A Recent Innovation in Corrosion Control for Electronics

Document Sample
A Recent Innovation in Corrosion Control for Electronics Powered By Docstoc
					Number:      204

Title:       A Recent Innovation in Corrosion Control for Electronics
Authors:     Barry L. Rudman, Christophe Chandler and Bill Westerfield
Citation:    Tri-Service Corrosion Conference, 1997
Keywords:    Electrostatic Discharge, Volatile Corrosion Inhibitors

Abstract:    Packaging materials for the electronics industry have become very specialized.
             The choice among the materials typically involves balancing several factors, such
             as the cost of the materials, the cost of the components and the sensitivity of the
             components to be packaged. Typically corrosion protection is sacrificed in favor
             of protection from electrostatic discharge (ESD). If corrosion and ESD protection
             was desired the choice has been to use a metallized static dissipative barrier bag
             with a desiccant. This option is usually very expensive and had several
             drawbacks. A main disadvantage was that these types of films are not transparent.
                     It was therefore desired to develop a new packaging material that was
             transparent and offered both corrosion and ESD protection. This new material was
             not to be a compromise between the two types of protection, but rather a
             combination of the best of both materials.

Pros/Cons:   This paper discusses about the problems associated with the packaging materials
             and a standard test method was developed to characterize both the dissipative
             properties and corrosion inhibiting ability of films. Finally from the results it is
             found that hybrid films seems to provide both static dissipation and corrosion
             control among the other films employed. Thus VCIs in the hybrid is an ideal
             choice for protection of electronic components. Further research in this area will
             lead to the innovation of newer materials, which may have better properties than
             the present ones.