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					February 24, 2005                                                                      CN 022405

                                Customer Notification
Assembly Subcontractor Change for QFP and PLCC Packaged Devices
Dear Valued Customer:

This notification is for the purpose of informing you of a change by Mindspeed Technologies in the
packages used for the following devices:

                           Device                  Package
                           28370-22                80 Pin PQFP
                           28370-23                80 Pin PQFP
                           28375-23                80 Pin PQFP
                           28376-23                80 Pin PQFP
                           CX28392-25              128 Pin LQFP
                           CX28394-25              128 Pin LQFP
                           CX28342-11              144 Pin eLQFP
                           CX28343-11              144 Pin eLQFP
                           CX28344-11              144 Pin eLQFP
                           28954-13                68 Pin PLCC
                           R6786-24                100 Pin PQFP Monopac

This notification identifies a change with our assembly manufacturing subcontractor for these products
and the resulting differences with the assembled package due to this change. Details of this change are
described below.
Purpose
To transfer the assembly of the products utilizing the plastic QFP and PLCC packages, including the 80
pin PQFP, 100 pin PQFP, 128 pin LQFP, 144 pin eLQFP, and the 68 pin PLCC from the Skyworks facility
in Mexico to the Amkor facility in Philippines and Korea respectively. This is due to the Skyworks’ closure
of the QFP and PLCC assembly operation. The QFP and PLCC packages from both sites comply with
JEDEC reference outlines MS-022, MS-026, MS-016. Package materials and dimensions are described
in the tables below:

80 pin PQFP

                                         Old                      New
                    Assembly SubCon      Skyworks, Mexico         Amkor, Philippines
                    Mold Compound        Sumitomo 6650E           Nitto MP8000CH4
                    Die Attach           Ablestik 8361J           Ablestik 8361J
                    Lead Frame           Cu 194                   Cu 194
                    Lead Coating         85/15 Sn/Pb              85/15 Sn/Pb
                    Wire                 1.25 mil Au              1.0 mil Au
                    Marking              Ink                      Ink




28XXX-PCN-002-A                                                                                 Page 1 of 4
February 24, 2005                                                             CN 022405

                                Customer Notification
Assembly Subcontractor Change for QFP and PLCC Packaged Devices
100 pin PQFP Monopac

                                      Old                New
                    Assembly SubCon   Skyworks, Mexico   Amkor, Philippines
                    Mold Compound     Sumitomo 6650E     MP8000CH4
                    Die Attach        Ablestik 8361J     Ablestik 8361J
                    Lead Frame        Cu 194             Cu 194
                    Lead Coating      85/15 Sn/Pb        85/15 Sn/Pb
                    Wire              1.25 mil Au        1.0 mil Au
                    Marking           Ink                Ink


128 pin LQFP

                                      Old                New
                    Assembly SubCon   Skyworks, Mexico   Amkor, Korea
                    Mold Compound     Sumitomo 7351LS    Sumitomo 7320CR
                    Die Attach        CRM-M0209          Ablestik 84-1 LMISR4
                    Lead Frame        Cu 194             Cu 194
                    Lead Coating      85/15 Sn/Pb        85/15 Sn/Pb
                    Wire              1.25 mil Au        1.0 mil Au
                    Marking           Ink                Ink


144 pin eLQFP

                                      Old                New
                Assembly SubCon       Skyworks, Mexico   Amkor, Korea
                Mold Compound         Sumitomo 7351LS    Sumitomo EME-G700L
                Die Attach            CRM-M0209          Ablestik 3230
                Lead Frame            Cu 194             Cu 194
                Lead Coating          85/15 Sn/Pb        85/15 Sn/Pb
                Wire                  1.25 mil Au        1.0 mil Au
                Marking               Ink                Ink


68 pin PLCC

                                      Old                New
                Assembly SubCon       Skyworks, Mexico   Amkor, Philippines
                Mold Compound         Sumitomo 6650E     Nitto MP8000CH4
                Die Attach            Ablestik 8361J     Ablestik 8361J
                Lead Frame            Cu 194             Cu 194
                Lead Coating          85/15 Sn/Pb        85/15 Sn/Pb
                Wire                  1.25 mil Au        1.0 mil Au
                Marking               Ink                Ink


28XXX-PCN-002-A                                                                       Page 2 of 4
February 24, 2005                                                                    CN 022405

                                Customer Notification
Assembly Subcontractor Change for QFP and PLCC Packaged Devices


Change Schedule
Customers should expect to receive these devices manufactured by Amkor beginning on July 1, 2005.

Method to identify parts
The assembly location codes marked on the part will change from Mexico to Philippines or Korea. All
products marked with date codes 0527 or greater are manufactured by Amkor.


Customer Impact
No customer impact is anticipated with this change. The moisture sensitivity remains at level 3.
All of the performance characteristics of the devices packaged using the new subcontractor meet the
same specification as the devices packaged utilizing the original subcontractor. The qualification results
for this change are available upon request.
We are confident this change will allow Mindspeed Technologies to maintain its high standards for quality
and reliability. We will be managing this change very closely to ensure minimum disruption to our
customers. If, at any time, you have a need for further information, please contact your local Sales
Representative.




28XXX-PCN-002-A                                                                                    Page 3 of 4
February 24, 2005                                                                         CN 022405

                                    Customer Notification
 Assembly Subcontractor Change for QFP and PLCC Packaged Devices
         The indicated Customer Notification letter was received and acknowledged by the undersigned

         authority.


Name:
                Signature                                     Print

Company:
                Name                                          Location

Title:

Date:

Comments/additional requests:




         Thank you for your attention on this matter.

         Please return the acknowledgment form to the attention of Dan McCarville MINDSPEED
         Technologies Inc., 4000 MacArthur Blvd, Newport Beach, Ca, 92660; FAX (949)579-3050.




28XXX-PCN-002-A                                                                                        Page 4 of 4

				
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