Get documents about "Changing the Paradigm of Automated X-Ray Inspection XStation MX
Document Sample
Changing the Paradigm of
Automated X-Ray
Inspection
XStation MX
Peter Edelstein
AXI Product Manager
Peter.Edelstein@Teradyne.com
May 9, 2007
BECAUSE TESTING MATTERS
Agenda
• Industry Trends And Resulting Issues
• Current And Future X-ray Technologies
• Teradyne’s 3D X-ray Approach
• XStation MX Detection Capability
• XStation MX – Z-Find and Enhancements
• Summary
22
Drivers for Automated X-Ray Inspection
Increased
Product Quality
Requirements
Loss Of Visual Increasing Board
Access Complexity
Automated
Loss Of
Electrical Access X-Ray BGA Usage
Inspection
High
Lead Free
Frequency
Nets
IPC
33
Technology Challenges
• AOI - No Visual • MXI and 2D X-Ray will • 3D X-Ray allows for full
Access to the BGA see components on the inspection of double
Connections opposite sides of the sided boards
boards as defects • Laminographic 3D X-ray
• ICT - No Access to limiting defect coverage systems resolve the
Parallel Capacitors,
coverage issues with AOI
Multiple VCC and GND
and 2D X-ray but exhibit
pins on BGAs
high false call rates and
• ICT - Loss of net poor reliability
access due to
component density
44
Solder Joint Feature Measurements
Algorithms extract solder GULLWING SOLDER JOINT
joint features to
determine:
• Width (Sub-Pixel Accuracy)
X-Ray Image
• Heel Solder
Heel Fillet
• Toe Solder Side Fillets
Toe Fillet
• Pad Solder
• Fillet Shape / Slope
Heel Fillet
• Side Fillet Shape
• Length + Many More
X-RAY
AOI Side Toe Fillet
ICT Fillet
3D Solder Joint Profile
55
ICT and AXI Each Have Unique and Overlapping Fault Coverage
Strengths
ICT and AXI have overlapping and unique abilities to test for component
“structural” vs. “operational” defects. AOI has only overlapping
capabilities.
AOI AXI
Defect Coverage AOI AXI ICT
Solder Defects Opens
Bridges
Shorts
Lifted Leads
Parallel Components Solder Quality
Solder Quality Insufficient Toe
Hidden Joints
Heal Cosmetic
VCC/GND pins
Void Voids
Excess Shorts, Opens
Misc. Solder Bridges
Solder Quality
Component Presence,
Absence
Component Lifted Lead
Comp.
Missing Component
Polarity, Hidden
Misalign Wrong Part Joints
Misplaced Part
Wrong Part
Non Functional
Area Array Shorts Component Value
Opens Component Operation
Duplicate
VCC/GND Coverage/Cost
ICT
66
XStation MX Compliments The Value Of ICT & Extends
The Life Of Your Existing Systems
• Increased Coverage Reduces Manufacturing Costs By Increasing the Yield to Functional
Test While Reducing Scrap from un-detected defects.
• Adding AXI on average improves joint coverage by ~30% and component coverage by
~25%.
77
Current and Future X-ray
Technologies
BECAUSE TESTING MATTERS
Limitations of MXI & Semi-Automated AXI
MXI - Transmission – Pseudo 3D • Throughput
–Only sample tests can be performed
• High False Fail Rates Above
3000 – 10,000 ppmJ
– Angled views are described as 3D,
but still have obscuration issues
– 7-axis manipulation and low
accuracy of motion
PCBA
– Manual Programming Tools
Static
Detector
99
Limitations of Laminography
Laminography - 3D • High False Fail Rates Above
3000 – 10,000 ppmJ
Rotating X-Ray Source
– Low Resolution at Large FOV
Laser
– Uses Averaging to Reconstruct
Images
– Inaccurate Mechanical Motion Induces
Errors
Board movement in Z to
converge on focal plane
PCBA
• Low uptime
– Mechanical Complexity
Rotating Detector
(1000 RPM)
10
10
Teradyne’s 3D
X-ray Approach
BECAUSE TESTING MATTERS
Measurement Methods
• High Quality Imaging
TM
ClearVueTM - 3D High Speed! TraX - 2D – High resolution at large FOV to inspect 0201’s
– Uses computational techniques to reconstruct
images – No blurring
• Typically less than 500 ppmJ False
PCBA Fail Rates
– Removal of mechanical errors and averaging
– Static image capture increases image quality
PCBA – No moving parts during image capture
• Allows for TraX 2D inspection
– Highest Quality Images
Static Detector
– Up to 6 Sq inches per second throughput
Static X-Ray Source New! Static Detector!
Static Board New! Static X-Ray Source!
New! Static Board!
12
12
XStation MX Detection Techniques:
TraXTM High-Speed Transmission X-Ray
Detector
Large FOV PCB
High-Speed
Transmission
Image
Transmission
X-Ray source
The detector is area is divided into a single region, each region is now a FOV
13
13
XStation MX Detection Techniques:
ClearVueTM Image Reconstruction
4.4”
Detector
A B A
PCB
Range used
23o - 41o
Transmission
X-Ray source
2.2”
The detector area is divided into 9 regions, each region is 1/9 of a particular FOV
14
14
ClearVue Slicing Capabilities
X
B B B
T T T
Z
B T T B
x
Rx
tan
T T T y
Ry
tan
B B B
15
15
ClearVue Provides Clear Accurate Slices
B B B Top Slice T
Pad Slice
T T T
B B B
Bottom Slice B
B TTT B
TTT
B T TB
TT T B
Objects at different
elevations move by different
B B B horizontal distances
T T T allowing for automated Z
height detection
B B B “Max Value” algorithm
removes artifacts
16
16
XStation MX
Detection Capability
BECAUSE TESTING MATTERS
XStation MX – High Fault Coverage
• Designed for manufactures that have quality as their
number 1 priority. Provides the highest level of defect
detection of any test or inspection solution.
• Allows for boards up to 18” x 20” to be inspected in a
single pass with automated in-line operation.
ClearVue TraX Fully Automated
3D X-Ray 2D X-Ray Defect Detection
18
18
XStation MX Provides Maximum Fault Detection and Lowest
False Call Rates.
• By Providing High Resolution Without Loss Of Original Image Information
– All Defect Types Can Be Located.
Capacitor
Looks Like Short with 2D X-Ray In this slice all bottom-side
components have been
removed
BGA Ball
Resistor
Test Point
2D ClearVue
19
19
Example ClearVue Defect Detection
Example Defect located on Example Defect located on
Defect Defect
XStation MX XStation MX
BGA Open BGA Void
Leaded Open BGA Bridge
Leaded Insufficient Leaded Bridge
Passive Open and
Passive Skew
Skew
Missing Resistor Missing Capacitor
Solder Ball Capacitor Open
20
20
XStation MX
Z-Find and Enhancements
BECAUSE TESTING MATTERS
How Does XStation Find the Correct Slice to Inspect?
• For most solder joints the optimal joint elevation is
the pad level where the lead of a device touches the
copper layer on the PCB.
– For BGAs the optimal joint elevation is the equator of the ball
• Z-Find is the task that estimates the optimal joint
elevation to inspect a solder joint by:
– synthesizing multiple slices (typically 20 to 30) across a ROI over a
range of heights
– plotting the profile of amount of solder over the z elevation
22
22
Z-Find Profile Example – Fine Pitch QFP
23
23
Z-Find Process Visualized
TOP SLICE
Signature
Top Slice Bottom
Slice
Z Elevation
BOTTOM SLICE
24
24
Enhanced Z-Find
• Z-Find works best when given a small range to
search over, approximately 10-20 mils
• Bare boards can be warped by up to 1% of their
diagonal size ( No limit for loaded boards)
– For a 10”x10” board, that’s almost 75 mils at the center
Nominal board Nominal board
surface surface
25
25
Enhanced Z-Find
• 100 or more measurements made per move
• A new software task determines the board surface
from the data:
– Correlate the measurements with the X-ray views
– Smart enough to filter presence of parts on the board
– Will interpolate if data for a view is unavailable
• Still no need for a special mapping procedure; the
mapping occurs in parallel with the inspection
26
26
Other Performance Enhancements
• Reduced Programming Time in the Production
Environments
• Image enhancement to improve fault detection
• Increased the standard FOV with no loss of accuracy
which allows for higher throughput
27
27
Summary
BECAUSE TESTING MATTERS
XStation MX – Automated X-Ray Inspection
Software
XFrame Programming
Software
XVer Repair Station
Accurate Defect Detection, High Performance Automated
In-Line X-Ray Inspection System.
29
29
Strength of XStation MX
• XStation MX is the only Automated X-ray Inspection solution that
deploys two patented* X-ray measurement techniques
• 3D X-ray
– The first is our Patented ClearVue 3D technique that allows for
slicing from top to bottom side of the board at ~1 mil increments
using a static imaging train
• High Speed 2D X-ray
– Our Patented TraX, Transmission X-ray solution provides full
defect coverage on single sided boards at higher throughput than
most AOI platforms
• These techniques can be used in the same inspection program
allowing the best fault coverage and throughputs to be achieved
* Patents include: 6,748,046, 4,809,308, RE35,423, EP 0236 001 and
5,541,856.
30
30
Summary – XStation MX Provides
• Industry leading image quality
– The Highest Fault Coverage to reduce DPMO rates and increase
delivered quality
– Lowest False Call Rates, reducing repair costs and increasing call
accuracy
• Multiple X-Ray inspection techniques
– Allows for optimum throughput while retaining defect detection
• Proven hardware and software lineage from our
installed base
• High MTBF’s and service coverage from Teradyne’s
world-wide support network
31
31
Changing the Paradigm of
Automated X-Ray
Inspection
XStation MX
Peter Edelstein
AXI Product Manager
Peter.Edelstein@Teradyne.com
May 9, 2007
BECAUSE TESTING MATTERS
Related docs
