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Plastic Packages for Integrated Circuits Wafer Level Chip Scale

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CSP (Chip Scale Package) package, chip-scale packaging means. CSP packages the latest generation of memory chip packaging technology, its technical performance has a new upgrade. CSP CSP package installed seal allows the chip area and packaging area ratio exceeds 1:1.14, very close to 1:1 has been the ideal situation, the absolute size is also only 32 square millimeters, about the ordinary BGA 1 / 3, only very TSOP memory chips in the area of ??1 / 6. Compared with the BGA package, under the CSP and the same space can be three times more storage capacity.

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									                                         Plastic Packages for Integrated Circuits

Wafer Level Chip Scale Package (WLCSP)                          W3x3.9B
                                                                3x3 ARRAY 9 BALL WAFER LEVEL CHIP SCALE PACKAGE
                                E                               (Intersil Standard)
                                                                    SYMBOL                MILLIMETERS                 NOTES
                                                                         A              0.54 Min, 0.65 Max              -
 PIN A1 ID AREA
                                             D                           A1                  0.24 ±0.03                 -
                                                                         A2                 0.355 ±0.03                 -
                                                                         b                   0.32 ±0.03                 -

                            TOP VIEW                                     bb                 θ 0.30 REF.                 -
                                                                         D                   1.45 ±0.05                 -
                                                                         D1                 1.00 BASIC                  -
                                        bb
                                                                         E                   1.45 ±0.05                 -
                                                                         E1                 1.00 BASIC                  -
                                                 A2
           A                                                             e                  0.50 BASIC                  -
                  A1                                                     SD                 0.00 BASIC                  -
                                                                         N                          9                   3
                                        b
                                                                                                                      Rev. 0 6/06
                            SIDE VIEW
                                                                NOTES:
                                                                1. Dimensions are in Millimeters.
                               E1
                                                                2. Dimensioning and tolerancing conform to ASME 14.5M-1994.
                                                                3. Symbol “N” is the actual number of solder balls.
                       C
                                                                4. Reference JEDEC MO-211-C, variation DD.
                       B                              SD D1

                       A

                           1    2   3            b

                           BOTTOM VIEW




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