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Center for Wireless Integrated MicroSystems The University of Michigan (lead institution) Integrated microsystems for widely-distributed information gathering and control This Engineering Research Center is focused on miniature low-cost integrated microsystems capable of measuring (or controlling) a variety of physical parameters, interpreting the data, and communicating with a host system over a bi-directional wireless link. As such, the Center addresses the intersection of microelectronics, wireless communications, and microelectromechanical systems (MEMS). The resulting devices are expected to become pervasive in A National society during the next two decades, extending the Science Foundation electronic connectivity now represented by personal Engineering communications and the worldwide web to information A 92MHz micromechanical filter: negligible power in Research Center provided directly by (or supplied to) the environment. very little space. since 2000 Such systems will provide button-sized information- gathering nodes for applications ranging from environ- sources, process technology, circuit limits, wireless mental monitoring (weather, global change, air and power-range tradeoffs, and size. The thrusts are being water quality) to improved health care (wearable and coordinated by focusing them on two application implantable biomedical systems). They will consist of a testbed systems: an rf-powered implantable power source, software, an embedded micro-controller, microsystem (initially a cochlear prosthesis for the a hardwired or wireless interface to the external world, profoundly deaf, with subsequent extension to devices and front-end microinstruments selected for the for treating epilepsy and Parkinson’s disease); and a intended application. Operating at less than 100µW, battery-powered environmental monitoring system they will occupy volumes as small as 1cc and communi- capable of gas analysis as well as the measurement of Partner Institutions: cate over distances from a few inches to a few miles. barometric pressure, temperature, humidity, and other variables. Each of these testbeds is aimed at achieving • Michigan State Research a significant breakthrough in its own right while University emphasizing the challenges that will be found in Center research is organized in four thrusts, dealing with micropower circuits, wireless interfaces, sensors microsystems generally. • Michigan Technological and microinstruments, and micropackaging. These The size, range, and operating lifetime of wireless University efforts are extending existing micropower circuit microsystems are strongly dependent on the power techniques and sensor-driven controller architectures, developing single-chip communication transceivers sources required to run them. While batteries are slowly improving, substantial improvements in system based on micromechanics, exploring a variety of self- testing microinstruments (including chemical, mechani- performance appear possible through lower-power cal, and thermal devices), and developing hermetic circuit techniques that may also make the use of renewable energy sources (e.g., solar) viable. Efforts wafer-level packaging using deposited thin films and vacuum-sealed cavities. The goal is to develop are focusing on the use of low-voltage deep-submicron systems that are rapidly configurable, reconfigurable, technology to achieve high functionality at very low and self-testing and to define their fundamental limits in the face of conflicting constraints imposed by power An integrated gas chromatograph for an environ- Architecture for a wireless integrated microsystem. mental monitoring microsystem. power. The challenges are not only in low- training future engineers. A series of Center Configuration, Leadership, voltage mixed-signal circuits but also in courses, facilitating an M.Eng. degree in Team Structure areas such as self-test, noise suppression, integrated microsystems, is being developed The Center involves faculty from most active power management, and digital jointly by all three partnering universities. engineering disciplines as well as from sensor compensation. The use of in-module These courses involve extensive multimedia computer science, chemistry, public health, data interpretation (increasing power use and shared virtual laboratory experi- and medicine. The efforts of these faculty dissipation in the controller) must be weighed ences facilitated via distance learning members are focused by the research against the power required for wireless data technology. The courses will be fine-tuned testbeds mentioned above. The Center transmission. The fundamental power-range across Michigan and then offered nationally. Director and Deputy Director are from the requirements must also be better under- On-going seminars are being shared across University of Michigan, with Associate stood, taking advantage of MEMS-based campuses and industrial sites that highlight Directors from Michigan State and Michigan antenna structures and micropower MEMS the pervasive societal implications of these Tech. These individuals, together with the resonators for filtering and frequency microsystems along with technical advances. Administrative Director, the Associate conversion. Industrial Collaboration/ Director for Industrial Programs, the Associate Director for Education, and the In the neural prosthesis testbed, flexible Technology Transfer research thrust leaders, form the Manage- electrode arrays containing site-selection Solving societal problems requires that ment Committee for the Center. The Center electronics are being developed along with technical developments be applied in Director reports directly to the Dean of active measurement and control of array products. Thus, technology transfer and Engineering. position in the cochlea. Subsequent efforts industrial partnerships are critically impor- will address the development of fully tant. An industrial partnership program has implantable microsystems capable of been established for the Center that involves electrically recording neural activity and leading companies in microelectronics, precisely delivering electrical and chemical MEMS, and wireless communications, stimuli at the cellular level to address including companies from the automotive, neurological disorders at point of need. The environmental, and medical fields. These centerpiece of the initial environmental companies participate in the Executive system is an integrated gas chromatography Committee and Industrial Advisory Board of system operating at 1mW in 1cc and the Center, helping set directions and detecting over 40 specific gases from the determine policies in both education and EPA’s air toxics list with 10-100 part-per- research. Named student scholarships and billion sensitivity. This device requires a high- internships in industry as well as visiting efficiency preconcentrator, a multi-valve industrial positions at the university are being sampling system, and an integrated vacuum used to facilitate technology transfer through pump. The transport and surface interactions personnel exchanges. Recognizing that the of microscale samples are being explored. missing link in many technology transfer Deposited thin-film coatings for corrosion efforts is the ability to generate prototypes for protection and micromolding using advanced evaluation by industry, the Center is also milling techniques are candidate approaches dedicating both personnel and facilities to to micropackaging here along with producing such devices, ensuring that the microassembly techniques at the chip level. results of its research are translated into Education products that benefit society. The multidisciplinary nature of this research Facilities is an ideal basis for making a significant The Center makes use of state-of-the-art impact on engineering education. At the facilities for the fabrication of microsystems high-school level, the Center is developing a and associated devices, including the set of teaching aids using MEMS to illustrate 14,000sf Class 10/100 Solid-State Fabrica- basic principles in physics and chemistry tion Facility at the University of Michigan. along with their applications in health care This facility supports a full range of micro- and environmental monitoring. Working with structure, device, and circuit fabrication science coordinators, summer training techniques and has pioneered MEMS Center Headquarters programs for teachers are facilitating delivery development for over two decades. to the students, with the goal of significantly Michigan State adds important facilities for increasing the number of young people new materials (e.g., diamond), while Center for Wireless Integrated MicroSystems pursuing careers in science and engineering. Michigan Tech adds capabilities for non- The University of Michigan These outreach activities include special 2401 EECS Building lithographic material processing and high- efforts with underrepresented minority resolution micromilling. Very large scale 1301 Beal Avenue students, selected in part through a micropower circuit fabrication is being carried Ann Arbor, MI 48109-2122 partnership with DAPCEP (the Detroit Area Homepage: http://www.umich.edu/wims out in facilities made available by our Pre-College Engineering Program). At the industrial partners. All three schools have undergraduate and graduate university extensive facilities for distance learning, Center Director: Dr. Kensall D. Wise levels, the ability to mix students with (734) 764-3346 • email@example.com which permit interactive networking of both different backgrounds in team-oriented research and educational efforts. research is, we believe, absolutely critical in Deputy Director: Dr. Khalil Najafi (734) 763-6650 • firstname.lastname@example.org Administrative Director: Ms. Karen Richardson (734) 647-1779 • email@example.com NSF 00-137r
"Center for Wireless Integrated MicroSystems _NSF00-137r_"