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					                                                                                CPSC 483
                                                                                Power PC


Date: 25 October 2000
To:    Rabi Mahapatra
From: Ian Remmler
       Kyle Brady
       Ray Harlan
       Rebecca Hansen
Subject: Progress of the PowerPC embedded system team




Abstract
The purpose of this paper is to present our project; the implementation and design of a
general-purpose embedded system based around the IBM 403GCX Processor. Our
implementation of the system will include a serial port interface, TCP/IP protocols to
enable networking, and Linux will be installed as the operating system. The objective
will be met by simultaneously building the circuit in Protel and on a breadboard using
actual components. This method will allow us to ensure that the design sent to
fabrication meets the design objectives. The end result of this project will be an outline
of preliminary laboratory exercises to be completed by future Embedded Design students.


Introduction
This project originated in Florida as a class project. Our objective is to use these existing
labs, oriented toward the cold-fire processor, to design labs for future classes using the
IBM PowerPC processor. Most of the research completed at this time has been for
background information on the components selected for use. Several Protel tutorials
have also been downloaded and studied.
Individual Achievements
In the use of Protel the team started with a simple tutorial and advanced to individual
component design:
       -Ian Remmler has begun designing the footprints, necessary for fabrication, for
       components not already in Protel’s libraries and determined how to produce the
       PCB layout to give to the fabrication shop. Also, he has started researching
       various embedded Linux projects to be modified for our board.
       -Kyle Brady designed several components for future board layout; he has also
       researched components for their technical specifications.
       -Ray Harlan did a lot of initial research for components. Currently he is the
       liaison with Jeff Webb, the teaching assistant for the Florida team who have
       completed similar projects. He also designed and wrote Lab1 and Lab2.
       -Rebecca Hansen also created several components needed for the final design
       along with researching components to add to Protel’s library and general research
       for components compatible with the PowerPC.


Design Process
In designing the various subsystems for our project, we have researched each component
in order to find out how it worked and its pin settings. This was mainly done by
searching the manufacturers’ web sites for the technical specifications documents for
each component.


After obtaining this information, we designed the component and its subsystem in Protel,
including connections to the buses and other subsystems. Once this was complete, we
designed the footprint for the component in order to place it on the PCB.


Now that we have received our physical components, we plan to begin assembly of the
subsystems on breadboards in order to verify that they will all work correctly as
designed. Once the subsystems have all been tested, we will test our overall design to
ensure that it will work correctly before we send the PCB to be fabricated.
Modifications
The only major modification we made to the design was the removal of the ISA interface
that was on the edge of the card. We may still need to use the bus itself to run our one-
chip networking solution, but our board will not be able to be used as an ISA device, as
were the projects in Florida.


Completed Research
All components necessary for the project have been researched and the ones compatible
with the 403GCX ordered. Protel was thoroughly researched to determine available
functions and capabilities. The reset, under-voltage, clock divider, CPU, power
regulator, and critical interrupt circuits have been designed and implemented in Protel.


Impediments
In working on our project, we did come across a few stumbling blocks. First of all, the
Protel design package was not as easy to use as we first thought it would be, and the
documentation that came with it was inadequate. We eventually found a tutorial on the
web that helped somewhat, but we still had some trouble. We solved this problem by
contacting Jeff Webb, the TA from a previous project group. He was able to tell us what
we needed to know in order to design our schematics and PCB layout in Protel. The
other major stumbling block that we have come across is lack of technical documents for
our parts. Without these, we did not know the pinouts of the chips or their packages, and
could not implement them in Protel. After many hours of searching, we have found the
documentation for most of our parts, but there are still a few that we have not found.


Our progress during this process has been slower than we anticipated, mainly due to the
delays with Protel. We have also not begun to physically connect the components on the
breadboard because until very recently, we did not have the physical components.
Remaining Research
Research still needs to be conducted for a few components because they have not yet
been found. The research is needed to determine the pinouts of the components so the
footprints can be designed and the components can be added to the Protel circuit. If the
component specifications can not be found an alternate must be found.


Conclusion
As previously stated, the only change was the removal of the ISA interface. There have
been several roadblocks, including lack of technical support on researching components
and lack of adequate documentation on Protel. The team has not closely followed the
time-line of the schedule. The schedule has been followed as far as sequence due to the
linear nature of the project. Any delays are due to the previous reasons.


The team has been working well together; the only problems are schedule conflicts, as
each member has obligations outside of lab hours.
References
AMD website – components reference, http://www.amd.com

AMP website – components reference, http://www.amp.com

PROTEL website – PROTEL package reference, http://www.protel.com

Lab manuals for creation of a similar system utilizing a coldfire processor by Michael
Lynch

http://www.mot.com/SPS/PowerPC/library/ppc_faq/ppc_faq.html – PowerPC
information

IBM website - components reference and processor specifications, http://www.ibm.com

Jeff Webb, mustang@ufl.edu

Fairchild Semiconductor, 74AC74 Dual D-Type Positive Edge-Triggered Flip-Flop, 1999
http://www.fairchildsemi.com/ds/74/74AC74.pdf

AMP, AMP Micro-edge connector Type C-178097, http://www.amp.com

Motorola Semiconductor Data, MC54/74HC245A, Octal 3-state non-inverting Bus
Transceiver http://www.motorola.com, 1997

Epson America, Epson America CMOS/TTL Oscillators, http://www.digikey.com

Motorola, Motorola 34064 Undervoltage Sensing Circuit, 1996

IBM, IBM PowerPC 403GCX embedded RISC Controller, 1999
http://www.chips.ibm.com/products/powerpc/chips/gcx_pb.pdf

IBM, IBM PowerPC 403GCX Controller User's Manual, 1999
http://www.chips.ibm.com/products/powerpc/chips/gcx_um.pdf

				
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