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RadHard ASIC Products RadHard Mixed-Signal ASICs Datasheet July 2007 INTRODUCTION SEU-immune to less than 1.0E-12 errors/bits-day available using special library cells Aeroflex Colorado Springs’ RadHard Mixed-Signal ASICs combine high-density, high-speed digital logic with analog and Variety of standard ceramic flat-pack and column grid array mixed-signal functions on the same monolithic die. Leveraging packages, or full custom package design available, including from our commercial mixed-signal design library, our radiation Plug & SenseSM modules with sensor integrated into hardening technology, and the capabilities of our QML approved package foundry partners, Aeroflex can meet the most complex mixed- signal requirements. External chip capacitor attachment option available to space quality levels (for improved SSO response) Aeroflex provides full turn-key mixed-signal design, including specification development. Our tools and libraries allow us to Level 1 - Turnkey Design: In cooperation with the customer, efficiently design ASICs to high-reliability specifications. Our we develop an ASIC specification from a system specification, flow allows you the flexibility to choose how best to complete and perform all detailed design (analog schematics, digital your ASIC project. netlist). We assemble a design and development team that includes analog and digital circuit designers, layout engineers, Table 1 lists the RadHard Mixed-Signal technologies and test and product engineers, as well as Manufacturing, Reliability attributes available. Figure 1 describes the design flow. and QA resources to create a device that meets your specifications. We can also translate your obsolete parts into one of our existing RadHard technologies. Aeroflex chooses a Wide range of mixed-signal technologies and attributes capable process technology in one of our QML-Q and QML-V available: 0.6μm, 0.35μm, 0.25μm, and 0.18μm silicon gate approved wafer foundry fabrication facilities and complete the CMOS assembly, screening, test and qualification processes in our QML-V qualified on-site facility. Up to ~10,000,000 usable equivalent gates (0.18μm) Toggle rates up to ~2GHz Level 2 - Specification & Netlist Handoff: Aeroflex integrates customers' digital netlist with Aeroflex analog/mixed-signal Operating voltage of 10V (0.35μm), 5V and/or 3.3V cells to create a design that meets the specification using the (0.35μm and 0.18μm) customer's netlist. 5-volt compliant I/O buffers in all technologies Level 3 - Co-designed Products: Aeroflex performs layout and Supports cold sparing for power down applications physical design of customer’s analog schematic and digital netlist, including place and route, back-annotation, and timing Analog IP cores (ADC’s, DAC’s, PWM’s, comparators, Op- closure. Full-chip, mixed-mode simulations performed, amps, voltage regulators, Analog Muxes, PLL, RC oscilla- including Safe Operating Area (SOA) analyses. SEE consulting tors/VCO’s, POR and others) and/or full-custom analog available during design phase. Aeroflex performs all design design with custom digital filters for signal processing integrity checks including analysis and verification of DRC, LVS, then manufactures the device, performing electrical test, Full complement of digital IP cores including microcontrol- environmental screens, and qualification. (NOTE: Execution of lers, microprocessors, interface controllers, memory three-way NDA’s with foundry/and or third-party IP providers controllers may be required. Execution of license agreement to obtain access to Aeroflex proprietary RadHard models required. Configurable RAM compilers Multiple product assurance levels available, QML Q and V, military, medical, industrial Radiation hardened from 100 krads(Si) to 1Megarad total dose available using Aeroflex Colorado Springs RadHard technology 1 TECHNOLOGY 90nm CMOS 130nm CMOS 180nm CMOS 0.25μm CMOS 0.35μm CMOS 0.6μm CMOS PARAMETERS Metal Layers 6-9 Cu 6-8 Al/Cu 5-6 Al/Cu 4-5Al/Cu 3-4 Al/Cu 3Al/Cu Capacitors MiM Mim MiM Mim MiM/PiP PiP High-value resistors No Yes Yes Yes Yes Yes Vertical NPN bipolar No No Yes Yes Yes Yes Substrate PNP bipolar Yes Yes Yes Yes Yes Yes HV CMOS support No No 5V (self-aligned) Yes 10V (self-aligned) 20V (ext drain) Thick metal inductor No Yes Yes No Yes No Digital/analog supply volt- 3.3, 2.5, 1.8, 1.2, 3.3, 2.5, 1.8, 1.5, 5.0, 3.3, 1.8 3.3, 2.5 10.0, 5.0, 3.3 5.0, 3.3, 2.5 ages (DVdd, AVdd; Vss=0 1.0 1.2 Alternate analog supply +2.5, +1.65, +0.9 +5, +2,5, +1.65 voltages (AVdd/AVss) Maximum toggle frequency 33GHz 5GHz 2.4GHz 1GHz 375MHz 215MHz Power dissipation - nW/ 7 10 20 40 150 320 gate - MHz; 20% duty cycle Gate delay 25oC (ps) 6 20 50 65 140 225 Usable gates (NAND2 15-20M 10-15M 8M 3M 1.5M 500K equivalent) Typical signal I/O ~1024 ~1024 ~1024 ~512 ~425 ~400 Flip-chip I/O available Yes No Yes No No No Cold sparing Yes Yes Yes Yes Yes Yes Full 5V compliance No No Yes No Yes Yes Cold sparing/5V tolerance Yes Yes Yes Yes Yes Yes Example analog IP (full Band-gap, Volt. reg. Band-gap, Volt, reg. Band-gap, Volt. reg. Band-gap, Volt. reg. custom analog available) Comp/op-amps, Comp/op-amps, Comp/op-amps, ADCs, DACs ADCs ADCs, DACs DACs PLL PLL PLL, VCO PLL PLL, VCO PLL/DLL RC oscillator SRAM compiled Yes Yes Yes Yes Yes No Non-volatile memory Flash* EEPROM* Flash* EEPROM* RadHard OTP RadHard OTP Metal Fuse** Metal Fuse** Special I/O SSTL, MGT, SSTL, MGT, SSTL, MGT, SSTL, MGT, SSTL, MGT, SSTL, MGT, CML, LVDS, CML, LVDS, CML, LVDS, CML, LVDS, CML, LVDS, CML, LVDS, PCI, PLL PCI PCI, USB1.1 PCI PCI, RS232/ PCI RS485 (+5V), USB1.1 Total Ionizing dose Rads(Si) 100-300K 100-300K 100-300K 100K-1Meg 100-300K 100-300K SEL (MeV-cm2/mg) @Vdd >100 >110 >110 >110 >110 >128 max and 125oC Reliability (FIT rate) <50 <20 <10 <10 <10 <5 Wafer foundry quality level ISO-9001 QML-Q&V QML-Q&V QML-Q&V QML-Q&V QML-Q&V Trusted foundry level ITAR/CCI ITAR/CCI N/A Classified N/A ITAR planned planned * Limited total-ionizing dose environments. Floating Gate Memories such as Flash and EEPROM must be periodically re-written in a total ionizing dose environment for reliability. ** QML-V Qualification 1Q2008 2 Customer Requirements Database Initial Design Review Chip Specification/ Block Diagram/ Preliminary Design Review Digital Digital Design Analog Design Analog Library Library Full Chip Design and Library Physical Layout Test Test Layout Physical Verification GDSII Developmen Database CDR Critical Design CDR Package/ Simulation Results/Physical Mask Generation Wafer Fabrication Production Test Packaging Prototype Characterization Figure 1. RadHard Mixed- Proof of Design/Production Signal Design Flow 3 COLORADO INTERNATIONAL NORTHEAST Toll Free: 800-645-8862 Tel: 805-778-9229 Tel: 603-888-3975 Fax: 719-594-8468 Fax: 805-778-1980 Fax: 603-888-4585 SE AND MID-ATLANTIC WEST COAST CENTRAL Tel: 321-951-4164 Tel: 949-362-2260 Tel: 719-594-8017 Fax: 321-951-4254 Fax: 949-362-2266 Fax: 719-594-8468 www.aeroflex.com firstname.lastname@example.org Aeroflex Colorado Springs, Inc., reserves the right to make changes to any products and services herein at any time without notice. Consult Aeroflex or an authorized sales representative to verify that the information in this data sheet is current before using this product. Aeroflex does not assume any responsibility or liability arising out of the application or use of any product or service described herein, except as expressly agreed to in writing by Aeroflex; nor does the purchase, lease, or use of a product or service from Aeroflex convey a license under any patent rights, copyrights, Our passion for performance is defined by three trademark rights, or any other of the intellectual rights of attributes represented by these three icons: Aeroflex or of third parties. solution-minded, performance-driven and customer-focused
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