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Plastic Packages for Integrated Circuits Wafer Level Chip Scale .._1_

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CSP (Chip Scale Package) package, chip-scale packaging means. CSP packages the latest generation of memory chip packaging technology, its technical performance has a new upgrade. CSP CSP package installed seal allows the chip area and packaging area ratio exceeds 1:1.14, very close to 1:1 has been the ideal situation, the absolute size is also only 32 square millimeters, about the ordinary BGA 1 / 3, only very TSOP memory chips in the area of ??1 / 6. Compared with the BGA package, under the CSP and the same space can be three times more storage capacity.

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									                                  Plastic Packages for Integrated Circuits

Wafer Level Chip Scale Package (WLCSP)                   W6x6.36
                          E                              6x6 ARRAY 36 BALL WAFER LEVEL CHIP SCALE PACKAGE
                                                                  SYMBOL                       MILLIMETERS
                                                                     A                  0.44 Min, 0.495 Nom, 0.55 Max
                                                                    A1                          0.190 ±0.030
                                                                    A2                          0.305 ±0.025
 PIN 1 ID
                                          D                          b                          0.270 ±0.030
                                                                     D                          2.530 ±0.020
                                                                    D1                          2.000 BASIC
                                                                     E                          2.530 ±0.020
                                                                    E1                          2.000 BASIC
                                                                     e                          0.400 BASIC
                      TOP VIEW                                      SD                          0.200 BASIC
                                                                    SE                          0.200 BASIC
                                                                              Number of Bumps: 36
                                                                                                               Rev. 0 6/08
                                                         NOTES:
                                                         1. Dimensions are in millimeters.

    A

                                                   A2
            A1
                                   b

                      SIDE VIEW




                         E1


                 SE
                                   e




                                              SD

                                                   D1




                                          b
                  BOTTOM VIEW




                          1

								
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