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					 Organic &
    Printed
Electronics
Speaker & Co-chair: Dr. Jie
Zhang, Motorola
Chair: Dr. Daniel Gamota,
Motorola
Co-chair: Dr. Jan Obrzut,
NIST
                        What If ??

•   A printing press could produce electronic products “on-
    demand”......PRODUCTION TIME GOES FROM WEEKS
    TO MINUTES

•   Integrated circuits were so inexpensive that they could be
    placed     everywhere       print   media       is   used
    today……PRODUCT COST FALLS FROM DOLLARS TO
    CENTS

•   A new electronics industry were created where “Insert Your
    Company’s Name Here” is the dominant player......YOU
    GO FROM FOLLOWER TO LEADER

                                                                 1
 Silicon Transistor Channel Length Trend
                  Graphic Arts                     Nanoimprint lithography is
                  Printed Electronics              promoted as a solution
                  OPPORTUNITY TODAY                to break the nano-barrier

         10                                                           10000

                   Nominal feature size

          1                                                           1000

                                         130nm                             Nano-
Micron                                        90nm                         meter
                       Gate Width
     0.1                                                              100

                Nanotechnology          70nm
                                            50nm
    0.01                                                              10
         1970     1980       1990        2000       2010          2020

                                                                                   2
           Question 1 of 100


                     Q1:
                     Today, what is technically comparable to the
                     semiconductor integrated circuits that were
                     used to help us reach the moon in 1969?




Apollo 11 - 1969

                                                                    3
           Question 1 of 100


                         A1: A Furby Doll




Apollo 11 - 1969          Furby - 2004
                                            4
                                Intel 4044 Processor




                                                                                Image courtesy: Technologyevalngelist.com


Image courtesy: Intel website




•    Introduced in Nov, 1971
•    2300 transistors
•    10 m channel length
•    Composed of 5 layers
• Four-bit microprocessor,                      Image courtesy: Intel website



    • Four-bit adder for doing additions
    • An accumulator for keeping track of partial sums
    • 16 registers for temporary storage.


                                                                                                                            5
Printed Electronics Market Opportunities

                         PET       Si based




                Where the products
                are cost sensitive,
Functionality




                 and relatively low
                   functionality




                 $0.01     $0.1   $1     $100   $1000   $$$

                                                              6
Printed Electronics Market Potential*
Signage - $10B                                    Power - $16B




                                   Displays - $20B
Lighting - $15B




              *Data compiled from press and industry reports


                                                                 7
    Printed Electronics Market Potential*

Sensors - $10B
                            Air Baggage/Freight, Ticketing, RFID -
                            $20B




Logic/Memory - $30B




                      *Data compiled from press and industry reports


                                                                       8
Printed and
Organic
Electronics
Roadmap -
Why Now ?


              9
Recent Printed Electronics Activity
      • Announced $100M financing deal to build a production
        facility in Dresden, Germany

      • Announced production of RF tags during 2007

      • Launched initiative for developing flexible, printed, and
        organic electronics market

      • Expanded investment; partnered with UC Berkeley

      • Acquired by Weyerhaeuser

      • Raised US $20M in most recent funding round

      • Creo purchased by Kodak, now Kodak Graphic
        Communications Group

      • Spun off from Philips Research; teamed with Innos Ltd.


                                                               10
R&D Transfer to Manufacturing Environment

• R&D
  – Development of new concepts
  – Develop and explore new
    technology space
                            Tech
                          Transfer



                           • High-Volume Manufacturing
                                  – Distribute technology to consumers
                                  – Generate new businesses



                                                                         11
Barriers and Gaps for Market
Introduction & Diffusion (Captured in 2002)

• Awareness & Education
• Value Chain
• Infrastructure: Materials,
  Manufacturing Platforms,
  Control Architectures, etc.
• Standards: Circuit Design,
  Reliability, Platforms, etc.
• Roadmaps (technology, products, etc.)


                                              12
New iNEMI Roadmapping Activity for 2007
What is Significant this Year?
• Organic & Printed Electronics Roadmap debuts in the 2007 iNEMI
  microelectronics roadmap
• iNEMI members selected organic & printed electronics as future
  electronics high growth market

What transpired?
• Kickoff of iNEMI Technology Working Group held on 02/2006 (Anaheim,
  CA)
• Engaged companies, academia, and government to provide an outlook for
  large-area electronics products (51 participants from 33
  organizations/companies)
• WG delivered 1st iNEMI Organic & Printed Electronics Roadmap in
  September 2006 (http://www.inemi.org/).

What is next?
• Revisit and update Organic & Printed Section as necessary



                                                                      13
iNEMI P&O Electronics Roadmap




                                14
       Printed Electronics Supply Chain




                 Processing/     Control      System    Design &
     Materials   Equipment     Architecture   Testing   Applications
                 Platforms




Supply chain is being established in preparation for
commercialization of printed electronics based products

                                                                       15
Printed Electronics Product Opportunities




                                            16
       iNEMI RFID Item Level Tag Roadmap


ILT Roadmap – Why now?

  – Major barriers exist at ILT RFID
    implementation
  – To provide RFID stakeholders guidance
    for ILT infrastructure and supply chain
    development
  – To drive ubiquitous deployment of RFID
    solutions
  – The ILT roadmap effort is being driven by
    the RFID supply chain members
  – This roadmap activity is open to all RFID
    stakeholders. Your participation is most
    welcome!


                                                17
  Functional Electronic Inks - Conductive,
    Semiconductive, and Dielectric Inks
                                           Semiconductor Inks
Attributes
• Characteristics similar to traditional
    electronic materials                        R   S
                                                        S
                                                            S
                                                                    S    R


• Solution processable for low cost                             n


    manufacturing                          Silver Nanoparticle
• Robust synthesis/formulating routes        Conductive Inks
• Materials and device stability in-air
• Large area processing routes
    demonstrated
• Devices fabricated on graphic arts
    manufacturing printing platforms


                                                                        18
Printing Electronics Manufacturing Platform

                                   Curing Oven                     Curing Oven
Flex Fixture

               Contact Printing                Non-Contact
                (litho, flexo)                Printing (ink jet,             Inspection
                                              microdispensing)                  Unit

      F lex        μ D ispensors    C uring                        C uring      Inspection
                                                 μ D ispensors
    F ixture                         O ven                          O ven          U nit




  Highly integrated hybrid system for high throughput and low maintenance


                                                                                        19
                        Printing Technologies
   Contact Printing                    Screen Printing
                                                          Non-Contact Printing
            Offset                     Gravure Printing
               Inking                                           Ink Jetting
                                       Offset Printing
                        Damping
 Plate                                 Flexo Printing
 cylinder
                                       Stamping
Blanket
                  Printing substrate
                                       Inkjet
cylinder
                                       Microdispensing
                                       …
Benefits
                                                     Benefits
• Commercially available
                                                     • CAD data driven enables
• Low-cost, high-speed parallel
                                                     fast change-over “on the fly”
  processing
                                                     • Fast prototype
• Commercially available
                                                     • Suitable for printing on 3D
  functional materials
                                                       substrates
• Demonstrated repeatability

                                                                                     20
       In-Line/Off-Line Characterization

Critical Parameters                                                   L
                                             S                S                   S

                                                     S                S                   S



 Printing resolution                         S
                                                     S
                                                              S
                                                                          S
                                                                                  S
                                                                                          S


                                                                  S                   S

 Printing registration                           S
                                                         S                    S               S


                                    Source       S                S                   S
                                                                                              S
                                                                                                  Drain
                                                         S                    S

 Layer thickness
                                                             Dielectric                              a
 Orientation of features                                      Gate
 Dimensions of features
                                                             Substrate
 Processing conditions
 Material quality (pot life)                                          b

 In-process electrical testing
 Final product electrical testing

                                                                                                          21
Electrical Design, Layout, and Simulation



                   Measured
                       Simulated




                                         Circuit Simulation
    OFET Device Model




      Circuit Design               Circuit Layout

                                                              22
                  Reliability Testing

– Reliability testing methods and conditions
   • Air to air temperature cycling (-20°C to
     +60°C, 30 min dwell)
   • Liquid to liquid thermal shock (-20°C
     to +60°C, 5 min dwell)
   • Flexure (30 degree off-axis bend)
   • Humidity exposure (60°C at 90% R.H.)
   • Oxygen exposure
   • Solvent resistance (Bleach, water,
     ammonia, etc.)
   • Tearing, crumpling, crushing

                        Reliability is application specific
                                                              23
Standards and Roadmap Efforts to Establish
   the Printed Electronics Infrastructure
 Standards                               Presentations &
                                         Publications
IEEE 1620™, IEEE 1620.1™, IEEE P1620.2
http://grouper.ieee.org/groups/1620/
http://grouper.ieee.org/groups/1620/1/
http://grouper.ieee.org/groups/1620/2/

Roadmaps

                                          Printed Organic and Molecular
To be released at APEX 2007              Electronics (ISBN 1-4020-7707-6)
http://www.inemi.org

                                                                      24
                Look around you…
At home
      At Work
              At the Store
                    On the move

Printed Materials are everywhere

The logic, intelligence and communication should be
embedded into all printed matter

We are talking about a future with pervasive printed
electronics seamlessly integrated into everyday life

                                                       25
26
  Order your
Roadmap Now!
www.inemi.org
      Email contacts:
        Dan Gamota
  Gamota@motorola.com
          Jie Zhang
 Jie.zhang@motorola.com
         Jan Obrzut
    Jan.obrzut@nist.gov




                          27

				
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Description: If you can quickly print out the number of conductor layers, insulation layers or semiconductor layers to form electronic circuits, then compared to the traditional manufacturing process, using this technology will lower the cost of production of integrated circuits. Typically, the printing performance semiconductor means different organic materials with silicon, or even than in the silicon material used should be greater in the geometric limit. In addition, many applications will benefit from the excellent performance of low-cost flexible substrates, such as RFID tags, for display of active matrix backplane (active-matrixbackplane). Printed silicon electronics pioneer in the field of Kovio Since its inception in 2001, has been in continuous improvement of printing technology, and in July 2009 announced the successful financing of 20 million U.S. dollars. The company said it plans to invest this money into the company's RF bar code mass production.