MONDAY 20 SEPTEMBER 2010

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					                                                                                      VERSION 9 SEPTEMBER 2010


                                 MONDAY 20 SEPTEMBER 2010

WELCOME – KEYNOTE                                                                                     08:30 - 09:15

08:30 - 08:45          Welcome and opening address
                       Paul Mertens (IMEC vzw, Belgium)
08:45 - 09:15          0.1 – Roadmap of Future Device Scaling
                       Marc Heyns (IMEC vzw, Belgium)


SESSION 1 - MECHANICAL CLEANING: AFM                                                                  09:15 - 09:30

09:15 - 09:30          1.1 - Effects of Interfacial Strength and Dimension of Structures on Physical
                       Cleaning Window
                       Tae-Gon Kim1, Antoine Pacco1, Kurt Wostyn1, Steven Brems1, XiuMei Xu1, Herbert Struyf1,
                                  1              2                1                 1            1
                       Kai Arstila , Jin-Goo Park , Sefan De Gendt , Paul W. Mertens , Marc Heyns
                       1
                        IMEC vzw, Belgium
                       2
                        Hanyang University, South-Korea
                       (student paper)



SESSION 2 - CHEMICAL MECHANICAL CLEANING: HIGH VELOCITY AEROSOL                                       09:30 - 11:15

09:30 - 09:45          2.1 - Effects of Target Compliance on a High-Speed Droplet Impact
                       Toshiyuki Sanada1, Keita Ando2, Tim Colonius2
                       1
                       Shizuoka University, Japan
                       2
                       California Institute of Technology, United States of America

09:45 - 10:00          2.2 - Order Estimation of Physical Processes in Dynamics of Steam-Water Mixed
                       Spray Cleaning Technique
                       Masao Watanabe1, Toshiyuki Sanada2, Takashi Mashiko2, Atsushi Hayashida3
                       1
                        Hokkaido University, Japan
                       2
                        Shizuoka University, Japan
                       3
                        Aqua Science Corporation, Japan

10:00 - 10:15          2.3 - Thermomechanical Resist Removal-Cleaning System Using Cryogenic Micro-
                       Slush Jet
                       Jun Ishimoto, Daisuke Tan, Hiroto Ohtake, Seiji Samukawa
                       Tohoku University, Japan


       10:15 - 10:45   Coffee break
                       Hall Fabiola / Boudewijn, level 0


10:45 - 11:00          2.4 - Uniformity of particle removal by aerosol spray
                       XiuMei Xu1, Antoine Pacco1, M. Wada2, L. Leunissen1, H. Struyf1, P. Mertens1
                       1
                       IMEC, Belgium
                       2
                       Dainippon Screen Mfg. Co, Ltd, Japan

11:00 - 11:15          2.5 - Development of a novel advanced spray technology based on investigation of
                       droplet energy and pattern damage
                       Takayoshi Tanaka, Masanobu Sato, Mai Kobayashi, Hajime Shirakawa
                       Dainippon Screen Mfg. Co.,Ltd, Japan




UCPSS 2010 Programme                                       1
                                                                                       VERSION 9 SEPTEMBER 2010



POSTER ANNOUNCEMENT SESSION 1                                                                        11:15 - 12:00


                                     CHEMICAL MECHANICAL CLEANING

11:15 - 11:18          P1.1 - The influence of liquid media on the fracture strength of polysilicon
                       nanostructures
                       Daniel Peter1, Michael Dalmer1, Alfred Lechner2, Alexander Gigler3, Robert Stark4,
                                         5
                       Wolfgang Bensch
                       1
                        Lam Research AG, Austria
                       2
                        University of Applied Sciences Regensburg, Germany
                       3
                        Ludwigs Maximilians Universität München, Germany
                       4
                        TU Darmstadt, Germany
                       5
                        Christian Albrechts Universität zu Kiel, Germany
                       (student paper)

11:18 - 11:21          P1.2 - Development of a Megasonic System for Cleaning Flat Panel Display
                       Hyunse Kim1, Yanglae Lee1, Euisu Lim1, Menachem Elimelech2
                       1
                       Korea Institute of Machinery and Materials, South-Korea
                       2
                       Yale University, United States of America

11:21 - 11:24          P1.3 - Stroboscopic Schlieren Study of Bubble Formation during
                       Megasonic Agitation
                       Marc Hauptmann1, Steven Brems1, Elisabeth Camerotto1, Paul Mertens1, Marc Heyns1,
                                      1                 2                3
                       Stefan De Gendt , Christ Glorieux , Walter Lauriks
                       1
                        IMEC vzw/ KU Leuven, Belgium
                       2
                        KU Leuven / ATF, Belgium
                       3
                        KU Leuven, Belgium
                       (student paper)

11:24 - 11:27          P1.4 - A dual ultrasonic system for damage minimization
                       in semiconductor cleaning
                       Keunhwan Park1, Wonjung Kim2, Ho-Young Kim1
                       1
                        Seoul National Unversity, South-Korea
                       2
                        MIT, United States of America
                       late news

11:27 - 11:30          P1.5 - Observations of disruptive bubble behavior and micro-pattern damage in
                       ultrasonic cleaning
                       Tae-Hong Kim, Ho-Young Kim
                       Seoul National University, South-Korea
                       late news - (student paper)

11:30 - 11:33          P1.6 - Development of CO2 Cluster Beam Based Wafer Cleaning Process
                       Hoomi Choi1, Youngguk Kim2, Deokjoo Yoon3, Taesung Kim1
                       1
                        Sungkyunkwan University, South-Korea
                       2
                        Kookmin University, South-Korea
                       3
                        ZEUS Co.,Ltd., South-Korea
                       late news - (student paper)

11:33 - 11:36          P1.7 - Development of Megasonic Transducer at Single Wafer Cleaning Process
                       Taewon Seo, Youngki Ahn, Donghyun Yu, Taesung Kim, Donghyun Lim
                       Sungkyunkwan University, South-Korea
                       late news - (student paper)

11:36 - 11:39          P1.8 - Comparison of various physical cleaning
                       Sang Won Bae, Dae Hyuk Kang, Hyo San Lee, Kun Tack Lee, Yong Sun Koh
                       Samsung Electronics Co., Ltd., South-Korea
                       late news


                               FEOL ETCHING AND SURFACE PASSIVATION

11:39 - 11:42          P2.1 - Study of the etching mechanism of heavily doped Si in HF
                       Nick Valckx1, Daniel Cuypers2, Rita Vos1, Harold Philipsen1, Jens Rip1, Geert Doumen1,
                                    1            1                   1
                       Paul Mertens , Marc Heyns , Stefan De Gendt
                       1
                        Imec, Belgium
                       2
                        Catholic University of Leuven, Belgium
                       (student paper)




UCPSS 2010 Programme                                      2
                                                                                      VERSION 9 SEPTEMBER 2010

11:42 - 11:45          P2.2 - Silicon surface passivation in diluted HF
                       Philippe Garnier, Vincent Joseph, Benoit Pernet, Christophe Duluard, Yves Gomez
                       STMicroelectronics, France

11:45 - 11:48          P2.3 - Study on Al2O3 film in anhydrous HF vapor
                       Heini Ritala, Mikko Tuohiniemi
                       VTT Technical Research Centre of Finland, Finland

11:48 - 11:51          P2.4 - Monitoring of Dissolved Silicon in Si3N4 Etching Solution
                       Eugene Shalyt, Julia Tyutina, Peter Bratin
                       ECI Technology, United States of America

11:51 - 11:54          P2.5 - Co-solvent effect on dry etching of sacrificial SiO2 in supercritical CO2
                       Kwon Taek Lim
                       Pukyong National University, South-Korea
                       (student paper)

11:54 - 11:57          P2.6 - Static charge induced damage during lightly doped drain (LDD) by single
                       wafer cleaning process
                       Ted M.-L. Guo, Tsung-Hsun Tsai, Chin-Cheng Chien, Michael Chan, Chan-Lon Yang, Jun-
                       Yuan Wu
                       United Microelectronics Corporation, Taiwan

11:57 - 12:00          P2.7 - Surface Charging Induced Gate Oxide Degradation
                       Chunling Chiang1, C.M. Cheng1, J.Y. Hsieh1, J.H. Liao1, L.W. Yang1, T.H. Yang1, K.C.
                            1              2
                       Chen , Chih-Yuan Lu
                       1
                       MACRONIX/ Advanced Module Process Development, Taiwan
                       2
                       MACRONIX, Taiwan


       12:00 - 14:00   Lunch – Poster session (for posters presented in Poster Announcement Session 1)
                       Hall Fabiola / Boudewijn, level 0



SESSION 3 - CHEMICAL MECHANICAL PARTICLE REMOVAL: MEGASONICS                                       14:00 - 15:15

14:00 - 14:15          3.1 - Comparison of Gold Particle Removal from Fused Silica and Thermal Oxide
                       Surfaces in Dilute Ammonium Hydroxide Solutions
                       Viraj Pandit1, Manish Keswani2, Shariq Siddiqui2, Srini Raghavan2
                       1
                       Novellus Systems Inc, United States of America
                       2
                       University of Arizona, United States of America

14:15 - 14:30          3.2 - The Influence of the Angle of Incidence in Megasonic Cleaning
                       Steven Brems, Hauptmann Marc, Elisabeth Camerotto, XiuMei Xu, Stefan De Gendt, Marc
                       Heyns, Paul Mertens
                       IMEC vzw, Belgium

14:30 - 14:45          3.3 - Simultaneous Removal of Particles from Front and Backsides by A Single Wafer
                       Backside Megasonic System
                       Chan Geun Park, Hong Seong Sohn, Han Ok Kim
                       Akrion Systems, United States of America

14:45 - 15:00          3.4 - The Importance of Cavitation Hysteresis in Megasonic Cleaning
                       Elisabeth Camerotto, Stefan De Gendt, Marc Hauptmann, Denis Shamiryan, Marc Heyns,
                       Paul Mertens, Steven Brems
                       IMEC vzw, Belgium
                       (student paper)

15:00 - 15:15          3.5 - Control of Sonoluminescence in Deionized Water Exposed to Megasonic Field
                       Sangita Kumari1, Manish Keswani1, Satish Singh1, Mark Beck2, Eric Liebscher2, Pierre
                       Deymier1, Srini Raghavan1
                       1
                       University Of Arizona, United States of America
                       2
                       Product Systems Incorporation, United States of America


       15:15 - 15:45   Coffee break
                       Hall Fabiola / Boudewijn, level 0




UCPSS 2010 Programme                                     3
                                                                                        VERSION 9 SEPTEMBER 2010

SESSION 4 - DAMAGE: HIGH A/R STRUCTURES AND CHARGE                                                 15:45 - 16:45

15:45 - 16:00          4.1 - Effect of Drying Liquid on Stiction of High Aspect Ratio Structures
                       Gyu-Hyun Kim
                       Hynix Semiconductor Inc., South-Korea


16:00 - 16:15          4.2 - Drying step optimization: efficient drying time in single wafer and capillary force
                       modelisation
                       Antoine Mallet
                       STMicroelectronics, France
                       (student paper)

16:15 - 16:30          4.3 - Wet Clean Induce Pattern Collapse Mechanism Study
                       Chia-Cheng Yang, Chung-Chi Ko, Y.Y. Peng, J.W. Liou, C.C. Chou, Stefan Tsai, KC Lin,
                       S.M. Jeng, H.J. Tao
                       Taiwan Semiconductor Manufacturing Company, Ltd (TSMC), Taiwan

16:30 - 16:45          4.4 - Investigation of Wet Clean Induced Dielectric Surface Static Charge and Its
                       Impact on Gate Oxide Integrity
                       Shunwu Lin1, Vincent Chang2, Matt Yeh2, Eric Houyang2
                       1
                       TSMC / Fab12, FMD2, Taiwan
                       2
                       TSMC, Taiwan



POSTER ANNOUNCEMENT SESSION 2                                                                      16:45 - 17:45


                                                 FEOL: PR-STRIP

16:45 - 16:48          P3.1 - Study on Resist Removal Using Electrolyzed Sulfuric Acid Solution in
                       comparison with SPM
                       Tatsuo Nagai, Haruyoshi Yamakawa, Minoru Uchida
                       Kurita Water Industries LTD, Japan

16:48 - 16:51          P3.2 - Using the background signal of a light scattering tool for I/I photo resist strip
                       optimization and monitoring
                       Sandip Halder1, Rita Vos1, M. Wada2, Martine Claes1, Karine Kenis3, P.W. Mertens1,
                                       4                    4                4                 5
                       Prasanna Dighe , Sanda Radovanovic , Gavin Simpson , R. Sonnemans
                       1
                        IMEC, Belgium
                       2
                        Dainippon Screen Mfg. Co, Ltd, Japan
                       3
                        Imec, Belgium
                       4
                        KLA Tencor, United States of America
                       5
                        Axcelis Technologies, United States of America

16:51 - 16:54          P3.3 - SPM photoresist strip characterization and optimization using a combination
                       of novel experimental and simulation methods
                       Ian Brown1, Wallace Printz1, Nobutaka Mizutani2, Naoki Shindo2, Hironobu Hyakutake2,
                                     2
                       Yasuko Takagi
                       1
                        Tokyo Electron, United States of America
                       2
                        Tokyo Electron Kyushu, Japan
                       late news


                                                       BEOL

16:54 - 16:57          P4.1 - TiN Metal Hardmask Etch Residues Removal on Advanced Porous Low-k and
                       Cu Device with Corner Rounding Scheme
                       Hua Cui1, Martine Claes2, Samuel Suhard2
                       1
                       Dupont/EKC technology, United States of America
                       2
                       IMEC, Belgium

16:57 - 17:00          P4.2 - Improved Cleaning Process for Etch Residue Removal in an Advanced Copper
                       / low-k Device without the use of DMAC (dimethylacetamide)
                       Chung-Kyung Jung1, Sung-Wook Joo1, Sang-Wook Ryu1, Shari Naghshineeh2, Yangwon
                           2              1
                       Lee , Jae-Won Han
                       1
                       Dongbu Hitek, South-Korea
                       2
                       Surface Discoveries, United States of America




UCPSS 2010 Programme                                        4
                                                                                               VERSION 9 SEPTEMBER 2010

17:00 - 17:03          P4.3 - Aqueous Fluoride Residue Removers for 32 nm and Beyond Copper Ultra
                       Low-K Technologies
                       Glenn Westwood1, Anatolio Pigliucci2, Thomas Oszinda3, Susanne Leppack4, Matthias
                               4
                       Schaller
                       1
                        Mallinckrodt Baker, Inc., United States of America
                       2
                        Mallinckrodt Baker B.V., The Netherlands
                       3
                        Fraunhofer-Center Nanoelektronische Technologien (CNT), Germany
                       4
                        GLOBALFOUNDRIES Dresden Module Two GmbH & Co. KG, Germany


                                                            3D

17:03 - 17:06          P5.1 - Ultra-Fast In-Line Inspection for 3D SIC TSV line - Bonding & Thinning
                       Pierre-Yves Guittet1, Lars Markwort1, Greg Savage1, Anne Jourdain2, Sandip Halder2
                       1
                       Nanda Technologies, Germany
                       2
                       IMEC, Belgium

17:06 - 17:09          P5.2 - Real Downstream And High Density Radical Flux Processing For Surface
                       Cleaning And Polymer Removal in Bosh Process And Drie
                       Marc Segers
                       NANOPLAS, France

17:09 - 17:12          P5.3 - Cleaning requirement in the thinning module for 3D-Stacked IC (3D-SIC)
                       integration
                       Kurt Wostyn, Ming Zhao, Hushan Cui, Patrick Laermans, Anne Jourdain, Greet Verbinnen,
                       Herbert Struyf, Steven De Strycker, Martine Claes, Youssef Travaly, Leonardus Leunissen
                       Imec, Belgium

17:12 - 17:15          P5.4 - High efficiency single wafer cleaning for wafer bonding-based 3D integration
                       applications
                       Don Dussault1, Frank Fournel2, Viorel Dragoi3
                       1
                        ProSys, Inc., Germany
                       2
                        CEA, LETI, MINATEC, France
                       3
                        EVGroup, Austria


                                     LITHOGRAPHY RELATED CLEANING

17:15 - 17:18          P6.1 - Production of High Purity Functional Water at Point-of-Use for Advanced Mask
                       Cleaning Processes
                       Annie Xia
                       Entegris, United States of America

17:18 - 17:21          P6.2 - Wafer edge bead cleaning with laser radiation and reactive gas
                       David Elliott1, Victoria Chaplick2, Eugene Degenkolb2, Kenneth Harte2, Ronald Millman2
                       1
                       UVTech Systems Inc., United States of America
                       2
                       UVTech Systems, Inc., United States of America

17:21 - 17:24          P6.3 - Environmentally benign in-line cleaning solutions for immersion lithography
                       tools
                       Tianniu Chen1, Michael Korzenski1, S. Bilodeau1, P. Zhang1, T. Hogan1, K. VanBerkel2, G.
                            2        2            3           3
                       Mirth , R. Mih , K. Hoekerd , B. Jansen
                       1
                        Advanced Technology Materials, Inc. (ATMI), United States of America
                       2
                        Intermolecular Inc., United States of America
                       3
                        ASML Netherlands B.V., Netherlands Antilles


                                          CONTAMINATION CONTROL

17:24 - 17:27          P7.1 - Concentration of Three Organic Compounds Influencing Each Other on
                       Silicon Surface
                       Hitoshi Habuka, Tatsuhito Naito, Norihiro Kawahara
                       Yokohama National University, Japan

17:27 - 17:30          P7.2 - Evaluating surface particulate contamination and surface cleaning techniques
                       Daniel Rodier
                       Particle Measuring Systems, United States of America


       17:45 - 19:15   Exhibitor reception
                       Poster session (for posters presented in Poster Announcement Session 2)
                       Hall Fabiola / Boudewijn, level 0

UCPSS 2010 Programme                                        5
                                                                                       VERSION 9 SEPTEMBER 2010



                                  TUESDAY 21 SEPTEMBER 2010

SESSION 5 – BEOL                                                                                     08:30 - 12:00

08:30 - 09:00          5.1 - INVITED PRESENTATION - Low-k integration using metallic hard masks
                       Olivier Joubert (CEA, France)


09:00 - 09:15          5.2 - Characterization of Low-k Dielectric Etch Residue on the Sidewall by Chemical
                       Force Microscope
                       Tae-Gon Kim, Quoc Toan Le, Samuel Suhard, Marcel Lux, Guy Vereecke, Martine Claes,
                       Herbert Struyf, Sefan De Gendt, Paul W. Mertens, Marc Heyns
                       IMEC vzw, Belgium
                       (student paper)

09:15 - 09:30          5.3 - Optimized wetting behavior of water-based cleaning solutions for plasma etch
                       residue removal by application of surfactants
                       Nicole Ahner1, Sven ZImmermann1, Matthias Schaller2, Stefan E. Schulz1
                       1
                       Fraunhofer ENAS, Germany
                       2
                       Dresden Module Two GmbH & Co. KG, Germany

09:30 - 09:45          5.4 - Modification of post-etch residues by UV for wet removal
                       Quoc Toan Le1, Frederik Drieskens2, Jean-Francois De Marneffe1, Thierry Conard1, Marcel
                           1               1              1
                       Lux , Herbert Struyf , Guy Vereecke
                       1
                       Imec, Belgium
                       2
                       Katholieke Universiteit Leuven, Belgium

09:45 - 10:00          5.5 - 'Damage Free' Cleaning for advanced BEOL Interconnections
                       Lucile Broussous1, Kristell Courouble1, Emmanuel Richard1, Didier Levy1, C. Pernel2,
                                    2
                       Virginie Loup
                       1
                       STMicroelectronics, France
                       2
                       CEA_LETI, France


       10:00 - 10:30   Coffee break
                       Hall Fabiola / Boudewijn, level 0


10:30 - 10:45          5.6 - A descum review for cleaning surfaces in polymer embedded process flows
                       Geraldine Jamieson
                       Imec, Belgium

10:45 - 11:00          5.7 - Influence of photoresist and BARC selection on the efficiency of a post-etch
                       wet strip in BEOL applications
                       Els Kesters1, Marcel Lux1, Joris Pittevils2, Jonas Baeyens3, Guy Vereecke1, Herbert Struyf1
                       1
                        IMEC, Belgium
                       2
                        Groep T, Belgium
                       3
                        De Nayer Instituut, Belgium

11:00 - 11:15          5.8 - ESH solvent for stripping positive and negative photoresists in 3D-WLP and 3D-
                       SIC applications
                       Samuel Suhard, Martine Claes, Yann Civale, Philip Nolmans, Deniz Sabuncuoglu Tezcan,
                       Youssef Travaly
                       IMEC, Belgium

11:15 - 11:30          5.9 - Tungsten oxidation kinetic after wet cleaning: XPS and ToF-SIMS
                       characterization
                       Francesco Pipia, Annamaria Votta, Enrica Ravizza, Mauro Alessandri
                       Numonyx Italy, Italy

11:30 - 11:45          5.10 - A comparison of interactions of BTA and the amidoxime functional group with
                       copper surfaces
                       Siddharth Jethwa1, Daniel Tee1, Chris Reid2
                       1
                        EKC Technology Ltd/ University of St Andrews, United Kingdom
                       2
                        EKC Technology Ltd, United Kingdom
                       (student paper)




UCPSS 2010 Programme                                     6
                                                                                      VERSION 9 SEPTEMBER 2010

11:45 - 12:00          5.11 - Electrochemical, Physical, and Electrical Characterization of Two Clean
                       Solutions for Cu PCMP Clean
                       Yunlong Li1, Nancy Heylen1, Jerome Daviot2, Chris Reid3, Leonardus Leunissen1
                       1
                        IMEC, Belgium
                       2
                        Assignee from DuPont EKC Technology Inc. at IMEC, Belgium
                       3
                        DuPont EKC Technology Inc., United Kingdom


       12:00 - 13:45   Lunch – Poster session
                       Hall Fabiola / Boudewijn, level 0

SESSION 6 - FEOL PHOTORESIST REMOVAL                                                                13:45 - 15:15

13:45 - 14:00          6.1 - Measurement of adhesion force of resist to wafer by using SAICAS:
                       Characteristics of lift-off of resist by steam-water mixed spray
                       Takashi Mashiko1, Toshiyuki Sanada1, Hideo Horibe2, Itsuo Nishiyama3, Masao
                                 4                      5
                       Watanabe , Atsushi Hayashida
                       1
                        Shizuoka University, Japan
                       2
                        Kanazawa Institute of Technology, Japan
                       3
                        Daipla Wintes, Japan
                       4
                        Hokkaido University, Japan
                       5
                        Aqua Science Corporation, Japan

14:00 - 14:15          6.2 - High Temperature SPM Process Study for Stripping of Implanted Photoresist
                       Matt Yeh1, Fan-Yi Hsu2, Shun-Wu Lin2, Ducky Liao2, Eric Houyang2, C.M. Yang2
                       1
                       Taiwan Semiconductor Manufacturing Company, Taiwan
                       2
                       TSMC, Taiwan

14:15 - 14:30          6.3 - Study of controlled oxygen diffusion approaches for advanced photoresist strip
                       Shijian Luo, Orlando Escorcia, David Mattson, Carlo Waldfried, Dongwan Roh, Ivan Berry
                       Axcelis Technologies, Inc., United States of America

14:30 - 14:45          6.4 - Non-Oxidizing Solvent-based Strip of Ion Implanted Photoresist
                       Diana Tsvetanova1, Rita Vos2, K. Vanstreels2, R. Sonnemans3, I. Berry3, D. Mattson3, C.
                                3             2               2             1
                       Waldfried , G. Vereecke , P.W. Mertens , M.M. Heyns
                       1
                        IMEC/KUL, Belgium
                       2
                        IMEC, Belgium
                       3
                        Axcelis Technologies, United States of America
                       (student paper)

14:45 - 15:00          6.5 - All-wet, metal-compatible high-dose-implanted photoresist strip
                       George Totir1, M. Khojasteh1, R. Nunes1, E. Cooper2, M. Kern2, K. Van Berkel3, M. Payne3,
                                       1      1           1
                       R. Dellaguardia , B. To , S. Maurer
                       1
                        IBM, United States of America
                       2
                        ATMI, United States of America
                       3
                        Intermolecular, United States of America

15:00 - 15:15          6.6 - Applicable solvent photoresist strip process for high-k/metal gate
                       Masayuki Wada1, Hiroaki Takahashi1, Jim Snow2, Rita Vos3, Paul Mertens3, Hajime
                                  4
                       Shirakawa
                       1
                        DNS/IMEC, Belgium
                       2
                        DNSE, United States of America
                       3
                        IMEC, Belgium
                       4
                        DNS, Japan


       15:15 - 15:45   Coffee break
                       Hall Fabiola / Boudewijn, level 0


SESSION 7 - GE, III-V AND NEW MATERIALS SURFACE CHEMISTRY ('FEOL')                                  15:45 - 17:45

15:45 - 16:15          7.1 - INVITED PRESENTATION - Scanning probe microscopy imaging before and
                       after atomic layer oxide deposition on a compound semiconductor surface
                       Andrew Kummel (University of California, USA)
16:15 - 16:30          7.2 - Optimized Post-CMP and Pre-Epi Cleans to enable Smooth and High Quality
                       Epitaxial Strained Ge Growth on SiGe Strain Relaxed Buffers
                       Roger Loo, Laurent Souriau, Patrick Ong, Karine Kenis, Jens Rip
                       Imec, Belgium



UCPSS 2010 Programme                                      7
                                                                                      VERSION 9 SEPTEMBER 2010

16:30 - 16:45          7.3 - Cleaning and surface preparation for SiGe and Ge channel device
                       Masayuki Wada1, Hiroaki Takahashi1, Rita Vos2, Jim Snow3, Paul Mertens2, Hajime
                                 4
                       Shirakawa
                       1
                        DNS/IMEC, Belgium
                       2
                        IMEC, Belgium
                       3
                        DNSE, United States of America
                       4
                        DNS, Japan

16:45 - 17:00          7.4 - S-passivation of the Ge gate stack using (NH4)2S
                       Sonja Sioncke1, Claudia Fleischmann2, Dennis Lin1, Evi Vrancken1, Matty Caymax1, Marc
                              1                2                 2                 3              3
                       Meuris , Kristiaan Temst , Andre Vantomme , Matthias Muller , Michael Kolbe , Burkhard
                                3
                       Beckhoff
                       1
                       Imec, Belgium
                       2
                       K.U.Leuven, Belgium
                       3
                       PTB, Germany

17:00 - 17:15          7.5 - Wet chemical cleaning of InP and InGaAs
                       Rita Vos, Sophia Arnauts, Thierry Conard, Alain Moussa, Paul Mertens, Herbert Struyf
                       IMEC, Belgium

17:15 - 17:30          7.6 - Achieving ultra-shallow junctions in future CMOS devices by a wet processing
                       technique
                       Joel Barnett, Richard Hill, Prashant Majhi
                       SEMATECH, United States of America

17:30 - 17:45          7.7 - Effect of wet cleanings on GST surface: XPS characterization
                       Annamaria Votta, Francesco Pipia, Enrica Ravizza, Mauro Alessandri
                       Numonyx Italy, Italy


       19:30           Conference dinner
                       Hall Astrid / Leopold, level 0




UCPSS 2010 Programme                                     8
                                                                                          VERSION 9 SEPTEMBER 2010




                              WEDNESDAY 22 SEPTEMBER 2010

SESSION 8 - PHOTOVOLTAIC APPLICATIONS                                                               08:30 - 12:00

08:30 - 09:00          8.1 - INVITED PRESENTATION – Photovoltaics: the renewable energy revolution
                       leading the semiconductor industry
                       Pierre Verlinden (AMROCK Pty Ltd, Australia)
09:00 - 09:15          8.2 - Ozone based chemical oxide growth for crystalline solar cell production
                       Klaus Wolke1, Christiane Gottschalk2, Jochen Rentsch3, Heike Angermann4
                       1
                        Technologie Consulting Wolke, Germany
                       2
                        MKS ASTex GmBH, Germany
                       3
                        Fraunhofer ISE, Germany
                       4
                        Helmholz-Zentrum Berlin, Germany

09:15 - 09:30          8.3 - Simple wet-chemical cleanings for high-efficiency silicon solar cell applications
                       Lena Breitenstein, Damian Pysch, Martin Bivour, Martin Hermle, Wilhelm Warta
                       Fraunhofer ISE, Germany
                       (student paper)

09:30 - 09:45          8.4 - Excellent passivation of silicon surfaces by ultrathin Al2O3 films synthesized by
                       plasma and thermal atomic layer deposition
                       Gijs Dingemans, Magda Mandoc, Richard Van de Sanden, Erwin Kessels
                       Eindhoven University of Technology, The Netherlands
                       (student paper)

09:45 - 10:00          8.5 - Advanced texturization of mc-Si solar cells
                       Simon Braun1, Stefan Mathijssen2, Michael Michel2, Michael Schmidt2, Mary-MeiChin
                             3                     3              1
                       Shen , William-ChengWei Lin , Andreas Klipp
                       1
                        BASF SE, Germany
                       2
                        GP Solar GmbH, Germany
                       3
                        BASF Electronic Materials Taiwan Ltd., Taiwan


       10:00 - 10:30   Coffee break
                       Hall Fabiola / Boudewijn, level 0


10:30 - 10:45          8.6 - Surface Contamination of Silicon Wafer after Acid Texturisation
                       Antje Oltersdorf, Anamaria Moldovan, Martin Zimmer, Jochen Rentsch
                       Fraunhofer Institut for Solare Energy Systems, Germany

10:45 - 11:00          8.7 - Optimization of post-texturization cleans for heterojunction solar cells
                       Twan Bearda1, Kunta Yoshikawa2, Elisabeth Van Assche2, Barry O'Sullivan1, Ivan Gordon1,
                                       2           1               1
                       Kenji Yamamoto , Kris Baert , Jef Poortmans
                       1
                       IMEC, Belgium
                       2
                       Kaneka Belgium, Belgium

11:00 - 11:15          8.8 - HF Last Passivation for High Efficiency Heterojunction Solar Cells
                       Adrien Danel1, Florent Souche1, Thomas Nolan2, Yannick Le Tiec3, Pierre-jean Ribeyron1
                       1
                        CEA-LITEN, France
                       2
                        Akrion Systems, United States of America
                       3
                        CEA-LETI, France

11:15 - 11:30          8.9 - Wet-chemical preparation of textured silicon solar cell substrates: Surface
                       conditioning and electronic interface properties
                       Heike Angermann1, Abdelazize Laades2, Uta Stürzebecher2, Erhard Conrad1, Carola
                              1           1                     2           1
                       Klimm , Tim Schulze , Alexander Lawerenz , Lars Korte
                       1
                       Helmholz-Zentrum Berlin, Germany
                       2
                       CiS Forschungsinstitut für Mikrosensorik und Photovoltaik GmbH, Germany

11:30 - 11:45          8.10 - Novel Texture Etch Chemistry for Transparent Conducting Oxides used in
                       Photovoltaic Cells
                       Steven Verhaverbeke, Roman Gouk, Kurtis Leschkies, Robert Visser
                       Applied Materials, United States of America




UCPSS 2010 Programme                                      9
                                                                                            VERSION 9 SEPTEMBER 2010



POSTER ANNOUNCEMENT SESSION 3                                                                         11:45 - 12:00

11:45 - 11:48          P8.1 - Two-in-one texturing and polishing in one solution
                       Victor Prajapati1, Joachim John1, Jef Poortmans2, Robert Mertens2
                       1
                        IMEC, Belgium
                       2
                        Katholieke Universiteit Leuven, Belgium
                       late news - (student paper)

11:48 - 11:51          P8.2 - Thermal ALD for industrial Si solar cells: advanced cleaning
                       Bart Vermang, A. Rothschild, T. Bearda, J. John, J. Poortmans, R. Mertens
                       Imec, Belgium
                       late news - (student paper)


       12:00 - 13:45   Lunch – Poster session (for posters presented in Poster Announcement Session 3)
                       Hall Fabiola / Boudewijn, level 0


SESSION 9 - CONTAMINATION CONTROL: METAL AND ORGANIC CONTAMINATION                                    13:45 - 15:15

13:45 - 14:00          9.1 - Indirect ultra-pure water metals analysis by extended ion exchange on a silica
                       surface
                       Larry Shive, Haihe Liang, Alexis Grabbe
                       MEMC Electronic Materials, Inc., United States of America

14:00 - 14:15          9.2 - Gettering behavior of transition metals in low energy, high dose ion implanted
                       silicon
                       Koichiro Saga
                       Sony Semiconductor Kyushu Corporation, Japan

14:15 - 14:30          9.3 - Yield Impact of Backside Metal-ion contamination
                       D. Martin Knotter, Stephen Carey, Eric Ooms, Johannes Boersma, Elfried Van der Sar,
                       Robbert Cop, Wim Gerritzen, Hans Van Zadelhoff, Henk Bouman
                       NXP semiconductors, The Netherlands

14:30 - 14:45          9.4 - Reliable quantification of inorganic contamination by TXRF
                       Beckhoff Burkhard1, A. Nutsch2, R. Altmann2, G. Borionetti3, T. Holz4, C. Mantler5, P.
                       Hönicke1, M. Kolbe1, M. Müller1
                       1
                        Physikalisch-Technische Bundesanstalt, Germany
                       2
                        Fraunhofer IISB, Germany
                       3
                        MEMC Electronic Materials SpA, Italy
                       4
                        AXO Dresden GmbH, Germany
                       5
                        Siltronic AG, Germany

14:45 - 15:00          9.5 - Reference Samples for Ultra Trace Analysis of Organic Compounds on
                       Substrate Surfaces
                       Andreas Nutsch1, Burkhard Beckhoff2, G. Borionetti3, Davide Codegoni4, Philipp Hoenicke2,
                                         4               1                   2             1                 1
                       Salvatore Grasso , Andreas Leibold , Matthias Mueller , Michael Otto , Lothar Pfitzner ,
                                             4
                       Maria- Luisa Polignano
                       1
                        Fraunhofer IISB, Germany
                       2
                        Physikalisch Technische Bundesanstalt, Germany
                       3
                        MEMC Electronic Materials SpA,, Italy
                       4
                        Numonyx, Italy

15:00 - 15:15          9.6 - Assessment of a FOUP Conditioning Equipment for Advanced Semiconductor
                       Application
                       Michael Otto1, Sylvain Rioufrays2, Arnaud Favre2, Andreas Leibold1, Roswitha Altmann1,
                                          3                    3                3               1
                       Salvatore Gennaro , Rossana Dell'Anna , Roberto Canteri , Lothar Pfitzner
                       1
                        Fraunhofer Institute Integrated Systems and Device Technology, Germany
                       2
                        Adixen - Alcatel Vacuum Technology France, France
                       3
                        FBK - Fondazione Bruno Kessler, Italy


       15:15 - 15:45   Coffee break
                       Hall Fabiola / Boudewijn, level 0




UCPSS 2010 Programme                                     10
                                                                                   VERSION 9 SEPTEMBER 2010

SESSION 10 - FEOL: ETCHING                                                                     15:45 - 16:30

15:45 - 16:00          10.1 - Deposition Wet-etching Deposition (DWD) Method for Polysilicon Gate Fill-in
                       at Flash Memory
                       Chunling Chiang1, C.M. Cheng1, J.H. Liao1, J.Y. Hsieh1, C.C. Yeh2, L.W. Yang1, T.H.
                             1          1              2
                       Yang , K.C. Chen , Chih-Yuan Lu
                       1
                       MACRONIX/ Advanced Module Process Development, Taiwan
                       2
                       MACRONIX, Taiwan

16:00 - 16:15          10.2 - Poly-Silicon Wet Removal for Replacement Gate Integration Scheme: Impact of
                       Process Parameters on the Removal Rate
                       Farid Sebaai
                       IMEC, Belgium

16:15 - 16:30          10.3 - A Hybrid Dry-Wet Approach for Removal of a Dummy Polysilicon Gate in a
                       Replacement Metal Gate Scheme
                       Guang-Yaw Hwang1, J.H. Liao1, S.F. Tzou1, Mark Lin1, Autumn Yeh1, Eason Chen2, Weien
                              2          2                3            4                 3
                       Huang , David Lou , Gowri Kamarthy , Kaidong Xu , Amulya Athayde
                       1
                        UMC, Taiwan
                       2
                        Lam Research Corporation, Taiwan
                       3
                        Lam Research Corp, United States of America
                       4
                        Lam Research Corp., Austria




SESSION 11 - DRYING: DRYING MARKS                                                              16:30 - 16:45

16:30 - 16:45          11.1 - Elucidation of an isopropyl alcohol (IPA) adsorption phenomenon on a wafer
                       surface for achieving an ultra-clean and IPA-saving drying process in the batch
                       cleaning system
                       Yoshiya Hagimoto1, Tomoki Tetsuka1, Hayato Iwamoto1, Hironobu Hyakutake2, Hiroshi
                               2
                       Tanaka
                       1
                       Sony Semiconductor Kyushu Corporation, Japan
                       2
                       Tokyo Electron Kyushu Limited, Japan




16:45 - 16:55          Best Student Paper Award
16:55 - 17:00          Closure




UCPSS 2010 Programme                                   11

				
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