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PROCESSING Powered By Docstoc
                      Sia Parsa
                      (510) 809-8620

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         Motivation and emphasis of this presentation

          – In order to share the facility and the equipment, each researcher must safely
            perform work without damaging the tools and/or impacting others’ work
          – This requires clear understanding of material compatibility rules
          – Understanding machine operation theory and processes that need to get
          – Members need to also be cognizant of what goes into the fabrication of structures
            and devices other than the ones he/she is working on, so as to not inadvertently
            jeopardize another’s research work as a result of a lack of understanding or
            knowledge (cross contamination issues are of the greatest concern!)

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                         Marvell NanoLab Operation

         – Clean Room Gowning Procedure – Carried out in a specific order
         – Equipment Qualification Procedure – Some tools require written test
         – Process Equipment - Available tools and processes in the NanoLab
         – Process & Material Compatibility – A dedicated manual chapter details the rules
           supported by relevant equipment manual chapters
         – Equipment Groups
                 - Integrated Circuits and electronic devices (MOS)
                 - Micro-electro mechanical systems (MEMS)
                 - Optoelectronics, Compound III-V and Metal contaminated
         – Various sinks support above equipment groups and related processes, where gold,
           copper and or other highly diffusive metals ARE NOT ALLOWED in some sinks
         – Cross Contamination - Avoid impacting other researchers' work

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                                     Working in the NanoLab
  Follow the Rules – starts at the entrance of the Lab

   DO NOT enter the NanoLab if:

          -      You have not passed the SAFETY QUIZ (annual renewal is required)
          -      Announcement at the entrance prohibits entrance (problem reported)
          -      The blue HazMat (hazardous material) warning light is flashing inside (Look through windows)
          -      No one else is working in the lab (computer warns you!)

   Gowning area

          -      Do not enter the gowning area without shoe covers on your street shoes
          -      Do not store chemicals in the storage boxes and/or in the gowning room
          -      Do not bring food or soft drinks or water in the Gowning Room
          -      Name tags are required on your coveralls
          -      Use proper size coverall and shoe cover
          -      Change damaged or stained coveralls or dirty shoe covers
          -      Must log onto the computer in the Gowning Room, before entering the lab

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                                   Process Equipment
         – Available processes and equipment are defined in the lab manuals
         – Lab manuals are organized by equipment groups and are available online
                  - Chapter 1- General Information & Processing
                  - Chapter 2 - Cleaning Procedures
                  - Chapter 3 - Mask Making

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                                                     Etch Equipment
        Etcher Type                    Equipment Name                          Etched Materials                                   Chapter
        Non Plasma gas phase
                                       xetch (xenon Difloride)                      silicon etch                                         7.5
                                       Matrix                                   PR removal                                              4.32
                                       Technics-c                          PR ash & Descum & Si3N4                                       7.2
                                       Lam6                                     SiO2, Si3N4                                             7.11
        Ion Mill
                                       ionmill (RIBE)                   Various material including sapphire                              7.1
        Reactive Ion
                                       Ptherm (versatile)            Various materials and substrates allowed                            7.3
                                       Lam7 (TCP)                          Metal (aluminum, TI, W) 7.12
                                       Lam8 (TCP)                    Poly-Si, single crystal Si, SiC, SiGe and Ge                       7.13
                                       Centura MxP+                                SiO2, Si3N4                                          7.32
                                       Centura -met                       Metal (aluminum, Ti, and W)                                   7.33
        Deep Reactive Ion
                                       Centura DPS                              Deep Si trench etching                                  7.31
                                       STS1                                     Deep Si trench etching                                  7.21
                                       STS2                                     Deep Si trench etching                                  7.22
                                       STS-oxide                                Deep Si trench etching                                  7.23
        Notes:   RIE = Reactive Ion Etching, RIBE= Reactive Ion Beam Etching, TCP =Transformer Coupled Metal RIE, MxP – Magnetically Enhanced RIE,
                 DPS - Decoupled Plasma Source RIE

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                     Material and Process Compatibility
 −     Chapter 1.7 - Defines furnace pre-clean, metal substrate, pyrex/borofloat glass restrictions
 −     Equipment manuals also define material compatibility and cleaning requirement.

 −     Manual chapters let members know:
        – Every piece of equipment has specific material restrictions
        – Several pieces of equipment may have similar restrictions
           – No gold or highly diffusive material in lam etchers and Tystar furnaces.
           – No acid, acid etchant or plating solution at metal sinks (Msink1, Msink2 and Msink3)
        – Specific tools and applicable processes require specific cleaning
           – Wafers processed in Tystar1, Tystar2, Tystar9 , Tystar10, and other MOS furnaces will only
              require Msink6 cleaning (non-meteal wafers)
           – Wafers processed in Tystar3, Tystar4 , Tystar12 and other non-MOS furnaces require
              additional Msink8 cleaning to Msink6 cleaning (non-meta wafers)
           – Metal coated wafers can not follow standard Msink8 and/or Msink6 cleaning, will require
              Msink1 metal clean instead (Piranha attacked metal!)

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                               Sink Information / Restrictions
          Sink Name
             (Maximum                 Processes Available                                               Important Comments
           Wafer Size)
                                 PR strip, tank develop, pre-furnace
           msink1 (8")                                                         382        Note 2
                                             metal clean

                                       PR strip, tank develop
           msink2 (6")                                                         382        Metal contaminated sink - Note 1
                                        all metals allowed

           msink3 (8")               Manual Resist Processing                  382

                                                                                          Staff Review required before wafers processed at
           msink4 (6")                   TMAH & KOH etch                       382
                                                                                                 this sink returning to msink6, msink7, msink8.
                                           HF, BHF etch
                                                                                          Metal contaminated sink, PR coated wafers allowed-
           msink5 (8")                   special project etch                  382
                                                                                                see Note 1
                                       (check labels at tanks)
                                                                                          No metals allowed
           msink6 (8")             Final Piranha - MOS clean sink              386
                                                                                          - MOS clean sink
                                          Hot phosphoric,
           msink7 (6")                                                         386        No metals, PR coated wafers allowed
                                          HF, silicon etch

                                          Piranha clean,                                  No metals except aluminum in the aluminum etch
           msink8 (8")                                                         386
                                        BHF, aluminum etch                                     tank, no PR coated wafers

          msink16 (N/A)       General clean - beaker process/part clean       582A        Metal contaminated sink - Note 1

          msink18 (N/A)       General clean - beaker process/part clean       582A        Metal contaminated sink - Note 1

       Note 1 -   Wafers processed at this sink are metal contaminated, ARE NOT ALLOWED to return to msink6, msink7, msink8.
       Note 2 -   Gold, copper and or other highly diffusive metals ARE NOT ALLOWED at this sink.

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                                        Working at the Sinks
            Reiterating what was said in the previous section of the orientation class:
                Personal protective gear must be worn at all times when working at the sinks!
                   – Chemically resistant gloves
                   – Face shield
                   – Chemically resistant apron

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                                      Working at the Sinks
           When mixing acids with water, remember to ADD ACID TO WATER and NOT WATER TO
            ACID! Exception is piranha.

           Working at general purpose sinks (MSink16/18)
              – Describe your processes to each other when multiple members are at the sink
              – Do not leave work that is not tagged
                  at the station
              – Do not heat up a container with solvent
                  in it directly on the heater chuck.
                  Solvent can only be heated up in a
                  water jacket. Aluminum trays are
                  available at the sinks for this purpose.

                 Report violations to staff, which will be kept confidential.
                 Anonymous suggestion box can also be used to report violations.

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                           Chemical Waste Management

     Chapter 1.01 - Marvell NanoLab Chemical Hygiene chapter defines the rules for chemical waste
        and expired chemical disposal

     −    Organic Waste Disposal - Organic waste is collected at Msink1, Msink3, Msink16 and
          Msink18 in designated bottles
     −    Members are responsible for replacing Full Organic Waste Bottles at these sinks. Pre-labeled
          empty hydrogen peroxide bottles are available in the Yellow Empty Waste Bottles Cabinet in
          the service chases 591 and 391 (one for each floor). These can be used as replacement!
     −    All organic chemical disposed at these sinks need to get logged in by members working at
          these sinks (one log sheet for each Organic Waste Disposal bottle)
     −    PRS-3000 in the heated bath at Msink1 and Msink2 are drained and collected by staff
     −    Checmical Waste from Special Project Tank at Msink5 is also managed by staff upon
          notification from member/s using the tank

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            • There is a lot more to learn about processing. You can
              check out the CMOS baseline process at our web site:

                 We regularly fabricate
                 CMOS transistors/IC
                 circuits to monitor the

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