Printed Electronics with Integrated Functionality Printed

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					                   Co-organised by                             2nd EU-Korea Cooperation
European Commission (DG Information Society and Media),
       the Ministry of Knowledge Economy (MKE),                   Forum on ICT Research
      Korea with the support of the COJAK project           @ Radisson SAS Royal Hotel - Brussels, Belgium




     Printed Electronics
with Integrated Functionality

                                     Dec. 1-2, 2008
                                     Kee Hyun Shin
                             Director of FDRC & e-Printing Cluster
                      Dept. of Mechanical Engineering, Konkuk University
                                          Seoul, Korea

                        khshin@konkuk.ac.kr               http://fdrc.re.kr
Contents

    1. Collaboration Partners
    2. Organization(Korea)
    3. EU-Korea Collaboration
            1. Collaboration Partners




     Reinhard Baumann,
Prof. Chemnitz Univ. of Tech.
                                    Together with Partners

                                3
2. Organization(FDRC) Vision : R2R e-Printing
(FDRC: Flexible Display Roll to Roll Research Center )

Nano/Micro Tech. (Micro/Nano Control, Pattern, Measurements, Line Design, CIM…)
Application Specific (RFID, MLCC, Solar Cell, e-Paper, Flexible Display, Elec. Device)
Disruptive Tech.(Flexible, Relative Motion, Continuous Process, Low Temp. Matching )

                FDRC
                                                                    Nip roll



                                                                                      Material(film)




                                                     Doctor blade
                                                                               90    Gravure roll      Total Package
                   R2R                    Printing
                  system
                             Disruptive                                                                  & Solution
                                          Process                              Ink



                             Matching
                                                                                                       - R2R Printing
pmTuc                       technology
                  R2R                      e-Ink                                                         Systems
                 Pattern                                                                               - RFID, Solar
                             Material                                                                    Cell
                                                                                                       - e-Paper
                                                                                                       - Flexible
                                                                                                         Display
Disruptive Tech, in R2R e-Printing

Rigid ☞ Flexible

Batch ☞ Continuous (Matching in on-line)

Absolute ☞ Relative Motion(Register, Inspection)

Evaporation / Deposition / Etching ☞ Printing, Multi-Layer

High Temp & Vacuum ☞ Low / Room Temp. Atmospheric Pressure

     Matching : Design, Control, Processing
                (Impedance, Chemical, Mechanical, Time, Geometry)




                                      5
 Multi-Layer Printing System




                   RFID Printing
                                                                       Research Topics
    IR
                                                                      - Electronics Printing
                                               Patterning             - Air Floatation
                                                                      - Multi Functional Printing
                                                                        (Gravure & Flexo-Offset)
                                                                      - Non-Contacting Mech.
RFID pattern design                Dryer
  / Chip bonding                                                        S/w Plat form/R-T
                                            Lateral Steering Guider   - Tension Control
                                           Controller
                                                                        (loadcell / dancer)
                            HMI                                       - 2-D Register Control
                                                                      - Taper Tension Control
                                     Winding            Outfeeding    - Lateral Control
  Air floatation                                                      - Multi Drying / Cooling
                         Low Speed - High Resolution Printing
                               (Velocity max. 30m/min,                - Patterning/Ink Transfer
                              Registration max. ≤ 20um)               - System Integ./Matching
                                                6
   Matching Technology

  Matching : Chemical, Mechanical, Time, Process, Impedance, Geometry etc
(Nano/Electronic Ink , Patterning, Substrate Handling, Sensors & Actuators, System integration)




                                          Matching
                                         Technology
                                       for the Printed
                                         Electronics




                                                 7
Matching Mechanics among:




 Ink (viscosity)
 Substrate (strain)
 R2R system (speed)
 Pattern (thickness)
Find Operating Ranges, Reduce Cost. Increase
Performance (Pattern Thickness – Viscosity - Tension - Speed)




                               + Average thickness is great in high viscosity
                               +Thickness is sensitive to tension, speed in
                                        high viscosity
                               +Thicker pattern in low tension & low speed
                                         in high viscosity
                               +Uniform Thickness range can be found
                                        regardless of tension & speed in
                                        low viscosity
On-going Research Activities in FDRC

                (1) “e-Printing Cluster” is being funded by
                    the “City of Seoul” (2006.8 – 2011.7)

                  - Research Grant: U$ 2,400,000/year
                  - 29 Ph.D researchers from the 4 universities,
                  - 2 national Labs, 12 companies
                      (SNU Precision, Eagon, SungAn, Handoo, Yuil, knw…)
                  - Multi-disciplinary group of
                    : mechanical engineering, material science,
                    : electrical engineering, chemistry,
                    : computer science majors.
                (2) Major Research Area
                    - Patterning, Inkjet, Substrate, Tension / Register Control,
                         Lateral/Wrinkling/Printing, Inspection, Drying,
                         Real-time Software Platform, Device Design


                (3) VTT-KU Joint Project: Multi-Layer Fine Printing
                    (2007.12-2013. 2) $ 500,000 (US) / year
                     with VTT- Korea @ Konkuk Univ.
International Collaboration




                                                                         many
                                                                      cooperations
                                                                        abroad




                                     Tokai
                   WHRC              Univ.
     International cooperation with global laboratory, MOU with pmTUC, VTT
              Be the leading research group in e-Printing techniques
                     VTT-KU Joint Lab(KICOS) @Konkuk Univ.
3. EU-Korea Collaboration
Goal of the Joint Project
ㄱ트




     Develop the core technology for R2R-based printed
     electronics which has integrated functionality like
     bio-sensor, solar cell, flexible display,…
     in terms of material, device, and R2R systems.



        • Develop printable materials and device
        • Develop optimal R2R system
        • Develop pattern and printing technology
Example( Solar Cell Type)
ㄱ트




  1st generation: sc, mc-silicon solar cell
  2nd generation: thin film solar cell (silicon, comp., dye sens., organic)
  3rd generation: nano, quantum dot, hybrid (ultra efficiency and reliability)
ㄱ트
Research Plan



                                          Research
     Major                                            Research Team
               Contents                   Team
     Area                                             (Korea Side)
                                          (EU Side)

                                          -Chemnitz
                                                      -Konkuk University
              Printable Material with      Univ.
     Material                                         -Hwabaek ENG. Co.
              Intelligent Functionality   -Other       LTD
                                           Partners
               Optimal Design                         -Konkuk University
               Matching Condition         Chemnitz    -SNU Precision Inc.
     R2R
               New Hybrid                 Univ.,..    -Sung An Machinery
     System    System(Inkjet, Thermal                  Co. LTD.
               transfer)                              -Others

                                          Chemnitz    -KNW Inc.
               Electronics with
     Device                               Univ.,..    -Eagon Window &
               Integrated Functionality                Door Systems Co. LTD.

				
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Description: If you can quickly print out the number of conductor layers, insulation layers or semiconductor layers to form electronic circuits, then compared to the traditional manufacturing process, using this technology will lower the cost of production of integrated circuits. Typically, the printing performance semiconductor means different organic materials with silicon, or even than in the silicon material used should be greater in the geometric limit. In addition, many applications will benefit from the excellent performance of low-cost flexible substrates, such as RFID tags, for display of active matrix backplane (active-matrixbackplane). Printed silicon electronics pioneer in the field of Kovio Since its inception in 2001, has been in continuous improvement of printing technology, and in July 2009 announced the successful financing of 20 million U.S. dollars. The company said it plans to invest this money into the company's RF bar code mass production.