Supplier Quality Presentations - PDF by obw58043

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									     WELCOME
        TO
SUPPLIER QUALITY DAY




                       1
Logistics

• Link to presentations will be emailed after the event.
   – please provide your email address on the signup sheet

• Bathrooms:
   – Go left to end of building (mini auditorium), men & women rest rooms on the
     right
   – Escort not required

• Cell-phones on Vibrate
• Laptops away until lunch break
• Emergency Exit
   – Straight ahead and Exit to your left by revolving doors



                                                                               2
AGENDA
TIME            PRESENTER              TOPIC

8:30 - 9:00                            Check-in
9:00 - 9:20     Bob Nees               Opening
9:20 - 9:40     Bob Nees               Priorities / Market update
9:40 - 10:00    Kyle Flessner          MAKE Update
10:00 - 10:20   Venu Menon             ATD Update
10:20 - 10:45   Andy Higgins           SC Quality Update
10:45 - 11:20   All                    Panel Q&A

11:30 - 12:45   Lunch and Networking

12:45 - 1:00    Mary Kay Vaughan       SEA Winners Address
1:00 - 1:30     Mike Mcfadden          Automotive Quality update
1:30 - 2:15     Andy Higgins           8D Training / Case Study
2:15 - 2:45     Troy Weber             Change Control
2:45 - 3:00     Bob Nees               Wrap Up and Q&A
                                       Complete Survey/ Close
                                                                    3
51 TI Suppliers here today….



                                     Siltron




                     Fujimi


                                     Hamada

                               AHI




                                           4
Why are we here today?
 2010 focus on QUALITY as a priority, to support TI‟s GROWTH.

 Training on 8D problem solving approach

 Increase awareness to change control

 Need to reduce quality excursions!




                                                                 5
6
Texas Instruments
Wafer Fab Supplier Quality Day
Rob Simpson
Vice President, Worldwide Procurement & Logistics

June 3, 2010
AGENDA
TIME            PRESENTER              TOPIC

8:30 - 9:00                            Check-in
9:00 - 9:20     Bob Nees               Opening
9:20 - 9:40     Bob Nees               Priorities / Market update
9:40 - 10:00    Kyle Flessner          MAKE Update
10:00 - 10:20   Venu Menon             ATD Update
10:20 - 10:45   Andy Higgins           SC Quality Update
10:45 - 11:20   All                    Panel Q&A

11:30 - 12:45   Lunch and Networking

12:45 - 1:00    Mary Kay Vaughan       SEA Winners Address
1:00 - 1:30     Mike Mcfadden          Automotive Quality update
1:30 - 2:15     Andy Higgins           8D Training / Case Study
2:15 - 2:45     Troy Weber             Change Control
2:45 - 3:00     Bob Nees               Wrap Up and Q&A
                                       Complete Survey/ Close
                                                                    8
Agenda
 • Introduction
 • TI Update
 • Quality Imperative
 • Close
Introduction
 • Welcome to TI‟s Wafer Fab Supplier Quality Day
 • TI is and will remain a leader in the Semiconductor industry
 • Suppliers are key to TI‟s success
      –      Half of TI‟s revenue spent with our suppliers
      –      About 200 suppliers make up 80% of our spend
      –      More 10,000 suppliers working with TI annually
      –      Over $1B spent in 2009 with Wafer Fab suppliers, more in 2010

 • Suppliers Quality is a must!
      – The quality of your products & services have a direct impact on TI and our
        customers
      – Consistent high quality suppliers will get a greater share of TI business
      – Supplier quality in 2009-2010 YTD has been a historical low

 • We need you to listen, learn and take the message back

 6/14/2010                    “TI Proprietary Information - Strictly Private” or similar placed here if applicable   10
Agenda
 • Introduction
 • TI Update
 • Quality Imperative
 • Close




 6/14/2010         “TI Proprietary Information - Strictly Private” or similar placed here if applicable   11
Global Presence
Approximately 26,700 employees worldwide




 12,700 in The Americas          9,800 in Asia
   ─ 9,900 in Texas              1,700 in Japan
   ─ 8,900 in North Texas        2,500 in Europe
   ─ 8,100 in Dallas area
   TI Revenue
      2009 Revenue of $10.4B                                                Quarterly Revenue

                         Analog (41%)                   $B
Other (20%)              (HPA, HVAL & Power)
Includes:
   Calculators
   ASIC                                                                                                                                *
                                                         4
   RISC
                                                        3.5
   DLP
                                                         3

                                                        2.5

                                                         2

                                                        1.5

                                                         1
                                                              1Q07 2Q07 3Q07 4Q07 1Q08 2Q08 3Q08 4Q08 1Q09 2Q09 3Q09 4Q09 1Q10 2Q10*




                                                          2Q10 Guidance:
Wireless (25%)
(Digital baseband, OMAP™       Embedded                            TI Revenue expected to be between $3.31B
apps processors, Connectivity) Processing (14%)               & $3.59B*
                               (Catalog, Comms                 EPS estimate of estimate of $.56 to $.64
                               Infrastructure & Auto)    2010: R&D $1.5B, Capital Expenditures $.9B,
                                                         Depreciation $.9B
Analog & Embedded Processing are
great opportunities
     • Large markets
            – Analog: $32B
            – Embedded Processing: $14B

     • Inside everything, cool new apps
            – ~80,000 TI customers

     • Profitable markets with strong cash generation
            – Low capital investment requirements

     • Fragmented competition
            – Analog: top eight companies comprise ~50% of market
            – Embedded Processing: top four companies comprise ~50% of market

     • TI has strong positions, room to grow
            – #1 in Analog, 13% share (WSTS)
6/14/2010
            – #2 in Embedded Proprietary Information - Strictly Private”share (WSTS)
                             “TI
                                 Processing, 11% or similar placed here if applicable   14
Capital Investment Comparisons
(vs. Analog competitors)
 1.4
 1.2
                                    TXN
   1
                                    LLTC
 0.8                                ADI
 0.6                                STM
                                    NSM
 0.4
                                    MXIM
 0.2
   0
         2007         2008   2009
TI’s unique manufacturing advantage




            RFAB (Richardson, TX)                                                             TI Clark (Philippines)


  • Industry’s 1st 300mm analog fab                                             • 800,000-square-foot assembly
  • Supports $3B in revenue                                                       and test facility
    growth over three phases                                                    • 12B unit annual production
  • Phases 1 & 2 underway                                                         capacity when fully equipped

  • Equipment acquired at                                                       • Supports advanced package
    distressed sale                                                               technologies

  • Initial production end 2010                                                 • Initial production early 2009
6/14/2010                 “TI Proprietary Information - Strictly Private” or similar placed here if applicable         16
  2010 Forecasts Show SC Growth >20%
                               2010 World SC Market Growth Forecasts
                          0%   2%   4%   6%   8%   10% 12% 14% 16% 18% 20% 22% 24% 26% 28%


       SC Intelligence, Feb                                                                 25.0%



              Gartner, Feb                                                  19.9%



              Semico, Mar                                                             24.0%



   Carnegie Research, Mar                                      15.0%



           IC Insights, Mar                                                                         27.0%



               Isuppli, Mar                                                         23.2%



New Venture Research, Mar                                                18.8%


                                                                       2010 Avg = 21.8%
    Market Outlook Summary – April 2010
•   Electronics – showing continued signs of stabilization with increasing demand.

  • US retail electronics Y-o-Y dollar growth continues to show negativity (but improving).
  •      PC units expected to show double digit Y-o-Y increase in 2010.

  •      Cell phone unit growth forecasted to increase in high single digits in 2010.

  •      IT spending starting to gain momentum (Windows 7 Release).

•   Semiconductors – growth trajectory continues to pick up speed.

  •      SC forecasts leaning towards >20% SC growth in 2010.

  •      Consistent pattern of shortages and extended lead times across Standard Logic,
         Microcontrollers, Analog, and Optoelectronics.

  •      IC capacity utilization nearing 90%.

  •      Some prices are increasing.

•   Economy – 2010 expected to see World GDP recovery.

  •      EU/Japan/U.S. economy growth positive in 2010.

  •      Asia economic growth remains strong. Concern exists about overheating, especially with
         respect to real estate.

  •      US sequential GDP growth in 1Q 2010 expected to be 2.7%.

  •      Concerns exist about exit from global stimulus programs.
Agenda
 • Introduction
 • TI Update
 • Quality Imperative
 • Close
Texas Instruments Quality Policy
We will achieve business excellence by:
  Encouraging and expecting the creative
  involvement of every TIer.
  Listening to our customers
  and meeting their needs.
  Continuously improving our processes,
  products and services.
Mission
Worldwide Procurement & Logistics

Provide a Sustained Competitive Advantage to TI and
its Customers in Procurement and Logistics in the areas
of Cost, Environmentally responsible procurement,
Technology, Responsiveness, Assurance of supply, and
Quality (CETRAQ)
                                    Cost
                                     Environmental Responsibility
                                       Technology
                                           Responsiveness
                                             Assurance of Supply
                                               Quality
2010 WPL Priorities
              • Accelerate growth to gain share!
Global
                  –   Ensure supply to meet every circumstance
Leverage          –   Attack supply chain costs
global            –   Optimize distribution network
                  –   Drive proactive supplier quality management
talents &         –   Provide value to our customers & internal partners
processes         – Utilize the creativity of our supply base




People
Fully engaged people with the right skills & resources succeeding
around the globe
Agenda
 • Introduction
 • TI Update
 • Quality Imperative
 • Close
TI: Your Preferred Customer
• In business for > 75 years
• In the Semiconductor market since Jack Kilby invented the integrated circuit
• 4th largest Semiconductor company worldwide
• Focused on markets that provide growth
     – #1 in Analog at 13% market share – Lots more opportunity!
     – #2 in Embedded Processing & looking to move ahead
     – Wireless focus on application (OMAP) processing & connectivity

• Financially stable
• Investing in the future
• Focus on Growth
• We recognize our Suppliers are Critical to our Success


6/14/2010                   “TI Proprietary Information - Strictly Private” or similar placed here if applicable   24
Closing
• Again, thank you for your support and for being here today
• We need from you:
   –   Cost:                    Continuous ideas on how to reduce costs
   –   Environment:             Green, energy efficient, safe, CSR
   –   Technology:              Close connection on roadmaps, innovation
   –   Responsiveness:          Lower leadtimes, meet commitments, speed
   –   Assurance of Supply:     Supply to meet TI growth
   –   Quality:                 Guaranteed quality, no excursions, immediate
                                action on issues

• Continue your close partnership with TI Wafer Fabs worldwide
• Enjoy TI Wafer Fab Supplier Day!
AGENDA
TIME            PRESENTER              TOPIC

8:30 - 9:00                            Check-in
9:00 - 9:20     Bob Nees               Opening
9:20 - 9:40     Bob Nees               Priorities / Market update
9:40 - 10:00    Kyle Flessner          MAKE Update
10:00 - 10:20   Venu Menon             ATD Update
10:20 - 10:45   Andy Higgins           SC Quality Update
10:45 - 11:20   All                    Panel Q&A

11:30 - 12:45   Lunch and Networking

12:45 - 1:00    Mary Kay Vaughan       SEA Winners Address
1:00 - 1:30     Mike Mcfadden          Automotive Quality update
1:30 - 2:15     Andy Higgins           8D Training / Case Study
2:15 - 2:45     Troy Weber             Change Control
2:45 - 3:00     Bob Nees               Wrap Up and Q&A
                                       Complete Survey/ Close
                                                                    26
Worldwide Manufacturing
Enhancing TI’s competitive advantage




6/14/2010          “TI Proprietary Information - Strictly Private” or similar   27
                                  placed here if applicable
Worldwide Manufacturing at a glance
• Worldwide infrastructure for fabrication, assembly, test and bump
• Nearly two million square feet of clean room space
• More than 12,000 employees in seven countries working as a single team
• Achieving 97% Process Yield worldwide
• Supporting innovative, new process development for future growth
• Developing technical leadership with more than 30% of Make
  technical staff represented on the TMG Technical Ladder
• Safest of the safe
    – Best safety record in the semiconductor industry
    – U.S. semiconductor industry ranks in the top 5% of durable
      goods manufacturers for safety
• Environmentally-responsible facilities
    – First semiconductor manufacturer to meet the U.S.
      Green Building Council‟s Leadership in Energy and
      Environmental Design (LEED) standards
    – LEED certified in Richardson, TX and the Philippines
Worldwide Manufacturing sites


                                      Freising
                                      FFAB


                                                                            Miho
                                                                            Miho Fab

                                                                            Hiji
                                                                            Hiji Fab
                                                                            Hiji A/T




Aguascalientes                                                     Taipei
TMX                                                                TITL


Dallas
DFAB                                             Kuala Lumpur
DMOS5                                            TIM
DMOS6
SFAB
DHC                                                  Baguio City
RFAB (Qual 2010)   Houston
                   HFAB                              Baguio
DBump
                   HBump
                                                       Pampanga
                             LEGEND
                                                       Clark
                             Wafer Fabs
                             Assembly / Test
                             Bump
                                                                                       29
Industry utilization saw a steep
             IC Industry Capacity
decline           Source: SICAS
                                 2,400                                                                100%

Two Primary Responses
    2,200                                             96%

  • 2,000
        Some manufacturers reacted by closing or 92%
 K Wafers/Week (200 mm equiv.)




       consolidating factories impacting available 88%
    1,800

    1,600                                             84%
       Industry capacity.
    1,400                                             80%
        TI’s competitors significantly reduced capital76%
  • 1,200
       spending
    1,000                                             72%

                                  800                                                                 68%

                                  600                                                                 64%
                                                                            Unused Capacity
                                  400                                                                 60%
                                                                            Utilized Capacity
                                  200                                       Percent Utilization       56%

                                    0                                                                 52%


                                                                                                             30




                                         “TI Proprietary Information - Strictly Private” or similar
Industry capacity reaching critical
            IC Industry Capacity
point            Source: SICAS
                                 2,400                                                                100%

                                 2,200                                                                96%

                                 2,000                                                                92%
 K Wafers/Week (200 mm equiv.)




                                 1,800                                                                88%

                                 1,600                                                                84%

                                 1,400                                                                80%

                                 1,200                                                                76%

                                 1,000                                                                72%

                                  800                                                                 68%

                                  600                                                                 64%
                                                                            Unused Capacity
                                  400                                                                 60%
                                                                            Utilized Capacity
                                  200                                       Percent Utilization       56%

                                    0                                                                 52%


                                                                                                             31




                                         “TI Proprietary Information - Strictly Private” or similar
Capital spending comparisons
TI investing, counter to industry, and
emerging strong!
                                                                                                                              60%



                                                                                                                              40%




                                                                                                                                     % Growth from 3Q08 Baseline
                                               40% Inc from
                                                 4Q to 4Q
                 3Q08
                                                                                                                              20%
                Baseline
  Unit Output




                                                                                                                              0%



                                                                                                                              -20%



                                                                                                                              -40%



                                                                                                                              -60%
                 3Q08      4Q08   1Q09     2Q09            3Q09            4Q09             1Q10         2Q10   3Q10   4Q10

                                         Actual           Capacity                 Baseline Growth
                                                                                                                                              33




                                            “TI Proprietary Information - Strictly Private” or similar
Contributing to analog growth
• Providing additional analog capacity
   – Purchased hundreds of 300mm tools for RFAB Phase1, Phase 2 announced in 2Q10
          •   50 wafers (Pilot / Mini Line Production), 200 wafers (Phase 1), 444 wafers (Phase II), 1500+?
   – Purchased over 400 testers for assembly/test expansion between 2Q09 and 2Q10
   – Opened and ramped Clark
   – Purchased or redeployed hundreds of 200mm tools to MIHO, DMOS5, Clark, FFAB, TIPI
          •   2008: 150+ tools, 4Q09: 200+ tools

• Driving new process development                                             KFAB equipment
   –   High-power BiCMOS (LBC)                                            redeployment supports ~
   –   High-speed BiCMOS (BiCOM3)                                         $1B / yr additional analog
   –   High-density analog CMOS (C05, A035, E035)                                  revenue
   –   High-precision analog CMOS (HPA07)
                     Clark                                                              RFAB




           780,000 square feet of                                          1 million square feet of
             additional capacity                                             space on 92 acres
Summary

• TI is growing!
• TI is investing!
• TI needs strong supplier partners!
  – Quality must be a top priority
  – Spares, parts, consumables inventory in place to support production
    and ramp needs
  – Timely tool conversions, relocations
  – Hit schedule commitments
  – Support quick turn development needs
  – … AND do it with improved cost

  – How can the factories help?
Thank you




                     http://tmg.ti.com
6/14/2010   “TI Proprietary Information - Strictly Private” or similar   36
                           placed here if applicable
AGENDA
TIME            PRESENTER              TOPIC

8:30 - 9:00                            Check-in
9:00 - 9:20     Bob Nees               Opening
9:20 - 9:40     Bob Nees               Priorities / Market update
9:40 - 10:00    Kyle Flessner          MAKE Update
10:00 - 10:20   Venu Menon             ATD Update
10:20 - 10:45   Andy Higgins           SC Quality Update
10:45 - 11:20   All                    Panel Q&A

11:30 - 12:45   Lunch and Networking

12:45 - 1:00    Mary Kay Vaughan       SEA Winners Address
1:00 - 1:30     Mike Mcfadden          Automotive Quality update
1:30 - 2:15     Andy Higgins           8D Training / Case Study
2:15 - 2:45     Troy Weber             Change Control
2:45 - 3:00     Bob Nees               Wrap Up and Q&A
                                       Complete Survey/ Close
6/14/2010                                                           37
Analog Technology Development at TI

Venu Menon
Vice President, ATD
June 03, 2010




6/14/2010                               38



TI Information – Selective Disclosure
Signal Conditioning & Data Converter Needs

                                                                              Customers
                                                                            Process Needs
                                                                Logic             Want
                                                                             Transistors
The Real             Amplifier
                                               Data                             Low-Noise
                                                                                Speed
 World                                       Converter                          Linearity
                                                                                Noise
                                                                             High-Accuracy
Temperature
                                                                             Resistors
 Pressure                                                                      High-Speed
                                                                                Temperature
                                                                                 coefficient
 Position
                                                                                Linearity
                                                                               Low Power
                                       Power               Digital Signal
  Speed                              Management                                 Matching
                                                            Processor
   Flow                                                                      Widely Varying
                                                                             Capacitors
                                                                             Voltage Ranges
                                                                                Linearity
 Humidity
                                                                                Matching
  Sound                                                                        Small Form
                                                                             Technology
                                                                                 Factors
   Light                                                                        BiCom3X
                         Amplifier             Data            Interface        BiCom3HV
                                             Converter                            Price
                                                                                HPA07
                                                                            Competitiveness
                                                                                BiCOM3ZL
                                                         Clocks & Timers




 TI Information – Selective Disclosure
                Everything That Uses Electricity
                  Needs Power Management
                                                                              Power IC
                                                                Logic        Care Abouts
                                                                              Customers
The Real                                       Data                                  Want
                                                                             Power Fets
                     Amplifier                                                  LDMOS
                                                                              Efficiency, Control,
 World                                       Converter
                                                                                Voltage
                                                                               Voltage Scaling,
                                                                                Current
Temperature
                                                                                Ruggedness
                                                                                  Form factor,
 Pressure                                                                       Power Metal
                                                                                Package
                                                                            Sequencing/Multiphase
 Position
                                                                             Analog mix
                                       Power               Digital Signal
  Speed                              Management             Processor           ACMOS In
                                                                                DE-CMOS
   Flow                                                                              Audio
                                                                                Bipolar
 Humidity                                                                       ESD
                                                                                  Peripherals
                                                                                Passives
  Sound
                                                                                  Batteries
                                                                             Technology
   Light
                                               Data            Interface        LBC5
                         Amplifier                                                  Motors
                                             Converter                          LBC7
                                                                                LBC8
                                                                                   Lighting
                                                                                LBC9
                                                         Clocks & Timers        Thick Cu
                                                                               Automobiles etc.




 TI Information – Selective Disclosure
                                              Analog Vs Digital

                                      C07                 C05-CMOS
                                                         C05-CMOS             C035
                                                                              C035           C027
                                                                                            C027
                    100
% OF PEAK REVENUE




                    80

                    60

                    40
                                                                           LBC4
                    20
                                                                                         C05-Analog
                     0
                          1999        2000        2001   2002     2003     2004   2005   2006   2007

                      • Processes ramp slowly
                                                                 YEAR
                      • Products last a long time
LBC4 and C05-Analog normalized based on forecasted peak revenue in 2011.

              TI Information – Selective Disclosure
About ATD
                            Extensions                   Platforms
                            • Cost                       • Perf/Pwr/Prec.
                            • Refresh                    • Density
                            • Differentiate              • Cost




                                        We create world class            Research
            Mfg. Strategy                                                • Disruptive
            Mostly internal             analog manufacturing             • Unique
           200mm & 300mm                    technologies                 • New markets




                                                          Dev. Fabs
                                 Dev. ATs                 • DM5, DM6
                                 • Malaysia               • Miho, Hiji
                                 • Taiwan                 • DFAB, DHC
                                 • Japan                  • FFAB
                                 • Philippines

TI Information – Selective Disclosure
Active Development Project Locations
                                                                TI Analog
                                                                Customers
                                            RFAB         DFAB


                                                                         Miho

                  FFAB




           DMOS5
                                    Clark                                       DMOS6



                                                                  TI
                                                                Mexico
                                             TIM
                                                         TITL

                           Hiji                                      DBUMP


                                                   DHC

TI Information – Selective Disclosure
                                         Trends

• Power, automotive, computers -> higher gate density, lower Rdson
• Industrial, solar, LED etc -> Higher voltage, FET‟s
• Battery management, motor control, automotive etc., -> embedded NVM
• Medical, metering, sensor networks, energy harvesting -> (Ultra) low power (+NVM)
• Hybrid integration -> 3-D, multi-chip packages
• Smartphones, gaming, automotive -> MEMS + analog
• Low cost -> modular technologies




 TI Information – Selective Disclosure
Analog process technology platforms
        High-Power BiCMOS                                   High-Speed BiCMOS
      LBC2, 5, 7, 8, 9, LBCSOI
   LBC2, 3, 4, 3, 4, 5, 7, LBCSOI                           BiCom3, XL, XHV, ZL
                                                             BiCom3, 3XL, XHV
       Bipolar and dual-gate CMOS                          Complementary Bipolar
       LDMOS & thick copper enablers                       CMOS
       Multi-voltage capability
                                    MEMS/Passives, 3D Low parasitics
                                     MEMS/Passives/3-D
                                    High-Power BiCMOS  
                                 LBC2, 3, 4,           High-quality Passives
          20V, 60V, and 100V+ IR Temp Sensor 5, 7, LBCSOI
                             branches
                                                           (thin film resistance)
                              Passive Integrated Circuits (PIC)
       Voltage-scaled DECMOS Bipolar and dual-gate CMOS
                                                             SOI
                            LDMOS & thick copper enablers & SiGe
                              Through Silicon Vias
       Non-volatile memory options
                                Packaging Technologies
                                  Multi-voltage capability
                                  20V, 60V, and 100V+ branches
                                  Voltage-scaled DECMOS
      High-Density                                                     Analog CMOS
                                                          High-Precision
                                  Non-volatile memory options
                            Analog CMOS
       A12, C05, A035, E035
       A12, C05, A035, E035                                    HPA07, HPE035
                                                                  HPA07
      Logic & analog CMOS                                  Low transistor noise
      Low Vt CMOS                                          High-quality passives
      Density                                               (thin film resistor)
      Passives                                             3 / 5V CMOS , High voltage

      Low leakage transistors                              Linear capacitance

      FRAM                                                 Low parasitics




TI Information – Selective Disclosure
                                            FRAM
                                           Key Features
              Parallel to Bit Line         • 0.13um with low cost MFG
                                           • Perovskite ferroelectric cap
                                           • Low power, low voltage
                                           • Fast write
                                           Key Benefits
                                           • Low cost, high density non-
                                             volatile memory
                                    VIA0
                                           • Ultra low leakage
                                           • TI intellectual property
          WL                        CONT
                                           Manufacturing
                                           • Qualified in DMOS5
                                           • 300mm in planning


TI Information – Selective Disclosure
Through Silicon Vias (TSV)




      “QFN Grounds”- TSV Driver

                                           WCSP Die
                                                             Passive


                                             TI Analog Die




                                        System in Package

TI Information – Selective Disclosure
First Six Kilby Labs Research Projects
Launched in January 2009




     Exploring Areas such as:
     • Energy Harvesting
     • ULP Signal Processing- Analog & Digital
     • FRAM & Piezoelectric Materials
     • Terahertz electronics
TI Information – Selective Disclosure
                                How can you help?
• 300 mm analog
     – Thicker layers
     – Higher temperatures
     – Batch sizes

• Make us aware of new trends, concepts, materials and opportunities
• Support evaluations and early prototyping
• Modeling, PDK tools and design IP for analog




TI Information – Selective Disclosure
                                        50


TI Information – Selective Disclosure
                                        Thank You




TI Information – Selective Disclosure
AGENDA
TIME                       PRESENTER              TOPIC

8:30 - 9:00                                       Check-in
9:00 - 9:20                Bob Nees               Opening
9:20 - 9:40                Bob Nees               Priorities / Market update
9:40 - 10:00               Kyle Flessner          MAKE Update
10:00 - 10:20              Venu Menon             ATD Update
10:20 - 10:45              Andy Higgins           SC Quality Update
10:45 - 11:20              All                    Panel Q&A

11:30 - 12:45              Lunch and Networking

12:45 - 1:00               Mary Kay Vaughan       SEA Winners Address
1:00 - 1:30                Mike Mcfadden          Automotive Quality update
1:30 - 2:15                Andy Higgins           8D Training / Case Study
2:15 - 2:45                Troy Weber             Change Control
2:45 - 3:00                Bob Nees               Wrap Up and Q&A
                                                  Complete Survey/ Close


TI Confidential – NDA Restrictions
               TI Supplier Presentation
                 Supplier Quality Day




                  Andy Higgins
            Wafer Fab Quality Manager
                a-higgins@ti.com
                  214-567-5422
6/14/2010            “TI Proprietary Information -       53
                   Strictly Private” or similar placed
            TI Supplier Presentation
              Supplier Quality Day


            •Quality at TI
            •TI Supplier Quality
            •2010 Quality Priorities
            •Supplier Quality Expectations


6/14/2010         “TI Proprietary Information -       54
                Strictly Private” or similar placed
            Corrective Action – Iceberg Effect

                  Supplier Issues                         “Most Visible”
                                                          • Final Inspection
                                                          • Final Test
                                                          • Customer Defects




                                                          “Less Visible”
                                                          Process Gaps that
                                                          will be unveiled
                                                          during audits!




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                                                                               TI Quality Expectations
   Defects
                                                                                     SFC                                                     Military
                                                            Defects

                                                                                                                                             Automotive
          Robust Design -- Design for Test




                   Defects
                                                                                                   Continuous Improvement
                                                                      Response, Actions, Feedback,Defects                          Defects

                                                     Robust
Defects                                              Process
                                                       Defects
                                                                                                                         Outlier             Medical Device




                                                                          5S
                                                   Development
          Defects                    Defects
                               Defects



                                                                                  Defects
                                                  Defects
     Defects                                                                                                          Defects                 Hard Drive
                                             Defects



                                                     FMEA
 Defects                                                                                                        Talent                       MP3 Player
                                                  Control Plan
                                                      SPC                                                   Defects

                                                     Specs
                                                 Characterization
                                                                                                                                             Cell Phone


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                     TI Supplier Quality
            Skills and Tools:
            • Audits (Customer, Internal and Self audits)
            • Problem solving
                    • 3x5Why
            • Preventive Action Process
                    • FMEA
            • Leading indicators of quality
                    • Abnormal material (Outlier)
                    • Yield
                    • Major events
            • Alert System (Fan out)
            • Collaboration (One Make Teams)
            • 5S
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                    Best Practice Root Cause Application:
                          3 legged 5-Why Analysis

    (5-Why 3 Paths: Occurrence cause, Escape cause & Systemic Failure)
 Problem             1. Why did the nonconformance happen?
Description          2. Why was the problem not detected and reached the customer?
      #1             3. Why did the system allow the nonconformance occur?
              Why
                      Why
                             Why
      #2                                Why
              Why
                      Why                          Root Cause           Occurrence cause
                             Why                                     Action Plan / Target Date
      #3                                Why
              Why
                                                   Root Cause
                      Why                                                 Escape cause
                             Why                                     Action Plan / Target Date
                                       Why
                                                   Root Cause
                                                                         Systemic failure
                                                                     Action Plan / Target Date


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            TI Supplier Presentation
              Supplier Quality Day


            •Quality at TI
            •TI Supplier Quality
            •2010 Quality Priorities
            •Supplier Quality Expectations


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                       TI Supplier Quality
                                                   Potential Impact:
Supplier                                           Line purge
Process               Fab A                        Line interruption
                                                   Customer

Outgoing                               WPL
Quality                                Fab:
                      Fab B                                    Business:     Customer:
Checks                                 Quality                               SQEs
                                                               Quality
            Defects                    Engineering             Engineering
                                       Planning                Planning
Process
                      Fab C
Controls                                     Event Management:
                                             Containment
Tool                                         Delivery (business recovery)
                      Fab D                  Risk Assessments
Controls
                                             Root Cause and Corrective Actions

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            TI Supplier Presentation
              Supplier Quality Day


            •Quality at TI
            •TI Supplier Quality
            •2010 Quality Priorities
            •Supplier Quality Expectations


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2010 MAKE Quality Priorities
New Product Introduction


Execution


Quality
  • Define & Implement Supplier Quality Infrastructure



Foundation




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                                              Quarterly PDO Updates


                                                Monthly Scorecards


                                          Weekly Reports (Top Issues)

                            Sponsors: Jimmy/George/Tom                        Sponsors: Andy/Bob/Tom       Sponsors: Jan/Tom




     Leadframes       Mold Cmpd        Substrate         Packing Mtl     Silicon Wfrs      Photomask            Logistics

 TI Factory Quality – Sub-team Lead        Data Collection & Analysis
 WPL SME                                   - Collect supplier issue information (LRR, CDs, Alerts, iAS, COPQ)
 SC Pkg SME                                - Analyze data and determine next steps/initiatives
 Quality                                   - Recommend change proposals
 SME (Factory Proc Engr)
   Top 5 Suppliers + New Tech              Drive Quality Improvements
                                           - Audit strategy execution –
2010 – Top 5 Suppliers + New Tech          - QBRs, CETRAQ
2011 – Top 10 Suppliers + New Tech         - Quality Jail
                                           - Work across MAKE sites
                                           - Fan-out Lessons Learned WW


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       Supplier Process Flow Diagram (Example)



                                                            Source of
                                                          Supplier Issues
                                                         (Specific Process)




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                          Audit Approach
            Work Instructions                      Preventive Maintenance




     FMEA                                                           Metrology
                          Fermentation
                            Process
     Control Plan                                                         SPC
                           (Example)
   Work
Environment
    (5S)
               Incoming                                People Resources

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            TI Supplier Presentation
              Supplier Quality Day


            •Quality at TI
            •TI Supplier Quality
            •2010 Quality Priorities
            •Supplier Quality Expectations


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                   TI Supplier Quality

            Supplier Quality Expectations

                 Containment
                 Fast, effective response
                 Prevention




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AGENDA
TIME                       PRESENTER              TOPIC

8:30 - 9:00                                       Check-in
9:00 - 9:20                Bob Nees               Opening
9:20 - 9:40                Bob Nees               Priorities / Market update
9:40 - 10:00               Kyle Flessner          MAKE Update
10:00 - 10:20              Venu Menon             ATD Update
10:20 - 10:45              Andy Higgins           SC Quality Update
10:45 - 11:20              All                    Panel Q&A

11:30 - 12:45              Lunch and Networking

12:45 - 1:00               Mary Kay Vaughan       SEA Winners Address
1:00 - 1:30                Mike Mcfadden          Automotive Quality update
1:30 - 2:15                Andy Higgins           8D Training / Case Study
2:15 - 2:45                Troy Weber             Change Control
2:45 - 3:00                Bob Nees               Wrap Up and Q&A
                                                  Complete Survey/ Close


TI Confidential – NDA Restrictions
AGENDA
TIME                       PRESENTER              TOPIC

8:30 - 9:00                                       Check-in
9:00 - 9:20                Bob Nees               Opening
9:20 - 9:40                Bob Nees               Priorities / Market update
9:40 - 10:00               Kyle Flessner          MAKE Update
10:00 - 10:20              Venu Menon             ATD Update
10:20 - 10:45              Andy Higgins           SC Quality Update
10:45 - 11:20              All                    Panel Q&A

11:30 - 12:45              Lunch and Networking

12:45 - 1:00               Mary Kay Vaughan       SEA Winners Address
1:00 - 1:30                Mike Mcfadden          Automotive Quality update
1:30 - 2:15                Andy Higgins           8D Training / Case Study
2:15 - 2:45                Troy Weber             Change Control
2:45 - 3:00                Bob Nees               Wrap Up and Q&A
                                                  Complete Survey/ Close


TI Confidential – NDA Restrictions
Supplier
Excellence
Award
_________________________________

Mary Kathryn Vaughan
Procurement Manager
WF Capital, Equipment Spares & Services




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 TI is committed to success
            – today and tomorrow




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         Mission of TI’s
Worldwide Procurement & Logistics

Provide a Sustained Competitive Advantage to TI and
 its customers in Procurement and Logistics in the
     areas of Cost, Environmentally responsible
     procurement, Technology, Responsiveness,
     Assurance of supply, and Quality (CETRAQ)




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           TI Counts on Suppliers
  • Enable us to:
       –   Innovate
       –   Differentiate
       –   Provide high quality
       –   Continuous cost reductions
       –   Get to market quickly
  • Provide more value! Go beyond just the product or
    service:
       –   Productivity
       –   Yield improvements
       –   Integration & Process
       –   Software
       –   System understanding
       –   Long term view of the relationship
       –   Global perspective

Suppliers are key to TI success !! -
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            Supplier Excellence Award
                     Purpose
• To recognize suppliers who contribute significantly to TI
  business success through outstanding performance &
  continuous improvement in providing goods and services
  to TI.

• To provide a company-wide definition of supplier
  excellence in order to improve standards and quantify TI‟s
  ever-increasing expectations.

• To act as a key vehicle for communicating TI standards of
  excellence.




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             SEA Supplier Nominations
   Supplier nominations are based on performance for
    the past calendar year using CETRAQ evaluations:

       •     Cost                                     •    Responsiveness
       •     Environmental Responsibility             •    Assurance of Supply
       •     Technology                               •    Quality


 Overall performance to all TI organizations is
    considered in addition to performance for the
    nominating group.
 Nominations may be made by any TI employee --
    individuals or teams.
 Nominations are reviewed throughout TI
    worldwide -- anyone can challenge a nomination.
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                           SEA Facts
•   Last 27 years TI has honored businesses
    that deliver superior service and support
•   2009 Total TI Suppliers ~ 14,000
•   2009 SEA Winners = 17, or < 1%!
     •   Semiconductor = 16
     •   Education Technology = 1

"TI values the contributions of all its suppliers but is especially proud of
these award recipients for their commitment to excellence and efforts to
deliver the highest quality and value to TI and its customers."
                                        - Rob Simpson, VP and Manager
 6/14/2010
                                          WW Procurement & Logistics
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  2009 TI Supplier Excellence Award
              Winners
Cisco
Cross-Link Electric & Construction Corporation
Headway GmbH
Jiangyin Changdian Advanced Packaging Co., Ltd. (JCAP)
Kinpo Electronics, Inc.
Kluh Security GmbH
Nippon Micrometal Corporation (NMC)
Photronics, Inc.
Rokko Systems Pte Ltd
Shinko Electric Industries Co., Ltd.
Small Precision Tools (SPT)
Specialty Optical Systems, Inc.
SUMCO Corporation
Technology Service Professionals, Inc. (TSP)
Teradyne Inc.
time:matters, a company of Lufthansa Cargo
T-Mobile
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               C O N G Strictly Private”L A T I O N S ! !
            Thank You!


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                        AGENDA
TIME            PRESENTER                        TOPIC

8:30 - 9:00                                      Check-in
9:00 - 9:20     Bob Nees                         Opening
9:20 - 9:40     Bob Nees                         Priorities / Market update
9:40 - 10:00    Kyle Flessner                    MAKE Update
10:00 - 10:20   Venu Menon                       ATD Update
10:20 - 10:45   Andy Higgins                     SC Quality Update
10:45 - 11:20   All                              Panel Q&A

11:30 - 12:45   Lunch and Networking

12:45 - 1:00    Mary Kay Vaughan                 SEA Winners Address
1:00 - 1:30     Mike Mcfadden                    Automotive Quality update
1:30 - 2:15     Andy Higgins                     8D Training / Case Study
2:15 - 2:45     Troy Weber                       Change Control
2:45 - 3:00     Bob Nees                         Wrap Up and Q&A
                                                 Complete Survey/ Close

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Quality Expectations of
Automotive Customers

Mike McFadden
Automotive Quality



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Automotive Quality

• Automotive Quality is a „layered‟ activity with each
  part of the process working to a zero defect goal.
      – The „process‟ can be design, Si, package, test, etc.

• Most of the activity is at „Time Zero‟ quality.
      – Once the material leaves the supplier (i.e. TI) any failure
        counts

• Intrinsic quality is about the same as commercial
  devices.
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Automotive Quality

• Typical metrics at the customer / OEM
        – Line (customer)
            • Best:            <5 dppm
            • Range:           <30 dppm
        – 0 km (OEM)
            • Best:             0 dppm
            • Range            <5 dppm
        – Field (OEM)*
            • Best:            <1 dppm
            • Range            <1 dppm


* - Field performance will not be appreciably different from commercial parts
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Automotive Quality

• Typical response when a supplier has a fail

            Please fix this as soon as possible.

                  Time to root cause is 14 days
                  after receipt of failing unit.




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Automotive Quality


• How do you do it?
        – You do it with a lot of „due diligence‟
        – You cannot cut corners
        – If you miss something, it will come back and find you
• Each part of the flow has separate activities
        – Business
            • Design, Test
        – Manufacturing
            • Process, Control

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Automotive Quality

• Business
        – New Product Development Flow
            • This MUST be in place with automotive in mind
        – Process Development
            • Design to -40C/+130C temperature range
            • Detailed FMEA
               – Design, Process, Test, Assembly, etc.
            • Qualification
               – Extra EFR, HTOL, T/C, etc. population and testing
        – Product Development
            • Requirements: Q100 / TS16949 / Customer Specific
            • Design / Test
               – Extra checklists
                   » Lessons learned, best practices, peer review
6/14/2010
               – More margin
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                   » Speed, voltage, current
               – Detailed reviews
Automotive Quality
• Manufacturing
            – Auto Quality Teams
               • Assembly and Test / Wafer Fab
                   – Charter is to ensure best automotive practices at TI sites
            – A/T
               • Dedicated machines (where needed)
               • Enhanced maintenance / process control
               • Outlier implementation
            – Fab
               • Dedicated machines (where needed)
               • Statistical Factory Control
                   – WECO, CpK, Tracking, Continuous Improvement
               • Outlier implementation



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Automotive Quality


• Typical returns
        – Latent defects
            • Usually particulate, but can be anomalies
        – Electrical issues
            • Design, use condition
        – Package
            • Delamination, bent leads, cracked Si




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 Automotive Quality at Texas Instruments
               TMG Management                                                        Business Unit Management
   Make                          SC Quality            Business Units
                                     Automotive Steering Team

                 A/T Auto Team                                                                      Fab 1 Automotive Team


Quality Toolkit Teams                                                                   Business CQE
Outlier       Maverick Material Identification                                          Issue resolution
SFC           Statistical Factory Control                                               DPPM step down charts
AVI           Automated Visual Inspection                                               Continuous Improvement Plans
TIMS          Tool Interdiction Monitoring System                                       Customer Interface




                           Customer Feedback
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Automotive Quality at Texas Instruments


• Automotive Quality is a „layered‟ activity with each
  part of the process working to zero defects.

• Most of the activity is at „Time Zero‟ quality.

• Intrinsic quality is about the same as commercial
  devices.


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AGENDA
TIME            PRESENTER                                                TOPIC

8:30 - 9:00                                                              Check-in
9:00 - 9:20     Bob Nees                                                 Opening
9:20 - 9:40     Bob Nees                                                 Priorities / Market update
9:40 - 10:00    Kyle Flessner                                            MAKE Update
10:00 - 10:20   Venu Menon                                               ATD Update
10:20 - 10:45   Andy Higgins                                             SC Quality Update
10:45 - 11:20   All                                                      Panel Q&A

11:30 - 12:45   Lunch and Networking

12:45 - 1:00    Mary Kay Vaughan                                         SEA Winners Address
1:00 - 1:30     Mike Mcfadden                                            Automotive Quality update
1:30 - 2:15     Andy Higgins                                             8D Training / Case Study
2:15 - 2:45     Troy Weber                                               Change Control
2:45 - 3:00     Bob Nees                                                 Wrap Up and Q&A
                                                                         Complete Survey/ Close
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              8D Training

                  Andy Higgins
            Wafer Fab Quality Manager
                a-higgins@ti.com
                  214-567-5422
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                      What is “8D”?
    8D (8 Disciplines) is a structured approach to problem solving

            D1        Problem Solving Team                   Do not limit scope &
                                                             potential causes
                                                             Quantify, accurate,
            D2        Problem Description
                                                             Customer description
            D3                                 3x5Why Analysis
                      Immediate Containment Measures
                                                             - Technical Root Cause
            D4        Analysis of Causes
                                                 - Escape Root Cause
            D5        Define Corrective Measures with
                                                 - Systemic Root Cause
                      Proof of Effectiveness

            D6        Implement Corrective Actions with
                      Monitor of Effectiveness

            D7        Preventive Actions & Fan out All processes, all sites

            D8        Recognize the team

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                    Best Practice Root Cause Application:
                          3 legged 5-Why Analysis

    (5-Why 3 Paths: Occurrence cause, Escape cause & Systemic Failure)
 Problem             1. Why did the nonconformance happen?
Description          2. Why was the problem not detected and reached the customer?
      #1             3. Why did the system allow the nonconformance occur?
              Why
                      Why
                             Why
      #2                                Why
              Why
                      Why                          Root Cause           Occurrence cause
                             Why                                     Action Plan / Target Date
      #3                                Why
              Why
                                                   Root Cause
                      Why                                                 Escape cause
                             Why                                     Action Plan / Target Date
                                       Why
                                                   Root Cause
                                                                         Systemic failure
                                                                     Action Plan / Target Date


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            Problem Solving




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                    3x5Why Analysis
            What is a 3x5 Why Root Cause Analysis?




            There must be a logical cause and effect relationship
            between the Customer’s Problem and the identified
            Technical Root Cause.

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                Problem Solving




            The Corrective Action for the Systemic Root
            Cause prevents recurrence and leads to a
            specific Lesson Learned


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            Problem Solving




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            Problem Solving




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            3x5Why Example #1




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DMOS6 Exhaust Loss due to Electrical Fault

 Problem Description                                           Root Cause                                      Source 2
                                                                                                              MOV Board
 Date/Time: March 26, 2010 7:15 PM                             A static switch had an
 Location: DMOS6 Electrical Room 273                           electrical fault on the
 • Exhaust loss causes production tools to shut down           Source 1 over voltage                           Source 1
                                                                                                              MOV Board
 • Employees evacuated due to a strong chemical                board. This fault shut
   odor                                                        down all VFDs
                                                               controlling exhaust.


                                                                                                              Source of
 Containment                                                                                                    fault

 Mar 26
 •   8:00 PM incident response team formed
 •   8:30 PM exhaust recovered. Employees evacuated due to
                                                                    Source 2 MOV Board   Source 1 MOV Board
     strong odor.
 •   10:40 PM portable fab air monitors detect no elevated
     contamination.                                            Corrective/Preventive Actions
                                                               • Repair ST3 & ST4                        Apr 16
                                                               • Restore PowerLogic on Sub S & T         Apr 23
                                                               • Repair ST2                              Apr 30
                                                               • Reconfigure VFD‟s for auto-reset on OV May 31
                                                               • Replace North Campus MOV‟s w/ encapsulated
                                                                 version (~300 static switches)          3Q10
                                                               • By-pass static switches with PLC controls for
                                                                 immediate switchover                     TBD
                                                               • By-pass 2 source static switches

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            3x5 Why Analysis
Leg 1: Why did the nonconformity occur?
  Q1: Why did DMOS6 lose all exhaust?
  A1: Every VFD feeding exhaust fans shutdown on overvoltage.
  Q2: Why did every VFD feeding exhaust fans shutdown on overvoltage?
  A2: An over voltage condition was experienced on the entire ST electrical subsystem.
  Q3: Why did the entire ST electrical subsystem experience an over voltage condition?
  A3: A fault occurred on both sources, Substation S and Substation T.
  Q4: Why did a fault occur on both sources?
  A4: An MOV Board on Source 1 catastrophically failed (arced over affecting the Source 2 MOV Board).
  Q5: Why did the MOV Board on Source 1 catastrophically fail and affect the Source 2 MOV?
  A5: Insufficient design (board failure and arcing, location of MOVs, no encapsulation).
  Q6: Why did the static switch possess an insufficiently designed board?
  A6: There was no knowledge of a new design outlined in a technical bulletin from the manufacturer.
      (To prevent this condition the MOV's have been placed in a protective sand filled enclosure that
      contains any MOV arcing and prevents damaging fault current.)
  Q7: Why was there no knowledge of the service bulletin?
  A7: The original manufacturer was sold twice. During these multiple sales, the information was not
      properly communicated.
  Why Technical RC? A6. Insufficient designed board and system (board failure and arcing, location of
      MOVs, no encapsulation).
  Why Systemic RC? A7. The original manufacturer was sold twice. During these multiple sales, the
      recall information was not properly communicated




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            3x5 Why Analysis

Leg 2: Why did the nonconformity escape detection?
     Q1: Why did the catastrophic failure escape detection?
     A1: Our FMEA did not detect this type of failure.
     Q2: Why didn‟t our FMEA detect this type of failure?
     A2: Our FMEAs do not address detection of board component level
       catastrophic failures.
     Q3: Why do our FMEAs not address detection of board component level
       catastrophic failures?
     A3: This level of analysis would require in-depth knowledge of the
       components and their integration. There are also resource limitations.
     Why Technical RC? A2. Our FMEAs do not address detection of board
       component level catastrophic failures.
     Why Systemic RC? Our information indicates that the manufacturer did
       not detect the possibility of this failure mode. They only learned about it
       from field failure reports.



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    3x5 Why Analysis CAPA
•   Non-Conformance
     – Technical
            •   Repair ST3 & ST4 (Complete)
            •   Restore PowerLogic on Sub S & T (Apr 30)
            •   Repair ST2 (Complete)
            •   Reconfigure VFD‟s for auto-reset on OV (May 31)
            •   Replace North Campus MOV‟s w/ encapsulated version (~300 static switches) (Awaiting
                Management Approval)

     – Systemic
            • Engage WPL to require vendor communication of all technical bulletins to the
              appropriate TI Org Groups (Complete)
            • Develop short, intermediate, and long-term plans to eliminate failures due to Static
              Switches (Pending Approval)

•   Non-Detection
     – Technical
            • Incorporate catastrophic electronic board failures into revised FMEA (May 15 )
                                                                                          th




     – Systemic
            • Review Facilities FMEA program to investigate possibility of component level detection.
                (June 30)




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            3x5Why Example #2




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TI identified “silicon
pitting” defects on                                      Leg 1: Cause for Occurrence
incoming wafers



Nickel precipitates at the
surface of the wafers
caused silicon pits

                             Nickel diffused from the
                             backside of the wafer
                             and precipitated on the
                             frontside
                                                        Nickel contaminatin on the
                                                        backside of the wafer between
                                                        the LTO layer and silicon


                                                                                        LTO reactor was
                                                                                        contaminating the backside
                                                                                        of the wafer with nickel
                                                                                        before deposition
                                                                                                                     Backside of the wafer
                                                                                                                     came in contact with the
                                                                                                                     baffle



                                                                                                                                                Misalignment of the belt
                                                                                                                                                input roller combined with
                                                                                                                                                belt degredation caused
                                                                                                                                                the wafer to contact the
                                                                                                                                                baffle



                                       Metal contamination was caused by misalignment
                                       of belt input roller combined with belt degradation

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TI identified “silicon
pitting” defects on
incoming wafers
                                           Leg 2A: Cause for Escape / Non-detection

Did not reject wafers with nickel
pits




                               The control plan was inadequate to
                               detect Ni trapped between the LTO
                               and the wafer backside


                                                                    LTO metals were
                                                                    controlled using MCLT on
                                                                    a wafer w/o LTO depo
                                                                                               Test was designed
                                                                                               primarily to detect non-
                                                                                               removable contamination
                                                                                               on the front side of the   Other failure modes for
                                                                                               wafer (facing the belt)    metals contamination were
                                                                                                                          not considered




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TI identified “silicon
pitting” defects on                                 Leg 2B: Cause for Escape / Non-detection
incoming wafers



Material was released even
though there was an
abnormal condition detected
in final LLS inspection (high
yield loss for total area
                                DRB incorrectly decided
                                that existing screen at final
                                inspection (total area < 2
                                mm^2) was effective to sort
                                out affected wafers while
                                root cause investigation
                                was ongoing
                                                                Risk was considered low




                                                                                              DRB incorrectly concluded that
                                                                                              abnormal condition was most
                                                                                              likely related to particles
                                                                                                                               Root cause investigation was
                                                                                                                               incomplete when DRB was
                                                                                                                               held




                                          Problem escaped because failure mode was not
                                          considered in Control Plan and root cause
                                          investigation was incomplete when DRB was held
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            Questions /
            Comments


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AGENDA
TIME            PRESENTER                                                TOPIC

8:30 - 9:00                                                              Check-in
9:00 - 9:20     Bob Nees                                                 Opening
9:20 - 9:40     Bob Nees                                                 Priorities / Market update
9:40 - 10:00    Kyle Flessner                                            MAKE Update
10:00 - 10:20   Venu Menon                                               ATD Update
10:20 - 10:45   Andy Higgins                                             SC Quality Update
10:45 - 11:20   All                                                      Panel Q&A

11:30 - 12:45   Lunch and Networking

12:45 - 1:00    Mary Kay Vaughan                                         SEA Winners Address
1:00 - 1:30     Mike Mcfadden                                            Automotive Quality update
1:30 - 2:15     Andy Higgins                                             8D Training / Case Study
2:15 - 2:45     Troy Weber                                               Change Control
2:45 - 3:00     Bob Nees                                                 Wrap Up and Q&A
                                                                         Complete Survey/ Close
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                TI Supplier Quality Day
                     June 3, 2010




                      Troy L. Weber
        WPL Supplier Development Quality Manager


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                  Change Control…

•    What is it??
•    What difference does it make??
•    TI‟s customer & supplier expectations
•    What you can do for TI
•    For more information…




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            Change Control… What is it??




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   Change Control… What difference does it make??




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         BOM-Related Issues in MSA PCU Packages
                    Lessons Learned
•     Problem description: Excessive
      solvent added in xyz Die Attach
      by the supplier to adjust viscosity
      resulted in die attach delamination
      at wire bond.
•     Resolution: TI conducted many
      evaluations to narrow down
      diluent/solvent composition range
      spec. Supplier xyz agreed and
      implemented it to resolve this
      issue.

                               •        Lessons Learned:
                                         – Supplier Change Management
                                           (notification and validation)
                                         – Critical Properties Determination
                                         – Spec Definition/Engagement with Supplier
TI Information – Selective Disclosure
                         Problem Statement
PRISM 1.0um low oxide breakdown voltage (GOI) issue

What was impacted?
• 50 lots had GOI fails (~ 500 wafers scrapped)
• Between 1 and 23 wafers per lot were affected
• Five CBC10 lots (125 wafers) also had similar GOI failures.
•




     It is believed to have the same mechanism and root cause as Prism1.0
       even though the within wafer signature was different.



What was failing?
• Failing structures: HV NWell & HV PWell at a lower rate
• Failure mode: Oxide was breaking down 5 to 20V earlier than expected
• Failing sites (on 3 plug bars/wafer): Top, Flat or both, Never center
     CBC10 also had center site failures, and all fails were on PDC caps

                                                                             117
                     Problem Statement

What was physically wrong?
  • TEM images showed dislocation loops 500A below the surface
  • TOF-SIMS results showed 10X higher levels of Ni on Level 0 etchers using
    xyz electrodes
  • Dilute Nitric leach test also confirmed 10X higher levels of Ni on xyz electrodes



Where was the Ni coming from?
  • Some tools were using xyz electrodes
  • The supplier did not disclose a recent change in their electrode sealant process
    (From DIW to Nickel Acetate)
  • GOI failures decreased as the electrode life increased (~ 50% fail rate)




                                                                                        118
                     Actual Case Study
   Supplier XYZ changed end suppliers for a critical part,
   but did not inform TI. TI Wafer Fab Z had a quality
   excursion as a result of this shift, that finally resulted in
   Supplier XYZ losing the business at TI to a competitor.

   As a result, Supplier XYZ has put in place a rigorous
   change control process to ensure their customers are
   informed and changes are approved before supply chain
   implementation.

   In “growth” times like these, suppliers are looking for
   cheaper/faster end sources. It is critical that TI is well
   informed in advance when such changes are planned,
   so we can “GROW” together!


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                               Robotic Commuter Pod
                                                 (Popular Science May 2010)




                                                  Single Occupancy Cabin

                                                  Small Wheels

                                                  Panoramic Dome

                                                  Lightweight Body

                                                  Electric Drive

                                                  Self-Guidance System




TI Information – Selective Disclosure
Change Control… TI‟s customer & supplier expectations

   Excerpt of TI Automotive Customer Requirement…




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Change Control… TI‟s customer & supplier expectations




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      Change Control… What you can do for TI.

• Be aware of your own internal factory change
  proposals (change control boards, etc.) and
  inform TI;
• Be aware of proposed changes in your supply
  chain and inform TI;
• Partner with TI through the WPL Category
  Teams:
     – Communicate, Communicate, Communicate
       PROPOSED changes allowing adequate lead times
       for assessments and qualifications if required;
     – Work together (DOEs, FMEA, etc.) to assess the risk
       and determine the type of change (Major/Minor) and
       subsequent requirements.
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                                                                       TI Supplier Quality Expectations
   Defects
                                                                                     SFC                                                     Military
                                                            Defects

                                                                                                                                                  Car
          Robust Design -- Design for Test




                   Defects
                                                                                                   Continuous Improvement
                                                                      Response, Actions, Feedback,Defects                          Defects

                                                     Robust
Defects                                              Process
                                                       Defects
                                                                                                                         Outlier             Medical Device




                                                                          5S
                                                   Development
          Defects                    Defects
                               Defects



                                                                                  Defects
                                                  Defects
     Defects                                                                                                          Defects                 Hard Drive
                                             Defects



                                                     FMEA
 Defects                                                                                                        Talent                       MP3 Player
                                                  Control Plan
                                                      SPC                                                   Defects

                                                     Specs
                                                 Characterization
                                                                                                                                             Cell Phone


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                                                                                            Strictly Private” or similar placed
      Change Control… For more information…

• Become familiar with the
  following TI websites:
     – WPL External Website:
     http://wpl.ext.ti.com/default.htm
     – TI External Website - Quality
       System Manual:
     http://focus.ti.com/quality/docs/genc
       ontent.tsp?templateId=5909&navi
       gationId=11221&contentId=5022




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      Change Control… For more information…




       Please contact your WPL Supplier
       Manager for more details on your
           specific “change control”
                 requirements.

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                  Change Control…

•    What is it??
•    What difference does it make??
•    TI‟s customer & supplier expectations
•    What you can do for TI
•    For more information…




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AGENDA
TIME            PRESENTER                                                TOPIC

8:30 - 9:00                                                              Check-in
9:00 - 9:20     Bob Nees                                                 Opening
9:20 - 9:40     Bob Nees                                                 Priorities / Market update
9:40 - 10:00    Kyle Flessner                                            MAKE Update
10:00 - 10:20   Venu Menon                                               ATD Update
10:20 - 10:45   Andy Higgins                                             SC Quality Update
10:45 - 11:20   All                                                      Panel Q&A

11:30 - 12:45   Lunch and Networking

12:45 - 1:00    Mary Kay Vaughan                                         SEA Winners Address
1:00 - 1:30     Mike Mcfadden                                            Automotive Quality update
1:30 - 2:15     Andy Higgins                                             8D Training / Case Study
2:15 - 2:45     Troy Weber                                               Change Control
2:45 - 3:00     Bob Nees                                                 Wrap Up and Q&A
                                                                         Complete Survey/ Close
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            THANK YOU!!




6/14/2010   “TI Proprietary Information - Strictly Private” or similar placed here if applicable   130

								
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