CSP (Chip Scale Package) package, chip-scale packaging means. CSP packages the latest generation of memory chip packaging technology, its technical performance has a new upgrade. CSP CSP package installed seal allows the chip area and packaging area ratio exceeds 1:1.14, very close to 1:1 has been the ideal situation, the absolute size is also only 32 square millimeters, about the ordinary BGA 1 / 3, only very TSOP memory chips in the area of ??1 / 6. Compared with the BGA package, under the CSP and the same space can be three times more storage capacity.
Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package (WLCSP 0.4mm Ball Pitch) W3x4.12 D 3x4 ARRAY 12 BALL WAFER LEVEL CHIP SCALE PACKAGE SYMBOL MILLIMETERS A 0.445 Min 0.495 Nom 0.545 Max E A1 0.190 ±0.025 A2 0.305 ±0.025 b 0.270 ±0.030 PIN 1 ID TOP VIEW D 1.695 ±0.020 D1 0.400 BASIC E 1.295 ±0.020 E1 0.400 BASIC e 0.400 BASIC A2 SD 0.200 BASIC A A1 SE 0 BASIC NUMBER OF BUMPS: 12 b Rev. 0 12/08 SIDE VIEW NOTES: 1. All Dimensions are in Millimeters. b SD e (E1) 3 2 SE 1 D C B A e (D1) BOTTOM VIEW 1
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