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Plastic Packages for Integrated Circuits Wafer Level Chip Scale .._2_

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Plastic Packages for Integrated Circuits Wafer Level Chip Scale .._2_ Powered By Docstoc
					                                           Plastic Packages for Integrated Circuits

Wafer Level Chip Scale Package (WLCSP 0.4mm Ball Pitch)
                                                                  W3x4.12
                                   D                              3x4 ARRAY 12 BALL WAFER LEVEL CHIP SCALE PACKAGE
                                                                      SYMBOL                         MILLIMETERS
                                                                           A                0.445 Min 0.495 Nom 0.545 Max

                                                     E                     A1                         0.190 ±0.025
                                                                           A2                         0.305 ±0.025
                                                                           b                          0.270 ±0.030
    PIN 1 ID
                             TOP VIEW                                      D                          1.695 ±0.020
                                                                           D1                         0.400 BASIC
                                                                           E                          1.295 ±0.020
                                                                           E1                         0.400 BASIC
                                                                           e                          0.400 BASIC
                                                    A2                     SD                         0.200 BASIC
                                                              A
        A1                                                                 SE                             0 BASIC
                                                                                      NUMBER OF BUMPS: 12
                               b
                                                                                                                     Rev. 0 12/08
                            SIDE VIEW                             NOTES:
                                                                  1. All Dimensions are in Millimeters.


                        b

                                           SD
               e (E1)




                                                3

                                                2        SE

                                                1

                        D     C        B   A

                            e (D1)

                        BOTTOM VIEW




                                   1

				
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posted:7/7/2011
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Description: CSP (Chip Scale Package) package, chip-scale packaging means. CSP packages the latest generation of memory chip packaging technology, its technical performance has a new upgrade. CSP CSP package installed seal allows the chip area and packaging area ratio exceeds 1:1.14, very close to 1:1 has been the ideal situation, the absolute size is also only 32 square millimeters, about the ordinary BGA 1 / 3, only very TSOP memory chips in the area of ??1 / 6. Compared with the BGA package, under the CSP and the same space can be three times more storage capacity.