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Low-Temperature_ Hermetic_ High-Yield Wafer-Level Packaging Technology

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Package can also be said that the semiconductor integrated circuit chip with the installation of the shell, which not only plays placed, fixed, sealed, protecting the chip and enhanced the role of thermal conductivity, but also inside the chip to communicate with the outside world, a bridge circuit - chip Contacts with a wire connected to the package shell pins, these pins and wires through the printed circuit board to establish a connection with other devices. Thus, for many IC products, the packaging technology are very crucial aspect.

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