Renesas Semiconductor Packages General Catalog by ghkgkyyt

VIEWS: 23 PAGES: 23

									To our customers,



                     Old Company Name in Catalogs and Other Documents

  On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology
Corporation, and Renesas Electronics Corporation took over all the business of both
companies. Therefore, although the old company name remains in this document, it is a valid
Renesas Electronics document. We appreciate your understanding.

                    Renesas Electronics website: http://www.renesas.com




                                                        April 1st, 2010
                                                        Renesas Electronics Corporation




Issued by: Renesas Electronics Corporation (http://www.renesas.com)
Send any inquiries to http://www.renesas.com/inquiry.
                                                                 Notice
1.    All information included in this document is current as of the date this document is issued. Such information, however, is
      subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please
      confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to
      additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.
2.    Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights
      of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.
      No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights
      of Renesas Electronics or others.
3.    You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.
4.    Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of
      semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software,
      and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by
      you or third parties arising from the use of these circuits, software, or information.
5.    When exporting the products or technology described in this document, you should comply with the applicable export control
      laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas
      Electronics products or the technology described in this document for any purpose relating to military applications or use by
      the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and
      technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited
      under any applicable domestic or foreign laws or regulations.
6.    Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics
      does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages
      incurred by you resulting from errors in or omissions from the information included herein.
7.    Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and
      “Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as
      indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular
      application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior
      written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for
      which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way
      liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an
      application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written
      consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise
      expressly specified in a Renesas Electronics data sheets or data books, etc.
      “Standard”:        Computers; office equipment; communications equipment; test and measurement equipment; audio and visual
                         equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.
      “High Quality”: Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-
                         crime systems; safety equipment; and medical equipment not specifically designed for life support.
      “Specific”:        Aircraft; aerospace equipment; submersible repeaters; nuclear reactor control systems; medical equipment or
                         systems for life support (e.g. artificial life support devices or systems), surgical implantations, or healthcare
                         intervention (e.g. excision, etc.), and any other applications or purposes that pose a direct threat to human life.
8.    You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics,
      especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation
      characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or
      damages arising out of the use of Renesas Electronics products beyond such specified ranges.
9.    Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have
      specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions. Further,
      Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to
      guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a
      Renesas Electronics product, such as safety design for hardware and software including but not limited to redundancy, fire
      control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because
      the evaluation of microcomputer software alone is very difficult, please evaluate the safety of the final products or system
      manufactured by you.
10.   Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental
      compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable
      laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS
      Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with
      applicable laws and regulations.
11.   This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas
      Electronics.
12.   Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this
      document or Renesas Electronics products, or if you have any other inquiries.

(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majority-
         owned subsidiaries.
(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.
  2009.11




Renesas
Semiconductor Packages
General Catalog




www.renesas.com
    Providing Solutions
    Faster through Synergy
                                                                                                                                                                                                                                                                     Package Mounting
                                                                                                                                                                                                                                                        Line-up
                                                                                                                                                                                                                                                                     Height vs. Pin Count               3
    In recent years demand for higher mounting densities
                                                                                                                                                                                                                                                                     Package Mounting
    and improved reliability has been increasing. By utilizing                                                                                                                                                                                                       Area vs. Pin Count                 4
    the strengths of both partners to the merger, Renesas
                                                                                                                                                                                                                                                       Package                                          5
    Technology is able to supply package solutions more
    rapidly than ever before.                                                                                                                                                                                                                          Products      MCP/POP                            6

                                                                                                                                                                                                                                                                     S-CSP                              7

                                                                                                                                                                                                                                                                     FC-BGA                             8

                                                                                                                                                                                                                                                                     WPP                                9

                                                                                                                                                                                                                                                                     HQFP                              10

                                                                                                                                                                                      High Pin Count Package                                                         LFPAK                             11
                                                                                                                                                    Package Mounting

                                                                                                                                                                       3.8
                                                                                                                                                       Height (mm)


                                     2.5
                                                                                                                                                                                                   FC-BGA
                                                                                                                                                                                              Flip chip Ball Grid Array
                                                               QFP                                      HQFP                                                                                                                                                         WPAK                              12
                                                          Quad Flat Package                  Quad Flat Package with Heat Sink
      Package Mounting Height (mm)




                                                                                                                                                                       3.0
                                                                                                                                                                          500                Pin Count                                         3000                  LQFP                              13
                                     2.0
                                                                                                                                                                                             BGA
                                                                    LQFP
                                                          Low Profile Quad Flat Package
                                                                                                                                                                                          Ball Grid Array                                                            QFN                               14


                                     1.5
                                                                                                                                                                                                                                                                     FBGA                              15
                                                                                                                                                                                                                                SiP
                                                                                                                                                                                                                          System in Package
                                                                                                                                       FBGA                                                                                                                          Overmold BGA, Pwr BGA 16
                                                                    TQFP                                                        Fine Pitch Ball Grid Array
                                                             Thin Quad Flat Package

                                                                                                                                                                                                                               MCP
                                     1.0                                                                                                                                                                                  Multi Chip Package                         LGA                               17
                                                     QFN                       LGA
                                           Quad Flat Non-Leaded Package    Land Grid Array

                                                                                                                                                                                                                                                      WEB Site                                         18
                                                                    100                         200                                300                                          400               500                                   600
                                                                                                                                                Pin Count                                                                                             Environmental Environmental Considerations
                                                                                                                                                                                                                                                      Considerations for Renesas Technology Products   19




1                                                                                                                                                                                                                                                                                                           2
                                            Line-up

                                            Package Mounting Height vs. Pin Count




                                                                              4.0
Package Mounting Height vs. Pin Count




                                                                                                      BGA family


                                                                              3.0
                                               Package Mounting Height (mm)




                                                                              2.0   LQFP family




                                                                                                                                     LQFP

                                                                                                                                     TQFP

                                                                              1.0                                                    QFN
                                                                                                            TQFP family              BGA
                                                                                         QFN family    LGA family
                                                                                                                                     LGA
                                                                                                                            Under development
                                                                                                                            (including planning)



                                                                                                      100                 1000

                                                                                                            Pin Count



                                        3   Line-up
Line-up

Package Mounting Area vs. Pin Count




                                                                                                                      Package Mounting Area vs. Pin Count
                               1000
                                                        LQFP family
 Package Mounting Area (mm2)




                                                   TQFP family

                                                                                        BGA family




                                100


                                                                                                 LQFP
                                      QFN family                                                 TQFP

                                                                                                 QFN

                                                                                                 BGA

                                                                                                 LGA
                                                             LGA family
                                                                                        Under development
                                                                                        (including planning)
                                 10

                                                                  100                 1000

                                                                          Pin Count



                                                                                                        Line-up   4
              (Package for ICs except *)




                 Surface-                                               *
                                                                            UPAK, SOT-89, DPAK(S),
                  mount                    Transistor, Diode Package          MP-3, LDPAK(S),
                   type                                                     TO-220S, LFPAK, WPAK
                  (SMD)
                                                                             MPAK, SOT-23mod


                                                                                  URP, UFP

                                           Gull wing                          TSOP, SSOP, SOP,
                                             lead           Dual type
                                                                                   HSOP
                                           package
Package




                                                           Quad type          LQFP, TQFP, QFP,
                                                                               HQFP, HLQFP

                                            J-lead
                                           package          Dual type               SOJ


                                                           Quad type                 QFJ

                                           Non-lead
                                           package          Dual type           VSON, WSON


                                                           Quad type            VQFN, WQFN

                                                                                BGA, LBGA,
                                                           Area array         LFBGA, TFBGA,
                                                            package           HBGA, HLFBGA

                                                                                   FC-BGA


                                                                                    LGA




                                                                        *
                 Through-                                                      TO-92, TO-220
                   hole                    Transistor, Diode package
                   type                                                           TO-3P
                  (THD)
                                                                             DPAK(L), LDPAK(L)


                                                                                  DO-34, 35


                                                            Dual type             DIP, SDIP



          5   Package
Products


MCP/POP Multi Chip Package/ Package on Package
                                     Thin, Large-Capacity Packages for Mobile Applications



<MCP> • Thin, large-capacity design accommodating up to 4 chips in a single package
        Mounting height of 0.7 mm with 3 chips and 1.0 mm with maximum 4 chips
      • Allows various combinations to suit customers’ requirements (Flash, SRAM, mobile RAM).
<POP> • Large-capacity configuration allowing stacked accommodation of up to 8 chips
        Mounting height of 2.0 mm with maximum 8 chips and 1.4 mm with maximum 6 chips
      • Allows combinations of different chip types to suit customers’ requirements (Flash, SRAM, mobile RAM).


                          LSI Chip (1)                                                           LSI Chip(2)   LSI Chip(1) Au wire
                 LSI Chip (2)                                                                 LSI Chip(3)                            Outer lead
                                                    Au wire    Outer lead
                                                                                         LSI Chip(4)
           Resin
                                                                                         Resin




                                                                                                                                                         MCP/POP
                                                   Die bond
                                      Die pad
                                                   materials
                     LSI Chip (3)                                                               LSI Chip(5)                     Die bond materials
                                                                                                                   Die pad
                                                                                                    LSI Chip(6)
                                    LSI Chip (4)
                                                                                                      LSI Chip(7) LSI Chip(8)

Basic Structure of 4-Chip MCP                                                 Basic Structure of POP




MCP Line-up
Package height                                                              Number of chips
    (mm)                        2 chips                          3 chips                      4 chips               4 chips + spacer (same die)

     1.4


     1.2


     1.0


     0.9


     0.7




POP Mounting Examples                                                                 POP application Examples
                                                                                       - Flexible arrangements possible using
                                                                                                space below package -
                                                                                                                                       MCP




                                                                                                                                        SoC

       Parallel Arrangement                          Crossing Arrangement


                                                                                                                                          Products   6
             Products


             S-CSP                       Stacked-Chip Scale Package
                                           Thin Large-Capacity Packages for Mobile Applications



            • Thin, large-capacity design
              accommodating up to 4 chips in a single
              package
              Mounting height of 1.2 mm with 3 chips                                                 LSI Chip(4)
                                                                                                                                          Au wire
              and 1.4 mm with maximum 5 chips                               Resin             LSI Chip(3)
            • Allows various combinations to suit
              customers’ requirements (Nor Flash,
              SRAM, mobileRAM, AND Flash,
              SDRAM).




                                                                                                                                               Substrate
                                                                                            Spacer
                                                                         Ball
                                                                                        LSI Chip(2)
                                                                                                        LSI Chip(1)
S-CSP




                                                             Basic S-CSP Structure with 4 Chips and 1 Spacer




            Line-up
             Package size   Terminal pitch Mounting height                                    Number of terminals
                (mm)            (mm)          (mm)              48                67                       72                    88                    144

               8.5 X 7.5        0.75             1.2            •
                                                             <3 chips>




               8.5 X10.8
                                0.80             1.4                                                        •
                                                                                                        <5 chips>                 •
                                                                                                                              <5 chips>


                                0.80             1.2                               •
                                                                                <3 chips>                                         •
                                                                                                                              <4 chips>


                10 X11          0.80             1.4                                                                                                    •
                                                                                                                                                    <5 chips>

                                                                                                                      < >: Maximum number of chips (including spacer)




        7   Products
Products


FC-BGA Flip-chip Ball Grid Array
                              Ultra-High-Pin-Count Packages Featuring High-Speed Operation
                              and High Heat Radiation Capability


• Ultra-high-pin-count packages (500 to 2500 pins)
  supporting high-speed operation (GHz level)                                    Build-up substrate    LSI chip
                                                                                                                        Underfill
• Use of flip-chip interconnection and high-density build-
  up substrate
• Heat spreader structure for high heat radiation capability



                                                                                                                  Bump
                                                                             Heat spreader
                                                                                                ball

                                                                    Basic Structure




                                                                                                                                                   FC-BGA
 784pin        37.5mm X 37.5mm                                      1848pin      45.0mm X 45.0mm




Line-up
                                                                                   As of September, 2009
                                                                           Number of terminals
                                                                                                                  •   : In   mass production
Package size Terminal pitch Mounting height
   (mm)          (mm)        (mm Max)       304   436   554   560    593   653   729    784     961 1089 1296 1681 1848 2116
   19 X19          0.80         2.60
                                                  •
   25 X 25         0.80         2.60
                                                              • • •
   29 X 29         1.00
                                3.40
                                                                                  •
                                2.80
                                                        •
   31X 31          1.27         3.50
                                            •
   33 X 33         1.00         3.20
                                                                                                 •
   35 X 35         1.00         3.80
                                                                                                        •
                   1.27         3.30
                                                                                         •
 37.5 X 37.5
                   1.00
                                3.20
                                                                                                                  •
                                2.90
                                                                                                                  •
 42.5 X 42.5       1.00         3.80
                                                                                                                             •
   45 X 45         1.00         3.80
                                                                                                                                    •
 47.5 X 47.5       1.00         2.90
                                                                                                                                        •
                                                                                                                                    Products   8
           Products


           WPP Wafer Process Package
                                             Chip structure with redistributed interconnection and
                                             formed solder bumps for mounting at wafer level

          • Small, high-density mounting
          • High reliability                                                              Redistribution Iayer
                                                                                                                                             Bump
          • High-speed transmission                                           Polyimide (2)
                                                                                                                                         (Sn-Ag-Cu)
          • Lead-free                                                         Polyimide (1)


          Application Examples
                                                                     Passivation
          Automotive: High-reliability applications                       Al Pad                                                              280-
                      • ECU modules (stand-alone                                                                                              725μm
                        type WPP)                                                                           LSI Chip
          Servers:    High transmissibility, high
                      reliability
                      • Ultra-high-speed cache
                                                                                                 WPP Cross-Sectional Structure
                        memory (PKG type WPP)
                      • Ultra-high-speed, ultra-high-
                        pin-count SoCs (PKG type                                           LSI Chip        LSI Chip                         Interposer
                                                                   WPP
                        WPP)                                  Planar Structure



                                                                              Underfill

                                                                                               WPP Application Example (SiP)
WPP




          Applications
                                                                                                                      L    S
          Wafer size: ø200/ø300
          Rewiring rule: 10 μm/13 μm minimum L/S
          Maximum thickness t: 11 μm                                                                t



          Bump Structure
            Bump pitch      Basic Land                                                 Bump height (μm)
              (μm)           size (μm)            ≤70    80         90         100             110           120            130    140          150
               ≥500              250
                                                  •      •          •              •            •                •             •   •            •
                400              250
                                                  •      •          •              •            •                •             •   •
                300              150
                                                  •      •          •              •            •
                250
               <250
                                 130
                         Individually supported
                                                  •      •          •              Individually Supported



                                                                                                                     Bump pitch


                                                                                                                                   Bump height



                                                                                                          Land size

      9   Products
Products


HQFP Quad Flat Package with Heat sink
                                                        Heat spreader type, high heat-radiation Packages for
                                                        Automobile Applications

• Exposed heat spreader structure for low thermal
                                                                                                                             Chip
   resistance: j-c = 1.0˚C/W                                                                          Au Wire                               Resin
• High-quality specifications for automobile and OA                                       Die bond
                                                                                          materials
   applications
   (JEDEC MSL-1)
• Suitable for high-temperature environments
   (Ambient environment: Tj = 150˚C Max., Ta =
   125˚C Max.)
• Protruding corner header structure, protecting
   leads and simplifying visual inspection of mounting                                                  Lead
                                                                                                                                    4 Heat Spreader
   solder                                                                                                                           Corner Headers
• Industrial standard out line: ED-7311-15 (JEITA)
                                MO-204 (JEDEC)                                          Basic Structure



Line-up




                                                                                                                                                                 HQFP
                                     HLQFP1414-80                               HLQFP1414-100                               HQFP1414-64




Characteristics
Fig. Thermal resistance measured Results of HLQFP (Type2)
     (Connected Heatspreader area to PWB)

                                     25
                                              Connected soldering area
                                                                                                                Boundary condition:
     Thermal Resistance j-a (˚C/W)




                                                only 4 corner header
                                                                                                                 Natural convection
                                     20
                                                                                                                 Mounted Renesas original PWB
                                                                                                                 (FP=4, 100mm 100mm)
                                                                         S=7%
                                     15



                                     10


                                                                                                                       All exposed header area
                                     5                                                                                      S=Approx. 100%



                                     0
                                          0        20              40             60            80               100
                                              Connected Heatspreader area by solder to PWB S (%)

                                                                                                                                                 Products   10
             Products


             LFPAK                           Loss Free Package
                                            Low on-resistance Packages for Power MOSFET



             • Wireless structure for low on-resistance
                  2.1 mΩ typ.
             • Exposed drain electrode structure for low thermal
                  resistance: ch–c: 3˚C/W
             • Low inductance: 1.1 nH                                                              5
             • Small package: Same board footprint as SOP8
                                                                                                                                          4
             • Industrial standard package: SC-100 (JEITA)
                                             MO-235 (JEDEC)                                                                           3
             • Lead-free
                                                                                                                                  2
                                                                                 Pin No.
                                                                                 1, 2, 3 Source
                                                                                                                              1
                                                                                 4 Gate, 5 Drain




             Package Dimensions
                                                              5.3 Max.

                                                                4.9
                                                                4.0                                            0.25
LFPAK




                                           3.95
                                    6.1




                                                                                                                0.1 Max.




                                                                                                                 1.1 Max.
                                                  1.27                           0.4
                                                                                                                                              Unit:mm




             Structure
                                                                         Resin
                                                                                                        Lead (Gate, Source)




                                          Heat Sink (Drain)              Die           Bump            Die bond materials



        11   Products
Products


WPAK Very Very Thin Package
                           Ultra thin type Packages for power MOSFET for Mobile Applications



• Thin type: Max. 0.8 mm mounting height
• Low thermal resistance ( ch-c): 5˚C/W
• Small package: Same board footprint as SOP8                                                     8
                                                                                5      6      7
• Flat lead structure (HSON equivalent)
• Lead-free




                                                                                                          3     2    1
                                                                     Pin No.                          4
                                                                     1, 2, 3 Source
                                                                     4 Gate, 5, 6, 7, 8 : Drain




Package Dimensions

                       5.3 Max.                                                 0.8 Max.
                           4.9

                 8     7         6   5
          5.9




                                                6.1




                                                                                                                                    WPAK




                 1     2     3       4
                      Top view                                                                    Bottom view
                                                       (stand-off)
                                                Max.
                                         0.05




                                                                                                                    Unit:mm




                                                                                                                    Products   12
            Products


            LQFP                      Low Profile Quad Flat Package
                                          High reliability, Standard Lead type Packages with rich line-ups



            • High pin-count, ideal for high-functionality, high-I/O-
              count LSIs
                                                                                                                        Resin
            • Small size, allowing high-density mounting
                                                                                                                                Chip
            • Low profile QFP (LQFP) with package mounting
              height of 1.70 mm or less
            • Small die pad structure, enabling highly heat-
              resistant mounting
                                                                                                                                       Lead
                                                                                        Au Wire

                                                                                    Die bond materials           Partial Silver Plating



                                                                             Basic Structure




            Line-up
              Package size   Terminal pitch
                                                                   As of September, 2009
                                                                                           •   : In mass production
                                                                                Number of terminals
                                                                                                                         •   : Under development

                 (mm)            (mm)         32   40    48   52   64   80    100 112 116 120 128 144 156 176 208 216 256
                                  0.80
                                              •
                  7X7             0.65
                                                   •
                                  0.50
                                                         •
                                  0.65
                                                         • •
                 10 X10           0.50
                                                                    •
                                  0.40
                                                                      •
                 12 X12           0.50
                                                                      •
                                  0.80
                                                                    •
                 14 X14
                                  0.65
                                                                      •
                                  0.50
                                                                              •
LQFP




                                  0.40
                                                                                                 •
                                  0.80
                                                                        •
                 14 X 20
                                  0.65
                                                                              •
                                  0.50
                                                                                                         •
                                  0.40
                                                                                                                    •
                 16 X16           0.50
                                                                                                 •
                                  0.65
                                                                                   • •
                 20 X 20          0.50
                                                                                                             •
                                  0.40
                                                                                                                             •
                 24 X 24
                                  0.50
                                                                                                                             •
                                  0.40
                                                                                                                                              •
                 28 X 28
                                  0.50
                                                                                                                                       •
                                  0.40
                                                                                                                                                  •

       13    Products
Products


QFN                     Quad Flat Non-lead Package
                                Small, thin Packages for Mobile Applications



• Small size, ideal for reducing size and weight for mobile applications.
• Allows orientation toward thinner implementation
  Max. 1.0 mm mounting height model are in mass production




                                                                            Resin

                                                                                                             Top View of Package
                                                                            Chip


                                                                            Au Wire


                                                                            Lead




Basic Structure


                                                                                                            Bottom View of Package



Line-up
              As of September, 2009
                                         •
 Package size Terminal pitch Mounting height
                                             : In mass production        : In mass production (Exposed die pad)
                                                                                      Number of terminals
                                                                                                                  •   : Under development

    (mm)          (mm)        (mm Max)            20     24         28       32        36     40     48      52       56     64      68

     4X4            0.50
                                  0.95
                                  0.80
                                                  •
     5X5
                    0.50
                                  0.95
                                  0.80
                                                                    •
                    0.40          0.95
                                                                            •
     5X6            0.50
                    0.80
                                  0.95
                                  0.80
                                                                           •
                                                                                                                                                 QFN




     6X6            0.50
                                  0.95
                                  0.80
                                                                                       •      •
                    0.40          0.90
                                                                                                    •
                    0.50
                                  1.00
                                  0.80
                                                                                                     •
     7X7                          1.00
                    0.40          0.95
                                                                                                             •
                                  0.90
                                                                                                             •
     8X8
                    0.50
                                  0.95
                                  0.80
                                                                                                             •
                    0.40          0.95
                                                                                                                             •
     9X9            0.50          0.80
                                                                                                                             •
    10 X10          0.50          1.00
                                                                                                                                     •
                                                                                                                               Products     14
            Products


            FBGA                               Fine-pitch Ball Grid Array
                                                   High reliability, Standard Array type Packages with rich line-ups



            • Arranging solder balls two-dimensionally, multi-pin-count and small package size can be achieved.
            • Small size offering excellent electrical characteristics
            • High quality and reliability

                                 Au Wire               LSI Chip                        2828-208pin                             2727-256pin                   1313-240pin             1111-256pin
                  Resin




                                                             Substrate
                                                                                             QFP                                     BGA                                      FBGA
                    Ball
                                                                                       7.0-11.5 (nH)                           4.0-6.5 (nH)                              1.2-4.5 (nH)
                                        Die bond materials


            Basic Structure                                                    Smaller Packages and Lower Impedance


            Line-up
            To 200pin
              Package size   Terminal pitch     Mounting height
                                                                                                            As of September, 2009
                                                                                                                                          •
                                                                                                                          Number of terminals
                                                                                                                                              : In mass production
                                                                                                                                                                             •   : Under development

                 (mm)            (mm)             (mm Max)          36    49     64        65         81        85      100    112    113      120    121        160         175     176    199    200
                                 0.80                 1.40
                                                                    •
                 5X5
                                 0.50
                                                      1.30
                                                                                                      •
                                                      1.00
                                                                                   •
                5.5X5.5          0.50                 1.30
                                                                                                                        •
                                 0.80                 1.40
                                                                          •
                 6X6
                                                      1.40
                                                                                                                •
                                 0.50                 1.20
                                                                                           •
                                                      1.00
                                                                                                                •              •
                 7X7             0.80                 1.40
                                                                                   •
                                 0.65
                                                      1.50
                                                                                                                                      •
                 8X8                                  1.40
                                                                                                                                                •
                                 0.50                 1.20
                                                                                                                                                                                     •
                 9X9             0.80                 1.40
                                                                                                                        •
                10X10            0.80                 1.40
                                                                                                                               •                         •
                11X11            0.65                 1.40
                                                                                                                                                                                                   •
                12X12            0.80                 1.40
                                                                                                                                                                 •
                13X13            0.80
                                                      1.40
                                                                                                                                                                             • • •
                                                      1.20
                                                                                                                                                                             •
            More than 201pin
              Package size   Terminal pitch     Mounting height
                                                                                                            As of September, 2009
                                                                                                                                          •
                                                                                                                          Number of terminals
                                                                                                                                              : In mass production
                                                                                                                                                                             •   : Under development

                 (mm)            (mm)             (mm Max)         224   233   240     256      261       264    272     288   292    320     336    401     404       417     440    449    513   565
                10X10            0.50                 1.40
                                                                         •
FBGA




                11X11            0.50                 1.40
                                                                                       •
                                 0.80                 1.40
                                                                    •
                                 0.65
                                                      1.90
                                                                               •
                13X13
                                                      1.40
                                                                               •                •                        •
                                                      1.55
                                                                                                                                                                       •
                                 0.50                 1.40
                                                                                                                                                     •                   •
                                                      1.30
                                                                                                                                      •                                •
                15X15
                                 0.80                 1.40
                                                                               •                           •
                                 0.50                 1.30
                                                                                                                                                                                             • •
                                                      2.00
                                                                                                                                •
                17X17            0.80
                                                      1.90
                                                                                       •                            •           •
                                                      1.70
                                                                                       •
                                                      1.40
                                                                                                                                               •
                19X19            0.80                 1.90
                                                                                                                                                             •
                21X21            0.80                 1.90
                                                                                                                                                                                       •
       15   Products
Products

                   BGA, Ball Grid Array
OvermoldArray, Power Pwr BGA
Overmold Ball Grid
                                 Area Array High-Pin-Count Packages



• High-Pin-Count Packages (250 to 1,500 Pins)
• Strengthened Power Supply and Ground to Support High-Speed Operation
• Internal Heat Spreader for Excellent Heat Dispersion (Power BGA)
• Higher Quality, Higher reliablity

  Overmold BGA                                                                   Pwr BGA
                                LSI Chip                                                                                             LSI Chip
                                                 Au Wire                                                                 Au Wire
                    Resin                                                                                                                   Heat spreader
                                                                                                   Resin




                                                         Substrate                                      Ball
                     Ball                                                                                                                             Substrate


Basic Structure


Line-up
To 400pin
 Package size   Terminal pitch Mounting height                                                 Number of terminals
                                                                                                                       As of September, 2009
                                                                                                                                                    •   : In mass production


    (mm)            (mm)        (mm Max)           225     256       268    272    297      304       316          324       329     345    352        361     376      385

   17X17            1.00
                                    2.00
                                                            •
                                    1.80
                                                            •
   19X19            1.00            2.20
                                                                                                                   •
                                    2.60
                                                                     •
   21X21            1.00            2.40
                                                                     •
                                    2.10
                                                                            •
   23X23            1.00
                                    2.60
                                                                                                                                     •                            •
                                    2.50
                                                                                    •
                    1.50
                                    2.70
                                                   •
                                    2.50
                                                   •
   27X27
                    1.27
                                    2.60
                                                                                                      •
                                    2.50
                                                            •               •                         •
                    1.00            2.60
                                                                                                                                                        •
   31X31            1.27
                                    2.60
                                                                                              •                              •                                          •
                                    1.70
                                                                                              •
   35X35            1.27            2.70
                                                                                                                                             •
More than 401pin
 Package size   Terminal pitch Mounting height
                                                                                      As of September, 2009
                                                                                               Number of terminals
                                                                                                                    •    : In mass production
                                                                                                                                                  •   : Under development
                                                                                                                                                                                    Overmold BGA, Pwr BGA




    (mm)            (mm)        (mm Max)       425         441   449       456    484    516      537      561         564     577    680       681      753      769   953
   23X23             1.00           2.60
                                                           •
   27X27             1.00
                                    2.60
                                                   •                 •            •               •
                                    2.43
                                                   •
   31X31             1.00           2.60
                                                                                                               •                                         •
                     1.27
                                    2.60
                                                                           •              •
   35X35                            2.50
                                                                                          •
                     1.00           2.60
                                                                                                                                                •                 • •
  37.5X37.5          1.27           2.80
                                                                                                                         •
   40X40             1.27           2.80
                                                                                                                                 • •
                                                                                                                                                               Products        16
           Products


           LGA Land Grid Array
                                          Small, thin, high-density Packages for Mobile Applications




           • Arranging lands instead of balls two-dimensionally, small package size and
             height can be achieved
           • High quality, High reliability of 2nd level interconnect




                            Resin                  LSI Chip              Au Wire



                                                                                                                  Top View of Package




                              Substrate    Die bond materials           Land




           Cross-Sectional Structure
                                                                                                                 Bottom View of Package




           Line-up
           Package size Terminal pitch Mounting height
                                                                                                As of September, 2009
                                                                                        Number of terminals
                                                                                                                        •   : In   mass production


              (mm)          (mm)        (mm Max)              49   64              77      81         85        100           113          145

               5X5
                              0.65          1.05
                                                              •
                              0.50          1.05
                                                                                           •
             5.5 X 5.5        0.50          1.05
                                                                                                                •
               6X6
                              0.65          1.05
                                                                   •
                              0.50          1.05
                                                                                   •                                           •
                              0.65
                                            1.20
                                                                                                      •
               7X7                          1.05
                                                                                                      •         •
                              0.50          1.05
                                                                                                                                            •
               8X8            0.65          1.20
                                                                                                                               •
               9X9            0.65          1.20
                                                                                                                                            •
LGA




              10 X10          0.65          1.05
                                                                                                                                            •



      17   Products
Home Page                                                                                    Introducing Our Web Site


www.renesas.com increases the quality of
your design and makes it faster.
                                             Providing Solutions Faster through Synergy
                                             In recent years demand for higher mounting densities and improved reliability has been
                                             increasing. By utilizing the strengths of both partners to the merger, Renesas Technology is
                                             able to supply package solutions more rapidly than ever before.




                         1
                                             Various Search Engines
     2
                                             1Keyword Search/Part Number Search
                                             Search the Web site using keywords or display product specs by typing in a product number.
                                             You can switch between the two types of results by clicking the appropriate tab.Then select the
                                             information you require from the list.
                                             2Parametric Search
     3                                       You can narrow your search by product function or specification to create a listing of items
                                             matching your desired specifications.You can also download the search results as a CSV file.
                                             3Document Library
     4
                                             You can search for documents by type or document number.
                                             4Discontinued Product Search
     5                                       You can search for information on products that are no longer being manufactured or promoted.
                                             5Non-Renesas Equivalent Product Search
                                             Input the part number of a non-Renesas product to display a list of equivalent products from Renesas.



                                             RSS Feeds
                                             Renesas Technology distributes information such as news releases, sample program code,
                                             documentation, and notifications about updates to the Web site via RSS feeds. Make sure to
                                             subscribe to keep up to date.




  Support Information                                 Partner Vendor Links                                  User Registration
 We aim to offer a total support                      This feature lets you find accurate               MyRenesas Registration provide rich
 package to meet customers´ needs                     information on services and                       information about Renesas by mail-
 through the provision of simulation data,            products such as microcomputer                    magazine and various premium
 FAQ, seminars, inquiries via the Web,                development environments provided                 supports.
 and so on.                                           by Renesas partner vendors.




                                    http://www.renesas.com
Overseas       http://www.renesas.com/eng/products/package/index.html
                                                                                                                                      WEB Site       18
                                               Environmental Considerations
                                              for Renesas Technology Products
               Renesas Technology is working actively to improve product environmental quality in all aspects of its
                business operations, including product design, materials procurement, manufacturing, and shipping.


                Design                                      Development of environmentally compliant products through product
                                                            environmental assessment
                                                            Making products more resource and energy efficient (more compact, higher integration,
                                                            reduced power consumption, extended service life)
                                                            Reducing environmental load due to chemicals (management of chemical content of products)

                                                            Compliance with domestic and international product environmental
                                                            regulations
                                                            EU RoHS Directive, China RoHS, ELV Directive, REACH Regulation



                                             Renesas Product Environmental Quality Management Sequence

                         Global environmental
                             preservation                                                  Customers                                Development, design
                         Resource conservation /                                                                                 Design of environmentally
                             Health effects                                                                                      compliant products
                                                                                  Requirement to eliminate




                                                                                                                                                                                Management of chemical substances
                                                                                                                                 (development and design
                                                                                  restricted substances                          operations)
                                                                                  Requirement to report chemical
                                                                                  substances content

                                Regulations                                                                                               Procurement
                                                                                                                                 Green procurement
                                RoHS Directive                                                                                   (materials procurement and
                                                                                    Renesas Technology                           product environmental
                               WEEE Directive
                                                                                                                                 management operations)
                                 ELV Directive                                                                                   Conformance assessment
                             REACH Regulation                                     Requirement to eliminate                       (quality assurance,
                                                                                  restricted substances                          development, and design
                              China RoHS etc.                                                                                    operations)
                                                                                  Requirement to report
                                                                                  chemical substances content

                                                                                                                                         Manufacturing
                                                                                                                                 Production management
                                                                                            Suppliers                            (manufacturing operations)



                                                                                                                              Shipment of environmentally
                                                                                                                                  compliant products




                                                            Thoroughgoing green procurement activities
                Procurement                                 Investigation and confirmation of chemical content of procured
                                                            parts and materials


                                                            Prevention of inclusion or contamination by prohibited chemicals in
                                                            products (process management)
                Manufacturing                               Reduction of CO2 emissions (reduction of PFC output and energy usage),
                                                            reduction of environmental load from chemicals used in manufacturing,
                                                            reduction of waste materials


                                                            Reduction of volume of packing materials
                                                            (expanding reuse of plastic packaging materials)
                Shipping
                                                            Reduction of energy consumption in transport
                                                            (improving overall efficiency of distribution)



                                                                   Compliance with customer requirements
                                          Transmission of information such as chemical content of products

     RoHS : Restriction of the use of certain Hazardous Substances in electrical and electronic equipment       ELV : End of Life Vehicles
     WEEE : Waste Electrical and Electronic Equipment                                                           REACH : Registration, Evaluation, Authorization and Restriction of Chemicals

19
Memo

								
To top