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Corporate Fact Sheet 2008
Innovative Laser
System
Pioneer of a revolutionary hybrid laser processing technology — Laser MicroJet® or LMJ — Synova
provides state-of-the-art dicing and cutting solutions, as well as drilling and edge-grinding systems, for
both the front- and back-end sectors of the global semiconductor manufacturing industry. This
breakthrough technology enables the world’s leading chipmakers to benefit from increased accurate
and controlled cutting performance, while at the same time witness other industry-first advantages,
including faster speed, increased flexibility, and enhanced wafer-surface protection — boosting
throughput. Moreover, Synova customers are realizing greater cost-of-ownership benefits than
traditional processing methods deliver – making Synova’s technology even more critical for high-volume
production.
Headquartered in Switzerland, Synova is now also providing its advanced laser-processing solutions to
applications in the electronics, LED, solar cell, flat panel display, tooling, medical and watch industries.
Founded 1997
Headquarters Synova S.A.
Chemin de la Dent d’Oche
1024 Ecublens (Lausanne)
Switzerland
Tel: +41-21-694-35-00
Fax: +41-21-694-35-01
Web Site http://www.synova.ch
Employees 75 worldwide
Global Synova supports its customers through a
Operations comprehensive network of application labs (MMC),
subsidiaries and distributors located in the United
States, Japan, South Korea, Taiwan, China,
Singapore, Malaysia, India, the Philippines, Israel,
Germany and Brazil.
Customer Micromachining Centers (MMCs): In addition to its Swiss facility, Synova has MMCs
Support located in the United States, Japan, Korea and Taiwan. Each serves as a competence
center for demonstration, sample testing and application development. In addition,
these facilities will offer micro-machining services to the local industry.
Executive Dr. Bernold Richerzhagen – Chief Executive Officer & President
Management Philippe Senn – Chief Operation Officer
Contacts Inquiries about the company may be directed to:
Sales Contact
Media / Marketing MCA Public Relations
EMEA: setayesh@synova.ch
Arnaud Brulé Karen Do
Asia: pasche@synova.ch
Tel: +41-21-694-35-00 Tel: +1-650-968-8900
USA: kling@synova-
brule@synova.ch kdo@mcapr.com
usa.com
SYNOVA 2008 1
Technology Laser MicroJet® is an innovative hybrid method
combining a laser beam with a low-pressure
water jet, which cools the cutting and offers
extreme precision debris removal.
The low-pressure water jet, emitted from the
nozzle, guides the laser beam by means of total
internal reflection at the water/air interface, in a
manner similar to conventional glass fibers. It is
therefore a “cold and clean laser” preventing all
the known problems associated with dry lasers
such as thermal damages, non-uniform
deposition and lack of accuracy.
Technology No limitation in work piece thickness High cutting speed
Benefits No mechanical stress; force free Consistently high cutting quality
No chipping Parallel cut walls
No thermal damage or material High fracture strength
change, no HAZ, no burrs Omni-directional cutting
No deposition or contamination Low running costs; no tool wear and
No protection layer needed on wafer very few consumables
surface Higher throughput for increased
productivity and better ROI
Markets Semiconductors: Silicon, gallium arsenide (GaAs), germanium (Ge), indium
incl. LED: phosphide (InP), silicon carbide (SiC), gallium nitride (GaN),
gallium phosphide or low-k wafers
Solar Energy: Solar photovoltaic cells
Electronics: Metal masks (such as stencils for PCB, wafer bump stencils,
or screen for flat panel display); ferrite core or ferromagnetic
ceramic materials
Tooling: Super hard material, such as cubic boron nitride (CBN),
polycrystalline diamond (PCD), polycrystalline cubic boron
nitride (PCBN) or silicon nitride
Medical: Medical devices such as stents, needles or implants
Automobile: Catalytic converters, fuel injection nozzles
Watch making: Watch hands and other precision metal parts
SYNOVA 2008 2
Products The LDS is primarily designed for
LDS 300 semiconductor back-end processing.
Laser Dicing Application processes include dicing, edge
System grinding, thinning, hole drilling, slotting,
grooving, inking, isolating and marking.
The Laser Edge-Grinding System has been
developed to grind the edge of thin wafers in
LGS 200
order to remove micro cracks. This advanced
Laser Grinding
process reduces wafer breakage, facilitates
System
wafer handling, and enhances wafer fracture
strength.
LCS 300 The LCS is a versatile tool conceived for
Laser Cutting micro-cutting applications in a variety of
System applications and industrial sectors.
The LSS is primarily designed for the cutting
LSS 800
of stencils or metal masks used in the
Laser Stencil
electronic industry and in the flat panel display
System
sector in particular.
The HLS is combines two dicing methods:
HLS 300
diamond saw and Laser MicroJet®. The tool is
Hybrid Laser
optimizing both processes for combining
Saw
manufacturing throughput and cut quality.
Synova now also offers core components of its
LMJ-IP
Laser MicroJet® systems, allowing
Integration
manufacturing companies to integrate modules
package
directly into their own production lines
Recent News July 2008 Synova receives multi-system order from European solar cell
manufacturer
February 2008 Synova teams with Fraunhofer ISE and photovoltaic
manufacturing leaders in European solar research alliance
June 2007 Synova and Disco to co-develop hybrid dicing tool
April 2007 Manz Automation and Synova combine technology expertise to
deliver more cost-effective photovoltaic manufacturing solutions
February 2007 Synova to license Laser MicroJet® technology to end users and
select equipment manufacturers
SYNOVA 2008 3
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