Split Vision Rework

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					Sniper & Sniper II Split Vision Rework Systems SMD-7000
The Sniper & Sniper II are BGA and Micro BGA Rework systems. One side of the Sniper removes the device, the other side
selects a replacement component; a monitor reflects the image of the bottom of the chip and the footprint on the board.
These are then adjusted to exactly overlay each other and the component placed automatically. The part is then reflowed.


               Split Vision

Energy Reflow                           DABIS Prism                               Free & Clear
The Sniper & Sniper II SMD-7000         A Dichroic Alignment Beam Image           Once aligned, the component is
Rework systems combine the unique       Splitter (DABIS) is a contemporary        automatically positioned by
Energy Reflow operation of the          innovative refinement in imaging dual     pneumatic control, lifting the camera
Flo-Master with the very latest         fields using a split prism to enhance     system clear of the placement vector.
technology in optic engineering and     and clarify the image.                    A Vertical Placement Drive (VPD)
alignment design. They provide                                                    accurately orients the component to
absolute control in positioning all                                               the contact land patten.
ultrafine pitch, Micro BGA, QFP, and
CSPs (Chip Scale Packages), together
with large ceramic or plastic BGA                          Sniper & Sniper II Specifications:
devices.                                                           Power     110–220V 1800 Watts
                                                                  Current    25 Amps @ 110V, 15 Amps @ 220V
                                                               Dimension     21.75" x 29.12" (552 x 740 mm)
                                                   Board Holder Standard     12" x 16" (305 x 406 mm)
                                                 Reflow Nozzles included     See Flo-Master, page 13
                                                Preheat Nozzles included     See Flo-Master, page 13
                                                             Temperature     Select Celsius or Fahrenheit
                                                      Reflow Air Velocity    Internal Motor <12.7 CFM
                                                     Component Pick Up       Venturi Generator Reflow & Imaging
                                                               Factory Air   60-80 psi for Placement System
                                                  Controller Both Heaters    Fuzzy Logic PID Profile Storage
                                                         Board Alignment     Micrometer Controls
Vacuum Pick-Up                                          Reflow Operation     Pulsed or Continuous
                                                    Maximum Board Size       16" x 18"(406 x 457 mm)
A Venturi Vacuum Pick-Up system                                  Air Flow    Up to 1 SCFM
supports the component during                                     Weight     165 lb (75 kg)
alignment and automatically snap                          Communication      RS232 Sniper II Only
releases the component during                       Operational Software     Specview GDW Sniper II Only

16                                               Phone: 305-451-4722 Fax: 305-451-3374 e-mail:
                                  Sniper & Sniper II Split Vision Rework Systems SMD-7000
Look Up Look Down                                                                  Sniper vs. Sniper II
The DABIS Prism permits the contact                                                The vision operation of both
array of the component to be                                                       machines is identical, only the reflow
viewed from the underside and                                                      programming and storage capabilities
superimposed over an image of the                                                  differ.
contact land pattern on the PCB.
Component Alignment                                                                The Sniper is an ideal choice where
Precision Micrometers align the two                                                simple programing is required. Four
lead patterns; the camera’s zoom and                                               (4) profiles are provided in the reflow
focus are adjusted to comfortably         Vertical Placement Drive (VPD)           controller. The Bottom Heater is
align and view the PCB and                                                         independently controlled and the
                                          When placing delicate components to
component on the monitor.                                                          system is operated by a foot pedal
                                          fine tolerances, emphasis on stability
                                                                                   (panel switch optional).The Sniper
                                          of engineering is a priority, the
Focus and Split                           reinforced VPD provides a stable final
                                                                                   does not include Data Logging
                                                                                   capabilities. See page 18 for
Using a prism simplifies the alignment    positioning operation, and is
                                                                                   order information.
procedure and ensures repeatability       adjustable in the Z-axis for pressure
during continuous operation. It is also   sensing.
possible to view many different types
                                                                                   Sniper II
of components without additional          Rotary/Staged Vacuum                     The Sniper II stores up to sixteen (16)
setup. To view the diagonal corners                                                multi segment (Ramp & Soak) profiles
of very large components, an
                                           Board Holder                            on the machine or any number of
optional Diagonal Image Scope can         The SMD-7007 includes a standard         profiles by using Windows-based
be dropped into place when needed.        12" x 16" (305 x 406 mm) vacuum          software. Programs can be created
                                          actuated Board Holder, which quickly     and entered directly on the Reflow
Repeatable Alignment                      glides to position. Precision            Controller keypad or created using
                                          micrometers adjust in X- and Y-axis      Graphical Display software (included).
The selected component is first
                                          and the “Rotary/Staged” feature of       Data Logging events is provided in
supported in a Template Nest, which
                                          the table provides “Theta.” Optional     PDF format. The rework cycle is
is seated within a Reflex Register. The
                                          Board Holder Extender Kits are           automatically controlled and shut off
Register is then moved to position
                                          available for smaller and larger board   after completion. See details and
under the Vacuum Pick-Up on the
                                          types.                                   order information on page 18.
Vertical Placement Drive (VPD), thus
providing repeatable selection from
the same registration, every time.
                                          • Registration without mirror            Stencil Attachment
                                            adjustment for components              An optional Screen Stencil Foot
                                            0.040"–2.50" sq. (1.02–63.5 mm2)       mounts to the Vacuum Pick-Up Barb
                                          • Automatic placement                    of the vision system, so that the
                                          • Component Templates for fast           stencil pattern is overlayed to the PCB
                                            registration                           component pattern, when viewed
                                          • Vacuum pick-up of component            on the monitor. The stencil can then
                                          • Vacuum actuated                        be automatically lowered to position
                                            Rotary Board Holder                    and solder paste applied by the
                                          • X, Y, Z and Theta Micrometer           squeegee, which is included in
                                            adjustments                            the Kit.
                                          • High Resolution Camera and
                                            14" Monitor for 10-80X viewing
                                          • Widest range of component types
Final Positioning                           accommodated from Micro BGAs to
                                            high pin count Ceramic CBGA
The Vacuum Pick-Up has been               • Board sizes up to 16" X 18"
designed to ensure adequate                 (406 x 457 mm)
clearance of adjacent components          • Proven integrated High Power,
and obstacles around the positioning        Low Temperature Flo-Master
arena, consequently the length of the       Technology
Vacuum Pick-Up Barb is 0.90"              • Inspection option for ghosted
(22.86 mm), which should provide            images of board and component
sufficient depth of penetration.            leads/balls

Phone: 305-451-4722 Fax: 305-451-3374 e-mail:                                                         17

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