Film Production Company Organization Chart by bti54815

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									Company Profile

1.    Company Status
2.    Products and Services
3.    Significant Achievements
4.    Organization Chart
5.    Total Quality
6.    Total Satisfaction
7.    Major Customers
8.    Trend of Equipment Investment
9.    Major Production Equipment
10.   Available Technologies & Processes
11.   Major Strengths
12.   R&D Partner - ITRI & CSIST
13.   Technical Service Partner - CMC
14.   Market Sales by Region
15.   Our Focus
16.   Major Objectives for 2010
17.   Target Market Segments
18.   Twin Plants Strategy

                       Taiwan Sector

                                        TAIPEI FACTORY

                     Chung Li Sector

                                       CHUNG-LI FACTORY

Philippines Sector

                                       PHILIPPINE FACTORY
                                1. Company Status

              Taipei Plant                Chung-Li Plant            Philippine Plant
Address       55 Lane 365, Yingtao Rd.,   8F,No. 27, Ji-Lin Rd.,    116 Excellence Avenue,
              Yingko, Taipei Hsien, 239   Chung-Li Industry Park,   corner Competence
              Taiwan                      Tao-Yuan Hsien, 320       Drive, Carmelray
                                          Taiwan                    Industrial Park 1,
                                                                    Canlubang, Calamba City,
                                                                    Laguna, Philippines
Established   August 1975                                           September 1994

Area          Land: 138,000 sq. ft.                                 Land: 405,700 sq. ft.

              Bldg:   89,064 sq. ft.      Bldg: 58,982 sq. ft       Bldg: 266,866 sq. ft.

Employees     653                         230                       1058

Tel:          886-2-2679-0122             886-3-433-5998            63-49-549-2952

Fax:          886-2-2670-0122             886-3-433-5995            63-49-549-2940

Web Site:                               

            2. Products and Services

    Contract Manufacturing for Microelectronic Packaging and
        Ceramic Thick Film/Thin Film Substrate Fabrication.

•   RF Modules for Cellular Handsets, WLAN, and WiMax
•   SiP Packaging for WLAN, UWB, and PAN
•   MEMS Packaging
•   CMOS Image Sensor Packaging
•   Reconstruction Wafer
•   Chip Probing and Final Test
•   PCB assembly with SMT and/or COB Processes
•   Automotive and Military Hybrids
•   Thin Film on Alumina and AlN
•   Thick Film on Alumina
           3. Significant Achievements

1974 Tong Hsing Established
1976 Started Production of Alumina Ceramic Substrates
1977 Started Production of Thick Film Print and Fire
1979 Started Production of Hybrid Modules
1986 Shipped 500K Modules of Electronic Fuse for U.S. Military
1989 Received IECQ Manufacturer Approval
1993 Started Large Scale Production of Thick Film Copper Process
1993 Received ISO-9002 Certification
1994 Established Tong Hsing Electronics (Philippines) Inc.
1995 Started Production of Photo-Sensitive Thick Film Circuits
1996 Established CIM System to Track the WIP through LAN
1997 Started Mass Production of CDMA Power Amplifier Modules
1998 Received QS-9000/ISO-9001 Certification
1999 Started Mass Production of GSM Power Amplifier Modules
2001 Started Production of Thin Film DPC Substrate Fabrication
2002 Received ISO14000 Certification
2006  Received TS16949 and OHSAS 18001 Certification
2007  IPO at Taiwan Stock Exchange on Nov.15th
2008  Won the “Excellent Enterprise Innovation Award” from MOEA (Ministry of Economic
2009 Received AS9100 Certification
  4. Organization Chart
     - Tong Hsing Electronic Ind., Ltd.

                                          Chairman & CEO
                                            Jay Yang

                                            Henry Liu

                                                                 Mark Lee

Vice President
Vice President       Vice President
                     Vice President          Vice President
                                             Vice President         Vice President
                                                                     Vice President       Vice President
                                                                                          Vice President
    Finance      Marketing & Innovation
                 Marketing & Innovation    Operations of THEIL
                                           Operations of THEIL    Operations of THECL
                                                                  Operations of THECL   Operations of THEPI
                                                                                        Operations of THEPI
   Kevin Lai
   Kevin Lai            Heinz Ru
                        Heinz Ru               Mike Chiu
                                                Mike Chiu              SY Huang
                                                                       SY Huang             Jenson Lin
                                                                                            Jenson Lin
          4.1 Organization Chart
              - Taiwan Operations

                                                            Vice President
                                                             Michael Chiu

                R&D        Manufacturing         QA/QC        Material Control    Purchasing   Administration          IT

                                     Substrate                                                              HRD             Hardware
Substrate Pkg          RF Pkg                               QC               MC

                                    Assembling                                                            Facilities        Software
    ADE               Hybrid Pkg                            QA           Outsourcing
                                     & Testing

                                                         Document                                           OHS
     4.2 Organization Chart
         - Marketing & Innovation

                                            Vice President
                                               Heinz Ru

                                                CSS & PC                Sales

  Market                   Customer
                                        THETP                 THECL
Development               Development

                                        CSS & PC             CSS & PC

4.3 Organization Chart
    - ChungLi Operations

                                Vice President
                                  SY Huang

                                             Quality Reliability
  Manufacture         Engineering                                    Logistics

                        Chip Probing
    Chip Probing                                  Quality Control    Bond & I/Export

  Restructure Wafer   Restructure Wafer          Quality Assurance    Administration

       Facility                                                        Warehouse
             4.4 Organization Chart
                 - Philippine Operations
                                                   Vice President
                                                     Jenson Lin

                                        MIS                           VP’s Office
                                   Dept Manager                   Executive Secretary

Accounting      Administration       HR              Operations          Quality Mngt.            PPIC             Advanced Engg

                                   HR Employment
     Payroll         Purchasing                        Prod Sec. Mgr      Quality Control     Prod. Sec. S. Head     Project Dev’t
                                    & Learning

    General                        HR Relations        Equipment                                                         New
                       Traffic                                             Material Dev’t     Inventory Control
   Accounting                       & Welfare          Engineering                                                   Technologies

     Cost                                                                  Document Control                              New
                      Facilities                      A&TE Sec. Mgr.           Center
   Accounting                                                                                                        Technologies

                                                       Process Dev’t
   Services                                                                Quality Eng’g

                                                        Process              Calibration

                                                          Test               NPI/SAP
                                                       Engineering          WIP Control
                  4.5. Employees

        Administration                        26%

      QA                                        Substrate
      21%                                      Fabrication

                             Total : 1941
                (THEIL: 653, THECL: 230, THEPI:1058)
      4.6. Engineers by Function




                     Total :164
        (THEIL : 95, THECL: 37, THEPI : 32 )
            5. Total Quality


Excellence in Quality is at the Forefront
of all our activities. At Tong Hsing
there is no Compromise of Quality.

                                       Chairman and CEO
      6. Total Satisfaction

To be your Preferred Manufacturing Partner.
We will provide our Best Quality,
Delivery and Service to Accomplish
your 100% Satisfaction.

                                  Chairman and CEO
                          7. Major Customers

                           •   AEI
                           •   Advanced Bionics
                           •   Anadigics
                           •   DDC
                           •   Delphi
                           •   National Semiconductor
                           •   Sensata
                           •   SiGe
                           •   Skyworks
                           •   TI

We look forward to our continuing expansion and development to better serve our customers.
            8. Trend of Equipment Investment
                           Comparison 1999 through 2009
                                                                                                      Millions US$










     1999    2000      2001        2002     2003        2004     2005          2006     2007          2008   2009

                    1999    2000   2001   2002   2003   2004   2005     2006    2007   2008    2009
            9. Major Production Equipment

Substrate Fabrication        Assembly                        Reconstruction Wafer
Laser Machining         11   SMD Pick & Place           24   Taping                       1
Printer                 14   Reflow Furnace              8   Detaping                     1
Thick Film Furnace      10   Solvent Cleaner            20   Wafer Mounter                1
YAG Laser                5   Printer                    36   Wafer Grinder                2
Sputter System           4   Die Bonder                 58   Dicing Saw                   1
Mask Aligner/Exposure   15   Wire Bonder               123   Sorter                       1
Developer                2   Flip Chip Bonder(GGI/C4     4
Plating Lines--Cu        6   Plasma Cleaner             19
Plating Lines--Ni/Au     4   Transfer Molder             8   Testing
                             Laser /Stamping
E'less--Cu/Ni/Au         2                               6   FT Handler                   8
Strip & Etch             2   Dispenser                  10   Prober                       2
Surface Measurement      4   Dicing Saw                 35   Tester                       1
AOI                      6   AOI                         2
Flying Probe System      3   Taping                      1
Grinding/Lapping         7   Detaping                    1
Back Grinding            2   Wafer Mounter               2
Laser Marker(Ceramic)    5   Wafer UV Oven               2

                                                                          Updated Dec. 2009
    10. Available Technologies & Processes

Assembly Technologies     * SMT
                          * Chip & Wire
                          * Heavy Aluminum Wire
                          * Automatic Solder Die Attach

Packaging Technologies    * CSP, LGA and MCM BGA                        * Metal Lid
                          * Hermetic Metal Can Packages                 * Liquid Encapsulation
                          * Ceramic Lid                                 * Overmold
                          * Plastic Lid                                 * Glass Lid

Substrate Technologies    * Thick Film
                          * Thin Film
                          * Double Side Circuitry with Through Holes

Laser Mfg. Technologies   * Precision Substrate Scribing & Drilling
                          * Resistor Trimming(<=0.1%), Active Functional Trimming
                          *2D Barcode on Ceramic

Reconstuction Wafer       *Wafer Grinding                               *Sawing
                          *AVI                                          *Sorting

Testing                   * Final Test
                          * Chip Probing
                  11. Major Strengths

•   Flexibility
•   Technical Innovation
•   Continuous Improvement & Growth
•   Excellent High Volume Production Capacity
•   Superior Supporting Infrastructure in Northern Taiwan
•   Abundant Supply of Human Resources for
    Semiconductor Packaging in the Philippines
•   Superb Customer Satisfaction
•   Strong R & D Partners
                       12. R&D Partners
                        (ITRI & CSIST)

             The Industrial Technology Research Institute (ITRI)
        The Chung Shan Institute of Science and Technology (CSIST)

•   ITRI: a national research organization that serves to strengthen the
    technological competitiveness of Taiwan.
    –      Field of Services: Communication and Optoelectronics, Precision Machinery
           and MEMS, Materials and Chemical Engineering, Biomedical Technology,
           Sustainable Development, and Nanotechnology.

•   CSIST: a research institute for national Defense, serves to integrate all the
    local industries in Taiwan , especially Information & communication
            13. Technical Service Partner

                                CMC Laboratories, Inc.

• Core expertise: material science on interconnect applications including all
  aspects of packaging and assembly.
• Services:
     –   Failure analysis
     –   Destructive physical analysis
     –   Electrical characterization
     –   Thermal characterization
     –   Process development support to engineering
     –   Yield enhancement support to manufacturing
     –   Customized reliability testing
     –   Technical market analysis on electronic packaging industry
               14. Market Sales by Region

 Europe: 32%                                Asia: 2%

N. America:                                    Taiwan: 2%
   15. Our Focus

• Customer Satisfaction

• Quality

• Turnaround/Delivery Time

• Productivity
 16. Major Objectives for 2010

• Become the leading foundry service provider of RF Modules, SiP and
  MEMS packaging in Asia Pacific
• Continue the expansion of the Production Scale of Metalized
  Ceramic Substrates used in High Brightness LED’S and Solar Cell
• Ramp up the Production of Ultra High Brightness LED used in
• Expanding the business in Military and Commercial Aircraft industry
• Ramp up the Production of Medical Electronic Circuits
• Establish strategic partnership with RF testing house to provide
  Turn-key solution for RF Modules
• Continue to drive the cost down in RF Modules by introducing high
  volume production techniques with Lead Frame and IPD
• Continue the expansion of the production scale of Image Sensor
  backend services
  17. Target Market Segments

• RF Modules, PA and Front-End Modules for Handsets and
• Special Packaging for MEMS devices.
• SiP for PAN, WLAN and GPS.
• Image Sensor.
• Modules for the Automotive Electronic Industry.
• Ultra High Power LED Packaging.
• Medical Electronics.
• Military Electronics
• Electronics for Commercial Aircraft
• Thin Film (DPC) Metalized Ceramic Substrates for High
  Brightness LED, Solar Cell and Hybrid Electrical Vehicle.
• DBC for Power Electronics
               18. Twin Plant Strategy

                   •   Risk Management
                   •   Flexibility
                   •   Exact Copy
                   •   One Window/One Price

Products are produced in two plants with identical
materials, processes, equipment, and control procedures
after processes are developed in Taiwan.

   This “dual source” provides advantages for better risk management,
    flexibility, consistency, and quality to cope with a dynamic market

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