Course Assessment and Graduation Requirements Regular attendance of courses

Course Assessment and Graduation Requirements Regular attendance of courses is expected. Students in the program must complete 30 credits with a graduation grade average (GGA) of B or above as required for all postgraduate students at HKUST. Professor Tianshou Zhao Professor PhD Hawaii Professor Christopher Y H Chao Associate Professor PhD Univ of California, Berkeley Professor Yongsheng Gao Associate Professor PhD Birmingham Professor See Chun Kot Associate Head and Senior Lecturer PhD Cornell Professor David C C Lam Associate Professor PhD Univ of California, Santa Barbara Professor Ricky S W Lee Associate Professor PhD Purdue Professor Yi-Kuen Lee Associate Professor PhD Univ of California, Los Angeles Professor Huihe Qiu Associate Professor PhD Erlangen-Nuremberg Professor Kai Tang Associate Professor PhD Michigan Professor Jingshen Wu Associate Professor PhD Sydney Credit Transfer Credit transfer may be granted to students in recognition of studies complete elsewhere. Application must be made to the program office within the first semester after admission. All credit transfer must be approved by the Program Director and are subject to the normal university, school, and program requirement on credit transfer. Program Fee HK$84,000 for the entire program (updated rate please refer to the program web page). Students admitted with credit transfer are also required to pay the full program fee. If a student fails to meet the graduation grade average requirement, the student is required to repeat or substitute the course(s) at a per credit fee. Successful applicants may apply for the Government’s Nonmeans Tested Loan Scheme (NLS) from the Government Student Financial Assistance Agency (SFAA). Faculty List Following faculty members in the Department of Mechanical Engineering teach the MSc courses. Professor Tongxi Yu Chair Professor PhD ScD Cambridge Professor Lilong Cai Professor PhD Toronto Professor C T Hsu Professor PhD Stanford Professor Jang Kyo Kim Professor PhD Sydney Professor Yang Leng Professor PhD Virginia Professor Qing Ping Sun Professor PhD Tsinghua Professor Matthew M F Yuen Head/Professor PhD Bristol Professor Tongyi Zhang Professor PhD Univ of Sc & Tech, Beijing For application details, please contact: http://www.seng.ust.hk/msc/mech Tel : (852) 2358 8987 / 2358 6966 Fax : (852) 2719 3027 Email : mscmech@ust.hk MSc(MECH) Program Office (Room 2577, 2/F, Lift 29-30) School of Engineering The Hong Kong University of Science and Technology Clear Water Bay, Kowloon, Hong Kong PTC-G12585 This brochure describes the HKUST MSc(MECH) program as intended at the time of printing. The program details in this brochure may be changed from time to time. In the event of inconsistency or where an interpretation of the brochure is required, the decision of the University Authority shall be final. MESF 504 Thin Film Materials Science and Mechanics Basic knowledge of materials science and mechanics of thin films with an emphasis on the mechanical properties of thin films and failure mechanisms in microelectronic devices. MESF 505 Fracture Behaviour of Polymers Introduction to both fundamental and practical knowledge on the microstructure, physical and mechanical behaviors, par ticular ly the fr acture behavior and toughening mechanisms, of polymers and composites. Discussions and critiques on related research activities in the literature. Case studies to help students prepare for the industry. MESF 521 Fluid Dynamics Basic concepts of fluid flows, derivation of governing equations, viscous flow, potential flow, boundary layer, flow instability, transition to turbulence, turbulent boundary layer. MESF 522 Conduction Heat Transfer This is a course for beginning graduate students. The initial emphasis will be on the formulation of a heat transfer problem as well as the prescription of the boundary conditions. Numerical techniques are introduced. MESF 526 Air Pollution Meteorology Atmospher ic boundar y layer, lapse r ate , stability classification, atmospheric turbulence, dispersion modeling, boundary layer wind-tunnel. MESF 541 Advanced Mechanical Behavior of Materials Relationships between microstructure and mechanical behavior in crystalline materials; temperature-dependent deformation in elasticity, viscosity and creep; embrittlement, fatigue and fracture of engineering materials; strengthening mechanisms in crystalline materials. MESF 543 Thermodynamics and Kinetics of Materials An advanced treatment of the thermodynamics, kinetics and transport properties in solids, solutions, surfaces, and heterogeneous reactions. MESF 548 Coating and Thick Films This course is a sur vey course on coating and thick films with emphasis on applications in electronics. Application methods and resulting material structures and interfaces are reviewed with focus on composite polymeric c o a t i n g s a n d t h i c k fi l m s . C o r r e l a t i o n s a m o n g s t processing, proper ties, material structure are reviewed with respect to current theories and hypotheses. The course will draw major por tion of the course content from cur rent liter ature and shall have a strong explorator y and dynamic flavor. MESF 552 Theories and Practice of CAD/CAM/CAE Computer graphics, data str uctures, geometric modeling, NC cutting path planning, process planning, mesh generation techniques for analysis, computer integrated manufacturing, intelligent CAD systems. MESF 592 Introduction to Electronic Packaging State-of-the-ar t in IC technology, fundamental package architecture, types of package; packaging materials and processing technologies; functions, geometr y, materials and structure of substrates and PCBs; interconnection technologies; reliability testing and failure mechanisms of package components; characterization, measurement and failure analysis; future trends. MESF 593 Finite Element Methods Finite element formulation; variational principles for s t r u c t u r a l a n d c o n t i nu u m m e c h a n i c s ; nu m e r i c a l interpolation and integration; plane stress and plane strain analysis; plate bending and three dimensional solids; solution of large systems of algebraic equations. MESF 595 Introduction of Microsystems: Technology and Devices Physics of Scaling; energy transduction, sensing and actuation principles; micro-fabrication technology and technology fundamentals; film formation, photolithography and etching; integrated microsystems and microsystems packaging. MESF 596 Fundamentals of Microsystems Packaging The role and trends of packaging in microelectronics and microsystems; fundamentals of microelectronics packaging; fundamentals of optoelectronics/RF/MEMS packaging; design for reliability and environment; standards and qualifications; fundamentals of failure modes and mechanism; package level reliability; board level reliability. MESF 597 Materials Characterization and Failure Analysis This course will provide students with basic working principles as well as the hands-on experiences of various materials characterization, advanced testing and failure analysis techniques that are widely used in electronic packaging R&D practices and industrial production. MESF 691 Special Topics in Mechanical Engineering Selected topics in mechanical engineering of current interest to the Depar tment in emerging areas and not covered by existing courses. MESF 695 Independent Project An independent research project on Mechanical Engineering carried out under the supervision of a faculty member. May be repeated for credits. All courses carry 3 credits each, except MESF 695 which worths 3 – 6 credits. The number of courses to be offered every semester will be dependent on demand. Program Objectives • Provides an opportunity for applied scientists and engineers to pursue an in-depth study beyond undergraduate level in broadly based mechanical engineering discipline, which is essential to technological developments of industries in Hong Kong and the Pearl River Delta region • Designed to benefit students with a broad spectrum of backgrounds • Aims to enable students to acquire technological understanding to design, select materials for and manufacture various electrical, mechanical and thermal systems and their components, as well as in electronic packaging. Lecture Venue Classes will be held at HKUST campus at Clear Water Bay, Kowloon. Students may apply for free parking at HKUST. Students may also take minivan or KMB from the closest Hang Hau MTR station or another close by Choi Hung MTR station. The traveling time is around 10 minutes. Program Curriculum Students are given an option of studying for a general MSc in Mechanical Engineering or a concentration in Electronic Packaging. For students who would like to complete a general MSc in Mechanical Engineering program, a minimum of 30 credits of coursework from any of the following MESF courses with an average grade of B or above is required. Subject to the Program Director’s approval, students may repeat MESF 695 to obtain a maximum of 6 credits for graduation. For students who would like to complete the concentration on Electronic Packaging, a minimum of 30 credits of coursework from the followings must be completed with an average grade of B or above: (1) Minimum of six credits of courses from List A (2) Minimum of six credits of courses from List B (3) Six credits of MESF 695 in the area of electronic packaging Program Commencement and Schedule February and September every year. Approximately 1 year for full-time and 2.5 years for parttime study which may be adjusted depending on student’s own pace of study. All postgraduate courses are scheduled on weekday evenings and Saturday afternoons. Medium of Instruction All in-class lectures and materials will be in English. List A : MESF 592, MESF 596, MESF 597 Target Students Target Students are BEng or BSc graduates both from local and overseas universities, as well as working professionals in industr y such as Mechanical Engineer s, Design / Manufacturing Engineers, Electrical Engineers, Civil Engineers, Materials Engineers and Environmental Engineers. List B : MESF 504, MESF 541, MESF 543, MESF 548, MESF 593, MESF 595, MESF 597 As an alternative, students may take 9 credits of courses from List A and minimum of 3 credits of courses from List B. Subject to Program Director’s approval, students may take other approved equivalent courses to fulfill the graduation requirement. Admission Requirement Applicants must possess a bachelor’s degree from a recognized university, or with an equivalent qualification, in Mechanical Engineering, Manufacturing Engineering, Engineering Mechanics, Engineering Management, Electrical & Electronic Engineering, Civil Engineering, Energy and Thermal Engineering, Environmental Engineering or related disciplines with an appropriate background. Applicants from universities where English is not the major medium of instruction will be considered on a case-by-case basis. In general, English proof such as Test of English as a Foreign Language (TOEFL), International English Language Testing System (IELTS), or National English Exam (CET) is required. Course Description MESF 501 Foundation of Solid Mechanics Continuum concept for deformation of solids; analysis of stress and strain; constitutive equations; solution of problems relevant to materials processing, fracture mechanics and structural analysis; energy methods and numerical solutions. MESF 503 Introduction to Mechanics of Defects in Solids This course is to present a brief integrated view on var ious roles of defects in mechanics of solids, introducing the basic concepts, equations and methods used in the mechanics analysis of various kinds of defects by continuum mechanics and ther modynamics approaches. Typical types of defects – crack and second phase inclusions – are descr ibed intensively with illustrative examples provided. The applications of the theor y in the mechanics analysis of fr acture of engineering materials and phase transformation process in smar t materials and structures are demonstrated.