VIEWS: 128 PAGES: 28 CATEGORY: Hardware POSTED ON: 8/8/2010
If you can quickly print out the number of conductor layers, insulation layers or semiconductor layers to form electronic circuits, then compared to the traditional manufacturing process, using this technology will lower the cost of production of integrated circuits. Typically, the printing performance semiconductor means different organic materials with silicon, or even than in the silicon material used should be greater in the geometric limit. In addition, many applications will benefit from the excellent performance of low-cost flexible substrates, such as RFID tags, for display of active matrix backplane (active-matrixbackplane). Printed silicon electronics pioneer in the field of Kovio Since its inception in 2001, has been in continuous improvement of printing technology, and in July 2009 announced the successful financing of 20 million U.S. dollars. The company said it plans to invest this money into the company's RF bar code mass production.
Organic & Printed Electronics Speaker & Co-chair: Dr. Jie Zhang, Motorola Chair: Dr. Daniel Gamota, Motorola Co-chair: Dr. Jan Obrzut, NIST What If ?? • A printing press could produce electronic products “on- demand”......PRODUCTION TIME GOES FROM WEEKS TO MINUTES • Integrated circuits were so inexpensive that they could be placed everywhere print media is used today……PRODUCT COST FALLS FROM DOLLARS TO CENTS • A new electronics industry were created where “Insert Your Company’s Name Here” is the dominant player......YOU GO FROM FOLLOWER TO LEADER 1 Silicon Transistor Channel Length Trend Graphic Arts Nanoimprint lithography is Printed Electronics promoted as a solution OPPORTUNITY TODAY to break the nano-barrier 10 10000 Nominal feature size 1 1000 130nm Nano- Micron 90nm meter Gate Width 0.1 100 Nanotechnology 70nm 50nm 0.01 10 1970 1980 1990 2000 2010 2020 2 Question 1 of 100 Q1: Today, what is technically comparable to the semiconductor integrated circuits that were used to help us reach the moon in 1969? Apollo 11 - 1969 3 Question 1 of 100 A1: A Furby Doll Apollo 11 - 1969 Furby - 2004 4 Intel 4044 Processor Image courtesy: Technologyevalngelist.com Image courtesy: Intel website • Introduced in Nov, 1971 • 2300 transistors • 10 m channel length • Composed of 5 layers • Four-bit microprocessor, Image courtesy: Intel website • Four-bit adder for doing additions • An accumulator for keeping track of partial sums • 16 registers for temporary storage. 5 Printed Electronics Market Opportunities PET Si based Where the products are cost sensitive, Functionality and relatively low functionality $0.01 $0.1 $1 $100 $1000 $$$ 6 Printed Electronics Market Potential* Signage - $10B Power - $16B Displays - $20B Lighting - $15B *Data compiled from press and industry reports 7 Printed Electronics Market Potential* Sensors - $10B Air Baggage/Freight, Ticketing, RFID - $20B Logic/Memory - $30B *Data compiled from press and industry reports 8 Printed and Organic Electronics Roadmap - Why Now ? 9 Recent Printed Electronics Activity • Announced $100M financing deal to build a production facility in Dresden, Germany • Announced production of RF tags during 2007 • Launched initiative for developing flexible, printed, and organic electronics market • Expanded investment; partnered with UC Berkeley • Acquired by Weyerhaeuser • Raised US $20M in most recent funding round • Creo purchased by Kodak, now Kodak Graphic Communications Group • Spun off from Philips Research; teamed with Innos Ltd. 10 R&D Transfer to Manufacturing Environment • R&D – Development of new concepts – Develop and explore new technology space Tech Transfer • High-Volume Manufacturing – Distribute technology to consumers – Generate new businesses 11 Barriers and Gaps for Market Introduction & Diffusion (Captured in 2002) • Awareness & Education • Value Chain • Infrastructure: Materials, Manufacturing Platforms, Control Architectures, etc. • Standards: Circuit Design, Reliability, Platforms, etc. • Roadmaps (technology, products, etc.) 12 New iNEMI Roadmapping Activity for 2007 What is Significant this Year? • Organic & Printed Electronics Roadmap debuts in the 2007 iNEMI microelectronics roadmap • iNEMI members selected organic & printed electronics as future electronics high growth market What transpired? • Kickoff of iNEMI Technology Working Group held on 02/2006 (Anaheim, CA) • Engaged companies, academia, and government to provide an outlook for large-area electronics products (51 participants from 33 organizations/companies) • WG delivered 1st iNEMI Organic & Printed Electronics Roadmap in September 2006 (http://www.inemi.org/). What is next? • Revisit and update Organic & Printed Section as necessary 13 iNEMI P&O Electronics Roadmap 14 Printed Electronics Supply Chain Processing/ Control System Design & Materials Equipment Architecture Testing Applications Platforms Supply chain is being established in preparation for commercialization of printed electronics based products 15 Printed Electronics Product Opportunities 16 iNEMI RFID Item Level Tag Roadmap ILT Roadmap – Why now? – Major barriers exist at ILT RFID implementation – To provide RFID stakeholders guidance for ILT infrastructure and supply chain development – To drive ubiquitous deployment of RFID solutions – The ILT roadmap effort is being driven by the RFID supply chain members – This roadmap activity is open to all RFID stakeholders. Your participation is most welcome! 17 Functional Electronic Inks - Conductive, Semiconductive, and Dielectric Inks Semiconductor Inks Attributes • Characteristics similar to traditional electronic materials R S S S S R • Solution processable for low cost n manufacturing Silver Nanoparticle • Robust synthesis/formulating routes Conductive Inks • Materials and device stability in-air • Large area processing routes demonstrated • Devices fabricated on graphic arts manufacturing printing platforms 18 Printing Electronics Manufacturing Platform Curing Oven Curing Oven Flex Fixture Contact Printing Non-Contact (litho, flexo) Printing (ink jet, Inspection microdispensing) Unit F lex μ D ispensors C uring C uring Inspection μ D ispensors F ixture O ven O ven U nit Highly integrated hybrid system for high throughput and low maintenance 19 Printing Technologies Contact Printing Screen Printing Non-Contact Printing Offset Gravure Printing Inking Ink Jetting Offset Printing Damping Plate Flexo Printing cylinder Stamping Blanket Printing substrate Inkjet cylinder Microdispensing … Benefits Benefits • Commercially available • CAD data driven enables • Low-cost, high-speed parallel fast change-over “on the fly” processing • Fast prototype • Commercially available • Suitable for printing on 3D functional materials substrates • Demonstrated repeatability 20 In-Line/Off-Line Characterization Critical Parameters L S S S S S S Printing resolution S S S S S S S S Printing registration S S S S Source S S S S Drain S S Layer thickness Dielectric a Orientation of features Gate Dimensions of features Substrate Processing conditions Material quality (pot life) b In-process electrical testing Final product electrical testing 21 Electrical Design, Layout, and Simulation Measured Simulated Circuit Simulation OFET Device Model Circuit Design Circuit Layout 22 Reliability Testing – Reliability testing methods and conditions • Air to air temperature cycling (-20°C to +60°C, 30 min dwell) • Liquid to liquid thermal shock (-20°C to +60°C, 5 min dwell) • Flexure (30 degree off-axis bend) • Humidity exposure (60°C at 90% R.H.) • Oxygen exposure • Solvent resistance (Bleach, water, ammonia, etc.) • Tearing, crumpling, crushing Reliability is application specific 23 Standards and Roadmap Efforts to Establish the Printed Electronics Infrastructure Standards Presentations & Publications IEEE 1620™, IEEE 1620.1™, IEEE P1620.2 http://grouper.ieee.org/groups/1620/ http://grouper.ieee.org/groups/1620/1/ http://grouper.ieee.org/groups/1620/2/ Roadmaps Printed Organic and Molecular To be released at APEX 2007 Electronics (ISBN 1-4020-7707-6) http://www.inemi.org 24 Look around you… At home At Work At the Store On the move Printed Materials are everywhere The logic, intelligence and communication should be embedded into all printed matter We are talking about a future with pervasive printed electronics seamlessly integrated into everyday life 25 26 Order your Roadmap Now! www.inemi.org Email contacts: Dan Gamota Gamota@motorola.com Jie Zhang Jie.firstname.lastname@example.org Jan Obrzut Jan.email@example.com 27
"Organic _ Printed Electronics"