Processes by linzhengnd


									                                                              1-09-09 Audit Checklist NASA-STD 8739.2
Q#    Paragraph                           Query                                            Notes

                  Has the supplier received written approval from
 1     Design     the cognizant NASA contracting officer with regard Yo No NAo
                  to departures from these standards? (1.5.1)

                  Is the supplier intending to use processes,
                  materials or parts not covered by this publication
 2     Design
                  that requires the approval of the procuring NASA
                                                                            Yo No NAo
                  Center? (4.1.3)
                  For internal connection of parts not subject to
                  these requirements. Did the supplier assured that
 3     Design     the parts have suitable internal solder connections       Yo No NAo
                  that will not unsolder or deteriorate when tinning?

                  Has the supplier implemented a training program
                  to provide training for soldering and inspection
4a      Mfg
                  personnel on parts mounting, soldering techniques
                                                                    Yo No NAo
                  and use of equipment and procedures? (5.1.2)

                  Are operators, inspectors and instructors qualified
4b      Mfg       to fulfill all the requirements of this Standard    Yo No NAo
                  involved in their assigned tasks? (5.1.2)
                   Are records kept with regards to the certifying
4c      Mfg
                  and recertification for each individual? (5.1.2)
                                                                            Yo No NAo

                  Is evidence of certification maintained in the work
4d      Mfg
                  area, and available upon request? (5.1.3)
                                                                            Yo No NAo

                  Have all personnel that perform soldering or
 5      Mfg       inspection of soldering connections had a vision          Yo No NAo
                  tests by a qualified examiner? ( 5.2.1)
                  Is the result of the vision examination maintained
5b      Mfg
                  and available for review? (5.2.1)
                                                                            Yo No NAo

                  Does the vision test check the following; far vision,
5c      Mfg
                  near vision, and color vision? (5.2.2)
                                                                        Yo No NAo

                  Were vendors Level B. instructors trained by a
6a      Mfg
                  NASA Level A instructor? (5.3.1)
                                                                            Yo No NAo

                  When an operator is certified to perform limited
6b      Mfg       operations or processes is it stated on the           Yo No NAo
                  certification card? (5.3.4)
                  Is the records of training and certification made
 7      Mfg       part of the suppliers quality data and retained for a Yo No NAo
                  minimum of five years? (5.5.2)
                  Does the vendors training program meet the
 8      Mfg       requirements of section 5.4 and 5.5 of the            Yo No NAo
                  Standards? (5.4 and 5.5)

                  Does the reasons for when recertification is
9a      Mfg
                  required follow the requirements of section (5.6.3)
                                                                            Yo No NAo

                  Is the certification revoked when certificate holder
9b      Mfg       fails recertification, fails the visual acuity test, or   Yo No NAo
                  terminates employment? (5.6.4)
                  Is the work area maintained in a clean and orderly
10a     Mfg       condition, with no smoking, eating, or drinking at        Yo No NAo
                  the individual workstations? (6.1)

                  Are nonessential tools and materials permitted at
10b     Mfg
                  the workstation? (6.1)
                                                                            Yo No NAo

                  Is access to the work area limited to direct
10c     Mfg       performance, monitoring, and support personnel?           Yo No NAo
                  Is the area where surface mounted technology
                  (SMT) is carried out free from dirt, dust, solder
11a     Mfg       particles, oils, clipped wires, facial or body            Yo No NAo
                  makeup, or any other environmental condition that
                  could contaminate the work piece? (6.2.1)

                  Is the outside and recirculated air, filtered to
11b     Mfg
                  remove dust particles? (6.2.2)
                                                                            Yo No NAo
            Is the temperature and humidity monitored in the
            processing area and maintain between 30% and
11c   Mfg
            60% humidity and the temperature between 65° to
                                                                   Yo No NAo
            85° F? (6.2.3)

            Are parts, materials, and equipment being
            processed that require more stringent controls,
11d   Mfg
            identified and specified in the engineering
                                                                   Yo No NAo
            documentation? (6.2.4)
            Are the areas used for cleaning parts, and where
            toxic or volatile vapors are generated have a
11e   Mfg
            ventilating system for removing contaminated air?
                                                                   Yo No NAo
            Is the illumination on surfaces being soldered or
12    Mfg   inspected have a light intensity of 1076 Lm/m          Yo No
            square or 100 foot candles? (6.3)
            Are the tools and equipment properly maintained
13a   Mfg
            and kept clean? (6.4.2)
                                                                   Yo No

            Are there references in the suppliers soldering
            program detailing operating procedures and
13b   Mfg
            maintenance schedules for tools and equipment
                                                                   Yo No NAo
            requiring calibration or testing? (6.4.3)

            Are records of tool and equipment calibration and
13c   Mfg
            verification maintained in the work area? (6.4.4)
                                                                   Yo No NAo

            When tools become defective, damaged or
13d   Mfg   uncalibrated are they've removed from the work         Yo No NAo
            area? (6.4.5)

            Is the soldering equipment such as reflows
            soldering machines, soldering irons and
            associated process equipment checked to ensure
14a   Mfg
            that it does not expose the parts or PWA's to
                                                                   Yo No NAo
            electrical energy that could damage or degrade
            the items being soldered or cleaned? (6.6)

            Is there any vibration or excessive movement
            exhibited by the equipment which can cause a
14b   Mfg
            discrepant solder connection or part
                                                                   Yo No NAo
            misalignment? (6.6)

            When not in use is equipment appropriately stored
14c   Mfg
            and adequately protected? (6.6)
                                                              Yo No NAo

            Have special controls been developed to control
            key product requirements such as soldering
14d   Mfg
            temperature, contamination level of cleaning
                                                                   Yo No NAo
            systems, and solder paste dispensing? (6.6)
            Does the tools and equipment provided a means
15a   Mfg   for applying and controlling the amount of heat to     Yo No NAo
            the metals being joined? (6.7.1.a)
            Is the cleanliness of the heat source monitored to
15b   Mfg   ensure uniform heat transfer and to prevent            Yo No NAo
            contamination of the solder connection? (6.7.1.b)

15c   Mfg   Is the use of soldering guns prohibited? (6.7.1.c)     Yo No NAo

            Are the conductive type irons controllable within ±
16a   Mfg   10° Fahrenheit and electrically earth grounded?        Yo No NAo
            (6.7.2 .a)
            Is the tip of the conductive type irons periodically
16b   Mfg   and prior to use checked for the items listed under    Yo No NAo
            section 6.7 .2 a (1 and 8)
            Are the solder pots capable of maintaining the
17a   Mfg   solder temperature within ± 10° F as well as being     Yo No NAo
            grounded? (6.7.5)
            Is the solder in the tinning pots analyzed and
            recorded on an established schedule to ensure
17b   Mfg
            that they meet the requirements of Table 6-1?
                                                                   Yo No NAo
            Does the tinning pot get immediately removed
17c   Mfg   from use when the solder produces a dull, frosty,      Yo No NAo
            or granular appearance? (6.7.5.a)
            Are thermal shunts or heat sinks used to absorb
            heat from part leads when necessary to protect
18    Mfg
            parts and insulating material from damage during
                                                                   Yo No NAo
            thinning and soldering operations? (6.8)
               Are inspections performed using aids conforming
19     Mfg     to the requirements in section 6.9 of the               Yo No NAo
               Standards? (6.9)

               For in-process storage and handling, are the
20a    Mfg     containers compatible with the material stored          Yo No NAo
               within them? (6.10.1)

               When it is unavoidable to handle bare metal
20b    Mfg     surfaces, are clean lint free gloves or antistatic      Yo No NAo
               finger cots used? (6.10.2)
               If metal surfaces are touched with the bare hand
               or otherwise become contaminated are they
20c    Mfg
               immediately clean using approved solvents listed
                                                                       Yo No NAo
               in paragraph 6.14? (6.10.2)
               When electrostatic discharge sensitive items are
               not being tested or worked on are they protected
20d    Mfg
               by shunts such as bars, clips, or conductive
                                                                       Yo No NAo
               covering? (6.10 .3)
               Is all gold plating removed by tinning prior to use?
21a    Mfg
                                                                       Yo No NAo

               Was all material to be soldered verified as being
21b    Mfg
               solderable prior to use? (6.11)
                                                                       Yo No NAo

               Have all materials met the program and
21c    Mfg     contractual outgassing and off gassing                  Yo No NAo
               requirements? (6.11)
               Does solder conform to ANSI/J-STD-005, ANSI/J.-
22a   Design
               STD-006, or equivalent? (6.12.1)
                                                               Yo No NAo

               For hand soldering connections, are they made
22b    Mfg
               with flux cored wire solder? (6.12.1)
                                                                       Yo No NAo

               Is the solid solder (e.g. bar, ingot, etc.) used for
22c   Design   solder pots, baths, and wave solder have a              Yo No NAo
               composition of Sn 60 or Sn 63? (6.12.1)

               Is the solder paste Sn 63/Pb 37, Sn 60/Pb 40 or
23a   Design
               Sn 62/Pb 36/Ag2 composition? (6.12.2)
                                                                       Yo No NAo

               Is the solder paste compatible with the base metal
23b   Design   and meets all the requirements of ( 6.12 .2 .a-d.)? Yo No NAo
               Section 6.12.2.d gives requirements that will
24     Mfg     maintain the solder paste purity. Are these         Yo No NAo
               procedures being followed? (6.12.2.d)
               Does the process documentation described the
25    Design   type of flux, where each is used, and the               Yo No NAo
               necessary precautions? (6.13.1)
               Does the Rosin flux conform to ANSI/J- STD-004,
26a   Design
               Type L0, L1, or equivalent? (6.13.2)
                                                                       Yo No NAo

               When liquid flux is used with flux core solder, is it
               chemically compatible with the solder core flux
26b   Design   and with the material? This is for the fluxing          Yo No NAo
               application where adequate subsequent cleaning
               is not practical. (6.13.2)

               When the request for other flux compositions are
               made to the procuring supplier. Does the request
27    Design
               include the information in Section 6.13.3?
                                                                       Yo No NAo

               When printed wire assemblies (PWA's are
               processed utilizing any other flux composition, do
28     Mfg     they meet the cleanliness standards of chapter 11       Yo No NAo
               prior to being returned to production or
               fabrication? (6.13 .4)
               When solvents and aqueous cleaners used for
               removing grease, oil, dirt, flux and other debris.
29a   Design   Are they selected for their ability to remove ionic     Yo No NAo
               and non-ionic contaminate and not to degrade the
               material or parts? (6.14.1)
29b    Mfg     Are solvent containers properly labeled? (6.14.1)       Yo No NAo
               Does the use of any other solvent identified in the
29c   Design   suppliers engineering documentation have the            Yo No NAo
               approval of the procuring supplier? (6.14.1)
               Are the Material Safety Data Sheet (MSDS) for all
29d    Mfg     solvents and cleaners used available for                Yo No NAo
               personnel review? (6.14.1)
               Are methyl alcohol, secondary butyl alcohol, and
30a   Design   tertiary butyl alcohol ever purchased as a          Yo No NAo
               constituent of an already blended solvent? (6.14.2)
               Are methyl alcohol or secondary butyl alcohol ever
30b    Mfg
               used alone as a solvent? (6.14.2)
                                                                  Yo No NAo

               Are PWAs and parts properly dried immediately
31     Mfg
               after the use of deionized water? (6.14.3)
                                                                        Yo No NAo

               Has the required approval of the procuring
32    Design   supplier been received to use water-based                Yo No NAo
               saponifier and detergent system? (6.14.4)
               Was the appropriate marking permanency testing
               performed as a part of the evaluation procedure
33    Design
               for any solvent or cleaning system selected to be
                                                                        Yo No NAo
               used? (6.14.5)
               Is the adhesive readily dispensable, nonstringing,
34a   Design   and have a reproducible dot profile after                Yo No NAo
               application? (6.15.1)

               Will the adhesive not interfere or alter circuit
34b   Design   performance and yet be compatible the PWB and            Yo No NAo
               parts? (6.15.2)

34c   Design   Is the adhesive noncorrosive? (6.15.3)                   Yo No NAo

               Does the adhesive have sufficient strength or
34d   Design   surface tension to hold parts during handling prior      Yo No NAo
               to cure? ( 6.15.4)
               Was a compatibility test performed between
34e   Design   adhesive and solvent to ensure that the adhesive         Yo No NAo
               does not become brittle? (6.15.5)
               Does the adhesive material meet program
34f   Design   outgassing, off gassing, and flammability                Yo No NAo
               requirements? (6.15.6)
               When oil is used to reduce the surface tension
               and oxidization of the liquid solder was it selected
               using the following criteria? (thermal stability, long
35a   Design
               life, low weight loss, high boiling point, good
                                                                        Yo No NAo
               wetting ability, and ease of removal after
               soldering.) (6.16. 1-6)
               Are the only additives in the oil; oxidization
35b   Design   inhibitors, wetting agents, and dross scavengers?        Yo No NAo
               Does the minimum protective equipment provided
36    Design   include eye protection, gloves, and good                 Yo No NAo
               ventilation? (6.17)
               Are parts examined 100% for coplanarity from the
37a    Mfg     lead to the surface to which the parts are to be         Yo No NAo
               soldered? (7.1.1)
               Do the coplanarity blocks or other means of
37b    Mfg     verifying the planarity meet the applicable ESD          Yo No NAo
               requirements? (7.1.1. a)
               Is the coplanarity examination equipment the type
37c    Mfg     that will not damage or degrade the part or part         Yo No NAo
               lead? (7.1.1. b)
               If the parts or part leads nonplanar to the surface
37d    Mfg     are they placed in a protective container to be          Yo No NAo
               reworked? (7.1.1. c)
               Is the portion of the lead and/or part that will
               become part of the completed solder connection,
38a    Mfg
               tinned with a lead solder alloy and clean prior to
                                                                        Yo No NAo
               connection? (7.2.1)
               Are the operations of lead forming, alignment, and
38b    Mfg     cutting accomplished prior to tinning of ribbon          Yo No NAo
               leaded parts? (7.2.1.a)
                Has all gold plating on all surfaces which will be
38c    Mfg     part of the finished solder connection been              Yo No NAo
               removed? (7.2.1 b)

               Was gold plating removed by two or more
38d    Mfg
               successive tinning operations? (7.2.1.b)
                                                                        Yo No NAo

               Was the tinned surface verified to exhibit at least
38e    Mfg
               95% coverage? (7.2.2)
                                                                        Yo No NAo
               Since a thin residual bands of gold-tin inter-
               metallic can severely embrittle the connection,
38f    Mfg
               was the contact time between gold plating and
                                                                      Yo No NAo
               molten solder sufficient to remove all gold? (7.2.2)

               Was the solder paste submitted to the following
39a    Mfg     tests: oxidization/cohesion, slump, and verification   Yo No NAo
               of working life? (7.3)
               Was the solder paste test method described in
39b    Mfg     appendix A. of NASA-STD-8739.2 followed?               Yo No NAo
               When reviewing the results of the
               oxidization/cohesion test were the following
               unacceptable results kept in mind: more than two
39c    Mfg
               solder balls, excessively dull or frosty appearance,
                                                                    Yo No NAo
               halo of small particles, and peripheral solder
               balls? (7.3.1 a-d)
               Prior to use are the printed wire boards (PWB)
40a    Mfg     examine for oxidization, discoloration, damage,        Yo No NAo
               contamination, and flatness? (7.4.1)
               The PWB's shall be clean and demoisturized prior
               to soldering. Is the bake out time and temperature
40b    Mfg
               defined in the supplier's process documentation?
                                                                      Yo No NAo

               Is the bake out time, temperature and the time in
40c    Mfg
               and out of the oven or chamber recorded? (7.4.2)
                                                                      Yo No NAo

               Is the de-moisturizing performed within eight hours
40d    Mfg
               prior to soldering? (7.4.2)
                                                                   Yo No NAo

                The PWB's may be stored for a longer period
40e    Mfg     time if they are stored in a controlled, moisture      Yo No NAo
               free atmosphere. Is this being done? (7.4.2)

               Pre-cleaned PWBs shall be placed on a holding
               fixture in a calibrated convection oven to de-
40f    Mfg     moisturize. Does the holding fixture provides          Yo No NAo
               sufficient support during the bake cycle to prevent
               warping? (7.4.2)

               Does the suppliers engineering documentation
41     Mfg     defined the material disposition and the placement     Yo No NAo
               requirements of the parts? (8.1)

               Is the solder paste or cream deposited on the
42a    Mfg     substrata or land by means of a stencil, screen, or    Yo No NAo
               syringe? (8.2.1)

               Is the solder disposition process consistent and
42b    Mfg
               repeatable? (8.2.1)
                                                                      Yo No NAo

               Is the method of solder paste/cream disposition
42c    Mfg     and its accept/reject criteria defined in the process Yo No NAo
               documentation? (8.2.1)
               Has the supplier demonstrated that the solder
               disposition process remains within the limits
42d    Mfg
               defined by this Standard and engineering
                                                                      Yo No NAo
               documentation? (8.2.2)

               Due to the rapid oxidization of solder paste is the
42e    Mfg
               container left open longer than necessary? (8.2.3)
                                                                      Yo No NAo

               For a clear print is the mean particle size of the
43a   Design   solder paste a maximum of 1/3 the size of the          Yo No NAo
               screen mesh? (8.3.1)

               Is the screen position above the substrata in a
43b    Mfg
               parallel plane with the substrata? (8.3.2)
                                                                      Yo No NAo

               Does the engineering documentation defining a
43c   Design   snap-off distance between the screen and the           Yo No NAo
               substrata? (8.3.3)

               Is the squeegee made of rubber or synthetic
43d    Mfg     material that will not damage or degrade the           Yo No NAo
               screen? (8.3.4)
               Does the engineering documentation specify the
43e   Design
               frame size of the screen? (8.3.5)
                                                                         Yo No NAo

               If the engineering documentation does not specify
43f   Design   the frame size is the value of two times the print        Yo No NAo
               area used? (8.3.5)

               Does the engineering documentation define the
43g   Design
               emulsion thickness on the wire mesh? (8.3.6)
                                                                         Yo No NAo

               Does the engineering documentation defining the
               mesh size, mesh angle, emulsion, and paste
43h   Design
               thickness tolerance using the information from the
                                                                         Yo No NAo
               screen manufacturer's instructions? (8.3.7)

               Is the pattern area of the stencil, a metal foil (e.g.,
44a    Mfg
               brass, stainless steel)? (8.4.1)
                                                                         Yo No NAo

               Is the open area in the stencil optimized at each
44b    Mfg
               solder paste disposition site? (8.4.2)
                                                                         Yo No NAo

               Is the thickness of the stencil pattern specified in
44c   Design
               the engineering documentation? (8.4.3)
                                                                         Yo No NAo

               When the stencil design is larger than the
               associated footprint, is the spacing between the
44d    Mfg
               solder deposits sufficient to prevent solder
                                                                         Yo No NAo
               bridges? (8.4.5)
               A method for holding the substrata in registration
               with the stencil shall be employed. Does the
44e   Design
               engineering documentation lists the tolerance for
                                                                         Yo No NAo
               the degree of accuracy required? (8.4.6)

                Is the squeegee made of a material that will not
44f    Mfg
               damage or degrade the stencil? (8.4.7)
                                                                         Yo No NAo

               When the engineering documentation does not
44g   Design   dictate the frame size, is a stencil frame size 1.5       Yo No NAo
               times the print area? (8.4.8)

               Is the dispensing grade solder paste used in a pre-
45a    Mfg
               loaded cartridge for syringe dispensing? (8.5.1)
                                                                   Yo No NAo

               Is printing grade solder paste used in syringe
45b    Mfg
               dispensers? (8.5.2)
                                                                         Yo No NAo

               Is a dispensing schedule relative to part size and
45c   Design   interconnecting sites been developed and defined          Yo No NAo
               in the engineering documentation? (8.5.3)

               Was the required solder paste thickness
46a    Mfg
               documented and verified? (8.6.1)
                                                                         Yo No NAo

               Is the solder paste alignment inspection results for
46b    Mfg     compliance to paragraph 12.6 for each PWB,           Yo No NAo
               recorded? (8.6.2)
               Has the supplier developed and documented parts
               placement, alignment requirements, and quality
47a   Design
               acceptance requirements, as well as any criteria
                                                                Yo No
               unique to the process? (8.7)
               Is care taken to ensure that proper tension or
               compression that's applied to the parts during
47b    Mfg
               mounting do not damage or deform the parts,
                                                                Yo No
               parts leads, or the substrata? (8.7.1)
               Are parts placed in the solder paste within a
47c    Mfg
               maximum of two hours? (8.7.2)
                                                                 Yo No NAo

               Is the solder paste reflowed within a maximum of
47d    Mfg
               four hours of the solder paste application? (8.7.2)
                                                                         Yo No NAo

               Was the part alignment rework accomplished
47e    Mfg     within the specific time allotment from solder            Yo No NAo
               disposition to solder reflow? (8.7.2)
               Are the parts placement and alignment examined
47f    Mfg     prior to solder reflow to ensure that marked parts        Yo No NAo
               are mounted with markings visible? (8.7.4 .a)
               Are parts and substrata termination areas
               examined for evidence of cracks, nicks, chip outs,
47g    Mfg
               and evidence of glass fibers and lifted circuitry?
                                                                   Yo    No NAo
               (8.7.4 .b-c)
               Prior to the solder reflow are the placement of
               parts and their alignment examined for the
47h    QA
               requirements listed under section 8.7.4 .d-m of
                                                                   Yo    No NAo
               this Standard? (8.7.4)
               Were the parts placement and alignment
               inspected prior to solder reflow using a
48a    QA
               magnification of 4X to 10 X and the results
                                                                   Yo    No NAo
               recorded? (8.8)
               Was the PWB substrata and parts inspected for
48b    QA      damage caused by the tools used to place the        Yo    No NAo
               parts? (8.8.1)
               Were parts that had seals broken or operational
48c    QA      elements exposed recorded as being                 Yo     No
               unacceptable? (8.8.2)
               Were the thick film chip resistors checked to
48d    QA      make sure that the proportion with the colored         Yo No NAo
               protective glass film is in the up position? (8.8.3)
               Were the parts positioned and aligned on
48e    QA      locations called out by the engineering                Yo No
               documentation? (8.8.4)
               Was the adhesive deposited on the substrata by
49a    Mfg
               means of a stencil or syringe? (8.9)
                                                                      Yo No
               Is the adhesive disposition process consistent and
49b    Mfg
               repeatable? (8.9)
                                                                      Yo No NAo
                Does the engineering documentation defining the
49c   Design   method for the adhesive disposition and its            Yo No NAo
               acceptance/rejection criteria? (8.9)
               Was the adhesive cured, per manufacturers
49d    Mfg     recommendation, following the parts placement          Yo No NAo
               inspection and prior to soldering? (8.9)
               Was the required adhesive thickness range been
50a    Mfg
               documented and verified? (8.10.1)
                                                                      Yo No NAo

               Is the adhesive dot centered under the body of the
               part equidistant between the land patterns, making
50b    Mfg
               sure there is no contact with solderable surfaces,
                                                                  Yo No NAo
               part leads, or part terminations? (8.10.2)
               Does the soldering log showed the preheat
               temperature, solder reflow temperature, and the
51a    Mfg
               time in each zone for each PWA in order to
                                                                  Yo No NAo
               repeat previously successful runs? (9.1)
                If the PWA's are required to be submitted to more
               than two mass reflows, is the reason for the
51b    Mfg     additional processing documented and a             Yo No NAo
               notification submitted to the procuring NASA
               Center within 24 hours? (9.1)
               Does the heater bar reflowed soldering equipment
52a    Mfg     provide an optical feature or equivalent to ensure     Yo No NAo
               proper parts alignment? (9.2.1)
               Is the part lead or shorted bar maintained at a
               preset temperature that is a minimum of 12° C.
52b    Mfg
               (20° F.) above the melting point of solder?
                                                                      Yo No NAo
               With the heater bar reflow soldering, is the dwell
52c    Mfg     time temperature maintained at plus or minus           Yo No NAo
               2.5% of the preset value? (9.2.1)
               For condensation reflow soldering, does the solder
               fluid have a minimum boiling point of 12° C. (20°
53a    Mfg
               F.) above the melting point of solder paste/cream
                                                                      Yo No NAo
               being used? (9.2.2.b)
               Is there a good ventilation system conforming to
               environmental conditions as described in
53b    Mfg
               paragraph 6.2, in all areas where reflow soldering
                                                                      Yo No NAo
               is performed? (9.2.2.c)
               For all types of reflow soldering is the maximum
53c   Design   temperature set at a point where it will not
               damage parts or substrate? (9.2.2 b.)
               Is the pre-heat temperature for
54a    Mfg     convection/radiation reflow soldering maintained       Yo No NAo
               within +/- 2°C (+/- 2°F) at the heater? (9.2.3. a)
               Is the convection/radiation solder reflow
54b    Mfg     temperature maintained at +/- 6°C (+/- 10°F) at        Yo No NAo
               the PWA surface in the reflow zone? (9.2.3 .b.)
               Is a soldering log maintained showing preheat
               temperature and solder temperature for each
54c    Mfg
               PWA type in order to repeat previously successful
                                                                        Yo No NAo
               runs? (9.2.3.c.)
               For hot gas/air reflow soldering does the
               equipment minimize thermal shock cycling and
55a    Mfg
               not jeopardize the integrity of an adjacent parts
                                                                        Yo No NAo
               and PWA's during the process? (9.2.4.c)
               Is a hot gas/air soldering log maintained showing
55b    Mfg     preheat and reflow temperatures in order to              Yo No NAo
               repeat previously successful runs? (9.2.4.d)
               For automated or automatic wave soldering is the
56a    Mfg     selected temperature maintained within +/- 2°C (+/-      Yo No NAo
               5°F)? (9.2.5.a)
               Is the preselected speed of the conveyor
56b    Mfg     controlled as to not very more than an inch per          Yo No NAo
               minute? (9.2.5 .b)
               Is the solder temperature controlled so that the
56c    Mfg     solder in the wave is 248.9°C (480°F) to 273.9°C         Yo No NAo
               (525°F)? (9.2.5.c)
               Can the height of the wave be controlled to a
56d    Mfg
               constant preselected height? (9.2.5 d.)
                                                                        Yo No NAo
               Is there an established schedule, based on usage,
               to assure that the solder meets the requirements
56e    Mfg
               of the solder contamination levels listed in Table
                                                                        Yo No NAo
               6.1? (9.2.5.e)
                Is the oil analyzed on an established schedule,
               based on usage, to determine the rate of
56f    Mfg
               degradation and the oil replacement period?
                                                                        Yo No NAo
               Does the wave solder log show preheat
               temperature, conveyor speed, solder temperature
56g    Mfg
               range, wave height for each PWA type in order to
                                                                        Yo No NAo
               repeat previously successful runs? (9.2.5.g)
               After soldering, whether it's reflow or wave
57     Mfg     soldering, Is the flux dross inhibitor, solder resist,   Yo No NAo
               and oil promptly removed? (9.3)
               Are the PWAs to be cleaned handled in a matter
58a    Mfg     that will not degrade or damage the parts or the         Yo No NAo
               PWB? (10.1.2)
               Are the parts and PWAs protected from
               electrostatic discharge damage as well as
58b    Mfg
               hardware degradation during the cleaning and
                                                                        Yo No NAo
               drying process? (10.1.3)
               Have specific procedures been developed for
58c   Design   drying unsealed parts that are immersed or               Yo No NAo
               aqueous cleaned? (10.1.4)
               Are the PWA's cleaned within the time frame that
58d    Mfg
               permits removal of contamination? (10.1.5)
                                                                        Yo No NAo

                Are the conveyors, pallets, etc. moving the units
               from one zone to another made of a material and
59a    Mfg
               configured to prevent contamination, damage, or
                                                                        Yo No NAo
               degradation of the unit or parts? (10.2.1 Caution)
               Is aqueous cleaning, high pressure washing
               machine, or semi automatic equipment used for
59b    Mfg
               cleaning electrical or electronic parts or PWAs?
                                                                        Yo No NAo
               If the equipment listed in question 59b. is used.
59c    Mfg     Has prior authorization from the procuring supplier      Yo No NAo
               been obtained? (10.2.2)
               Is ultrasonic cleaning used for any assemblies that
60     Mfg
               contain electronic parts? (10.3)
                                                                        Yo No NAo
               Does manual cleaning have as a minimum, three
61a    Mfg
               steps? (10.4.1)
                                                                        Yo No NAo
               As the first step are the PWA's emerged in a
               solvent bath and scrubbed with a natural brush
61b    Mfg
               until all visible contamination is removed? (10.4.1
                                                                        Yo No NAo
               In the second step, are the PWAs rinsed by
61c    Mfg     immersing in a second, clean, solvent bath?              Yo No NAo
               (10.4.1 b.)
               Is Rinsing the PWAs, by immersion in a third
61d    Mfg     clean solvent bath or by spraying/pouring the            Yo No NAo
               solvent from a bottle the third step? (10.4.1 c.)
                If there is visible evidence of flux residue or other
61e    Mfg     contamination. Is the process repeated? (10.4.1          Yo No NAo
               When solvent baths become visibly contaminated,
61f    Mfg
               are they replaced? (10.4.1 Note)
                                                                        Yo No NAo
               Is conformal coated PWAs cleaned using a vapor
62a    Mfg
               degreaser? (10.4.2 b.)
                                                                      Yo No NAo
                Is the supplier generated vapor degreaser
62b   Design   engineering documentation approved by the              Yo No NAo
               procuring supplier? (10.4.2 d.)
               When spray nozzle is not used, does the vapor
               degreaser engineering documentation, give the
62c    Mfg     rate of speed for lowering and raising PWBs in         Yo No NAo
               and out the vapor zone, and the length of time
               exposed to the vapors? (10.4.2.e.1-2)
                When using a spray nozzle does the
               documentation give the distance from the end of
62d    Mfg     the nozzle to the PWB and length of time it is to      Yo No NAo
               be exposed to the vapor sump after spraying?
               Is a handling rack which prevents damage, but
62e    Mfg     assures vapor circulation, and provide condensate      Yo No NAo
               drainage used? (10.4.2 f.)
               Does the parts or PWA's have contact with the
62f    Mfg
               boiling sump? (10.4.2. f)
                                                                      Yo No NAo
               Are the cleaning requirements in the supplier's
63    Design
               engineering documentation as required? (11.1)
                                                                      Yo No NAo
               Are all PWAs cleanliness tested prior to applying
64     Mfg     conformal coating and the results recorded?            Yo No NAo
               Is the equipment used for cleanliness testing
               capable of measuring the resistivity/conductivity of
65a    Mfg
               a test solution in which contaminants from the test
                                                                      Yo No NAo
               specimen solubilized? (11.3)
               Does the dynamic range of the cleanliness testing
65b    Mfg     equipment meet the requirements of section 11.3?       Yo No NAo
               Is the testing performed with sufficient frequency
               to ensure compliance with the requirements, at
66a    Mfg
               minimum once per shift and just prior to changing
                                                                      Yo No NAo
               the solvent? (11.4.1)
               Are records of relevant readings having to do with
               the cleanliness testing maintained for early
66b    Mfg
               detection of a trend towards an out of specification
                                                                      Yo No NAo
               condition? (11.4.2)
               When the results of the cleanliness test is
               unacceptable are all PWAs that were cleaned
66c    Mfg
               between the previously passed test and the failed
                                                                      Yo No NAo
               test considered unacceptable? (11.4.3)
               Prior to cleaning the failed PWAs, is the
66d    Mfg     appropriate corrective action performed on the         Yo No NAo
               cleaning system? (11.4.4)
               Is the solvent extract resistivity measured in
67     Mfg     accordance with section 11.6 of the NASA-STD-          Yo No NAo
               8739.2? (11.6.1-4)
               Is the sodium chloride salt equivalent ionic
68     Mfg     contamination measured in accordance with              Yo No NAo
               section 11.7 of the NASA-STD-8739.2? (11.7.1-4)

               Is inspection for acceptability performed on all
69a    QA      solder connections, parts condition and mounting,      Yo No NAo
               conductor routing, and PWB? (12.1.2)
               Are the parts and conductors physically disturbed
69b    QA
               to aid inspection? (12.1.2)
                                                                      Yo No NAo
               Have the parts been x-ray hardened or has it
               been demonstrated that the emission level is not
69c    QA
               detrimental to the parts thereby allowing x-ray
                                                                      Yo No NAo
               and/or laser inspection? (12.1.3)
               Are the complete documentation of the x-ray
69d   Design   and/or laser processes, procedures, and safety         Yo No NAo
               requirements available? (12.1.3)
               Were the functions listed in section 12.1.4 of this
               standard been accomplished as required (i.e.
69e    QA
               tests, measurements, certification, lighting, etc.)?
                                                                      Yo No NAo
               Is the magnification requirements specified in the
70    Design
               inspection instructions? (12.2.3)
                                                                      Yo No NAo
               Has all the required documentation and
               procedures been verified to be current and
71     QA
               approved as required by section 12.3 of the
                                                                      Yo No NAo
               standard? (12.3.1.a-n) and (12.3.2.a-l)
               Has the quality assurance personnel verify that the
               required documentation as listed in section 12.4,
72     QA      has in fact been approved by the procuring NASA        Yo No NAo
               Center or supplier prior to implementation? (12.4.1-
               Were the tools and equipment verified for
73a    QA      conformance to the requirements found in section       Yo No NAo
               6.4? (12.5.1)
               Were engineering documentation and contract
               requirements used to verify that all material
73b    QA
               conformed to the requirements of 6.11 through
                                                                      Yo No NAo
               6.16? (12.5.2)
               Was material control implemented to ensure only
               conforming material was used and that any non-
73c    QA      conforming or not required material was removed        Yo No NAo
               from the work area and tagged as non-usable?
               Were the quality assurance personnel involved in
               the in-process examinations, verifying the
74     QA      accept/reject criteria with regards to the solder      Yo No NAo
               paste application, parts alignment, and general
               rejection criteria? (12.6.1 to 12.6.3)
               Are the quality personnel involved in the in-
               process inspection having to do with the
               acceptance criteria of the thick film chip resistors
75a    QA      being positioned with the colored glass film in the    Yo No NAo
               up position and the parts positioned and aligned in
               accordance to the engineering documentation?
               Are the units in the in-process inspection checked
               for the rejection criteria of PWB substrata or parts
75b    QA
               being damaged, broken part seals and operational
                                                                    Yo No NAo
               elements exposed? (12.7.2)
               Are the quality assurance personnel involved in
               the inspections aware of the general acceptance
76     QA
               and rejection criteria as outlined in section 12.8.1
                                                                      Yo No NAo
               and 12.8.2.a-c? (12.8)
               Are the quality assurance personnel involved in
77a    QA      the inspections aware of the specific criteria         Yo No NAo
               having to do with chip parts? (12.9.1)
               Are the quality assurance personnel involved in
77b    QA      the inspections aware of the specific criteria         Yo No NAo
               having to do with leaded parts? (12.9.2)
               Are the quality assurance personnel involved in
77c    QA      the inspections aware of the specific criteria         Yo No NAo
               having to do with J-leaded parts? (12.9.3)
               Are the quality assurance personnel involved in
77d    QA      the inspections aware of the specific criteria         Yo No NAo
               having to do with L-leaded parts? (12.9.4)
               Are the quality assurance personnel involved in
77e    QA      the inspections aware of the specific criteria         Yo No NAo
               having to do with I-leaded parts? (12.9.5)
               Are the quality assurance personnel involved in
77f    QA      the inspections aware of the specific criteria         Yo No NAo
               having to do with MELF parts? (12.9.6)
               Are the quality assurance personnel involved in
77g    QA      the inspections aware of the specific criteria         Yo No NAo
               having to do with LLCC parts? (12.9.7)
               Is care taken to insure that no electrical or
78a    Mfg     mechanical damage is imparted to the part or           Yo No NAo
               PWA as a result of rework? (13.1.1)
               Does the equipment used to accomplish rework
78b    Mfg     conform to the requirements of the Chapter 6 of        Yo No NAo
               the Standard? (13.1.2)
               Prior to the rework of an unsatisfactory solder
78c    Mfg     connection has the discrepancy been                    Yo No NAo
               documented? (13.1.3)
               Were the suppliers rework processes and
78d    Mfg
               procedures approved prior to use? (13.1.4)
                                                                      Yo No NAo
               Are uncoated PWAs submitted for rework cleaned
78e    Mfg     in accordance with Chapter 10 of this Standard?        Yo No NAo
               Were special cleaning procedures developed,
               documented, and approved by the procuring
78f   Design
               supplier for cleaning conformal coated PWAs?
                                                                      Yo No NAo
               On coplanarity rework are metallic tools used to
79a    Mfg
               rework the leaded parts? (13.2.1)
                                                                      Yo No NAo

               Are the tools used to bend, moves, or otherwise
79b    Mfg     apply pressure to the part leads, a wooden orange Yo No NAo
               stick or made of a soft or pliant material? (13.2.3)
               Following the coplanarity rework are the parts
79c    Mfg
               cleaned? (13.2.5)
                                                                      Yo No NAo
               For parts that do not meet the alignment
80a    Mfg     requirements. Are they manually aligned with the       Yo No NAo
               aid of an approved hand tool? (13.3.1 .a)
               Is the solder paste checked for smearing or
80b    Mfg
               bridging after the part is moved? (13.3.1.b)
                                                                       Yo No NAo
               Is the solder paste and part carefully removed
80c    Mfg
               when the solder becomes smeared? (13.3.1. c)
                                                                       Yo No NAo
               When the PWB is populated, is new solder paste
               deposited on the footprint with a solder paste
80d    Mfg
               syringe dispenser prior to remounting part?
                                                                       Yo No NAo
               (13.3.1 .e)
               If the PWB is unpopulated, is it completely
               cleaned of solder paste and submitted to
               manufacturing to be examined for oxidization,
80e    Mfg
               discoloration, damage, contamination, and
                                                                       Yo No NAo
               flatness as well as being demoisturizing? (13.3.1.f-
               Are hot air or hot gas rework stations used?
81a    Mfg
                                                                       Yo No NAo
               If hot air or gas is used has it demonstrated that it
81b    Mfg     does not reflow the solder of the adjacent solder       Yo No NAo
               connections? (13.4.1)
                When realigning or replacing parts, is the rework
81c    Mfg     area cleaned thoroughly prior to putting on fresh       Yo No NAo
               solder paste? (13.4.3)
               Did the procuring NASA center require verification
82    Design   tests be conducted to establish confidence in the       Yo No NAo
               reliability of the solder joints? (14.1)


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