CSP (Chip Scale Package) package, chip-scale packaging means. CSP packages the latest generation of memory chip packaging technology, its technical performance has a new upgrade. CSP CSP package installed seal allows the chip area and packaging area ratio exceeds 1:1.14, very close to 1:1 has been the ideal situation, the absolute size is also only 32 square millimeters, about the ordinary BGA 1 / 3, only very TSOP memory chips in the area of ??1 / 6. Compared with the BGA package, under the CSP and the same space can be three times more storage capacity.
Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package (WLCSP) W6x6.36 E 6x6 ARRAY 36 BALL WAFER LEVEL CHIP SCALE PACKAGE SYMBOL MILLIMETERS A 0.44 Min, 0.495 Nom, 0.55 Max A1 0.190 ±0.030 A2 0.305 ±0.025 PIN 1 ID D b 0.270 ±0.030 D 2.530 ±0.020 D1 2.000 BASIC E 2.530 ±0.020 E1 2.000 BASIC e 0.400 BASIC TOP VIEW SD 0.200 BASIC SE 0.200 BASIC Number of Bumps: 36 Rev. 0 6/08 NOTES: 1. Dimensions are in millimeters. A A2 A1 b SIDE VIEW E1 SE e SD D1 b BOTTOM VIEW 1
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