, and used to make process
      control decisions?
      是否有証据表明磨損率監測被有效執行且用于制程控制決策? machine rejected components? Rs and Cs must not
      Is there a documented process for the disposition or reuse of
      be reused.
      是否有文件化制程規定對于机器拋料的處理和重新使用? 電阻和電容不可再使用.
      Are rejected components reviewed and repaired to ensure conformance before reuse, even of only used for
      rework?
      机器拋料在重新使用之前是否檢查和維修以确保其功能一致性, 即使是用于重工?
      Are there repair blocks available or a lead conditioner in use for repairing 'real' Coplanarity rejects? Score 0 if
      parts not repaired.
      Does the retraying process always ensure that component polarity wrt the tray and the component loading polarity
      is preserved?
      重新上料過程是否總能确保零件极性有被考慮?
      Is there a documented Process Deviation procedure to manage the machine skip of parts and their subsequent
      hand placement?
      是否有制程偏离程序來管控机器跳過的零件和后續的手工置件?
8. Process Capability
      Has a Process Capability Analyses (PCA) been conducted for the product being built?
      對所生產的產品是否進行制程能力分析?
      Were shape code allocations, component nozzle allocations, cam speeds, etc. recorded for this PCA?
      制程能力分析中是否紀錄了SHAPE CODE分配, 零件吸嘴分配, CAM SPEED等? speeds, the same as those
      Are the recorded shape code allocations, component nozzle allocations, and cam
      used today?
      紀錄的SHAPE CODE分配, 零件吸嘴分配, CAM SPEED等是否和所使用的一致?
                                                                                                    Maximum Score
                                                                                                     Score Obtained
                                                                                                  Score Percentage
                                                                                                   Pass Percentage
                                                                                                                 Outcome
     y


  Hi MB       Lo MB     Portables Hi Periph Lo Periph     Actual
1 or 0 may only be entered. NA is not a valid response.




  Hi MB       Lo MB     Portables Hi Periph Lo Periph     Actual
                                                 NA


                                                 NA




                                                 NA
Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual




                                       NA

                                       NA




Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual
Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual




                                       NA




Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual
Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual




                                       NA

                                       NA

                                       NA

Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual




 75      75        75        73        62         75
  0       0         0         0         0          0
                                                  0%
80%     80%       80%       80%       80%        80%
N/A     N/A       N/A        N/A      N/A        Fail
                                                                                 PCBA Quality Process Audit
                                                                                              Add a 'Y' to the Box if the Process Was Assessed
Reflow Soldering
 #                                                                 Audit Criterion
1. Work Instructions
      Is there a revision controlled Operator Work Instruction which contains set-up information for the specific product being reflowed?
1.1
      對于具体的過回焊爐的產品是否有一版本受控的工作指導書且包括所有的設定信息?
      Are Work Instructions readily available to the operator and are they followed at Reflow?
1.2   工作說明書是否隨手可取并且在回焊爐段別确實遵守?
      Is the conveyor speed set point specified on the Work Instruction and is it the same as that specified in the program?
1.3
      工作說明書是否指明傳輸帶速度并且和程式中的一致?
      Are the temperature set points specified on the Work Instruction and are they the same as those specified in the program?
1.4   工作說明書中是否指明溫度的設定點并且和程式中的一致?
      Do Work instructions indicate if pallets or other tooling are or are not required?
1.5
      工作說明書是否指明是否需要托盤或其它工具.
      Do Work instructions indicate if center rail support is or is not required, and if required, is the location specified?
1.6   工作說明書是否指明是否需要中心軌座, 如果需要, 是否指明位置?
      Is the machine Program Name specified on the Work Instruction or set-up sheets?
1.7
      工作說明書或設定說明中是否指明机器程式名稱?
2. Machine Capability
    Is the Reflow technology in use suitable for the product being built? Must be full forced Convection with sufficient zone count.
2.1 回焊爐所使用的技術是否和生產的產品相符合? 必須是強制對流且具有足夠的區域.
    Are air flow controllers used to balance exhaust flow rates for all exhaust drops/connections? Settings must be documented.
2.2 空气流動控制器是否用以平衡廢气流比率? 設定必須文件化.
    Does the Reflow Oven have the capability to use Inert Gas Reflow? No Inert Gas Capability = 0
2.3 回焊爐是否具有使用惰性气体回流的能力, 否則為0分.
    Is the machine Program Name revision controlled to show traceability of program changes?
2.4 机器程式名稱版本是否受控以追溯程式的變更?
    Is the machine Program Name traceable to the PCB and PCBA part number?
2.5 机器程式名稱是否可以追溯到PCB, PCBA料號?
    Is access to the machine program password protected with restricted access?
2.6 程式密碼是否受保護以控制進入權限?
    Do program changes to critical parameters during machine control remain unsaved unless approved by a technician/engineer?
2.7 在机器控制過程中關鍵參數的變更是否未存儲除非由技術員或工程師同意?
3. Temperature Profile
     Is there available a Temperature Profile for the product currently being built?
3.1 是否有所生產產品的溫度曲線?
     Is the Temperature Profile assessable and readily available to operators / technicians as and when required?
3.2 當需要時, 作業員和技術員是否可以隨時取得溫度曲線?
     Were the Temperature Set Points and Conveyor Speed logged for that Thermal Profile when it was conducted?
3.3 溫度設定點和傳輸帶速度是否有被紀錄成溫度曲線?
     Do the Temperature Set Points & Conveyor Speed written on the Thermal Profile correspond to the current Program settings?
3.4 溫度曲線上的溫度設定點和傳送帶速度是否和當前的程式設定一致?
     Is there available an Engineering based specification to detail the acceptable process window for Temperature Profiles?
3.5 是否有工程基礎上的規格以具体描述溫度曲線的允收制程窗口?
     Was the Engineering based spec. derived from the Paste manufacturer's recommendations but controls to a narrower window?
3.6 工程規格是否從錫膏生產厂商建議所得但是比建議更加嚴格?
     Does the product Temperature Profile fall within the Engineering based specification for the process window?
3.7 對于制程窗口, 溫度曲線是否适合基于工程要求的規格?
     Does the product Temperature Profile fall within the Engineering based specification for glass transition temperature requirements?
3.8 對于玻璃傳導溫度需求, 產品溫度曲線是否适合基于工程要求的規格?
     Can any excursions outside of the process window be justified and supported with hard evidence and logical analysis?
3.9 是否任何偏移可以被証明是正當的而且可以由相關証据証明并且有合理的分析?
     Are the boards used to establish the initial Thermal Profile kept as engineering samples?
3.10 用于建立溫度曲線的板子是否保留當作工程樣品?
     Is there evidence that a comparison study been conducted between the Thermal Profiles achieved from a loaded versus an unloaded oven?
3.11 是否有証据表明對于從有載回焊爐和無載回焊爐測量所得的溫度曲線進行過比較研究?
     Have at least five thermocouples been used at various points on the board to establish the Thermal Profile? Validate locations.
3.12 建立溫度曲線的時候, 是否最少用到5隻熱電偶來測量板子的不同位置?請指明並确認這些位置.
     Is there a documented and systematic approach used to identify the most appropriate locations to attach the thermocouples?
3.13 是否用文件化且系統化的方式來辨識最合適的位置以附上熱電偶?
     Is there evidence that each thermocouple ball was bonded to a board joint using HTS or Conductive Epoxy?
3.14 是否有証据表明每一個熱電偶球都是用導熱鹽或傳導性環氧化物來和板子的接點相凝結?

     Does the capability exist to continuously monitor oven Temperature Profiles using Virtual Profiling methods and thus detect degradation?
3.15 是否有能力通過可視性方式來不斷監測爐溫曲線從而及時發現溫度的變化?
     Is there the capability to detect a blower/fan failure and trigger an alarm automatically if this occurs?
3.16 是否有能力發現吹風机/風扇不良并且自動發出警報?
     Has a Calibration Profile been established in order to detect machine performance degradation?
3.17 是否建立一校準曲線來探測机器性能的退化?
     Is there a documented frequency for running a Calibration Profile and was it established based upon historical performance data?
3.18 是否有文件定義校準曲線進行的頻率? 其是否基于所紀錄的性能數据/工作特性而建立?
     Is there evidence to demonstrate that Calibration Profiles are conducted and that records are up-to-date?
3.19 是否可以証明校準曲線有被執行且記錄是最新的?
3.20 Is the practice of comparing the current Calibration Profile to the Standardized Calibration Profile used to identify changes?
     Is the current Calibration Overlay/Profile used to determine if a variation in the ovens thermal characteristics has occurred?
3.21 現行的校準覆蓋圖/曲線是否用以測定爐溫性能的變化?
     Is the current Calibration Overlay/Profile used to determine if a variation in conveyor speed has occurred?
3.22 現行的校準覆蓋圖/曲線是否用以測定傳輸帶速度的變化?
     Is there evidence to demonstrate that action was taken when the Calibration Profile was different to the Standard?
3.23 是否有証据可以表明當校準曲線和標准不同的時候,已經采取改善措施?
     Is a tool, such as a OvenRider, used with a standardized profile to conduct a Calibration Profile?
3.24 當進行校準曲線量測時, 是否有采用標准曲線和輔助工具, 比如: OVENRIDER?
     Is there evidence that the oven has the capability to trigger a warning alarm before the profile shifts outside the desired process window?
3.25 回焊爐是否有能力在溫度曲線偏离預想制程窗口之前可以自動發出警報?
     Is there a policy for maximum number of thermal excursions allowable per board?
3.26 是否有規定每一板子所允許的溫度偏移最多次數?
     Is this policy known to and practiced by the operators?
3.27 作業員是否熟悉并且按照這規定操作?
4. Manual Inspection
    Are outputted boards 100% inspected post reflow for placement positional accuracy, missing components, and solder defects?
4.1 過回焊爐后的板子是否100%檢驗以對置件位置不精确, 缺件以及焊錫不良現象進行糾正?

    Are Workmanship Standards defined for placement and soldering, and are they accessible and used to determine board acceptability?
4.2 是否定義置件和焊錫工藝的標准? 是否易懂并且用以決定板子的可允收性?
    Are Inspection Templates available and used to identify missing & unpopulated components and component polarity post reflow?
4.3 過回焊爐后是否用罩板檢驗缺件, 未組裝零件和零件极性?
    Are Inspection Templates or Visual Aids used to identify ICT not tested components post reflow?
4.4 過回焊爐后是否用罩板或目視輔助工具(放大鏡)來檢驗沒經ICT測試的零件?
    Are Templates readily accessible for verification purposes?
4.5 出于驗証的目的,罩板是否可以取得使用?
    Are Inspection Templates revision controlled and traceable to the current product ECO level?
4.6 罩板版本是否受控並能追溯到現行產品的ECO層次?
    Is there a software tool post reflow which is linked to CAD or program data to facilitate component identification and inspection?
4.7 回焊爐后是否采用和CAD或者程式數据相連的軟件工具來幫助零件辨識以及檢驗?
     Is there a documented requirement to conduct sampling X-ray inspection for BGA devices, and is there evidence that it is practiced?
4.8 是否有文件需求對于BGA零件需要進行X-RAY檢驗, 是否有証据表明此動作有被執行?
5. Automatic Inspection
    Are AOI methods, which include solder joint inspection, used post-reflow pre-wave for all reflowed parts? No AOI = 0
5.1 對于所有過回焊爐但未經錫爐的零件, 是否采用AOI方式, 包括銲點檢驗?
      Is the AOI coverage % calculated based on the board OFE for a given side vs the total # of joints/components inspected? No AOI = 0
      AOI覆蓋率是否通過所給板面的OFE和所檢驗的全部接點/零件數相比較而計算得來?
5.2
    Are the components/joints not covered by AOI documented and known and targeted for visual inspection? No AOI = 0
5.3 對于沒有被AOI覆蓋的零件/接點, 是否有文件注明并且讓人知曉其需要目視檢驗? 沒有AOI, 為0分.
    Is there evidence that the AOI coverage is verified periodically by using ICT pareto feedback and manual inspection results?
5.4 是否有証据表明AOI覆蓋率是根据ICT柏拉圖分析和目視檢驗結果來定期确認的?
      Is AOI data auto uploaded/linked to the shop floor data collection system?
5.5 AOI數据是否自動上載/連接到現場數据收集系統?
     Can it be demonstrated that the machine calls are reviewed by the operator to determine if real or false? No AOI = 0
5.6 是否可以証明机器的調用有經由操作員的檢查並判斷其正确与否? 沒有AOI, 為0分.
     Can it be demonstrated that the operator been fully trained and certified to interpolate the AOI images presented? No AOI = 0
5.7 是否可以証明操作員經過完全訓練並可以對AOI顯示的圖面進行更改? 沒有AOI, 為0分.
     Does the ICT pareto of defects suggest that AOI is being 100% deployed and is being effective? No AOI = 0
5.8 ICT 不良柏拉圖是否用以建議應100%采用AOI測試並使之有效? 沒有AOI, 則為0分.
     Can a feedback mechanism be clearly demonstrated from ICT to AOI to improve program and operator effectiveness? No AOI = 0
5.9 是否可以証明從ICT到AOI的回餽机制對于改善程式和作業之有效性?沒有AO﹐為0分
     Are rejected boards automatically conveyed off the line post operator false call validation? No AOI = 0
5.10 拒收的板子是否可以自動從線上流出? 沒有AOI, 為0分
     Are changes to AOI coverage made based only on performance feedback? No AOI = 0
5.11 對于AOI覆蓋率的變更是否僅基于成效之反饋? 沒有AOI, 為0分
6. Process Control
      Is real time Statistical Process Control (SPC) used to monitor the process output post reflow? ('real-time'=now, except for Lo Periph=1 to 2
      hrs)
6.1   過回焊爐后是否采取即時SPC以監測制程輸出?
      Is the processes DPMO and the products DPU monitored in real time? ('real-time'=now, except for Lo Periph=1 to 2 hrs)
6.2   是否即時監測制程DPMO和產品DPU?
      Is OFE data readily available & based on solder joint & component count data for what is actually placed?
6.3   OFE數据是否立馬可取并且是基于實際置件之銲點和零件數据?
      Is AOI data used to calculate SMT's DPMO? No AOI = 0
6.4   是否采用AOI計算SMT的DPMO? 沒有AOI, 為0分
      Are ICT debug results used to calculate SMT's DPMO?
6.5   ICT調試結果是否用以計算SMT的DPMO?
      Is the data collected meaningful and can it be demonstrated that it is used to make process control decisions?
6.6   數据收集是否有意義並表明其是用以對制程控制進行決策?
                                                                                                                                   Maximum Score
                                                                                                                                   Score Obtained
                                                                                                                                 Score Percentage
                                                                                                                                  Pass Percentage
                                                                                                                                        Outcome
  Hi MB      Lo MB    Portables Hi Periph Lo Periph       Actual
1 or 0 may only be entered. NA is not a valid response.




  Hi MB      Lo MB    Portables Hi Periph Lo Periph       Actual




                                     NA        NA




  Hi MB      Lo MB    Portables Hi Periph Lo Periph       Actual
                             NA        NA




Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual




                             NA        NA



Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual
                                       NA
                                           NA


                                           NA

                                           NA

                                           NA

                                           NA

                                           NA

                                           NA

                                           NA

                                           NA

                                           NA

Hi MB     Lo MB     Portables Hi Periph Lo Periph   Actual




                                           NA




  66        66         66        63        51         66
  0          0         0         0         0           0
                                                      0%
 80%       80%       80%       80%       80%         80%
  Not       Not       Not       Not       Not         Not
Audited   Audited   Audited   Audited   Audited     Audited
Manual Assembly
 #
1. Work Instructions

1.1


1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

1.10

1.11

1.12

1.13

1.14

1.15

1.16
2. Station Breakout

2.1

2.2

2.3
2.4


2.5

2.6

2.7

2.8

2.9
3. Line Set-Up and Verification

3.1

3.2

3.3

3.4

3.5

3.6
4. Tooling

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

4.10

4.11
5. Manual Inspection

5.1

5.2

5.3

5.4

5.5

5.6

5.7

5.8

5.9

5.10



                       Pass Percentage
                             Outcome
                                                    PCBA Quality Process Audit
                                                                 Add a 'Y' to the Box if the Process Was Assessed
Manual Assembly
                                                    Audit Criterion
1. Work Instructions
    Are revision controlled Work Instructions displayed for the operator at each assembly station?
    在每一站別是否都有版本受控的工作說明書?
    Are Work instructions free of hand written updates? Temporary hand written updates are OK if signed and dated
    with expiration date <48 hrs.
    工作說明書是否沒有\手寫更改?允許暫時性的更改, 但必須簽名并且只在48小時內有效.
    Are component part numbers and their descriptions specified on Work Instructions?
    工作說明書是否有指明零件料號和品名規格?
    Are component descriptions sufficiently detailed to ensure the correct component is being used?
    零件品名規格描述是否足夠具体以确保使用的是正确零件?
    Are the reference designators and the quantity per part number specified on Work Instructions?
    工作說明書上的參考指示和每一料號所使用的數量是否有指明?
    Is component polarity or its non-existence consistently and unambiguously specified on Work Instructions?
    工作說明書上是否明确不含糊的指明了零件的极性以及不需上件的位置?
    Are the components on the Work Instructions listed by the most appropriate order of insertion?
    工作說明書上所列的零件是否基于最适當的插件順序排列?
    Is the layout of lin bins/trays defined on Work Instructions for each assembly station?
    每一組裝站別的工作是否注明了零件料盒/料盤的布局?
    Are all lin bins/trays located in the correct position as per Work Instructions for each assembly station?
    所有零件料盒/料盤是否依照工作說明書指示放在正确位置?
    Do Work instructions indicate if solder pallets/carriers or breakers should or should not be used?
    工作說明書有沒有指明是否需要墊板/CARRIER或擋板?
    Do Work instructions indicate if a top hat, separators, plugs, Kapton tape, finger protection, etc.should or should
    not be used?
    工作說明書有否指明是否需要TOP HAT,align with the orientation 膠帶, 手指套等?the Work Instructions and Wave
    Does the direction of build for the board 隔离物, 插座, KAPTON of the board on
    direction?
    生產的板子是否和工作說明書上板子的方嚮以及過錫爐的方嚮是否一致?
    Do Work Instructions not only indicate what components need to be inserted but also the buddy check
    components?
    工作說明書是否不僅指明了需要手插的零件, 而且指明了需要一并檢查的零件?
    Is the conveyor's speed or indexing rate correctly documented on Work Instructions?
    工作說明書是否寫明了傳送速度或者標定指數?
    Is the PCB part number and Revision specified on the Work Instruction or line set-up instructions?
    工作說明書或線體設定指導書上指明了PCB料號和版本?
    Does the PCB part number and Revision cross-reference to the PCBA part number and Revision?
    PCB料號和版本是否和PCBA的料號和版本互相對應?
2. Station Breakout
    Is there a document available which describes the guidelines for station breakout at Manual Assembly?
    是否有文件描述在組裝段區分各站別及工作量的指導說明?
    Has the number of assembly stations required been determined scientifically in order to maximize throughput
    within constraints?
    是否需求的插件站別有被科學定義以最大限度的提高生產量?
    Is there evidence that the line is evenly balanced with the defined number of stations and the defined station
    breakout?
    是否可以証明線體在站別數和站別工作量上是均勻的平衡的?
     Is there evidence to demonstrate that the assembly operators follow the defined station breakout on the Work
     instructions?
     是否可以表明組裝作業員是依照工作說明書上的站別區分來工作的?
     Is there evidence that the conveyor speed or index rate is set such that there is sufficient time to complete each
     station operation?
     是否可以表明傳輸帶速度和指數率有被設定而且每段別都有足夠的時間來完成各段工作?
     Does following the breakout ensure that the insertion of subsequent components is not restrictive or increased in
     difficulty?
     是否有遵照站別區分以确保插件不受限制也不增加困難度?
     Does following the breakout ensure that 'snap-in' type components are inserted first or off-line?
     是否遵照站別區分以确保"Snap-in"類型零件先插或者在線下進行? are assembled at different and non-adjacent
     Does following the breakout ensure that components that 'look' alike
     stations?
     是否遵照站別區分以确保外觀相似的零件在不同的站別且不在相鄰的站別進行作業? different and non-adjacent
     Does following the breakout ensure that components that 'fit' alike are assembled at
     stations?
     是否遵照站別區分以确保"FIT" ALIKE零件在不同的站別且不在相鄰的站別進行作業?
3. Line Set-Up and Verification
     Are all Manual Assembly station set-ups verified according to Work Instructions and a log signed prior to start-up
     & re-start?
     在開動/或重新開動之前, 所有手插件段別的設定參數是否依照工作說明書和簽認的注意事項确認無誤?
     Are first-built boards verified against documentation for missing components, value, and for correct polarity pre
     Wave?
     在過錫爐之前, 首次生產的產品是否依照文件确認缺件与否,數值正确与否,极性正确与否? length, forming and
     Are the components supplied to Manual Assembly appropriately prepped with correct lead
     pitch, etc.?
     提供給手插件的零件是否經過預先的准備使得零件腳長, 成型以及距离都無誤? prep and/or pallet support
     Is it evident that lead snipping has been minimized through adequate component
     design?
     是否可以証明零件減腳已經通過零件備料和工板支持設計而變得最小化? designators, station number, and
     Are all lin bins/trays labeled with printed part numbers, descriptions, circuit
     layout information?
     是否所有零件料盒/料盤是否都貼有印刷的料號,品名, 線路參照, 站別號,以及分布圖?
     Are boards conveyed along the line automatically without the need to manually push the board forward?
     線體是否可以自動向前傳送板子而不必手工推動板子?
4. Tooling
     Is tooling used to provide underside support on all sides for the insertion of components like PCI & Dimm
     connectors?
     Is tooling used and is it adequate to 是否用工具在板子的各方面支撐?
     當手插PCI 和DIMM等連接器的時候,prevent board flexing during component insertion?
     插件的時候是否用治具防止板子彎曲變形?
     Is tooling used to verify pin straightness of connectors such as PCI or Dimm connectors prior to insertion?
     在插PCI 或DIMM之類的零件之前是否用治具檢查連接器腳是否豎直?
     Is there a document available which describes the guidelines for pallet/carrier design?
     是否有文件描述PALLET/CARRIER 的設計指導說明?
     Are footprint, co-planarity, depth below datum, ID, clamping mechanisms, chamfering, direction of flow, criteria
     Are pallets/carriers identified by a name or tooling number which is traceable to the PCBA part number and
     addressed?
     revision?
     PALLET/CARRIER是否用名稱或工具號碼區分標識且能追溯到PCBA的料號和版本?
     Is pallet/carrier orientation to the line specified or indicated and correct?
     PALLET/CARRIER在線上的方嚮是否指明且正确無誤?
     Are pallets/carriers designed such a way that they support all non-snap-in components without the use of
     weights?
     PALLET/CARRIER的設計是否可以支持NON-SNAP-IN 零件而不需要使用砝碼來壓住?
     Are pallets/carriers appropriately milled out to avoid shadowing and unsoldered vias on the board solder side?
     PALLET/CARRIER 是否适當銑過以避免板子錫面出現陰影或空焊?
     Do pallets/carriers use built in solder thieves to help reduce the occurrence of solder bridging?
     PALLET/CARRIER 是否采用built in solder thieves 方式以減少錫橋的出現?
     Are pallets/carriers in a good state of repair, clean, and satisfactorily stored to prevent damage?
     PALLET/CARRIER 是否經過良好維修, 洁淨并且妥善存儲以防止損害?
5. Manual Inspection
    Are outputted boards 100% inspected pre wave (Top Side) for missing components, value and polarity?
    產出的板子是否在過錫爐之前對缺件, 容量/阻值以及极性等100%檢驗?
    Is there evidence to demonstrate that this quality inspection is conducted?
    是否有証据表明有執行此品質檢驗?
    Is there a visual aid (hard copy or otherwise) which identifies the populated locations with polarity, and also the no-
    pop locations?
    是否有一目視輔助工具(硬拷貝或其它)區分已經組裝的零件的极性, 對于未組裝的位置是否也有標識?
    Is there a buddy check system used between stations to ensure the previous operation has been fully completed?
    是否有相互檢查体系以使站別之間各作業員相互檢查确保前站作業已經完全完成?
    Is there evidence to demonstrate that a buddy check system is deployed between assembly stations?
    是否有証据表明此檢查系統有被執行?
    Is the touch method used as part of the buddy system?
    拿取板子的方式是否也是檢查系統的一部分? tested by ICT specifically targeted for inspection in addition to the
    Are manually inserted components that are not
    buddy check?
    除了相互檢查之外, 未被ICT測試的手插零件是否有指明還需檢驗?
    Is there evidence to demonstrate that a real-time defect feedback process is in operation to Manual Assembly?
    是否有証据証明在手插組裝過程中實行了即時不良回饋之作業?
    Is accountability for Manual Assembly defects traceable to a specific workstation and operator/supervisor?
    是否可追溯到每一具体站別/作業員/領班的手插不良數目?
    Is tooling used to facilitate the inspection of connectors for bent pins post insertion?
    插件完后是否有使用工具幫助檢查連接器是否彎腳?
                                                                                                         Maximum Score
                                                                                                          Score Obtained
                                                                                                      Score Percentage
                                                                                                        Pass Percentage
                                                                                                                Outcome
  Hi MB       Lo MB    Portables Hi Periph Lo Periph      Actual
1 or 0 may only be entered. NA is not a valid response.




  Hi MB       Lo MB    Portables Hi Periph Lo Periph      Actual
Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual




Hi MB   Lo MB   Portables Hi Periph Lo Periph   Actual
Hi MB     Lo MB     Portables Hi Periph Lo Periph   Actual




  52        52         52        52        52         52
   0         0          0         0         0          0
                                                      0%
 80%       80%       80%        80%       80%        80%
  Not       Not       Not        Not       Not        Not
Audited   Audited   Audited    Audited   Audited    Audited
Wave Soldering
 #
1. Work Instructions

1.1


1.2

1.3

1.4


1.5


1.6

1.7

1.8

1.9

1.10

1.11

1.12

1.13

1.14

1.15

1.16

2. Machine Capability
2.1

2.2

2.3
2.4

2.5

2.6

2.7

2.8

2.9

2.10

2.11

2.12

2.13

2.14

3. Flux Application
3.1
3.2
3.3
3.4
3.5
3.6
3.7
4. Wave Set-Up
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
5. Temperature Profile
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
5.17
5.18
5.19
5.20
5.21
5.22
5.23
5.24
6. Solder Analysis
6.1
6.2
6.3
6.4
7. Manual Inspection
7.1
7.2
7.3
7.4



                       Pass Percentage

                             Outcome
                                                      PCBA Quality Process Audit
                                                                    Add a 'Y' to the Box if the Process Was Assessed
Wave Soldering
                                                      Audit Criterion
1. Work Instructions
    Is there a revision controlled Operator Work Instruction which contains set-up information for the specific product
    being processed?
    是否有一版本受控的工作說明書包含了所生產產品的設定信息?
    Are Work Instructions readily available to the operator and are they followed at Wave?
    工作說明書是否隨手可取并且确實遵守?
    Do Set-Up Sheets specify the Solder, the Flux, and the thinners (as applicable) to be used?
    設定指導頁是否指定錫膏,助銲劑,稀釋劑(如果適用)? settings such as delay, duration, traverse speed, pressure,
    Do Set-Up Sheets specify the Spray Flux parameter
    etc?
    設定指導頁是否指明了助銲劑的噴射參數設定如:遲滯, 維持, 來回速度, 壓力等?
    Do Set-Up Sheets specify the Pre-Heater set points and the Solder Pot Temperature and are they the same as
    those in the program?
    設定頁是否指明預熱設定點和錫爐溫度? 是否和程式中一致?
    Do Set-Up Sheets specify the Conveyor Speed and is it the same as that in the program?
    設定頁是否指明暸傳輸帶速度? 是否和程式中一致?
    Do Set-Up Sheets specify the Lead Clearance and is it the same as that set by the machine?
    設定頁是否指明LEAD CLEARANCE? 是否和程式一致?
    Do Set-Up Sheets specify the required Wave Height (Not Solder Pot Pump Speed) to be used?
    設定頁是否指明所需求的錫波高度(不是錫爐泵速度)?
    Do Set-Up Sheets specify Wave Type (Chip/Lambda/Omega) to be used?
    設定頁是否指明了WAVE的型號(Chip/Lambda/Omega)?
    Do Set-Up sheets specify the Solder Pot Hot Air Knife Pressure and Temperature settings? No Air Knife = 0
    設定頁是否指明錫爐熱气刀壓力和溫度設定? 沒有气刀為0分.
    Do Set-Up sheets specify if the Finger Cleaner should be on? No Finger Cleaner = 0
    設定頁是否指明需要打開FINGER CLEANER? 沒有Finger Cleaner, 為 0
    Do Set-Up Sheets indicate if Nitrogen should or should not be used when the capability exists?
    如果具有此功能的話, 是否注明需不需要使用氮气?
    Is the machine Program Name specified on the Work Instruction or set-up sheets?
    工作說明書或設定頁上是否指明了程式名稱?
    Do the all the above wave parameter settings correspond to those settings in the program recipe?
    上述所有錫爐設定是否和程式一致?
    Are Generic Wave Set-Up Parameters documented? These are the parameters which are not changed for
    product changeovers?
    是否將一般的錫爐設定文件化? 這些設定不會因為產品的變更而變化?
    Do these Generic Wave Set-Up Parameters include, pressure settings, conveyor angle, etc.
    這些一般設定是否包括壓力設定? 傳輸帶角度?
2. Machine Capability
    Is the flux application technology in use suitable for the product being built? If not Spray = 0
    助銲劑使用的技術是否和生產的產品适合? 沒有噴射, 為0.
    Is the wave technology in use suitable for the product being built? If not programmable = 0
    錫爐工藝/技術是否适合所生產的產品? 如果不能編程, 為0.
    Does the wave use a top side pre-heat and/or deploy forced convection? No capability = 0
    錫爐是否采用上部預熱和/或采用強制對流? 沒有此功能, 為0.
    Are air flow controllers used to balance exhaust flow rates for all exhaust drops/connections?
    是否使用空气流嚮控制器來平衡廢气流比率?
    Is Automatic Wave Height control installed to control the laminar wave height? No AWH Control = 0
    是否安裝自動錫波高度調節器來控制錫波高度? 沒有AWH, 為0分.
    Is Lead Clearance program controlled? Not program controlled = 0.
    是否控制LEAD CLEARANCE 程式? 沒有控制程式為0.
    Is there a Solder Pot Hot Air Knife installed and used on the wave equipment? No Air Knife = 0
    是否有安裝錫爐熱气刀? 否則為0.
    Is there an automatic Finger Cleaner installed and used on the wave equipment with an appropriated cleaning
    fluid? No FC = 0
    Does the Wave have the capability to use Nitrogen? No Nitrogen Capability = 0

    Is the machine Program Name revision controlled to show traceability of program changes?

    Is the machine Program Name traceable to the PCB and PCBA part number?

    Is access to the machine program password protected with restricted access?
    Do program changes to critical parameters during machine control remain unsaved unless approved by a
    technician/engineer?

    Is the safety equipment and protective clothing provided adequate and are they used?

3. Flux Application
    Is flux applied using either a fixed nozzle or moving nozzle spray application method? Any other application method = 0
    Can the sequence of; detection, delay, trigger, duration, and stop, be clearly explained by a technician? Other method = 0
    Is the detection, delay, trigger, duration, and stop, controls performing as expected? Other method = 0
    Is there a feedback link between the conveyor speed and the flux applicator to auto-compensate for changes? Other method =
    Is there an automatic sensor that indicates when a flux drum is near empty?
    Is there a test used to check the quantity of flux applied to the board to ensure it is optimum?
    Is there a test used to check the coverage of flux applied to the board to ensure it is sufficient?
4. Wave Set-Up
    Has specifying the Solder Pump Speed value been discontinued as a way to achieve the desired Wave Height?
    Is the relationship between Wave Height set-up and Contact Area/Length known for the product being processed?
    Is there a Quartz Plate available to verify Contact Area/Length achieved for the board being processed?
    Is the documented Contact Area/Length being achieved for the Wave Height set-up used?
    Does the shape of the Contact Area indicate parallelism?
    Does the Contact Length coupled with the Conveyor Speed, achieve the documented dwell time requirement?
    Is there evidence that Contact Area/Length and shape verified after Solder Pot removal and replacement, and maintenance?
    Is there evidence that the Contact Area/Length and shape verified on addition of solder or on adjustment of lead clearance?
    Does the board/pallet exit the Solder Pot in the stagnant area for the set conveyor angle and lead clearance?
    Are all conveyor Fingers in a good state of repair?
    Is the quantity, type and spacing of each Finger design defined for the conveyor?
    Has the pot been set up to run with an intermittent wave so as to reduce dross build up? If gap between subsequent PCBAs too
    Does the level of Dross in the pot suggest that the pot is dedrossed at least once every 8 hours?
5. Temperature Profile
    Is there available a Temperature Profile for the product currently being built?
    Is the Temperature Profile assessable and readily available to operators / technicians as and when required?
    Were the Pre-Heat Set Points, Conveyor Speed, and Solder Temperature logged for that Thermal Profile when it was conducte
    Do the Set Points, Conveyor Speed & Solder Temp written on the Thermal Profile correspond to the current Program settings?
    Is there available an Engineering based specification to detail the acceptable process window for Temperature Profiles?
    Was the Engineering based spec. derived from the Flux manufacturer's recommendations but controls to a narrower window?
    Does the product Temperature Profile fall within the Engineering based specification for the process window?
    Does the product Temperature Profile fall within the Engineering based specification for glass transition temperature requireme
    Can any excursions outside of the process window be justified and supported with hard evidence and logical analysis?
    Are the boards used to establish the initial Thermal Profile kept as engineering samples?
    Have at least five thermocouples been used at various points on the board to establish the Thermal Profile?
    Is there a documented and systematic approach used to identify the most appropriate locations to attach the thermocouples?
    Is there evidence that each thermocouple ball was bonded to a board joint using HTS or Conductive Epoxy?
    Is the top side Temperature Profile low enough to prevent secondary reflow? Must be below 160 degrees C.
    Has a Calibration Profile been established in order to detect machine performance degradation?
    Is there a documented frequency for running a Calibration Profile and was it established based upon historical performance dat
    Is there evidence to demonstrate that Calibration Profiles are conducted and that records are up-to-date?
    Is the practice of comparing the current Calibration Profile to the Standardized Calibration Profile used to identify changes?
    Is the current Calibration Overlay/Profile used to determine if a variation in the wave's thermal characteristics has occurred?
    Is the current Calibration Overlay/Profile used to determine if a variation in conveyor speed has occurred?
    Is there evidence to demonstrate that action was taken when the Calibration Profile was different to the Standard?
    Is a tool, such as a WaveRider, used with a standardized profile to conduct a Calibration Profile?
    Is there a policy for maximum number of thermal excursions allowable per board?
    Is this policy known to and practiced by the operators?
6. Solder Analysis
    Is there a documented frequency for conducting Solder Analysis and was this frequency established based upon historical resu
    Is there evidence to demonstrate that Solder Analysis records are up-to-date?
    Does the Solder Analysis results suggest that contaminants within the solder pot are within acceptable levels?
    Is there evidence to demonstrate that action was taken when Solder Analysis results were unsatisfactory?
7. Manual Inspection
    Are outputted boards 100% inspected post wave for wave solder defects as part of machine performance control?
    Are Workmanship Standards defined for soldering, and are they accessible so that machine performance can be measured ac
    Is Measles Charting used to identify the common location of defects so actions can be taken to eliminate them?
    Is via penetration to board topside satisfactory?
                                                                                                    Maximum Score
                                                                                                     Score Obtained
                                                                                                  Score Percentage
                                                                                                   Pass Percentage

                                                                                                            Outcome
  Hi MB      Lo MB    Portables Hi Periph Lo Periph       Actual
1 or 0 may only be entered. NA is not a valid response.




                          NA         NA         NA




  Hi MB      Lo MB    Portables Hi Periph Lo Periph       Actual


                                     NA         NA

              NA          NA         NA         NA
                               NA        NA      NA        NA

                                                 NA        NA

                                         NA      NA        NA




                                                 NA        NA




                                                 NA        NA




               Hi MB       Lo MB    Portables Hi Periph Lo Periph   Actual
cation method = 0
 ? Other method = 0

hanges? Other method = 0




               Hi MB       Lo MB    Portables Hi Periph Lo Periph   Actual

 processed?




ent, and maintenance?
ent of lead clearance?



en subsequent PCBAs too small, score 1

               Hi MB       Lo MB    Portables Hi Periph Lo Periph   Actual


ofile when it was conducted?
 urrent Program settings?
 perature Profiles?
 s to a narrower window?
on temperature requirements?
 logical analysis?


ach the thermocouples?



historical performance data?

d to identify changes?
 eristics has occurred?




                Hi MB       Lo MB     Portables Hi Periph Lo Periph   Actual
 ased upon historical results?




                Hi MB       Lo MB     Portables Hi Periph Lo Periph   Actual

nce can be measured accurately?


                  82             80      78        74        74         82
                   0              0       0         0         0          0
                                                                        0%
                 80%           80%      80%       80%       80%        80%
                 Not         Not        Not        Not       Not        Not
               Audited     Audited    Audited    Audited   Audited    Audited
Post Wave Soldering
 #
1. Automatic Inspection
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
2. Work Instructions
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
3. Manual Inspection
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
4. Process Control
4.1
4.2
4.3
4.4
4.5
4.6
5. Contamination Testing
5.1
5.2
5.3
5.4
5.5
  Score Obtained
Score Percentage
 Pass Percentage
       Outcome
                                                    PCBA Quality Process Audit
                                                                 Add a 'Y' to the Box if the Process Was Assessed
Post Wave Soldering
                                                    Audit Criterion
1. Automatic Inspection
    Are AOI or AXI methods, which include solder joint inspection, used post-wave?
    Is the AOI/AXI coverage % calculated based on joints/components inspected and those not inspected?
    Are the components/joints not covered by AOI/AXI documented and known and targeted for visual inspection?
    Can it be demonstrated that the machine calls are reviewed by the operator to determine if real or false?
    Can it be demonstrated that operators have been fully trained and certified to interpolate the AOI/AXI images presented?
    Does the ICT pareto of defects suggest that AOI/AXI is being 100% deployed and is being effective?
    Can a feedback mechanism be clearly demonstrated from ICT to AOI/AXI to improve program and operator effectiveness?
    Are changes to AOI/AXI coverage made based only on performance feedback?
2. Work Instructions
    Is there a revision controlled Operator Work Instruction which contains information for the specific product being inspected?
    Is there a visual aid available which identifies the populated PTH locations with polarity, and also the no-pop locations?
    Do the Work Instructions specify the specific solder/flux/cleaning agent etc. to be used?
    Do the Work Instructions define acceptable lead lengths and/or specific customer requirements?
    Have all connector heights/lean acceptance and assembly requirements been addressed from the PCBA Assembly Drawings?
    Are Work Instructions also used as an alert to flag specific customer or known issues?
    Do the Work Instructions specify the specific inspection stamps and locations to be used?
    Do Work Instructions require AOI/AXI Paper Less Repair (PLR) data to be evaluated? No PLR = 0
3. Manual Inspection
    Are outputted boards 100% inspected for wave solder defects and for lead evidence?
    Are outputted boards 100% inspected for missing PTH components & polarity, and raised/tilted PTH components?
    Are outputted boards 100% inspected for those components and joints not covered by ICT or AOI/AXI?
    Are Workmanship Standards defined for soldering, and are they accessible and used to determine board acceptability?
    Are AOI/AXI Paper Less Repair (PLR) Stations effectively used at inspection for the evaluation of AOI/AXI defect calls?
    Is there a software tool post reflow which is linked to CAD or program data to facilitate component identification and inspection?
    Is it evident that lead snipping has been minimized through adequate component prep and/or pallet support design?
    Is there a tool available and used to check component lead length against the required lead length specification?
    Is it evident that only those leads which exceed the specification for component lead length are snipped?
    Are magnification and lighting tools available to the operator at the inspection station?
    Are self calibrating Soldering Irons, (like Metcal) used 100% post wave?
4. Process Control
    Is real time Statistical Process Control (SPC) used to monitor the process output post wave? ('real-time'=now, except for Lo Pe
    Is the processes DPMO and the products DPU monitored in real time? ('real-time'=now, except for Lo Periph=1 to 2 hrs)
    Is OFE data readily available & based on solder joint & component count data for what is actually inspected?
    Is AOI/AXI data used to calculate Wave DPMO? No AOI/AXI = 0
    Are ICT debug results used to calculate Wave DPMO?
    Is the data collected meaningful and can it be demonstrated that it is used to make process control decisions?
5. Contamination Testing
    Is there a defined process used to assess the cleanliness of products processed?
    Is there evidence to demonstrate that this process is followed and understood?
    Is there a documented audit frequency for conducting this cleanliness test?
    Are SIR tests run periodically to recalibrate the system or after maintenance?
    Is there a specification defined and documented for resistivity?
                                                                                                      Maximum Score
  Score Obtained
Score Percentage
 Pass Percentage
       Outcome
                Hi MB         Lo MB   Portables Hi Periph Lo Periph      Actual
               1 or 0 may only be entered. NA is not a valid response.
                                                                 NA
                                                                 NA
                                                                 NA
                                                                 NA
 mages presented?                                                NA
                                                                 NA
 erator effectiveness?                                           NA
                                                                 NA
                Hi MB         Lo MB   Portables Hi Periph Lo Periph      Actual
 duct being inspected?
 o-pop locations?


 BA Assembly Drawings?


                                                               NA
                Hi MB         Lo MB   Portables Hi Periph Lo Periph      Actual

 omponents?

 ard acceptability?
 /AXI defect calls?                                            NA
ntification and inspection?
upport design?




                                                    NA         NA
                Hi MB         Lo MB   Portables Hi Periph Lo Periph      Actual
me'=now, except for Lo Periph=1 to 2 hrs)
 Periph=1 to 2 hrs)

                                                               NA


                Hi MB         Lo MB   Portables Hi Periph Lo Periph      Actual




                  38           38           38       37         26        38
   0         0         0         0         0         0
                                                    0%
 80%       80%       80%       80%       80%       80%
  Not       Not       Not       Not       Not       Not
Audited   Audited   Audited   Audited   Audited   Audited
Mechanical Assembly
 #
1. Work Instructions
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
2. Board Tooling / Depanelization
2.1
2.2
2.3
2.4
2.5
2.6
3. Heatsinks and Mechanical Bonding
3.1
3.2
3.3
3.4
3.5
4. Line Set-Up and Verification
4.1
4.2
4.3
4.4
4.5
5. Manual Inspection
5.1
5.2
5.3
                                                           PCBA Quality Process Audit
                                                                          Add a 'Y' to the Box if the Process Was Assessed
Mechanical Assembly
                                                          Audit Criterion
1. Work Instructions
    Is there a revision controlled Operator Work Instruction which contains details of how to assemble the product?
    Are Work Instructions readily available to the operator and are they followed at Assembly?
    Are component part numbers and descriptions included on the Work Instructions?
    Are components sufficiently identified to ensure the correct component is being used?
    Is the layout of bins/trays defined on Work Instructions for each assembly station?
    Are all bins/trays located in the correct position as per Work Instructions for each assembly station?
    Do Work Instructions contain clear pictures to aid the operator & ensure the correct assembly method is understood?
    Are torque settings and the sequence of screw insertion specified for screw assembly operations?
    Are all torque drivers set to the required torque and screws inserted in the right sequence?
    Is there evidence that torque drivers are frequently calibrated to ensure the correct torque requirements?
    Do all torque drivers have 'lock nuts' to fix the torque setting after calibration to prevent operator adjustment?
    Are all hand tools needed by the operator listed with their descriptions on Work Instructions?
2. Board Tooling / Depanelization
    Is breakout tooling specifically designed for the board or is a line-side Router or v-score machine used? Manual breakout=0.
    Can it be demonstrated that board flexing has been eliminated and clearance is sufficient by using such tooling?
    Can it be demonstrated that the possibility of cutting at an angle has been error proofed?
    Can it be demonstrated that the board is supported before and after the cut so as to prevent board damage due to dropping?
    Does the press fit tooling use force feedback control that provides repeatable installation and prevents PWB damage?
    Has all tooling used at Mechanical Assembly been designed to prevent board flexing?
3. Heatsinks and Mechanical Bonding
    Is heatsink installation tooling used to align heatsinks to the required orientation and position tolerance?
    Is the force applied to the heatsink and the duration of the applied force documented on Work Instructions and controlled?
    Is the dry time for the solvent document on Work Instructions and controlled?
    Is there a process to control the volume of bonding adhesive and activator applied to ensure the required bond strength?
    Is the cure time for the bonding adhesive documented on Work Instructions and controlled?
4. Line Set-Up and Verification
    Are first-assembled boards verified against documentation to ensure mechanical items have been assembled correctly?
    Are all bins/trays labeled with printed part numbers, descriptions, locations, and layout information?
    Is the Mechanical Assembly work cell laid out ergonomically with components & assembly tools within easy reach?
    Are mechanical items stored before and during use in a manner which prevents damage?
    Are color coding techniques deployed for parts, tools, work instructions etc. in an attempt to error proof the process?
5. Manual Inspection
    Is there evidence to demonstrate that a defect feedback process is in operation to Mechanical Assembly?
    Is accountability for Mechanical Assembly defects traceable to a specific workstation and operator/supervisor?
    Are cosmetic standards are readily available to the assembly operator on the assembly line?
                                                                                                    Maximum Score
                                                                                                     Score Obtained
                                                                                                   Score Percentage
                                                                                                    Pass Percentage
                                                                                                                         Outcome
                  Hi MB    Lo MB    Portables Hi Periph Lo Periph     Actual
               1 or 0 or NA may be entered as appropriate




 is understood?




                  Hi MB    Lo MB    Portables Hi Periph Lo Periph     Actual
d? Manual breakout=0.


mage due to dropping?
s PWB damage?

                  Hi MB    Lo MB    Portables Hi Periph Lo Periph     Actual

 ions and controlled?

red bond strength?

                  Hi MB    Lo MB    Portables Hi Periph Lo Periph     Actual
sembled correctly?

 easy reach?

of the process?
                  Hi MB    Lo MB    Portables Hi Periph Lo Periph     Actual



                   31        31         31         31         31        31
                    0         0          0          0          0         0
                                                                        0%
                 80%       80%        80%         80%        80%       80%
                  Not       Not        Not         Not        Not       Not
                Audited   Audited    Audited     Audited    Audited   Audited
In Circuit Test
 #
1. Operator and Work Instructions
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
2. ICT Fixture
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
3. ICT System Hardware
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
4. ICT Software
4.1
4.2
4.3
4.4
4.5
4.6
5. Test Operation
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
5.12
5.13
5.14
5.15
5.16
5.17
6. ICT WIP Tracking
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
7. Debug and FA Capability
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
                                                     PCBA Quality Process Audit
                                                                  Add a 'Y' to the Box if the Process Was Assessed
In Circuit Test
                                                     Audit Criterion
1. Operator and Work Instructions
     Is there a revision controlled Test Instruction which contains unique details for the specific product being tested?
     Are Work Instructions readily available to the test operator and are they followed?
     Is the Fixture ID specified on Work Instructions?
     Is the Fixture ID traceable to a specific PCBA part number and revision level and to the Unit Under Test?
     Is the Batch File specified on Work Instructions?
     Is the Batch File traceable to a specific PCBA part number and revision level and to the Unit Under Test?
     Is the Vacuum setting specified on Work Instructions?
     Is the PCB orientation to the Fixture identified in the Work Instructions or on the Fixture?
     Does the test Operator have the Standard Operating Procedure (SOP) for the tester available to them at all times?
     Is there evidence that the Operator been trained and certified against the Standard Operating Procedure for the Tester?
     Does the Operator know the content of the Standard Operating Procedure for the Tester and do they and follow it?
     Are Operators required to log into the Tester station and does this provide an automatic verification of training status?
2. ICT Fixture
     Is the ICT fixture identified with a name or number?
     Is the Preventative Maintenance / Calibration sticker on the ICT fixture current and up to date?
     Is there a Preventative Maintenance procedure and schedule for ICT fixtures?
     Is there evidence to demonstrate that Preventative Maintenance records are up-to-date?
     Are spare test fixture parts (excluding probes) stocked?
     Are spare test fixture probes stocked?
     Is the spare test fixture parts inventory adequately controlled?
     Are ICT fixtures adequately stored in such a way that the tester interface is protected?
3. ICT System Hardware
     Is there a vacuum gauge on the line connected to the test system?
     Is the vacuum gauge visible to the test operator and is it at the correct setting?
     Does the test system have adequate ESD protection?
     Is the Preventative Maintenance / Calibration sticker on the Test System current and up to date?
     Is there a Preventative Maintenance procedure and schedule for ICT Test Systems?
     Are the test systems pin electronics verified daily?
     Is there evidence to demonstrate that Preventative Maintenance records are up-to-date?
     Are spare test system parts stocked?
     Are spare test system pin electronics boards stocked?
     Are other (not pin electronics) spare test system electronics boards stocked?
     Are spare test system parts inventory adequately controlled?
4. ICT Software
     Are all ICT test systems networked together and to a server?
     Is the ICT software downloaded from a central server when the program is called up?
     Is the ICT software revision controlled for program changes?
     Is a control database used to log all changes to an ICT program no matter how insignificant the change is considered?
     Is it impossible for unapproved ICT s/w changes to remain on the test system longer than 24 hours?
     When changes are made, is there evidence that change details are sent to Dell for approval?
5. Test Operation
     Is there an automated method of loading test programs (i.e. the batch file).
    Is the Fixture ID used to select and automatically load the correct ICT program for the unit under test?
    If the same ICT fixture is used for different PCBA part numbers, does the Batch file automatically differentiate? NA may be use
    Is there a foolproof method to ensure that product A will not pass ICT if Batch File B is used? NA may be used.
    Is there a foolproof method to ensure that product B will not pass ICT if Batch File A is used? NA may be used.
    Is the PCBA orientation to the fixture identified or is required to be checked before PWB loading?
    Is the test program uniquely identified on the test system display after the test program has been loaded?
    Is there a documented and agreed convention outlining the storage of untested, failed, and pass boards?
    Are boards marked in some way to facilitate the implementation of this convention?
    Are boards awaiting test identified and stored to one side of the operator or routed via dedicated conveyor?
    Are passing boards identified and stored on the opposite side of the operator or routed via dedicated conveyor?
    Are failing boards identified and stored away from all other boards or routed via dedicated conveyor?
    Are pass and failed boards stored on different storage carts or routed via a unique conveyor?
    Is SPC data collected at this process point?
    Is the content of the SPC data chart up-to-date?
    Are out of control SPC data points actioned?
    Are ICT buffer trigger points established to ensure process shut down should the limits be exceeded?
6. ICT WIP Tracking
    Is a Forced Board Routing system and WIP Tacking system fully deployed throughout the test process?
    Does the system verify the 'last' step processed and compare it to the expected 'last' step?
    Do boards that PASS have an identifying mark to indicate their pass status? (Forced Routing is acceptable.)
    Do boards that FAIL have an identifying mark to indicate their fail status? (Forced Routing is acceptable.)
    Do failed boards have ICT fail listings attached for debug purposes? (Paperless repair is acceptable)
    Do all debugged boards have an identifying mark to indicate a debug status? (Forced Routing is acceptable.)
    Is there a software link between ICT Test results & the Forced Routing/Quality Data System?
    Does this software link eliminate manual intervention to indicate the test result status?
    Is this link fully automated and used to log Test Yield/First Pass Yield & Board Yield data?
    For boards tested in panel format, is the failed board identified before the panel is removed from the fixture?
7. Debug and FA Capability
    Are boards awaiting debug identified and stored to one side of the operator or routed via dedicated conveyor?
    Are debug buffer trigger points established to ensure process shut down should the limits be exceeded?
    Can it be demonstrated that a technician qualification or formal training is required for debug and failure analysis activity?
    Can it be demonstrated that all debug personnel meet the above requirements ?
    Is there adequate debug equipment available at each debug station ?
    Can it be demonstrated that an Expert System is used to capture fail codes, their fixes, and then recommend the most common
    Is a paperless debug system deployed and fail data accessed via a display unit?
    Is a test point location map available to the repair/failure analysis operator?
    Are there detailed instructions on determining false failures?
    Are false failure rates tracked, monitored, and documented?
    Are there goals for false failure reduction? (I.e. goals to increase FPY)
                                                                                                       Maximum Score
                                                                                                        Score Obtained
                                                                                                     Score Percentage
                                                                                                      Pass Percentage

                                                                                                             Outcome
                Hi MB    Lo MB    Portables Hi Periph Lo Periph        Actual
             1 or 0 may only be entered. NA is not a valid response.




 at all times?
ure for the Tester?
and follow it?
 training status?
                Hi MB    Lo MB    Portables Hi Periph Lo Periph        Actual




                Hi MB    Lo MB    Portables Hi Periph Lo Periph        Actual




                Hi MB    Lo MB    Portables Hi Periph Lo Periph        Actual



e is considered?



                Hi MB    Lo MB    Portables Hi Periph Lo Periph        Actual
rentiate? NA may be used.




                Hi MB    Lo MB     Portables Hi Periph Lo Periph   Actual




                  NA        NA        NA
                Hi MB    Lo MB     Portables Hi Periph Lo Periph   Actual


re analysis activity?


mmend the most common fix?




                  74        74        74        75        75         74
                   0         0         0         0         0          0
                                                                     0%
                80%       80%       80%       80%       80%         80%
                 Not       Not       Not       Not       Not         Not
               Audited   Audited   Audited   Audited   Audited     Audited
Automatic Functional Test
 #
1. Operator and Work Instructions
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2. Fn Test Fixture
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
3. Fn Test Software
3.1
3.2
3.3
3.4
4. Test Operation
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
4.13
5. Fn Test WIP Tracking
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
5.10
5.11
6. Debug and FA Capability
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
6.10
                                                    PCBA Quality Process Audit
                                                                  Add a 'Y' to the Box if the Process Was Assessed
Automatic Functional Test
                                                    Audit Criterion
1. Operator and Work Instructions
    Is there a revision controlled Test Instruction which contains unique details for the specific product being tested?
    Are Work Instructions readily available to the test operator and are they followed?
    Is the Test File name and number specified on Work Instructions?
    Is the Test File traceable to a specific PCBA part number and revision level and to the Unit Under Test?
    Does the test Operator have the Standard Operating Procedure (SOP) for the tester available to them at all times?
    Is there evidence that the Operator been trained and certified against the Standard Operating Procedure for the Tester?
    Does the Operator know the content of the Standard Operating Procedure for the Tester and do they and follow it?
    Are Operators required to log into the Tester station and does this provide an automatic verification of training status?
    Does the operator practice adequate ESD procedures?
2. Fn Test Fixture
    Is the Test fixture identified with a name or number?
    Is the Preventative Maintenance / Calibration sticker on the fixture current and up to date?
    Is there a Preventative Maintenance procedure and schedule for each Test fixture?
    Is there evidence to demonstrate that Preventative Maintenance records are up-to-date?
    Are NDF rates used to flag a test station maintenance schedule?
    Are there goals for NDF reduction specified for each product and each fixture?
    Are spare parts for test stocked?
    Is the inventory of spare test parts adequately controlled?
3. Fn Test Software
    Are all Fn Test systems networked together and to a server?
    Is the Functional Test software downloaded from a central server when the program is called up?
    Is the Fn Test software revision controlled for program changes?
    Is a control database used to log all changes to the Fn Test program?
4. Test Operation
    Is there an automated method of loading test programs?
    Is there a documented and agreed convention outlining the storage of untested, failed, and pass boards?
    Are boards marked in some way to facilitate the implementation of this convention?
    Are boards awaiting test identified and stored to one side of the operator or routed via dedicated conveyor?
    Are passing boards identified and stored on the opposite side of the operator or routed via dedicated conveyor?
    Are failing boards identified and stored away from all other boards or routed via dedicated conveyor?
    Are pass and failed boards stored on different storage carts or routed via a unique conveyor?
    Is SPC data collected at this process point?
    Is the content of the SPC data chart up-to-date?
    Are out of control SPC data points actioned?
    Are Fn Test buffer trigger points established to ensure process shut down should the limits be exceeded?
    Are false failure rates tracked, monitored, and documented?
    Are there goals for false failure reduction? (I.e. goals to increase FPY)
5. Fn Test WIP Tracking
    Is a Forced Board Routing system and WIP Tacking system fully deployed throughout the test process?
    Does the system verify the 'last' step processed and compare it to the expected 'last' step?
    Do boards that PASS have an identifying mark to indicate their pass status? (Forced Routing is acceptable.)
    Do boards that FAIL have an identifying mark to indicate their fail status? (Forced Routing is acceptable.)
    Do failed boards have Fn fail details attached for debug purposes?
    Do all debugged boards have an identifying mark to indicate a debug status? (Forced Routing is acceptable.)
    Is there a software link between Fn Test results & the Forced Routing/Quality Data System?
    Does this software link eliminate manual intervention to indicate the test result status?
    Is this link fully automated and used to log Test Yield/First Pass Yield & Board Yield data?
    Can it be demonstrated that there are no boards in the debug analysis loop for longer than 30 days?
    Can it be demonstrated that boards in the Fn Debug Loop have had their ICT Pass mark removed before being returned to ICT
6. Debug and FA Capability
    Are boards awaiting debug identified and stored to one side of the operator or routed via dedicated conveyor?
    Are debug buffer trigger points established to ensure process shut down should the limits be exceeded?
    Can it be demonstrated that a technician qualification or formal training is required for debug and failure analysis activity?
    Can it be demonstrated that all debug personnel meet the above requirements ?
    Is there adequate debug equipment available at each debug station ? E.g. Multimeter, oscilloscope, bus emulator, etc.
    Can it be demonstrated that an Expert System is used to capture fail codes, their fixes, and then recommend the most common
    Are schematics for the latest revision of the board available?
    Has it been demonstrated that component replacement data is logged by board serial number?
    Is it clear which components have been replaced on each board in the repair/failure analysis area?
    Has it been demonstrated that each board has a record showing the number of components replaced?
                                                                                                       Maximum Score
                                                                                                        Score Obtained
                                                                                                     Score Percentage
                                                                                                      Pass Percentage
                                                                                                          Outcome
                Hi MB    Lo MB    Portables Hi Periph Lo Periph        Actual
             1 or 0 may only be entered. NA is not a valid response.




 at all times?
ure for the Tester?
and follow it?
 training status?

                Hi MB    Lo MB    Portables Hi Periph Lo Periph        Actual




                Hi MB    Lo MB    Portables Hi Periph Lo Periph        Actual




                Hi MB    Lo MB    Portables Hi Periph Lo Periph        Actual




                Hi MB    Lo MB    Portables Hi Periph Lo Periph        Actual
ore being returned to ICT?
                Hi MB    Lo MB     Portables Hi Periph Lo Periph   Actual


re analysis activity?

us emulator, etc.
mmend the most common fix?




                  55         55       55        55        55         55
                   0          0        0         0         0          0
                                                                     0%
                80%       80%       80%        80%       80%        80%
                 Not       Not       Not        Not       Not        Not
               Audited   Audited   Audited    Audited   Audited    Audited
Packing
 #
1. Board Packing
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
2. Palletization
2.1
2.2
2.3
2.4
2.5
                                                     PCBA Quality Process Audit
                                                                   Add a 'Y' to the Box if the Process Was Assessed
Packing
                                                     Audit Criterion
1. Board Packing
     Is there a revision controlled Operator Work Instruction which contains packing information for the specific product being packe
     Is the part number for the box and its inserts, etc. indicated on the Work Instructions?
     Is the part number and dimensions for the static bag indicated on the Work Instructions?
     Is the part number and location for all box labels to be attached defined?
     Is every PCBA scanned prior to packing to ensure it has completed all process and test steps in the correct sequence?
     Is there a significant automatic alarm raised if the board scanned is not ready for shipment as a result of the verification scan?
     Has the orientation of loading the PCBA into the static bag and the box been defined?
     Is the method of folding and sealing the static bag defined once the PCBA has been inserted?
     Is the box labeled with the PCBA part number before packing? A PCBA must not be loaded into an unidentified box.
     Is the operator required to check that the part number of the first PCBA cross checks to the box label before placing it in the bo
     Is every PCBA scanned, placed in the static bag, placed in the box, in that sequence, before beginning to pack another PCBA?
     Does the scanning operation verify through a forced routing system that all routed operations have been competed?
     Is the Dell Shipping label attached to the box before the box is sealed?
     Do the labels and packaging requirements comply with the required Dell Packaging Specification requirements?
2. Palletization
     Is there a revision controlled Operator Work Instruction for Pallet Stacking?
     Is the pallet type and dimensions indicated on the Work Instructions?
     Does the instruction require boxes to be cross weaved for stability?
     Does this instruction require the outer box label for each box to be visible for every box on the pallet?
     Does both of the above happen?
                                                                                                         Maximum Score
                                                                                                          Score Obtained
                                                                                                       Score Percentage
                                                                                                        Pass Percentage

                                                                                                               Outcome
                 Hi MB       Lo MB     Portables Hi Periph Lo Periph     Actual
               1 or 0 may only be entered. NA is not a valid response.
ecific product being packed?



orrect sequence?
 of the verification scan?


nidentified box.
 before placing it in the box?
g to pack another PCBA?
 en competed?



                 Hi MB       Lo MB     Portables Hi Periph Lo Periph     Actual




                   19            19       19        19        19         19
                    0             0        0         0         0          0
                                                                         0%
                 80%          80%       80%       80%       80%         80%
                  Not          Not       Not       Not       Not         Not
                Audited      Audited   Audited   Audited   Audited     Audited
General Process
 #
1. Environmental and ESD Control
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
1.18
1.19
1.20
1.21
1.23
2. Line Set-Up and Control
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
3. Machine Maintenance (select any machine used in the PCBA Manf. process and answer all questions below base on
3.1
3.2
3.3
3.4
3.5
3.6
3.7
4. Machine Operator (select any machine operator in the PCBA Manf. area and answer all questions below base on selec
4.1
4.2
4.3
4.4
5. PCBA Inspector (select any inspector in the PCBA Manufacturing area and answer all questions below base on selectio
5.1
5.2
5.3
5.4
5.5
5.6
5.7
5.8
5.9
6. Chemical Compatibility
6.1
6.2
6.3
7. Programmed Parts (Score NA if programming is subcontracted to a supplier)
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
                                                       PCBA Quality Process Audit
                                                                     Add a 'Y' to the Box if the Process Was Assessed
General Process
                                                       Audit Criterion
1. Environmental and ESD Control                                                                             1 or 0 may only be entered. N
       Are there temperature & humidity sensors throughout the Manufacturing area to monitor temperature & humidity over time?
       Are there documented upper & lower specification limits for temperature and humidity to assure Paste viscosity, ESD and MSD
       Is the monitor linked to an alarm system to indicate an unacceptable temperature or humidity status?
       Is there evidence to demonstrate that action was taken when the temperature/humidity was outside the defined limits?
       Is either an ESD Conductive or Static Dissipative floor installed in the Manufacturing areas? Use of ESD Matting also scores ze
       Is there evidence that the floor was installed using conductive adhesive with copper earth grounding straps?
       Is there evidence that the floor is frequently waxed to ensure conductivity using an appropriate ESD wax?
       Are fixed material storage racks for components/assemblies earth grounded and in conductive contact with the ESD floor?
       Do portable material storage racks for components/assemblies use conductive wheels or drag chains to contact the ESD floor?
       Are all machines earth grounded?
       Are timed Resistance-to-Ground tests conducted using an ESD Meter to periodically evaluate ESD performance?
       Is there evidence that at least five tests are taken per 5000 square feet of production floor space?
       Is there evidence of periodic performance testing of the floor and all work surfaces in the ESD protective area?
       Are ESD protective areas appropriately marked and labeled?
       Is there evidence that anyone in the ESD protective area is required to wear ESD Smocks and two ESD Heal Straps / ESD Sho
       Is there evidence that anyone seated must use an ESD wrist strap while handling components in addition to Heal Straps/ ESD
       Is there evidence that the chairs uses are ESD safe and are they in conductive contact with the floor?
       Is there evidence that Heal Straps/ESD Shoes and Wrist straps are tested each time the ESD Protective area is entered?
       Is there evidence that the materials used in operator tools inside the ESD protective area ESD safe?
       Is there evidence that Antistatic & Static dissipative material (usually pink) is not used outside the ESD area for component stor
       Is there evidence that Static Shielded material (usually gray) is used outside the ESD area for component storage?
2. Line Set-Up and Control
      Is the SMT process set up as one continuous free flowing conveyorized line for both single or double sided boards?
      Are the SMT and PTH lines linked together as one continuous free flowing conveyorized line? In-line buffering is OK. No Carts.
      Is the PTH process set up as one continuous free flowing conveyorized line up as far as ICT?
      Is line balancing between SMT and PTH continuous lines achieved only by in-line buffering and without the use of carts of trolle
      Is the Test process set up as one continuous free flowing conveyorized line?
      Are the ICT and Fn test processes linked together as one continuous free flowing conveyorized line?
      Is a Forced Board Routing system and WIP Tacking system fully deployed throughout SMT, PTH and Test?
      Are all board tracked through the process by serial number and is board history available for traceability purposes?
      Does the system verify the 'last' step processed and compare it to the expected 'last' step?
      Are quality performance or buffer trigger points established to ensure machine shut down should the limits be exceeded?
      Is there a documented checklist available and in use to ensure successful product changeover?
3.   Machine Maintenance (select any machine used in the PCBA Manf. process and answer all questions below base on select
      Is there a recommended Spare Parts list for the selected machine?
      Are on-hand stock quantities and minimum reorder points set and controlled using a database?
      Does the on-hand stock balance reflect the physical stock quantities for two samples taken?
      Are Daily Maintenance logs kept at the machine and are they up to date?
      Is a Preventative Maintenance Database used to flag when periodic Preventative Maintenance is required?
      Is there evidence to demonstrate that Preventative Maintenance records are up-to-date?
      Are problem descriptions and their closure recorded and verified on the Daily and Preventative Maintenance logs?
4.   Machine Operator (select any machine operator in the PCBA Manf. area and answer all questions below base on selection)
      Does the Operator have the Standard Operating Procedure (SOP) for the machine available to them at all times?
      Is there evidence that the Operator has been trained and certified against the Standard Operating Procedure for the Machine?
      Does the Operator know the content of the Standard Operating Procedure for the Machine and do they and follow it?
      Are Operators required to log into the Machine station and does this provide an automatic verification of training status?
5.   PCBA Inspector (select any inspector in the PCBA Manufacturing area and answer all questions below base on selection)
      Is the Inspector required to wear gloves or finger cots when handling boards and do they wear them?
      Does the Inspector have the IPC-610 standard available to them at all times?
      Is there evidence that the Inspector has been trained and certified against the IPC-610 Standard and on component identificatio
      Does the Inspector know the content of the IPC-610 Standard and are they able to read component identification markings?
      Are Operators required to log into the inspection station and does this provide an automatic verification of training status?
      Do quality inspectors have access to sampling plans (e.g. ANSI, MIL, ASQ) at all times?
      Does the quality inspector know the sampling plan and switching rules for increased/decreased sample sizes?
      Does quality inspector have access to product specific reference tools, (e.g. golden unit, templates)?
      Is there evidence that quality inspector has been trained/certified in basic quality practices and statistics/SQC?
6. Chemical Compatibility
       Is there a master matrix which outlines the Chemical Compatibility for solder wire, fluxes, flux pens, cleaning solutions, etc?
       Are specifications readily available for the various types of solder, flux, cleaning agents, etc. being used?
       Are Chemical Industry standard labeling used to identify all chemicals used, e.g. flux, alcohol, etc?
7.   Programmed Parts (Score NA if programming is subcontracted to a supplier)
       Are revision controlled Work Instructions displayed for the operator at the programming station?
       Are component part numbers and their descriptions specified on Work Instructions?
       Are component descriptions sufficiently detailed to ensure the correct blank component is being used?
       Are label part numbers identified and a drawing/picture of the label contents included on the Work Instruction?
       Is the orientation of the label on the component consistent and does it include the correct checksum information?
       Are parts only labeled post programming with the program information?
       Is there evidence to demonstrate that programmed parts are clearly segregated from unprogrammed parts?
       Is the Master Program name/number and revision indicated on the Work Instructions and traceable to the current PCBA revisio
       Do Work Instructions indicate the orientation for loading blank components into the programmer?
       Are the Moisture Sensitive Devices (MSDs) readily known to the operator?
       Are MSDs time stamped at opening and their exposure time recorded as a result of programming?
       Can MSD control be demonstrated for MSD devices that need programming?
       Is the orientation of programmed parts in their packaging preserved before and after programming?
       Is there evidence that a defined process for non-conforming material such as damaged, failing or programmable parts is in ope
                                                                                                             Maximum Score
                                                                                                             Score Obtained
                                                                                                           Score Percentage
                                                                                                            Pass Percentage
                                                                                                               Outcome
                 Hi MB        Lo MB   Portables Hi Periph Lo Periph   Actual
0 may only be entered. NA may be a valid response for elements of section 7.
& humidity over time?
 viscosity, ESD and MSD control?

 e defined limits?
SD Matting also scores zero.


 t with the ESD floor?
 to contact the ESD floor?




SD Heal Straps / ESD Shoes?
 tion to Heal Straps/ ESD Shoes?

ive area is entered?

D area for component storage?
nent storage?
                 Hi MB        Lo MB   Portables Hi Periph Lo Periph   Actual
sided boards?                                                NA
buffering is OK. No Carts.                                   NA

ut the use of carts of trolleys?                             NA
                                                             NA
                                                             NA

 ty purposes?

 mits be exceeded?

                 Hi MB        Lo MB   Portables Hi Periph Lo Periph   Actual




                 Hi MB        Lo MB   Portables Hi Periph Lo Periph   Actual
cedure for the Machine?
y and follow it?
of training status?
                Hi MB      Lo MB    Portables Hi Periph Lo Periph   Actual


on component identification?
entification markings?
n of training status?




                Hi MB      Lo MB    Portables Hi Periph Lo Periph   Actual
eaning solutions, etc?



                Hi MB      Lo MB    Portables Hi Periph Lo Periph   Actual




 the current PCBA revision?




grammable parts is in operation?
                 69           69       69        69        64         69
                  0            0        0         0         0          0
                                                                      0%
               80%         80%       80%       80%       80%         80%
                Not         Not       Not       Not       Not         Not
              Audited     Audited   Audited   Audited   Audited     Audited
Rework and Repair
 #
1. General Repair Capability
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2. General Rework and Repair
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
3. BGA Rework
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
4. Mini-Wave Rework
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
5. Post Rework and Repair Inspection and Feedback
5.1
5.2
5.3
5.4
5.5
5.6
                                                    PCBA Quality Process Audit
                                                                 Add a 'Y' to the Box if the Process Was Assessed
Rework and Repair
                                                    Audit Criterion
1. General Repair Capability
    Is the capability of each piece of rework equipment defined to ensure the correct equipment is used for the correct rework oper
    Is the rework process and equipment used appropriate to meet established industry standards?
    Is the age, limit quantity, and ECO level of boards in a repair loop monitored?
    Is there a tracking system in place to monitor and limit the number of Reworks conducted on any given unique board serial num
    Is there a demonstrated method in place to highlight differences between a board's ECO level and the current board's ECO lev
    Does this method flag the rework path necessary to bridge the ECO gap?
    Is minimal shippable ECO information available and a reliable method in place to ensure it is kept current?
    Is there a reliable tool available to provide ASL details for each component reference designator for the current BOM revision?
    Is there a reliable method in place to ensure BOM information is kept current?
2. General Rework and Repair
    Is rework conducted real time and on the production line except for rework requiring specialized desktop equipment?
    Is there a documented Rework Standard Operating Procedure for board preparation, rework techniques, and post rework pract
    Are all reworks carried out to IPC 7711 & 7721 standards?
    Prior to replacing a passive device is the operator required to verify its value using multimeter and do they?
    Are self calibrating and self regulating Soldering Irons, (like Metcal) exclusively used for solder iron repair?
    Is there a documented frequency for the calibration and maintenance of Soldering Irons? Score 1 if Self Calibrating (SC).
    Is Solder Iron calibration conducted for the combination of a specific handheld iron with a specific control box? Score 1 if SC.
    Does the handheld iron in use correspond to the control box used as indicated by the calibration records? Score 1 if SC.
    Is there evidence to demonstrate that Soldering Iron calibration and maintenance is adequate and that records are up-to-date?
    Are the operating temperatures and tip sizes to be used for the different component types clearly defined?
    Are all Soldering Irons in use grounded?
    Are rework consumables, i.e. Solder Wire, Flux, Cleaning agents, conditions of use documented?
    Does the reworker have access to visual aids/tools which will identify the value, location & polarity of components to be replace
3. BGA Rework
    Are all BGA devices replaced using dedicated BGA Replacement Equipment with bottom side board heating and split prism alig
    Is there a documented Standard Operating Procedure for the setup and operation of BGA Replacement Equipment?
    Are the BGAs being used in the replacement process stored and used according to their moisture level sensitivity rating?
    Is there evidence to demonstrate that the control process for MSDs is in use and effective?
    Does the procedure specify the program name, nozzle & nest to be used for each type of BGA component?
    Are specific reflow profiles available for each type of BGA component?
    Is the application process for Flux/Paste documented, consistent, and acceptable?
    Has it been verified that the Flux/Paste used is compatible with the original solder paste used during the manufacturing process
    Is the removed BGA isolated from good product and dispositioned correctly?
    Post BGA Rework, is the replaced BGA X-Rayed to verify replacement quality?
    Is there evidence that a board must be slow baked prior to BGA removal for when a BGA component is needed for failure analy
4. Mini-Wave Rework
    Is there a documented Standard Operating Procedure for the setup and operation of Mini-Wave Equipment ?
    Does the procedure specify the solder type, its temperature setting, and the flux type to be used ?
    Does the procedure specify the nozzle for specific component type & the solder exclusion pallet to be used for each board?
    Can it be demonstrated that solder exclusion pallets are used exclusively to confine hear exposure to the component being rep
    Has the use of Kapton tape been discontinued due to the use of solder exclusion pallets?
    Does the Mini-Wave set-up allow the operator to use both hands to replace the component?
    Are components being used in the replacement process identified and stored correctly?
    Are the components being used in the replacement process stored in their original packaging up to the point of use?
    Is the removed component isolated from good product and dispositioned correctly?
    Does the procedure specify the process and chemicals to be used for excess flux residue removal?
5. Post Rework and Repair Inspection and Feedback
    Are magnification and lighting tools available to the operator at the inspection station?
    Are repaired boards 100% inspected post repair not only for the repair undertaken but for possible repair damage??
    Is there a documented requirement that repaired boards be reprocess not only through ICT but through AOI/AXI if deployed?
    Is the data collected meaningful and can it be demonstrated that it is used to make process control decisions?
    Is there evidence that operators receive quality feedback and are responsible for the quality of their work?
    Is there evidence that the board has been appropriated cleaned?
                                                                                                       Maximum Score
                                                                                                        Score Obtained
                                                                                                     Score Percentage
                                                                                                      Pass Percentage

                                                                                                           Outcome
                Hi MB        Lo MB   Portables Hi Periph Lo Periph   Actual
               1 or 0 or NA may be entered as appropriate
 r the correct rework operation?


n unique board serial number?
 current board's ECO level?


e current BOM revision?

                Hi MB        Lo MB   Portables Hi Periph Lo Periph   Actual
op equipment?
es, and post rework practices?



elf Calibrating (SC).
trol box? Score 1 if SC.
 ds? Score 1 if SC.
t records are up-to-date?



omponents to be replaced ?
                Hi MB        Lo MB   Portables Hi Periph Lo Periph   Actual
heating and split prism alignment?
 nt Equipment?
el sensitivity rating?




he manufacturing process?


is needed for failure analysis?
                Hi MB        Lo MB   Portables Hi Periph Lo Periph   Actual


used for each board?
the component being replaced?
e point of use?



                  Hi MB     Lo MB     Portables Hi Periph Lo Periph   Actual

pair damage??
 h AOI/AXI if deployed?



                    49        49         49        49        49         49
                     0         0          0         0         0          0
                                                                        0%
                   80%       80%       80%        80%       80%        80%
                    Not       Not       Not        Not       Not        Not
                  Audited   Audited   Audited    Audited   Audited    Audited
RMA / Service Repair
 #
1. RMA WIP Flow and Tracking
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
1.15
1.16
1.17
1.18
1.19
1.20
2. Process for Failure Verification
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
3. Control of No Defect Found (NDF)
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
4. Debug and FA Capability
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
5. PCBA Documentation
5.1
5.2
5.3
5.4
                                                      PCBA Quality Process Audit
                                                                   Add a 'Y' to the Box if the Process Was Assessed
RMA / Service Repair
                                                      Audit Criterion
1. RMA WIP Flow and Tracking
     Are Dell Returns logged into the RMA tracking system by serial number upon receipt?
     Are all failure details supplied by Dell entered into the tracking system for each board serial number? (e.g. RTV & DSP details.)
     Does the tracking system have the proven capability to segregate factory returns from field returns using forced routing?
     Does the tracking system have the proven capability to capture a specific serial number that has been flagged by Dell Engineer
     Does the tracking system have the proven capability to record Warranty & ECO status on Dell Returns?
     Does the tracking system have the proven capability to report both the manufacturing history & previous RMA history by serial n
     Does the tracking system have the proven capability to identify the receipt of 2nd or 3rd time Dell Returns?
     Does the tracking system include a flag to identify when Dell Returns should be scrapped? (Dell Requirement is to scrap upon
     Does the tracking system have the proven capability to monitor the turn around time by board serial number and to conduct full
     Can it be demonstrated that there are no boards in the RMA loop for longer than 30 days?
     Does the tracking system have the proven capability to capture repair and defect information for every board serial number?
     Does the tracking system have the proven capability to capture and highlight the components replaced as a result of rework?
     Does the tracking system have the proven capability to allow traceability between the reworked board and the reworker who co
     Does the tracking system have the proven capability to generate a Failure Analysis Report for boards in and completed the RM
     Is a Forced Board Routing system and WIP Tacking system fully deployed to monitor and control RMA Process Flows?
     Does the system verify the 'last' step processed and compare it to the expected 'last' step? (True Forced Routing)
     Does the forced routing system have the proven capability to automatically re-route NFF boards for additional special processin
     Has it been demonstrated that RMA pass/fail data is logged real-time to the forced routing system by serial number and is avail
     Does the system ensure that only boards that have passed through all stages of the RMA Process will be returned to Dell?
     Does the layout of the RMA area indicate that it has been process engineered to avoid product mixing?
2. Process for Failure Verification
     Are there available revision controlled RMA Process Flow Charts for processing Dell Field and Line Returns?
     Does the Process Flow indicate that all Dell Returns are fully inspected for workmanship issues prior to test processing?
     Does the Process Flow indicate that all Dell Returns are fully inspected for damage prior to test processing?
     Does the Process Flow indicate that all Dell Returns are reviewed for ECO status prior to test processing?
     If workmanship or damage is detected, does the Process Flow require details to be recorded in the RMA tracking system prior
     If workmanship or damage is detected, does the Process Flow require product to be HMUed for failure mode verification prior t
     Does the Process Flow indicate that workmanship or damage should only be repaired post HMU failure verification?
     Does the Process Flow indicate that ECO upgrade should only take place post HMU failure verification?
     Does the Process Flow indicate that Dell Returns must not be upflashed at HMU verification without first determining if the origi
     Does the Process Flow require that all removed silicon components be captured and preserved for Component Analysis?
     Are the top 5 component replacements verified on a socketed board before they are returned to the supplier for Failure Analysi
     Does the Process Flow indicate that repaired boards are processed through ICT, Automatic Functional Test, and HMU prior to
     Does the Process Flow ensure that all boards to be shipped to Dell are reflashed to the correct revision of Bios, Firmware, etc?
     Can it be demonstrated that RMA data is used to improve Production Processes?
3. Control of No Defect Found (NDF)
     Does Process Flow indicate how No Defect Found (NDF) boards are processed on completion of the failure verification proces
     Is there a documented procedure which defines an NDF and the process for handling and processing NDFs?
     Is the percentage of NDFs less than 5% of total for Dell Line Returns due to on-site failure verification at Dell factories?
     Can it be demonstrated that the supplier utilizes additional 'special processes' in an attempt to 'force' an NDF to fail?
     Do these additional special processes include such processes as 'Burn-in Test', or 'Extended Test', or 'Configuration Tests', etc
     Can it be demonstrated that the supplier utilizes configuration matching in an attempt to 'force' an NDF to fail for a specific conf
     Can it be demonstrated for Dell Line Return boards, that NDFs that continue to pass all tests and special processes are held fo
    Is it documented that a Test Correlation exercise must be conducted between RMA Test and Dell factory Test for Dell Line Ret
    Is there evidence available to demonstrate that Test Correlation exercises are conducted on a regular basis?
    Can it be demonstrated that Test Correlation data is used to improve Test Coverage?
4. Debug and FA Capability
    Can it be demonstrated that a technician qualification or formal training is required for debug and failure analysis activity?
    Can it be demonstrated that all debug personnel meet the above requirements ?
    Is there adequate debug equipment available at each debug station ?
    Is a mulitmeter available at each debug station?
    Is an oscilloscope available in each debug area?
    Is a bus emulator available in each debug area?
    Can it be demonstrated that all debug personnel can demonstrate the use of all debug equipment ?
    Can it be demonstrated that an Expert System is used to capture fail codes, their fixes, and then recommend the most common
    Can it be demonstrated that the Test Software used to verify the fail at HMU is current to that which is used in Production?
    Can it be demonstrated that the Test Software used during Debug is current to that which is used in Production?
    Are adequate Spare Parts stocked of all Test Equipment ?
    Is there evidence that rework operators receive feedback on the quality of the rework performed?
5. PCBA Documentation
    Are the latest schematics for the PCBA available at each debug/failure analysis station?
    Do debug personnel have access to all down-rev revisions of schematics ?
    Are all schematics available to all debug personnel?
    Are the latest Bill of Materials and AVL for the PCBA available at each debug/failure analysis station?
                                                                                                       Maximum Score
                                                                                                        Score Obtained
                                                                                                     Score Percentage
                                                                                                      Pass Percentage

                                                                                                            Outcome
                Hi MB       Lo MB      Portables Hi Periph Lo Periph    Actual
              1 or 0 may only be entered. NA is not a valid response.

e.g. RTV & DSP details.)
ng forced routing?
flagged by Dell Engineering ?

us RMA history by serial number?

irement is to scrap upon 3rd time return)
umber and to conduct full WIP age analysis?

y board serial number?
d as a result of rework?
 and the reworker who completed the rework?
 in and completed the RMA process?
A Process Flows?

dditional special processing?
serial number and is available?
l be returned to Dell?

                Hi MB       Lo MB      Portables Hi Periph Lo Periph    Actual

o test processing?


MA tracking system prior to repair?
e mode verification prior to repair?
re verification?
                                                     NA       NA
rst determining if the original flash was corrupted? NA       NA
omponent Analysis?
upplier for Failure Analysis ?
al Test, and HMU prior to shipping?
 n of Bios, Firmware, etc?

                Hi MB       Lo MB      Portables Hi Periph Lo Periph    Actual
failure verification process?

 at Dell factories?
an NDF to fail?
 'Configuration Tests', etc?
F to fail for a specific config?
cial processes are held for Test Correlation?
ory Test for Dell Line Returns?



                Hi MB      Lo MB   Portables Hi Periph Lo Periph   Actual
re analysis activity?




                                                NA        NA

mmend the most common fix?
used in Production?




                Hi MB      Lo MB   Portables Hi Periph Lo Periph   Actual




                  64        64        64        63        62         64
                   0         0         0         0         0          0
                                                                     0%
                80%       80%       80%       80%       80%         80%
                 Not       Not       Not       Not       Not         Not
               Audited   Audited   Audited   Audited   Audited     Audited

				
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