Sample Resumes for Qsr Industry - DOC - DOC by qar98483

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									CTI
          CTI
CircuiT Design
  Bench TesTing
     Closed-Loop
      Solid-staTe
           Real-Time
            Modeling
             Analysis
          CTI
                MOSFEt
                  OpAmpS
Signal Processing
  DEBUG
Troubleshooting
        Prototyping
          Data Comm
             Interface
               Routing
                  DigiTal
                   Layout
                    FPGAs
                    PLDs
                     Code


I/O Conditioning
         CTI
DaTa ConverTers
  Microprocessors
        Transducers
         MagneTics
              DigiTal
               FerriTes
                Sensors
                     ADCs
                       DACs
 DisTribuTionS
   PICs
  MonTe-Carlo
    Document
      Six-Sigma
         S-and-H
           ANOVA
              FMEA
                                    CTI
                                                         DFM
                                                         WCA
                                                                    LEDs

                                            PREFACE

After several attempts at compressing the size of the diagrams, photographs, and figures that
were embedded within the original hardcopy of the portfolio, I am resorting to providing
hyperlinks to these diagrams and figures. These „picture‟ files will reside on a different server
with sufficient memory to accommodate the size of these jpeg, png, and gif files. The „drawing
file set‟ should be opened in another “window” or session in order to view the portfolio
drawing and the portfolio text simultaneously.* I have indicated the URL for each diagram
within the document where the figure would normally have been located. I have also included a
separate file within the ELANCE PORTFOLIO set of files called “Portfolio Drawings” which
lists all the drawings together with the “live” hyperlinks similar to this section. This file was
added to the PORTFOLIO for more flexibility and to increase the number of drawings that can
be viewed at any given time. There are not an excessive number of drawings within the
document (a total of 9); most of which are located in the last half of the portfolio. I apologize for
any inconvenience.

Sec    Description of Drawing or Document

                                              URL (Uniform Resource Locator)
0-0    Cover Page
                       http://cipherlabs.freewebspace.com/portfolio/image002.jpg

8-1    Bill-of-Material (for Stepper Motor Design)
                      http://cipherlabs.freewebspace.com/portfolio/image006.jpg

9-2    RS-422 Assembly: Component Placement
                   http://cipherlabs.freewebspace.com/portfolio/image008.jpg

12-1   PCB Schematic Page 1 of 2
                   http://cipherlabs.freewebspace.com/portfolio/image095.jpg

12-2   PCB Schematic Page 2 of 2
                   http://cipherlabs.freewebspace.com/portfolio/image097.jpg
                                  CTI
*In order to open a second window in which to view the drawing, point the mouse cursor
(symbol) to the desired hyperlink „linking‟ the diagram and click the left mouse button. Next,
depress the Ctrl key located on the keyboard, and then select the option “Hyperlink”. When the
subsequent pull-down menu appears, select the option: “Open in New Window” from this pull-
down menu. A new window should now appear and the drawing should begin downloading.


                                               i
                                 CTI
                                   PREFACE (CONTINUED)

12-3   PCB System Block Diagram
                   http://cipherlabs.freewebspace.com/portfolio/image099.jpg

13-2   Recommendation from Andrew Corp.
                   http://cipherlabs.freewebspace.com/portfolio/image101.jpg

13-3   Recommendation from FlightSafety International
                   http://cipherlabs.freewebspace.com/portfolio/image103.jpg

14-1   Photograph of Printed Circuit
                     http://cipherlabs.freewebspace.com/portfolio/image089.jpg

14-2   Photograph of Test Lab Built
                     http://cipherlabs.freewebspace.com/portfolio/image107.jpg

15-1   Reprint of MSEE Diploma
                    http://cipherlabs.freewebspace.com/portfolio/image109.gif

15-2   Certificate from the American Society of Quality Control: CQE
                      http://cipherlabs.freewebspace.com/portfolio/image111.jpg

15-3   Provisional Teaching Certificate: Community Colleges of Arizona
                     http://cipherlabs.freewebspace.com/portfolio/image113.jpg

15-4   ACT-SO Program Volunteer: Maricopa County Chapter
                   http://cipherlabs.freewebspace.com/portfolio/image115.jpg

16-1   IEEE Membership for 2005
                   http://cipherlabs.freewebspace.com/portfolio/image117.jpg

16-2   IEEE Standards Association Membership for 2005
                    http://cipherlabs.freewebspace.com/portfolio/image119.jpg

16-3   IEEE Vehicular Technology Society Membership for 2005
                    http://cipherlabs.freewebspace.com/portfolio/image121.jpg


                                   Cover Page Hyperlink:

                  http://cipherlabs.freewebspace.com/portfolio/image002.jpg
CTI
 ii
                      CTI
                         CONTENTS

                               1

   PROPOSAL EXAMPLES, SAMPLE QUOTES & SCHEDULES-OF-WORK

                               2

                     ABOUT THE COMPANY…

                               3

                   CONTRACTOR‟S FACT SHEET

                               4

                            RESUME

                               5

                PROFILES OF CORPORATE CLIENTS

                               6

               CONTRACT / CONSULTING AGENCIES

                               7

SURVEY OF ELECTRONIC & COMPUTER-AIDED-DESIGN (CAD/CAM) TOOLS &
                          UTILITIES

                               8

          PARTS LIST & BILL-OF-MATERIAL (BOM) EXAMPLES



                               i
         CTI
       CONTENTS CONTINUED


                   9

       PRINTED CIRCUIT BOARDS

          COMPONENT PLACEMENT

        CIRCUIT LAYOUT GUIDELINES

         BENCH TEST PROCEDURES

          CONFIRMATORY TESTING

                   10

           PRINTED CIRCUIT

      ELECTRICAL TEST PLAN (ETP)

                   11

ANALYSIS EXAMPLE: SIGNAL CONDITIONING

  EXHAUST GAS TEMPERATURE SENSOR RANGE

                   12

       ELECTRICAL SCHEMATICS

                   13

          CLIENT REFERENCES

          ANDREW CORPORATION

       FLIGHTSAFETY INTERNATIONAL

         ADDITIONAL REFERENCES




                   ii
        CTI
     CONTENTS CONTINUED


                14

          PHOTOGRAPHS



                15

CERTIFICATES & COMMUNITY RELATIONS



                16

    PROFESSIONAL AFFILIATIONS



                17

      CONTACT INFORMATION




                iii
         CTI     1


PROPOSAL EXAMPLES, SAMPLE QUOTES &
       SCHEDULES-OF-WORK




                1-0
                          CTI
DOC. NO. ___
TITLE: STATEMENT OF WORK FOR PROJECT ID NUMBER ______




                        PROJECT ID NO. (IR-264)

                SUB-COMPACT EPIDURAL ENDOSCOPE




                             PREPARED BY
                    CIPHER TECHNOLOGIES INC.
                    890 CHERRY VALLEY ROAD
                 VERNON HILLS, ILLINOIS 60061-2626



                               FOR THE
                  BIO-MEDICS DEV. CORPORATION
                      3201 ROXY PARK CIRCLE
                 NASHVILLE, TENNESSEE 37918 USA




     17 February 2005
        Cipher Technologies Inc.




                        STATEMENT OF WORK FOR
                    PROJECT ID NUMBER (TBD) –
               SUB-COMPACT EPIDURAL ENDOSCOPE




PREPARED BY:                                          DATE:
               Kevin George, Consulting Engineer




                         CIPHER   TECHNOLOGIES INC.
                  890 CHERRY VALLEY ROAD SUITE 302
       VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
       Cipher Technologies Inc.
                       RECORD OF CHANGES

REV.     PAGES CHANGED             DESCRIPTION OF CHANGE         DATE
 -              -             Original Issue                    12-08-04




                     CIPHER   TECHNOLOGIES INC.
                  890 CHERRY VALLEY ROAD SUITE 302
       VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
            Cipher Technologies Inc.
LETTER OF INTRODUCTION


Dear Mr. Najmi,

Thank you for the opportunity to submit a quotation for evaluating your design and
schematics for the EPIDURAL SUB-COMPACT ENDOSCOPE. Specifically, the
objective of the evaluation has been set forth as follows:

      1. Evaluate the electronic circuitry for robustness and manufacturability,
      2. Determine the potential for reducing the board size, i.e. surface area and
         component profile occupied by the present design.

It is my hope that I may be of assistance in helping you meet your requirements
pertaining to this project. I look forward for the opportunity to further discuss the
project details and finalize any specifics or requirement necessary before commencing
the evaluation.



Most respectfully submitted,

Kevin J. George

Kevin George
Consulting Engineer
Cipher Technologies Inc.



/kg




                               CIPHER   TECHNOLOGIES INC.
                     890 CHERRY VALLEY ROAD SUITE 302
          VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
            Cipher Technologies Inc.
1   CONTRACTOR REQUIREMENTS

The contractor shall perform design services and produce data for the customer in
accordance with this Statement of Work (SOW). Services shall consist of providing a
confidential report describing the evaluation and meeting the requirements described
above (refer to the Letter of Introduction).

The contractor shall be available to answer questions and resolve any problems as
necessary.

 CONTRACTOR PROFILE

Contractor expertise is in the design and development of analog and digital electronic
circuits and assemblies. The contractor has been responsible for a number of electronic
designs through the full product development cycle, i.e. from early concepts through
production pilot runs. The contractor has formally trained in designing products for
manufacturability (DFM). The contractor has also led several workshops on this
important subject.

The contractor has spent well over twenty (20) years in the electronics industry, most
recently serving in the capacity of an independent consultant. Early professional years
were in a direct capacity (captive employee) for several Fortune 500 companies. The
contractor has been fortunate enough to work for a number of engineering groups serving
both privately- and publicly-owned enterprises. These companies represent a wide cross-
section or segment of the front-runners leading advances in the high-tech market place.

The contractor completed the post-secondary requirements for a Bachelor and a Master of
Science degree in Electrical Engineering from the Illinois Institute of Technology,
located in Chicago, Illinois. The contractor chose his graduate degree specialty in the
area of Circuits and Electronics.

Involved with various little „pet‟ projects and gadgets, the contractor is a home hobbyist
and „tinkerer‟ when time permits.

3 APPLICABLE DOCUMENTS

The following documents form a part of this statement-of-work to the extent specified
herein:

All work will conform to the IPC-D-330 Design Guide for Printed Wiring Boards.




                              CIPHER    TECHNOLOGIES INC.
                      890 CHERRY VALLEY ROAD SUITE 302
           VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
          Cipher Technologies Inc.
4 PROJECT DELIVERABLES

  4.1. The customer will receive a confidential report that will summarize the
       evaluation; including the results obtained the conclusions reached, etc. The
       customer will be offered recommendations or suggestions in going forward.

  4.2. Budget and Schedule

     4.2.1. The contractor will provide an estimate of time and costs associated with
            various stages of the evaluation.

     4.2.2. The contractor is responsible for maintaining and reporting schedule
            results and/or deviations as requested.

     4.2.3. The quotation and schedule of work will be submitted in a separate
            attachment accompanying this SOW.

5 DOCUMENTATION REQUIREMENTS

   The report deliverable will be in hard copy and in electronic document form using
   Microsoft Word 2000 Office application. If requested, a Windows NTTM or
   compatible CD-ROM disk will be supplied containing a copy of the evaluation
   report.

6 PROJECT BID FIGURES

  6.1. The total project budget estimate is between $2,550 and $5,640 U.S. dollars.
       These figures are from an estimate of the total man-hours required for project
       completion ranging between 30 and 66 hours with the hourly rate schedule of
       $85 U.S. dollars per hour.

  6.2. The bid figures were obtained without benefit of knowing the complexity of the
       design circuitry, or the number of separate circuit functions/sections contained
       within the design. Eight (8) separate sections or block functions within the
       schematic was the „guesstimate‟ used in arriving at most of the estimates in the
       quotation. The component count provided for the three circuit boards was
       estimated to be between 125 and 150 parts.




                             CIPHER   TECHNOLOGIES INC.
                    890 CHERRY VALLEY ROAD SUITE 302
         VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
            Cipher Technologies Inc.
7 TERMS OF AGREEMENT BETWEEN EMPLOYER AND CONTRACTOR

    7.1. The contractor has read the statement of work provided by the customer and is of
         the belief that he/she is qualified to complete the project with excellence.

    7.2. The professional profile of the contractor within this document as well as the
         information describing the services and qualifications, etc. on the CTI website is
         accurate with respect to the contractor‟s skills, availability, contact information,
         credentials, etc.

    7.3. The contractor will be prompt and courteous at all times when responding to the
         employer when he/she attempts to contact the contractor.

    7.4. The contractor will invoice and receive payment from the employer for said
         services in a timely fashion, preferably within 4 weeks upon delivery of the
         evaluation to the customer, not to exceed 8 weeks after completion.


8   NOTES




                               CIPHER    TECHNOLOGIES INC.
                      890 CHERRY VALLEY ROAD SUITE 302
           VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.



                          2


            ABOUT THE COMPANY…




                          2-0



              CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
           Cipher Technologies Inc.
About CIPHER TECHNOLOGIES




Cipher Technologies                                 incorporated the first year of the
new millennium, year 2000, set forth with the mission to provide the product
development and manufacturing community with the opportunity of securing fast
and reliable designs, without the excessive overhead or the long and costly
development cycle. The founder and principal engineer, K. George, is a graduate
of Tufts University, located in Medford, Massachusetts, from which he received
his Bachelors Degree in Electrical Engineering in 1982 with a specialization in
Power Systems. He began his engineering career with the Components Division
of Motorola Inc. in Franklin Park, Illinois, starting as a quality engineer. A few
years later, he moved into the base development group within the Fixed Products
Division located in Schaumburg, Illinois. During this period he attended the
Illinois Institute of Technology in Chicago, Illinois, where he was awarded a
Masters degree in Electrical Engineering with a concentration in Circuits &
Electronics. Mr. George has spent over twenty years in product development and
research groups, mostly with Fortune 500 companies. He has spent over eleven
years designing communications equipment for major technology leaders such
as GTE, AT&T, and the Boeing Corporation. He has worked on a number of
teams developing wireless communication products. Mr. George has industry
experience with automotive and industrial products, engine control modules, and
electronic-power steering systems. Mr. George's experience includes airborne
data recorders and signal data computers for the military, including safe-arm-and
fire devices developed for several missile defense programs.

With just over thirteen years in consulting, Mr. George has served his community
as Membership Chairperson of the Alumni Extension of the National Society of
Engineers (CAE), and is a past member of the Arizona Council of Engineers and
Scientists. He has served on the Phoenix Urban League Advisory Board for the
Employment Skills Enrichment Consortium. He is a past member of the American
Society for Quality Control (ASQC); he is a past-certified Quality Engineer. He is
a member of the Institute for Electrical and Electronic Engineers (IEEE), the
Circuits and Systems Society of the IEEE (CAS), and the Chicago/Rockford
chapter of the IEEE Consultants' Network. Mr. George was recently a voting
member of the IEEE P1616 (Draft) Standards Committee for Motor Vehicle
Emergency Data Recorders released in September of 2004 (ISBN: 0-7381-4498-
3).




                            CIPHER   TECHNOLOGIES INC.
                     890 CHERRY VALLEY ROAD SUITE 302
          VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.


                          3


             COMPANY FACT SHEET




                          3-0




              CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
             Cipher Technologies Inc.

                                          Professional

 Over twenty (20) years of experience in electronic product design and engineering for
  predominantly Fortune 500 companies
 Thirteen (13) years of experience designing communications equipment; six (6) of those
  years developing mobile communications hardware
 Over six (6+) years experience in automotive and industrial electronics equipment, i.e.
  microprocessor-based engine control modules (ECM), electronic-power steering (EPS)
  systems …
 Experience in the development of high-quality electronic systems for the defense industry, i.e.
  signal data computers, crash and structural data recorders, safe-arm-and-fire-devices …
 Experience in the development of medical products and systems driven by advances in
  biotechnology
 Twelve (12) years of experience as an independent contractor and consultant

                                            Degrees

 MSEE awarded from the Illinois Institute of Technology (IIT), Chicago, IL, with a
  concentration in Circuits and Electronics, 1988.
 BSEE awarded from Tufts University, Medford, MA, 1982.

                                         Certifications

 American Society for Quality Control (ASQC) Quality Engineer Certification, 1983

                                           Affiliations

   Member of the Institute for Electrical and Electronics Engineers (IEEE)
   Member of the IEEE Circuits and Systems Society (CAS)
   Past Member of the IEEE Vehicular Technology Society (VT)
   Member of the IEEE Consultants‟ Network Chicago/Rockford Chapter
   Past member of the American Society for Quality Control (ASQC)

                                          Recognition

 Listed in the 2002-2003 Edition of Strathmore‟s Who‟s Who Registry and Global Network




                                CIPHER    TECHNOLOGIES INC.
                      890 CHERRY VALLEY ROAD SUITE 302
           VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.

                          Products

            Barcode printers and printing products
          Signal data computers and event recorders
             Electrical Power Steering controllers
              Electronic Engine Control Modules
                         Smart Antennas
                        Beam Simulators
            Cellular (GSM) switch/base simulators
              Subscriber Line Interface Circuits
                        Flight Simulators
                 Digital Control Audio Systems
             Cabin attendant/Flight deck handsets
                       Telecom line cards
                       Telecom Test Units
                   Microwave radio modems
               Trunked base stations/repeaters
                        RF control boards
           Temperature-controlled crystal oscillators
                         Oven oscillators




               CIPHER    TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.


                          4


                       RESUME




                          4-0




              CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
               Cipher Technologies Inc.

Professional   Design of analog, digital, and mixed-system industrial, automotive, medical, telecom, wireless, and
 Summary       avionic products/equipment through full development cycle and delivery to manufacturing.
               Concept-to-manufacture. Electronic and PC-driven test and design verification. In-circuit test
               (ICT) design. Broad analog and microprocessor-based multi-layer board experience, some
               embedded application/test software and hardware descriptive languages. Experience with military
               and commercial electronics. Proven record of accomplishment in multi-tasking, meeting project
               schedules, goals. Assertive, motivated and results-oriented. Ability to plan and work
               independently without supervision. Strong technical writing with extensive EMI/EMC background.
               Good interpersonal/communication skills. Solid work ethic. Team player.

 Education                             Illinois Institute of Technology Chicago, Illinois 1988
                                       MSEE Master of Science in Electrical Engineering
                                               Field of concentration: Circuits and Electronics
                                                 Tufts University Medford, Massachusetts 1982
                                        BSEE Bachelor of Science in Electrical Engineering

Professional                   Member of the Institute of Electrical and Electronics Engineers (IEEE)
Affiliations                       Member of the IEEE Circuits and Systems Society (CAS)
                                    Member of the IEEE Standards Association (IEEE-SA)
                                  Member of the IEEE Chicago/Rockford Consultants‟ Network
                                     Member of the IEEE Communications Society (COM)


Professional   2002-2003             Under contract to BAXTER HEALTHCARE CORPORATION
Experience     Electrical Engineer
               Fenwal Division, Round Lake, Illinois Design and development of the Automatic, Mixing and Dosing System
               (AMD) for reconstitution, dose metering, and delivery of pathogen-inactivated red blood cells (medical
               instrumentation). Design and development through two revisions of the Sensor Data Acquisition Printed Circuit
               Card, providing the major sensor requirements for the AMD system. Digitized sensor information and status
               provided to master (rack) system controller via the Philips P89C668 microcontroller, Altera MAX7000 128-
               macrocell CPLD, RS-485 serial communications interface, 8-single and 16-differential-ended sensor channels,
               analog-to-digital conversion/signal acquisition circuits, switch-mode and linear DC power regulation. Additional
               design features of the 822-component, 6-layer circuit board include in-system programming (ISP) capability, RS-
               232 serial debug interface, JTAG in-circuit programming and data-download mode, I/O-latched data capture,
               external sensor power supplies. EMI suppression filtering for signal conditioning, toroids, inductors, ferrite
               beads, common-mode block filtering, ESD protection devices, RS-232/485 transceivers, LM12H458 12-Bit
               Data Acquisition System, dual voltage micro-monitor, zero-drift, low-bias, and ultra-low offset op amps,
               precision voltage references, 16-Bit Serial ADC, LDO, switched-capacitor and negative voltage regulators,
               TLC16C550C asynchronous communications element (UART), 14-Bit DAC, ultra high-speed signal line
               drivers/receivers/buffers, low-leakage analog mux. Responsible for all prototype bench and system-specific
               confirmatory testing. Low-level signal and noise measurements. Analysis of test results, evaluation of distortion
               and noise source failure mechanism(s), and successful implementation of corrective-action measures. Extensive
               noise-reduction analyses and EMI studies. Responsible for prototyping, simulation, FMEA, and design
               presentation during formal design reviews. Printed circuit board layout and design support and supervision.
               Responsible for formal documentation including Design Description (43 pgs.) and Electrical Test Plan (33 pgs).
               Knowledge/‟hands-on‟ experience with ANSI EIA/TIA standards RS-232-C, RS-422-A and RS-485, and IEEE
               1149.1 Joint Test Action Group (JTAG). IPC-D-330 Design Guide - Institute for Interconnecting and Packaging
               Electronic Circuits. OrCAD Family Release 14.0 and 9.2 (Capture CIS), GerbTool Version 12.0, AHDL,



                                   CIPHER       TECHNOLOGIES INC.
                        890 CHERRY VALLEY ROAD SUITE 302
             VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.
  MAX+PLUS II 10.2 Baseline, Flash Magic ISP Software Version 1.74 (Embedded Systems Academy), Keil
  uVision2 IDE and 8051C Debugger, Philips WinISP Version 2.29, IBM Lotus Notes 6, Microsoft Office
  Outlook 2000, Excel 2000, Power Point 2000, Word 2000, Windows NT/97, Windows ME, Publisher 2000,
  Internet Explorer 6.0, Xeltek Super Pro 2000+ Universal Programmer, Adobe Distiller/Acrobat 5.0



  2001-2002 Under contract to L-3 COMMUNICATIONS, Electrodynamics, Inc.
  Electrical Engineer
  Electrical Engineering, Rolling Meadows, Illinois Design and development of military aircraft data recorders for
  flight-event, crash, and structural data recording. Design and development of arming devices for missile
  programs, i.e. Hellfire and Legacy. Hardware consisting of 8/16-bit micros MC68661, 80C286, 8086, 8088,
  80287 math coprocessor, and various system peripherals such as 82C284 and 82C84A clock generators,
  AM9513A system timing controller, 82C54 programmable interval timer, 82C59A interrupt controller, 82C88
  bus controller and 82C87 data bus transceiver, 82C55A programmable peripheral interface (PPI), 8-bit equal-to
  comparators, programmable timers. Various memory devices including ASICs, FPGAs, PALs, PLAs, SRAM,
  EEPROM, EPROM, NOVRAM, and Flash. FAST, HCMOS, CMOS, HMOS, AC, FACT, ALS, and LS logic
  families of buffers, counters, latches, registers, etc. Precision instrumentation and operational amplifiers,
  comparators, analog switches, analog and digital data selectors, multiplex, decoders, bus transceivers, line drivers,
  parity generators and checkers, bit-rate generators. Various discrete devices including FETs, reference diodes,
  switches, rectifiers, bipolars, peak-detectors, tranzorbs, transient voltage suppressors, TVS arrays, pulse
  transformers, gap switches, high-voltage capacitors. Responsible for design and development of rocket-deployed
  safe-and-arm land-based device. Clean-sheet design of RS-422/485 data communications interface. Design of
  safe-separation timing circuits and supply-line low-pass filtering. Clean-sheet design of test circuits, interface
  cards, and test cables for safe-and-arm device. Development of automatic and manual test procedures and suites.
  Development of layout rules and design guidelines for multi-layered printed circuit boards. Responsible for
  coordinating and approving printed circuit designs and FPGA VHDL-93 and test-bench development activities.
  Responsible for the re-design of analog and vibration circuit cards (the exhaust gas temperature sensor and
  tachometer input-channel circuits processing engine over-speed detection) for next-generation advanced-signal
  data computer. Derivative-product development of analog conditioning cards for signal computer. Firmware
  modifications to vibration processor circuit card. Responsible for troubleshooting and testing of structural data
  collector and crash data recorder utilizing ATE and bench test equipment (i.e. Tektronix logic analyzers).
  Analysis of test results, evaluation of failure mechanism(s), and successful implementation of corrective-action.
  Responsible for design, simulation, worst-case analysis, documentation and presentation of designs in formal
  design review settings. Knowledge of ANSI EIA/TIA standards RS-422-A and RS-485. IPC-D-330 Design
  Guide, Institute for Interconnecting and Packaging Electronic Circuits. P-CAD 2001, OrCAD Pspice A/D
  Release 9.1, OrCAD (Schematic) Capture, Microsoft Office Outlook, Excel, Power Point, Word 97, Windows
  NT/97, Publisher, Internet Explorer 6, Adobe Acrobat 5

  2000-2001      Under contract to ZEBRA TECHNOLOGIES CORPORATION
  Electrical Engineer
  New Product Engineering, Vernon Hills, Illinois Design and development of bar code printing
  products utilizing uP-based controller for management and deployment of various label printing
  operations and functions including DC stepper-motor drive control, media, ribbon, and print head
  sensor circuits. 32-bit Hitachi Super H (SH7790A) RISC engine, DRAM, ASICs, FPGAs,
  HCMOS, and LS logic. Design of pulse detection circuits for management of ribbon spindle
  speed. Clean-sheet design of control panel test circuits. Derivative product development of next-
  generation printer products. Development of component requirements. Precision op amps,
  comparators, A/D converters, SMT fuses, econo resets, differential line drivers
  and receivers, heat-sinks, various discretes. Responsible for circuit design,


                       CIPHER       TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.
  simulation, worst-case analysis, design verification and technical documentation. Knowledge of
  ANSI EIA/TIA standards RS-422-A, RS-423-A, RS-485, and CCITT Recommendation V.11.
  Protel 99 SE Design Explorer and Schematic Capture Version 6.5.2, Electronics Workbench
  Professional Edition Version 5.12, MathCAD 2000
  Professional, Microsoft Office Outlook, Excel, Word 97, Windows NT Version 4.0, Internet
  Explorer 5, Adobe Acrobat 4



  2000                             Under contract to MOTOROLA INC.
  Electrical Engineer
  Automotive and Industrial Electronics Group, Northbrook, Illinois Design and development of electrically-
  powered steering assembly utilizing uP-based controller for control of the instantaneous electric current provided
  to 3-phase motor in response to various vehicle and sensor inputs. 32-bit Infineon C167CS processor providing
  MOSFET-bridge drive and safety-related functions interfaced to power electronics, sensor input-conditioning
  circuits, application-specific IC‟s, DC-link circuits, and various analog inputs. Precision low-noise op-amps,
  comparators, multiplexers, clock drivers, voltage regulators, relays, CMOS transistor switches and drivers, CAN
  interface circuits, EEPROM, HEXFETs, and various discrete devices. Common and differential mode chokes
  for power and EMC filtering, thermistors, sense resistors and rectifiers. Responsible for circuit analyses, power
  dissipation studies, worst-case analyses, PCB layout support, development of electrical test requirements, design
  verification testing, specification of component requirements and testing of component prototypes. PWM
  modulation techniques and motor speed control technologies. Knowledge of ISO 9141 (K-link), CAN2.0B
  (SAE J1583), RS-232 (TIA/EIA-232-F). Mentor Graphics Design Architect and Board Station, Windows 2000,
  Microsoft Word 2000, Excel 2000 and Outlook 2000

  1996–1999                        Under contract to MOTOROLA INC.
  Electrical Engineer
  Automotive and Industrial Electronics Group, Northbrook, Illinois Design and development of natural gas and
  diesel electronic engine control modules (ECMs) for automotive and high-horsepower industrial, marine, and
  locomotive applications. MC68376/MC68302 platform, analog, digital, and mixed signal circuitry for engine
  sensor and various I/O functions including spark-drive and timing, injector-firing, fuel and mixer-inlet pressures,
  engine speed and position, engine knock, high and low-side drive circuits for lamps and relays. Precision and
  low-noise op amps, comparators, multiplex, knock-signal processors, A/D and D/A converters, serial and parallel
  FET pre-drivers. FLASH memory, DPRAM, ASICs, several FET technologies including MOS, TEMP, PRO
  and TMOS E-FET. Bipolar and CMOS transistor amplifiers and switches, PWM power controllers, precision
  voltage references and regulators, data com drivers and controllers. Power devices including transformers,
  chokes, coils, ferrites and power resistors. Responsible for circuit development, simulation, verification testing,
  troubleshooting and failure-mode analysis. Responsible for development and release of new component
  specifications and requirements. Responsible for ECM test procedures. Filter compensation and stability
  analysis for fly-back power converter, transient and bode (gain-phase) analyses, control-loop compensation and
  stability analysis for linear regulation, worst-case circuit analysis (WCA), failure mode and effects (FMEA).
  Knowledge of TIA/EIA-232-F (RS-232) and TIA/EIA-485-A (RS-485), SAEJ1583 (CAN2.0B), SAEJ1587,
  SAEJ1939, SAE/TMC J1922, DIN19245 (PROFIBUS). Windows NT/4.0/95/3.1, MicroSim Pspice A/D
  8.0/7.1, MicroSim Schematics, MathCAD 8 Professional, Microsoft Excel 4.0, Microsoft Word 6.0, Microsoft
  Internet Explorer 3.0, Adobe Acrobat Reader 3.0, Netscape Navigator 3.0, MS-DOS 6.0

  1995–1996            Under contract to ANDREW CORPORATION
  System Engineer
  Research and Development, Orland Park, Illinois Multi-beam cellular and PCS base station
  „smart-antenna‟ developed from concept to fully working prototype. Responsible for design of
  system and subsystem assemblies including wireless receivers, embedded control electronics,



                       CIPHER      TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
               Cipher Technologies Inc.
               RF beam switching. Developed software and hardware requirements, features, interface
               requirements and specifications. Responsible for system capacity and throughput analysis, assisted
               in adaptive- control algorithm development. Performance prediction techniques, system test
               procedures, performance analyses for receiving and switching systems. System connectivity and
               mechanical packaging utilizing VME platform.
               Engineering Consultant
               Assisted in establishment of electronics facility, equipment procurement and personnel resources.
               Responsible for specifying electronic, embedded, and RF lab equipment, software development
               tools and packages, research materials, reference and data books. Assisted with staffing and
               personnel search. Reviewed resumes and assisted with interviews of prospective technical staff.
               Design Engineer
               Development of processor-controlled beam selector switch for smart-antenna system and PC-controlled beam
               simulator. Responsible for circuit design utilizing LSI, VLSI, and RF components. Test software development
               and programming. RF system testing of 800 MHz receivers, power-splitters, combiners, attenuators, protection
               circuits, front panel displays. Responsible for PCB layout development. Knowledge of EIA/TIA-204-D,
               ANSI/EIA-152-C, EIA/IS-20-A, TIA/EIA/IS-53-A, TIA/EIA/IS-54-A, TIA/EIA/IS-56-A. Windows 3.1, MS-
               DOS 6.0, CA-Clipper 5.3, EasyPlot, AutoCad 12

               1994–1995                     Under contract to MOTOROLA INC.
               Electrical Engineer
               European Cellular Subscriber Division, Libertyville, Illinois Troubleshooting of cellular switch-base simulator
               implementing GSM Layer 1 transceiver protocols to landline interface. VME bus-based test bed utilizing high-
               speed timing and control logic, DSP56001 speech processing, programmable logic, high-speed memory, buffers,
               timers, discrete logic. Knowledge of TDMA and CDMA modulation techniques, speech and channel coding,
               SSI and SCI data protocols. Corrected state-machine design utilizing combinatorial and registered
               programmable logic using PALASM programmable logic software. Responsible for troubleshooting of
               subscriber landline circuit cards. 6-pole Tschebyshev VF transmit and receive filters, 2-to-4 wire audio hybrids,
               off-hook and ring detection circuits, DTMF generators, A/D and D/A converters, PCM codecs-filters, echo
               cancellation circuits. Transmission testing. Employed EMI noise-suppression and elimination techniques.
               Developed EMI/EMC design guidelines. Developed printed circuit layout guidelines. Knowledge of GSM
               physical layer, GSM 03.50, GSM 05.02, GSM06.10, IEEE Std 743, IEEE Std 823, FCC Part 68, LSSGR
               Section 7-Transmission. OrCAD 3.22, PALASM (MMI), X Window System Motif Edition (X/Motif), Apollo
               Domain OS SR10.3, Frame Maker 4, Interleaf 5.0, UNIX V Release 4, VTRX OS

Professional   1993               Under contract to FLIGHTSAFETY INTERNATIONAL INC.
Experience     System Engineer
(continued)    Simulation Systems Division, Tulsa, Oklahoma Research and clean-sheet design of digital audio system for
               flight simulation of the Boeing-777 digital control audio system. Multi-channel voice and digital sound system
               incorporating signal processors, glue-logic, and 16-bit CPU. Audio distribution, control and processing
               implemented on VME platform. Knowledge of ARINC 429, ARINC 629, EIA RS-232, EIA RS-422, EIA RS-
               423, EIA RS-485, IEEE 488 and P1014 – VME bus C.1, SCSI, AES 3 (ANSI S4.40), AES 5 (ANSI S4.28),
               AES 10 (ANSI S4.43), AES17 (ANSI S4.51) and AES18 (ANSI S4.52). Digital signal processing theory and
               concepts, principles and applications. AutoCAD 12, Microsoft Word 5.5, MS-DOS 3.0


               1992               Under contract to BOEING DEFENSE & SPACE GROUP
               Development Engineer
               Commercial Avionics Systems, Seattle Washington Design and development of cabin attendant/flight-deck
               handsets for the Boeing-777 voice communication and passenger-address cabin inter-phone system. Responsible
               for hardware design and computer-aided design release of handset. Solid-state receivers, amplifiers, DTMF


                                   CIPHER       TECHNOLOGIES INC.
                      890 CHERRY VALLEY ROAD SUITE 302
           VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.
  encoders, generators, pre-amplifiers, noise-canceling and directional microphones. Knowledge of RTCA/DO-
  160C, DO-170, ARINC 600, ARINC 732, MIL-STD-454, EIA RS-485. Knowledge of acoustic theory and
  principles, measurement techniques, specialized audio equipment - Bruel & Kjaer. Mentor Graphics NetEd,
  SymEd, QuickSim, AccuSim, AutoTherm, Board Station, Apollo Aegis OS, DOC and All-In-1 Desktop
  Publishing, VAX server

  1988–1990             AG COMMUNICATION SYSTEMS CORPORATION
  Member of Technical Staff
  A joint venture of AT&T and GTE, Phoenix, Arizona Development of analog and digital line and test cards for
  enhancing and maintaining GTD-5 digital switch equipment. Responsible for embedded firmware and hardware
  development, simulation, and prototype testing of next-generation facility test unit cards. Intel 8051 MPU, A/D
  and D/A converters, pulse-tone dialers, phase-locked loops, voice-frequency filters, clock oscillators, HCMOS,
  HCTMOS and ALS logic families. Firmware developed on MCS-51 development system with MICE
  Emulator-II, Mice Symbolic Debugger. Responsible for development of auxiliary feature line card employing
  „cutting-edge‟ technology. COMBOs, CODECs, switched-capacitor filtering, timing and sequencing control
  circuits, tone detection and protection devices, line interface electronics. Knowledge of LSSGR, UL, REA, FCC
  Part 68, CCITT, ISDN specifications, DS-0 and DS-1 Line Signal Standards, D2/D3 signaling, Foreign
  Exchange (F/X), Bell Core Method 1 Reliability. PL/M-51 programming language, BRIEF Text Editor,
  TSO/SPF, Mentor Graphics NetEd, QuickSim, Analog Workbench, Interleaf, 8051 assembly, MS-DOS, VAX
  11/780

  1982–1988                            MOTORLA INCORPORATED
  Electrical Engineer
  Communications Division, Schaumburg, Illinois (1986-1988) Development of trunking modems from concept
  through manufacture. Design of circuits for base band transmit and receive modem cards. Responsible for
  design of 7-pole voice-frequency active filter, input and output conditioning, balanced receivers, audio amplifiers,
  and level-shifting attenuators. Assisted with design of 3825-Hz signaling, phase-shifters for signal modulation and
  IF recovery, band pass filtering and 4.96 MHz voltage-controlled crystal oscillator reference. Responsible for
  output filtering, alarm circuits (over-current, under-voltage) for power converter module. Responsible for circuit
  simulation.       Filter worst-case, sensitivity, and Monte-Carlo analyses.             Knowledge of receiver
  modulation/demodulation including carrier synchronization techniques. General Analysis Simulation (GAS),
  SPICE, Mentor Graphics NetEd, Fortran IV, Macintosh Word Perfect, VAX 11/780
  Systems Engineer
  Communications Division, Schaumburg Illinois (1985-1986) System design and analysis of multi-site 2-way
  radio communications systems utilizing trunked base station repeaters. Responsible for system testing and
  evaluation, troubleshooting and system documentation. Detailed system descriptions, system and site block
  diagrams, equipment interface and connection diagrams, audio and signal level-setting procedures, unique system
  information. Hewlett-Packard CAD workstation, MS-DOS
  Electrical Engineer
  Communications Division, Schaumburg, Illinois (1985) Hardware test and product verification for next-
  generation international base station RF control cards. Responsible for test and trouble shooting of analog, digital,
  and radio-frequency (IF) circuits, failure-mode analysis and resolution. Responsible for 800-MHz base station
  field-testing. Mobile radios, duplexers, power combiners, isolators, and circulators. MS-DOS, Macintosh Word
  Perfect, Hewlett-Packard HP BASIC
  Quality Engineer
  Components Division, Franklin Park, Illinois (1982-1985) Design of quality systems for frequency-
  selective components. Crystals, substrates, reeds, temperature-controlled and ovenized oscillators.
  Instructor in Manufacturing Skills Training Seminar series. ASQC Certified Quality Engineer, 1983.
  MS-DOS, Word, HP ATE System




                       CIPHER       TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.



                          5


      PROFILES OF CORPORATE CLIENTS




                          5-0




              CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
            Cipher Technologies Inc.
                            Profiles of Former Clients & Partners

Baxter International Inc. operates as a global medical products and services company with
expertise in medical devices, pharmaceuticals and biotechnology to assist healthcare
professionals and their patients with the treatment of complex medical conditions, including
hemophilia, immune disorders, infectious diseases, cancer, kidney disease, trauma and other
conditions. The Company's continuing operations consist of three segments: Medication Delivery,
which provides a range of intravenous solutions and specialty products that are used in
combination for fluid replenishment, general anesthesia, nutrition therapy, pain management,
antibiotic therapy and chemotherapy; Bioscience, which develops biopharmaceuticals, biosurgery
products, vaccines and blood collection, processing and storage products and technologies for
transfusion therapies, and Renal, which develops products and provides services to treat end-
stage kidney disease.


                       Industry      Medical Instruments & Supplies
                       Employees 51,300


                                           *****
L-3 Communications Holdings, Inc. (L-3) is a supplier of a range of products used in a number
of aerospace and defense platforms. It is also a supplier of subsystems on platforms, including
those for secure communication networks; mobile satellite communications; information security
systems; shipboard communications; naval power systems; fuses and safety and arming devices
for missiles and munitions; microwave assemblies for radars and missiles; telemetry and
instrumentation, and airport security systems. In addition, the Company is a prime system
contractor for aircraft modernization and maintenance; intelligence, surveillance and
reconnaissance (ISR) collection platforms; simulation and training, and government systems
support services. L-3's four operating segments include Secure Communications and ISR;
Training, Simulation and Support Services; Aviation Products and Aircraft Modernization, and
Specialized Products.


                         Industry       Communication Equipment
                         Employees 38,700


                                           *****
Motorola, Inc. is a global provider of wireless, broadband, automotive communications
technologies and embedded electronic products. It provides software-enhanced wireless
telephone and messaging, two-way radio products and systems, as well as networking and
Internet-access products, for consumers, network operators and commercial, government and
industrial customers. The Company also provides end-to-end systems for the delivery of
interactive digital video, voice and high-speed data solutions for broadband operators, and
embedded semiconductor solutions for customers in wireless communications, networking and
transportation markets. In addition, Motorola offers integrated electronic systems for the


                               CIPHER    TECHNOLOGIES INC.
                      890 CHERRY VALLEY ROAD SUITE 302
           VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
             Cipher Technologies Inc.
automotive, telematics, industrial, telecommunications, computing and portable energy systems
markets.

Motorola, Inc.


                          Industry       Communication Equipment
                          Employees 88,000


                                        *****
Andrew Corporation is a global supplier of communications products and systems to the
wireless subsystem infrastructure market. The Company classifies its offerings into five product
groups: Antennas, Base Station Subsystems, Cable Products, Network Solutions and Wireless
Innovations. The Antenna group products include base station antennas, earth station antennas,
multi-band antennas and point-to-point antennas. Base Station Subsystems products are integral
components of wireless base stations. Cable Products include coaxial cables, connectors, cable
assemblies and accessories. Network Solutions includes software and equipment to locate
wireless 911 callers, as well as equipment and services for testing and optimizing wireless
networks. Wireless Innovations products are used to extend the coverage of wireless networks in
areas where signals are difficult to send or receive and include both complete systems and
individual components.

                          Industry       Communication Equipment
                          Employees 7,228



                                        *****
Zebra Technologies Corporation is in the business of making products that enable companies
and organizations to improve productivity, deliver better customer service and provide security
that is more effective. It designs, manufactures and supports a range of direct thermal and
thermal transfer bar code label and receipt printers, radio frequency (RF) identification
printer/encoders, card imaging printers and digital photo printers. The Company also sells related
specialty bar code labeling materials, ink ribbons for bar code and card printers and bar code
label design software. These products are used principally in automatic identification, data
collection and personal identification applications, and are distributed worldwide through a
network of resellers, distributors and end users representing a wide cross-section of industrial,
service and government organizations.




Zebra Technologies Corporation



                                CIPHER    TECHNOLOGIES INC.
                      890 CHERRY VALLEY ROAD SUITE 302
           VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
            Cipher Technologies Inc.
                             Industry      Computer Peripherals
                             Employees 2,200



The Boeing Company, together with its subsidiaries, is an aerospace company that operates in
six principal segments: Commercial Airplanes, Aircraft and Weapon Systems, Network Systems,
Support Systems and Launch and Orbital Systems (collectively, Integrated Defense Systems
(IDS)) and Boeing Capital Corporation (BCC). The Commercial Airplanes operations principally
involve development, production and marketing of commercial jet aircraft and providing related
support services, principally to the commercial airline industry worldwide. IDS' operations
principally involve research, development, production, modification and support of products and
related systems, including military aircraft, helicopters and missiles, space systems, missile
defense systems, satellites and satellite launching vehicles, rocket engines and information and
battle management systems. BCC is primarily engaged in the financing of commercial and private
aircraft and commercial equipment.


                Industry       Aerospace/Defense - Major Diversified
                Employees 157,000


                                        *****

Lucent Technologies Inc. (Lucent) designs and delivers the systems, services and software that
drive next-generation communications networks. Lucent has three business segments organized
around the products and services it sells: The Integrated Network Solutions (INS), Mobility
services and Services segment. The INS segment provides a broad range of software and wire
line equipment related to voice networking (primarily consisting of switching products and voice
messaging products), data and network management (primarily consisting of access and related
data networking equipment and operating support software) and optical networking. Mobility
provides software and wireless equipment to support radio access and core networks. Services
are a worldwide service organization that provides deployment, maintenance, professional and
managed services in support of both product offerings, as well as multi-vendor networks.

AG Communication Systems, a subsidiary of Lucent Technologies, is a leading developer
and manufacturer of advanced telecommunication products and services, including access,
wireless and intelligent network products. AG Communication Systems‟ GTD-5b digital switching
systems, serve more than 17 million customers worldwide in business, industry and government,




as well as subscribers serviced by the public telephone network. Annual revenues for the fiscal
year ended September 1997 were $400 million.

AG Communication Systems




                               CIPHER    TECHNOLOGIES INC.
                      890 CHERRY VALLEY ROAD SUITE 302
           VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
             Cipher Technologies Inc.
                         Industry        Processing Systems & Products
                         Employees 31,800

PRESS RELEASE:                                               FRIDAY JANUARY 23, 1998

AG Communication Systems to provide advanced videoconferencing
products for Lucent Technologies

WASHINGTON, D.C., (ComNet '99) - Lucent Technologies (NYSE: LU) and AG Communication Systems, a
subsidiary of Lucent Technologies, today announced an OEM agreement for a new multiple voice line
solution. Called the SuperLine™ Access System, this solution enables service providers to deliver up to
two additional phone lines to residential and small office/home office (SOHO) customers over the same
copper wire used today for their existing phone service.




                                  CIPHER     TECHNOLOGIES INC.
                       890 CHERRY VALLEY ROAD SUITE 302
            VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.


                          6


         PAST CONSULTING AGENCIES




                          6-0




              CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
             Cipher Technologies Inc.
                         CONSULTING-CONTRACTING AGENCIES


Name                                  Professional Relationship       Dates

Dale Schoenbeck                       Senior Vice President           2002 - 2003
Accord Consulting Service Inc.
10301 W. Roosevelt Rd.
Westchester, Illinois 60154
Bus. (708) 345-7900
Baxter Healthcare Corp.

Steve Bauer                           Branch Manger
Tech Staff of Illinois
804 East Park Avenue
Libertyville, IL 60048
(847) 816-0500

Formerly:
Randall Reed                          Recruiter                       2001 - 2002
Tech Staff of Illinois
9801 West Higgins Road
Suite 580
Rosemont, Illinois 60018-4732
(847) 692-3090
L-3 Communications

Ed Gaeke                              Human Resources Manager         2000 - 2001
ESPO Engineering
855 Midway Drive
Willowbrook, IL 60527
(630) 789-2525
Zebra Technologies Corporation

Steve Bauer                           Branch Manager
Tech Staff of Illinois
804 E. Park Ave.
Libertyville, IL 60048
(847) 816-0500

Formerly:
Joseph Hubbard                        Senior Account Representative   2000
Tech Staff of Illinois
9801 West Higgins Road
Suite 580
Rosemont, Illinois 60018-4732
(847) 692-3090
Motorola AIEG




                                 CIPHER   TECHNOLOGIES INC.
                       890 CHERRY VALLEY ROAD SUITE 302
            VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
             Cipher Technologies Inc.
Name
                                       Professional Relationship   Dates
Rose Mazza                             Account Executive           1996 - 1999
Pollak & SKAN Group
25 Northwest Point Blvd.
Suite 950
Elk Grove Village, IL 60007
(708) 437-0909
Motorola AIEG

John P. Fortino                        Account Executive           1995 - 1996
Pollak & SKAN Group
25 Northwest Point Blvd.
Suite 950
Elk Grove Village, IL 60007
(708) 437-0909
Andrew Corporation

Aerotek CE (#808)
1125 Tri-State Pkwy.
Suite 710
Gurnee, Illinois 60031
(847) 782-5430
(888) 494-9343

Formerly:
Adam Szczepanski                       Contracts Manager           1994-1995
Aerotek Contract Engineering
3701 Algonquin Road
Suite 780
Rolling Meadows, Illinois 60008
(847) 590-9595
Motorola Libertyville

Joyce (Endicott) Coble                 Manager, Marketing and      1993
Wyatt & Associates Inc.                Recruiting
9235 E. Harry, P.O. Box 782500
Wichita, Kansas 67278-2500
(316) 682-6740
(800) 762-1421
Flight Safety International
EDC Inc.
419 Emmerling Place
Friday Harbor, WA 98250
(360) 378-8433
Formerly:                            Contracts Manager             1992
(206) 657-0497
Tukwila, Washington
Boeing Commercial Aircraft Group (BCAG)


                                  CIPHER   TECHNOLOGIES INC.
                      890 CHERRY VALLEY ROAD SUITE 302
           VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
   Cipher Technologies Inc.

                            7


SURVEY OF ELECTRONIC & COMPUTER-AIDED-DESIGN
          (CAD/CAM) TOOLS & UTILITIES




                            7-0




                CIPHER   TECHNOLOGIES INC.
             890 CHERRY VALLEY ROAD SUITE 302
  VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
          Cipher Technologies Inc.
Document: Electronic Design Tools-Business Utilities-Software Applications
Original Draft:   January 26, 2005
Page: 1 of 3
                                                                 Rev: 0.0
________________________________________________________________

This document identifies and provides a brief description of some of the standard
electronic design and computer-aided-design (CAD) tools and software
applications available and/or recommended for use at Cipher Technologies Inc.
Several business platforms/utilities that are recommended for reports,
presentations, electronic and/or hard copy communications are also included.

1. Analog Circuit Analysis
WinSpice3 is a general-purpose circuit simulation program for non-linear DC,
non-linear transient, and linear AC analyses. Circuits may contain resistors,
capacitors, inductors, mutual inductors, independent voltage and current
sources, four types of dependent sources, lossless and lossy transmission lines
(two separate implementations), switches, uniform distributed RC lines, and the
five most common semiconductor devices: diodes, BJTs, JFETs, MESFETs, and
MOSFETs. WinSpice3 is utilized in our analogue circuit design and electronic
modeling.

2. Printed Circuit Board (PCB) Layout and Design
CADintPCB is currently recognized as one of the best layout and schematic tools
currently available for Printed Circuit Board layout and schematic capture,
delivering a suite of functionality that was only available with heavy-duty
engineering work stations in the not too distant pass. CADintPCB allows
“dimming” of various board layers while viewing them on the workstation monitor,
rendering them opaque and resulting in the ability to view other layers
unobstructed. CADintPCB allows 3-dimensional viewing of the circuit board. We
can review the circuit board with your engineering team with all the components
placed in real 3-D viewing before the drawings and drill tapes go to fabrication.
Observing the results of „possible‟ layout errors or issues, the appropriate
component placement, the correct height and size (footprint) of the part, and the
desired component version, can result in considerable cost savings to you. The
ability to make crucial corrections before the printed circuit boards are „fabbed‟
can most likely save the design team weeks in „hunting-down‟ and finding the
right component substitutions or replacements. At the minimum, we should be
able to save the build at least a “pass” or two. With the current cost of PCB




                           CIPHER   TECHNOLOGIES INC.
                    890 CHERRY VALLEY ROAD SUITE 302
         VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
           Cipher Technologies Inc.
Document: Electronic Design Tools-Business Utilities-Software Applications
Original Draft: January 26, 2005
Page: 2 of 3                                                    Rev: 0.0

fabrication prices, this may easily result in a savings of tens of thousands of
dollars.

3. Computer Operating Systems
Windows ME (Millennium Edition)

4. Reports and Presentations
Microsoft Word 2000 (9.0.6926 SP-3) for Microsoft Publisher 2000 SP-3

5. Tables, Spreadsheets, Selected Mathematical Computations (i.e. FMEAs)
Microsoft Excel 2000 (9.0.6926 SP-3)

6. Publications and Distributions
Adobe Acrobat/Distiller 5.0.0

7. FPGA Development (i.e. coding, programming, testing, fault-simulation)

7.1    AHDL (Altera‟s High-Level Design Language)
7.2    VHDL (VLSI High-Level Design Language)
7.3    MAX+PLUS II 10.2 Development Environment for FPGAs

8. Microprocessor Development, Modeling, and Test

8.1    Embedded Systems Academy‟s (ESA) Flash Magic ISP In-System
       Programming Software Version 1.74
8.2    Keil uVision2 IDE and 8051 “C” Debugger
       The Philip Corporations‟ WinISP (In-Systems Programming for
       Windows) Version 2.29

9. Business Communications: Email, Web Access, Reports, Memos, Informal
   Correspondence
      Microsoft Office Outlook, Microsoft Outlook Express, Internet Explorer
      6.0.2800.1106, Netscape 8.0




                            CIPHER   TECHNOLOGIES INC.
                     890 CHERRY VALLEY ROAD SUITE 302
          VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
           Cipher Technologies Inc.

Document: Electronic Design Tools-Business Utilities-Software Applications
Original Draft: January 26, 2005
Page: 3 of 3                                                    Rev:0.0
________________________________________________________________

fabrication prices, this may easily result in a savings of tens of thousands of
dollars.

The originator is expected to document any addendum or changes to this policy
in a timely and expeditious manner.

Date:                Type:                Originator:           Summary:

1
2
3
4
5




                             CIPHER   TECHNOLOGIES INC.
                     890 CHERRY VALLEY ROAD SUITE 302
          VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
  Cipher Technologies Inc.


                           8


PARTS LIST & BILL-OF-MATERIAL (BOM) EXAMPLES




                           8-0




               CIPHER   TECHNOLOGIES INC.
            890 CHERRY VALLEY ROAD SUITE 302
 VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.
          Bill-of-Material (for Stepper Motor Design)

   http://cipherlabs.freewebspace.com/portfolio/image006.jpg




    8-1 Bill-of-Material for Stepper Motor Control PCB Design




                 CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.



                          9



           PRINTED CIRCUIT BOARDS


          9.1 CIRCUIT LAYOUT GUIDELINES

            9.2 COMPONENT PLACEMENT

           9.3 BENCH TEST PROCEDURES

            9.4 CONFIRMATORY TESTING




                          9-0




              CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
             Cipher Technologies Inc.


CTI
Date:   December 20, 2005
To:     Gene McDonald @ CADinc
Cc:     M. Park, P. Hunter @ Bio-Medics
From:   Kevin George
Subject: Name of New Product Design: PCB Layout Guidelines



1 Description of the New Circuit
(A brief description of the assembly, product, or sub-system for which this printed circuit board or
PCB is currently in development for.)

2 Conductor Layout Guidelines

2.1 Multi-layer Printed Wiring Boards

A multi-layer board should be used with internal conductor layers. Each layer should be
separated by a power or ground plane. Every available square inch of the printed circuit board,
which does not contain circuits or conducting runs, should be ground plane. If the circuit density
is too high, the density must be reduced in order to create more „real estate‟ for the ground plane.
This will help to insure a uniform dielectric field for the conductors, thereby minimizing capacitive
or electric coupling and the interaction of electric fields between the circuits located on the PCB.

2.2 USE the Ground Plane Liberally

It has been shown that analog-to-digital coupling noise is reduced by at least 30 dB if regions
between analog signal traces are filled with copper and then electrically attached to the analog
ground plane.

2.3 Conductor Layers (a.k.a. Signal Traces)

Adjacent conductor layers (whether analog or digital) should „run‟ perpendicular to each other and
cross at right angles. This will minimize parallel runs and subsequently reduce crosstalk and
interference. Adjacent is where each pair of layers is assumed to be sandwiched between power
and/or ground planes.

2.4 Power and Ground Conductors (Supply Leads)

Power supply and ground leads should be heavy and well located. The supply and ground-return
traces must be routed in such a way as to achieve maximum (horizontal) isolation from the other.
The supply and ground-return leads should not cross one another on the different layers of the
PCB.



                                 CIPHER     TECHNOLOGIES INC.
                       890 CHERRY VALLEY ROAD SUITE 302
            VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
            Cipher Technologies Inc.


CTI
Date:   December 20, 2004
To:     Gene McDonald @ CADinc
Cc:     M. Park, P. Hunter @ Bio-Medics
From:   Kevin George
Subject: Name of New Product Design: PCB Layout Guidelines




                                   TO BE CONTINUED…




                               CIPHER     TECHNOLOGIES INC.
                      890 CHERRY VALLEY ROAD SUITE 302
           VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
             Cipher Technologies Inc.

CTI
Date:   December 20, 2004
To:     Gene McDonald @ CADinc
Cc:     M. Park, P. Hunter @ Bio-Medics
From:   Kevin George
Subject: Name of New Product Design: PCB Layout Guidelines



                                          Bibliography

IPC-2221, “Generic Standard on Printed Board Design”, ANSI/IPC-2221, February 1998, Northbrook,
Illinois. (www.ipc.org)


Ott, H.W., “Noise Reduction Techniques in Electronic Systems,” John Wiley and Sons, New York,
1976.


Karkowski, A. and Toy, D., “Electronic Techniques Manual”, GTECSC, Phoenix, 1988.




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Cipher Technologies Inc.

                9.2 COMPONENT PLACEMENT
           RS-422 Assembly: Component Placement

    http://cipherlabs.freewebspace.com/portfolio/image008.jpg




      9-2. RS-422 ASSEMBLY: COMPONENT PLACEMENT



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           9-3 BENCH TEST PROCEDURES




     EXAMPLE: PROTOTYPE TEST PROCEDURE:




   HONDA EPS -- CONTROL PCB TESTS


            Code Version. 2000cntrl test2-rev3a

           Serial Number _________________

            Design Level __________________

            Inspected By __________________

           Date Inspected _________________

            Location _____________________




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SCOPE The various manual bench tests within this document do not intend to provide 100% test coverage, but the testing will have
  sufficient coverage so that the hardware supplied by Motorola, with a reasonably good confidence level, should operate as intended.

OBJECTIVE Specify methods and create a recording document for board level testing of the initial Honda EPS Control printed circuit
    board, before shipment to Sterling Heights for software/hardware/system integration/vehicle testing.

TESTS

I. VISUAL INSPECTION

1. Verify that all diodes, Zeners diodes, ICs, tantalum caps, electrolytic caps, connectors are properly oriented, result
2. Inspect for solder shorts, cold solder, insufficient solder, notes
3. Check for damaged components, PCB traces, components sitting on the board properly, notes
4. Verify that the board has a unique serial number, s/n
5. Identify test connector pins 1, 7, 8, 14 on back & front sides of board with permanent markings, applied?
6. Verify, that both the sensor connector is mounted at a right angle to the board, result
7. Verify that the reset pull down resistor R3 12 is not placed, verified?
8. Verify that the reset filter capacitor, C3 12 is now 100-- 220 pFd, verified?
9. Verify that reset resistor R3 11 is 0 - 10 ohm resistors, verified?
10. Verify that reset resistor R3 13 is 0 - 10 ohm resistors, verified?
11. Verify that PB0 pull up resistor; R3 15 is not populated, verified?
12. Verify that Enable resistor, R342 is not populated, verified?
13. Verify that a wire jumper connects the new Enable port, P6. 1, micro pin 2 to the flex cable connection T 10, verified?
14. Verify that Can resistor R404 is not populated, verified?
15. Verify that Can resistor R405 is not populated, verified?
16. Verify that Torque sensor capacitor, C131 is a 1500 pFd part, verified?
17. Verify that Torque sensor capacitor, C 13 3 is a 1500 pFd part, verified?
18. Verify that Torque sensor input resistor Rl 31 is a 2.OK, 1 - 5 %, 0.10/0.0625 W resistor, verified?
19. Verify that Torque sensor input resistor R134 is a 2.OK, I - 5 %, 0.10/0.0625 W resistor, verified?
20. Verify that Torque amp feedback capacitor; C132 is not populated, verified?
21. Verify that Torque amp feedback capacitor, C134 is not populated, verified?
22. Verify that Torque amp feedback diode, D 131 is a BAS70 Schottky diode (marked "CGL"), verified?
23. Verify that Torque amp feedback diode, D134 is a BAS70 Schottky diode (marked "CGL"), verified?


II. POWER SUPPLY FEEDS, MICRO OSCILLATOR, GROUNDS, SENSOR FEED

General: power supply grounds are connected to T29 (0 V)
1. With a 250 mA current limit, slowly apply (5 V) to T28 and insure 5 V is not shorted, current is _______________ mA


2. Micro-Oscillator
       a. With 5V to T28, measure micro pin 68 (R316 - R317) for 2.5V_____________VDC
       b. Place a scope probe on micro pin 13 8, momentary tap 5V to T23 (RESET), verify 6.25 MHz oscillation __________________
3. With a 250 mA current limit, slowly apply 14V to T30 and insure 14V is not shorted, current is _________________mA
4. Measure the resistance between chassis ground pad at JSEN-1 or JSEN-8 and electronic ground at T29 or TC-8, it should be an open
circuit, resistance
       reading is ___________.
5. Sensor Driver Output
General: since the micro's reset pin is held low by R312, the micro SEN DRV - CLK port should be tri-stated
       a. Short test connection pins 5 (DRV_EN) & 14 (5V) to force DRV EN into logic hi state
       b. Apply a 0V - 5V (2.5Vpk) 200KHz square wave to TC-1 (or U103 pin 9), measure U102 pin 4 voltages with respect to T29 (0 V)
at -3.5Vmin __________VDC
       c. Record the 'no-load' current drain _____________mA




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      d. Connect a 10 - 22 ohm, 3 Watt resistor across JSEN pins 2 & 3 or JSEN pins 16 and 15, measure square wave Vp-p at 3.8V p-p
      min _________Vp-p
      c. Record the current drain with a load applied __________
      d. Remove test connector short, removed? ____________

III. INPUT CIRCUITS

General: Apply in this order; all power supply/signal generator grounds to T29 (0V). 5 V/.25 A to T28 (+5V), 14 V/.25 A to T30
      (VSW), all single input test signal grounds to T29 (0V), all double input signal grounds to the appropriate signal return pin
      connection; REMOVE IN THE OPPOSITE ORDER WHEN
      TESTS ARE COMPLETE
1. ALTR Input
      a. Apply a 2.5V dc signal to JSIG-10 (ALTR), and measure micro pin 39 (or C400-R412) for 1.0 V___________ VDC
      b. Apply a 14V dc signal to JSIG-10 (ALTR), and measure micro pin 39 (or C400-R412) 5.65 V ____________VDC
      c. What is the 14V current draw ? _____________ mA
2. VSPEED Input
      a. Apply a 0V - 2.5V (1.75Vpk) 1.0 KHz square wave to JSIG-1 1 (VSPEED), check the micro pin 49 or El pin I for no output,
      result _________ VDC
      b. Apply a 0 V - 12V (6.0Vpk) 1.0 KHz square wave to JSIG-1 I (VSPEED), check the micro pin 49 or El pin 1 for a 5V square
      wave output, result
      ____________ VDC
      c. Apply a 0V - 12V (6.0Vpk) 1.0 KHz square wave to JSIG-1 1 (VSPEED), check the micro pin 50 or El pin I for a 5V square wave
      output, result
      ____________ VDC
3. PS_PHX Inputs
      a. Apply 2.5V dc on T21 (2V5 - REF), measure U101 pin 14 for 2.5V dc, result ________________VDC
      b. Short test connection pins 6 (AN_SLCT) & 14 (5V) to force AN_SLCT into logic hi state, U104 pass "I" inputs to outputs
                                                                                               HA)
      c. Apply a floating 250 mV 800 Hz sine wave between JSEN pins 9 & 12_return (PS_PHA), measure micro pin 43 or U104 pin 14
      for 500 mV
      _________Vp-p
      d. Apply a floating 250 mV 800 Hz sine wave between JSEN pins 13 & 10-return (PS_PHB), measure micro pin 44 or U104 pin 15
      for 500 mV
      _________ Vp-




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     e. Apply a floating 250 mV 800 Hz sine wave between JSEN pins 11 & 14-return (PS_PHC),
     measure micro pin 36 or U104 pin 4 for 500 mV__________
     Vp-p
     f Remove test connector short, removed? _______

4. TS_PHX Inputs
      a. Short test connection pins 5 (DRV_EN) & 14 (5V) to force DRV - EN into logic hi state
      b. Apply a 0 V - 5V (2.5Vpk) 200KHz square wave to TC-1 (or U103 pin 9), measure U102 pin 4
      c. Short test connection pins 6 (AN_SLCT) & 7 (0V) to force AN_SLCT into a logic to state, U104
      d. Apply a 0V - 250 mV (125 mVpk) 200KHz sine wave to JSEN pin 4 (TS_PHA), measure micro
      e. Apply a 0V - 250 mV (125 mVpk) 200KHz sine wave to JSEN pin 6 (TS_PHB), measure micro
      f. Remove test connector shorts (2), removed? ________

5. Phase - X, VSTAR, VLINK, VBATT Flex Connector Inputs

     a. Apply 5V to T4 (PHASE_1), measure micro pin 28 for 2V______VDC
     b. Apply 17V to T4 (PHASE_1), measure micro pin 28 for 5.6 V______VDC
     c. Apply 5V to T3 (PHASEOUT), measure micro pin 29 for 2V_______VDC
     d. Apply 17V to T3 (PHASE_2), measure micro pin 29 for 5.6 V ______ VDC
     e. Apply 5V to T2 (PHASE_3), measure micro pin 30 for 2V_______ VDC
     f. Apply 17V to T2 (PHASE - 3), measure micro pin 30 for 5.6V _______ VDC
     g. Apply 5V to T5 (VSTAR), measure micro pin 42 for 2V _______ VDC
     h. Apply 17V to T5 (VSTAR), measure micro pin 42 for 5.6V ________ VDC
     i. Apply 5V to T22 (VLINK), measure micro pin 31 for 2V ________ VDC
     j. Apply 17V to T22 (VLINK), measure micro pin 31 for 5.6V ________ VDC
     k. Apply 5V to T27 (VBATT), measure micro pin 33 for 1.4 V ________ VDC.
     l. Apply 24V (or 17 V to T27 (VBATT), measure micro pin 33 for 5.6V (or 4.7 _____ VDC)

6. TUNE-SELECT Input
     a. measure micro pin 118 Rl - C178) for 2.2 V ________ VDC
     b. Ground JSIG pin 7 (TUNE_SELECT), measure micro pin 118 (R196 - C178) for 0 V
     ___________ VDC

7. VIGN Input
      a. A ply 5V to JSIG pin 12 (VIGN), measure VIGN DIV, U302 pin 28 (or C392 - R394), for 1.2V
      ________ VDC
      b. Apply 5V to JSIG pin 12 (VIGN), measure T13 (VIGN) for 5.0 V _________ VDC
IV. OUTPUT CIRCUITS

1. LINK RLY LO
      a. Measure DC voltage at T24 (LINK_RLY_LO) ______________VDC
      b. Connect a 15 - 22 ohm I Watt resistor between T24 (LINK RLY_LO) and 5V, verify T24 output
                                                                 _

      c. Apply 5V through a I0K ohm resistor to gate of Q391 (BSP76) or LINK_LSD_EN, verify T24
      output at 0 V or a low level _____________ VDC




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Cipher Technologies Inc.




                          10


         ELECTRICAL TEST PLAN (ETP)




              CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
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              Cipher Technologies Inc.

                                           CTI Corporation
                                          Space Applications


                       This document contains information which is confidential and
                                 Proprietary to Cipher Technologies Inc.



Title:                       Sub-Compact Endoscope PCB Electrical Test Plan (ETP)

Project:                     IR-264

Document Type:               Electrical Test Plan

Document Number: TP24-43677-M05

Revision Number:             X01

Revision Date:               January 14, 2005


Approval Signatures
                                                                               Date
Edward R. Milkier, Author
Electrical Engineer,
PPC, CBRIP
Kevin Gunwale                                                                  Date
Electrical Engineer,
PPC, CBRIP
                                                                               Date
Michele Leone
Engineer,
CTI Tampa
Henry E. Goldfinger                                                            Date
Manager, Electrical Engineering,
PPC, CBRIP




                                      CIPHER   TECHNOLOGIES INC.
                        890 CHERRY VALLEY ROAD SUITE 302
             VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
          Cipher Technologies Inc.


3    1      INTRODUCTION 58
    1.1     Scope 58
    1.2     Acronyms              58
    1.3     Responsibility        63
    1.4     Applicable Documents         59
2           BLOCK DIAGRAM 61
   2.1      Test Setup 61
   2.2      PCB Photograph Error! Bookmark not defined.Error!
   Bookmark not defined.
   3        EQUIPMENT AND SUPPLIES
   4        PREPARATION / SETUP
  4.1       CPLD Programming Setup
   5        TEST CASES
   5.1      Introduction
   5.2      List Of Tests To Be Performed
   6        TEST PROCEDURE
   6.1      Introduction
   6.2      Visual Inspection
   6.2.1    General Visual Inspection
   6.2.2    SAG-Specific Visual Inspection
   6.2.3    Rework and Repair-X1
   6.2.4    Continuity Verification
   6.3      Preliminary Tests
   6.3.1    Power-up
   6.3.2    Power Regulation and DC TPed Verification
   6.4      CPLD Programming and Verification
   6.4.1    Verify the following Items :
   6.4.2    Connect JTAG Programmer Connector :
   6.4.3    “Max+plus-II” program Initialization:
   6.4.4    Perform CPLD Programming and Verification Operations :
   6.5      Test Procedures
   6.5.1    LED (Powered) Inspection
   6.5.2    Jumper Functions (w/ Micro Installed)
   6.5.3    Input and Output Port States
   6.5.4    Microcontroller and Data Acquisition System Oscillators U3 and
   U19
   6.5.5    Input Signal Amplifiers - 1
   6.5.6    Input Signal Amplifiers – 2*
   6.5.7    While Programming the EPM7128S CPLD (See Appendix for
   Details)


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                     890 CHERRY VALLEY ROAD SUITE 302
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      Cipher Technologies Inc.

6.5.8    After Programming the EPM7128S CPLD
6.6      UART Debug Board
6.6.1    General Visual Inspection
6.6.2    Power-Up
6.7      PCB Board Diagnostics
6.7.1    Establish Communication
6.7.2    Sensor Board Diagnostics
6.7.3    Initial Test - Cycle Status LEDs
6.7.4    CPLD ID Registers
6.7.5    Version ID Test
6.7.6    Output Latch Testing
6.7.7    8051 Test Menu
6.7.8    Receive Interrupt Request
6.7.9    Analog-To-Digital Conversion Test
7        TYPICAL UNIT TEST REPORT 62
8        POST TEST CLEANUP 62
9        DOCUMENT CHANGE APPROVAL PROCESS                   62
10       REVISION HISTORY             62
11       APPENDIX Error! Bookmark not defined.Error! Bookmark not
defined.
11.1     Appendix A: Sensor Amplifier I/O Channel
11.2     Appendix B: Special Instructions
11.3     Appendix C: Diagnostic Menu Selections
11.3.1   MAIN MENU
11.3.2   8051 TEST MENU
11.3.3   READ ADC0 INPUTS MENU
11.3.4   READ ADC1 INPUTS MENU
11.3.5   READ ADC2 INPUTS MENU
11.3.6   SET OLATCH OUTPUTS MENU
11.3.7   CPLD COMMAND MENU
11.4     Appendix D: PCB Voltage Specifications Error! Bookmark not
defined.Error! Bookmark not defined.




                    CIPHER   TECHNOLOGIES INC.
                890 CHERRY VALLEY ROAD SUITE 302
     VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
         Cipher Technologies Inc.

INTRODUCTION
    Scope
         This document describes the electrical test plan for the PCB P/N:
         TP24-43677-M05 Circuit Board Assembly used in the PPC.
    Acronyms
         The following terminology may be used in this document:

    Term                                   Description
  ADC
  AHDL
  PPC
  AMP
  APQP
  BOM
  BST
  CAD
  CPLD
  CPU
  DAS
  DEX
  FMEA
  FSM
  GSH
  HCT
  HF
  IAP
  ID
  INTR
  ISP
  JMP
  MAX
  MC
  MDD
  MPU
  MSRT
  MTBF
  ICA
  IIP
  JTAG
  LAN
  LED
  LC
  PCB
  PDF
  PI



                       CIPHER   TECHNOLOGIES INC.
                890 CHERRY VALLEY ROAD SUITE 302
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    Cipher Technologies Inc.
PIC
PIRC
QSR
RBC
REG
RFID
RTL
SCD
SAG
SDS
SOF
SRI
TUI
UART
S-303
SAL
SNAIN
SyRS
TTL
TUI
VHDL



   Responsibility
          The engineer responsible for the design, test and documentation of
          PPC PCB is Kevin Gunwale.

   Applicable Documents
             TP428-SRD-001                PPC Subsystem Design Specification
             TP428-ERD-0001               PPC Electrical Requirements Definition
             TP428-DD-0010                PPC Design Description
             TP428-IDD-1008               PPC Interface Design Description
          The most recent revisions of the CTI drawings/databases listed
          below define this PCB.

      CTI
                                     Description                             Comments
   Dwg / Part #
                       PCB Configuration Drawing,
        T0-1282-009                                           Physical PCB
                       PPC
                       Bill Of Material ( BOM ),              BOM used to build the
        TB1-1282-009
                       PPC PCB                                GLK FGIOJR PCB Assembly




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   VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.

               Assembly Drawing,
 T1-1282-009                                        Assembled PPC PCB has this Rev. Level
               PPC PCB
               Board Blank,
 T2-1282-009                                        Bare, Physical PPC PCB
               PPC PCB
               Net List File,
 T3-1282-009                                        Net List
               PPC PCB
                                                    Physical Plotted reference Artwork,
               PCB Artwork reference Plots,
 T4-1282-009                                        Made from SK- 3RKVLKFGLM Gerber
               PPC PCB
                                                    Files
               Fabrication / Drill Drawing,
 T5-1282-009
               PPC
               Schematic Drawing,
 T6-1282-009
               PPC PCB
               Gerber Files,
 T9-1282-009                                        Gerber Files
               Sensor Data Acquisition PCB

               Programmed Logic Device ( File )
 T7-935-10xx   PPC PCB,                             Programmed CPLD Configuration
               U2, V1.0xx, CS/CRC Xxxxxx

               Programmed Microprocessor (File )
 T7-935-10yy   PPC PCB,                             Programmed Microcontroller Configuration
               U1, V1.0yy, CS/CRC Yyyyyy




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           890 CHERRY VALLEY ROAD SUITE 302
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         Cipher Technologies Inc.


     SYSTEM BLOCK DIAGRAM
                                                       Test-Setup
                                                                                  PC


                                                                      Parallel
                                                                       Parallel
                                                                      Port          COM Port
                                                                       Port




                                     IEEE 1284-1994                                    RS232


                                      Parallel Cable


                                                       RS485 to RS232
                                                       Converter
Altera Byte Blaster MV                RS485

                                                                          RS-232 Cable

 BACK PLANE
                                              UART Debug PCB
                         JTAG1   JMP3                                     RS-232 Cable
                                                 P2
                                     P2
                                      P2    J1
                                                 P3
                                                           NULL Modem Cable
                                                           For In-System-Programming
                                                              S
                                                    e
                                                    n
                                     PCB Photograph s
                                                    o
                                                    r

                                                                  D
     12V Power
12V Power Supply                                                  a
                                                                  t
                                                                  a
                                                A
                                 TECHNOLOGIES INC. c
                            CIPHER
                      890 CHERRY VALLEY ROAD SUITE 302
                                                   q
        VERNON    HILLS, ILLINOIS 60061, UNITED STATES                    OF AMERICA
                                                   u
                                                   i
                                                   s
                                                   i
                                                   t
          Cipher Technologies Inc.

TYPICAL UNIT TEST REPORT


  Test Results for the PPC PCB                      Serial No. _____________

   Test                              Title                                          Value

     1
     2
     3
     4
     5
     6
     7
     8




POST-TEST CLEANUP
DOCUMENT CHANGE APPROVAL PROCESS
REVISION HISTORY



                                         Description
   Date       Revision   Author


   12-20-04     X10      E. Miller       Document Created by Edward Miles
                         K. George       Technical Information provided by K. Gunwale




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Cipher Technologies Inc.




           SENSOR POWER SUPPLY VOLTAGES

 VOLTAG     TOL        NOM       MAX.     MIN.     VOLTAGE
     E      (%).      (VDC)      (VDC)   (VDC)    REGULATOR
 (NAME)
  12V_DC     10        12.0       13.2    10.8      NONE

  VSW6       2.0       5.95       6.07    5.88      LM2673

   VA5       2.5       4.99       5.12    4.87    LT1763CSA

   VD5       2.0       5.02       5.12    4.92      REG104

VSW6NEG      2.5      -5.95      -5.80   -6.10      LT1054

 VANEG      -4/+6     -4.00      -3.76   -4.16      LT1175




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Cipher Technologies Inc.




                          11



      WORST-CASE ANALYSIS EXAMPLE:
             SIGNAL CONDITIONING


   EXHAUST GAS TEMPERATURE SENSOR RANGE




                         11-0



              CIPHER   TECHNOLOGIES INC.
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          Cipher Technologies Inc.


DATE             February 24, 2005

PROJECT          ANALOG CONDITIONING CIRCUIT - ANALYSIS OF THE
                 EXHAUST GAS TEMPERATURE SENSOR RANGE

APPLICATION      System Data Recorder

MODULE           Analog EGT - Sensor Signal Conditioning Card

CIRCUIT          Input Conditioning

SECTION          Precision Instrumentation Amplifier

THEORY           Refer to Appendix




PREPARED BY:
                      Curtis Somers, Test Engineer

RELEASE DATE: _______________________________________________


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RECORD OF DESIGN SECTION CHANGES

 REV.     PAGES CHANGED             DESCRIPTION OF CHANGE         DATE
  -              -             Original Issue                    20041211




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ANALYSIS The Exhaust Gas Temperature Range, designated T6, has increased from
         1000 0C to 1350 0C for this new application. Subsequently, the thermo-
         couple sensor output in this application will increase from +/-40.14
         mV to +/-54.125 mV. A full-scale output at +/5VDC is desired in order to
         utilize the full-scale resolution of the 12-bit analog to digital conversion (0
         to 2,048 counts or 0x0000 to 0x0800 hexadecimal) executed by the
         Analog Conversion/Excitation Card. The existing circuit must be
         modified in order to accommodate the wider input range.




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COMPUTATIONAL ANALYSIS : ANALOG SIGNAL INPUT AND
                             RATIOMETRIC DIGITAL READING:

Exhaust Gas Temp (T6) Scaling Overall Range
(See also Section 1.4.4.30 of PPS 6008496C - 2/20/2000)

0      <=      0 0C            <     1350
0      <=      ADC VDC         <     5
0      <=      8-bit counts    <     256
0      <=      12-bit counts   <     2,048
0      <=      Sensor VDC      <     0000.054125

Exhaust Gas Temperature 12-Bit Format

Degree/Count = 1,350 0C/2,048 counts = 0.659179688
E units = 0.0 + 0.659179688 * Counts
Counts = 0.0 + 1.517037037 * E units

Exhaust Gas Temperature Channel Output Voltage in Counts (or Bits)

VO (counts) / 2048 counts = VO (volts) / VO (volts F.S.)
VO (counts) = VO (volts) / VO (volts F.S.) * 2,048 counts = 409.6 * VO (volts)

Exhaust Gas Temperature Channel Output Voltage in Counts (or Bits) vs. Channel Input
Voltage

In general,
       Channel Gain =
                    Output Response / Input Stimuli = Output Voltage / Input Voltage

In this case: G = 5.00000V / 0.054125V = 92.378752887

Or
       VO (volts)     = 92.378752887 * VIN (volts)

And
       VO (counts)    = 409.6 * 92.378752887 * VIN (volts)

                      = 37,838.3371825 * VIN (volts)

Where 2,048 counts (base 10) or 0x0800 (base 16) is full-scale output or 5.000VDC.



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COMPUTATIONAL ANALYSIS continued

Note also that 37,838.33610 = 0x93CE16 and 409.610 = 0x019916


Summary

VO (counts) = 409.6 * VO (volts)

VO (counts) = 37,838.3371825 * VIN (volts)

E units = 0.0 + 0.659179688 * Counts

Counts = 0.0 + 1.517037037 * E units

Initial Assumptions

1) VOUT = (VIN / RG) * RS or VOUT / VIN = RS / RG (See Design Principle in Appendix).

2) RSCALE (the resistance between pins 10 and 13) should be set to 100K +/-15%. If
   RSCALE < 85K the output swing of the AD521 is reduced; at values of RSCALE above
   120K and below 80K the stability of the AD521 may be compromised.

Current EGT Channel Model (Refer to Figure 2)

Component Values:
R62 = 98.8K
R54 ~ 1.1K (200 < R54 < 1.6K)
R38 = 768.0
R46 = 24.3
R78 = 5.11K
R70 ~ 6.0K (4.7k <= R70 <= 6.0K)
R22 = 1.0 M
R30 = 1.0 M
C30 = 0.1 UF
C38 = 0.1 UF

RSCALE = R54 + R62 = 98.9K + 1.1K = 99.9K

RGAIN = R38 + R46 = 768.0 + 24.3 = 792.3


                             CIPHER    TECHNOLOGIES INC.
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COMPUTATIONAL ANALYSIS continued

Ideal Design Parameters:

Since RSCALE =! 100.0K nominally and VOUT =! 5.000 V

VOUT = VIN * (RS / RG) = VIN (100.0 K / 792.3) = 126.214817620 * VIN

VIN = 5.000V / 126.214817620 = 0.039615000 V

The actual input range is +/-40.14 mV

VOUT == 40.14 mV (126.214817620) + VOFFSET

Set VOFFSET = 0 (through trim resistors R70 and R78)

Therefore VOUT = 5.06626277927 V

The gain range (approximation) for this channel can be interpolated from the actual input
and output ranges:

GAINMIN = VO(MIN) / VIN(MAX)

GAINMAX = VO(MAX) / VIN(MIN)

GAINNOM = (VIN(MAX)/VO(MIN) + VIN(MIN) / VO(MAX)) / 2

GAINMIN = VO(MIN) / VIN(MAX) = 5.00000 V / 0.04014 mV = 124.564025909

GAINMAX = VO(MAX) / VIN(MIN) = 5.06626 V / 0.039615 V = 127.887416383

GAINNOM = (VIN(MAX)/VO(MIN) + VIN(MIN) / VO(MAX)) / 2 =

           = (GAINMIN + GAINMAX) / 2 = 126.225721146

RSCALE = 99.9K +/- 1% or 98.901 <= RSCALE <= 100.899K

RGAIN(MAX) = (GAINMAX) -1 * RSCALE(MAX) = (VIN / VOUT)MAX * RSCALE(MAX)

              = 8.028E-3 * 100.899E3 = 810.017172


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                     890 CHERRY VALLEY ROAD SUITE 302
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RGAIN(MIN) = (GAINMIN) -1 * RSCALE(MIN) == (VIN / VOUT)MIN * RSCALE(MIN)
COMPUTATIONAL ANALYSIS continued

               = 7.8194E-3 * 98.901E3 = 773.344264

RGAIN(MID) = (GAINNOM) -1 * RSCALE(NOM) == (VIN / VOUT)NOM * RSCALE(NOM)

               = 7.923E-3 * 99.900E3 = 791.5077


For the present case:


RGAIN(MAX) = (GAINMAX) -1 * RSCALE(MAX) = (VIN / VOUT)MAX * RSCALE(MAX)

               = (54.125 V / 5.000E3) * 100.899E3

               = 10.825E-3 * 100.899E3 = 1,092.2317

RGAIN(MIN) = (GAINMIN) -1 * RSCALE(MIN) == (VIN / VOUT)MIN * RSCALE(MIN)

               = (54.125 V / 5.06626E3) * 98.901E3

               = 10.6834E-3 * 98.901E3 = 1,056.6012


RGAIN(MID) = (GAINNOM) -1 * RSCALE(NOM) == (VIN / VOUT)NOM * RSCALE(NOM)

               = (54.125 V / 5.033E3) * 98.901E3

               = 10.7540E-3 * 99.9000E3 = 1,074.3269

Provided with standard, ‘off-the-shelf’ 1 % resistor values, two possible solutions are:


                                                          RGAIN (ohms)
      R38         P/N        R46         P/N        MIN     NOM       MAX




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1.0K     71R5FS   71.5     71R5FS   1060.1   1071.5   1082.2

1.05K    1051BS   23.2     23R2FS   1062.5   1073.2   1083.9




                  CIPHER   TECHNOLOGIES INC.
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COMPUTATIONAL ANALYSIS continued


The remaining component values of this particular circuit section do not change:


New EGT Channel Model

Component Values:
R62 = 98.8K
R54 = 1.1K
R38 = 1.0K
R46 = 71.5
R78 = 5.11K
R70 ~ 6.0K (4.7k <= R70 <= 6.0K)
R22 = 1.0 M
R30 = 1.0 M
C30 = 0.1 UF
C38 = 0.1 UF




                            CIPHER   TECHNOLOGIES INC.
                     890 CHERRY VALLEY ROAD SUITE 302
          VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
              Cipher Technologies Inc.

APPENDIX


I. THE COMPUTATIONAL MODEL

Figure 1 is a simplified schematic of the AD521. A differential input voltage, VIN,
appears across RG causing and imbalance in the currents through Q1 and Q2, delta I =
VIN/RG. That imbalance is forced to flow in RS because the collector currents of Q3 and
Q4 are constrained to be equal by their biasing (current mirror). These conditions can
only be satisfied if the differential voltage across RS (and hence the output voltage of the
AD521) is equal to delta I * RS. The feedback amplifier, AFB performs that function.
Therefore, VOUT = VIN/RG * RS or VOUT/VIN = RS/RG.




    Figures 1 and 2 (above and below, respectively). Simplified AD521 schematic and
                              Analog Channel Spice model




                               CIPHER   TECHNOLOGIES INC.
                       890 CHERRY VALLEY ROAD SUITE 302
            VERNON HILLS, ILLINOIS 60061, UNITED STATES OF AMERICA
Cipher Technologies Inc.




              CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
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Cipher Technologies Inc.



                          12



    ELECTRICAL SCHEMATICS & DRAWINGS




                         12-0



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                  PCB Schematic Page 1 of 2

   http://cipherlabs.freewebspace.com/portfolio/image095.jpg




                  12-1 PCB Schematic Page 1



                  PCB Schematic Page 2 of 2


   http://cipherlabs.freewebspace.com/portfolio/image097.jpg




                  12-2 PCB Schematic Page 2




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                 PCB System Block Diagram


   http://cipherlabs.freewebspace.com/portfolio/image099.jpg




               12-3 PCB System Block Diagram




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                          13


              CLIENT REFERENCES
        COMMENTS FROM FORMER CLIENTS

              ANDREW CORPORATION

          FLIGHTSAFETY INTERNATIONAL

             ADDITIONAL REFERENCES




                         13-0




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    Cipher Technologies Inc.

         Comments from Former Clients of CTI


“…pursued each task aggressively and completed then on or before schedule.”

                                      Group Leader, Electrical Engineering

“…learned the unique requirements of audio systems quickly…”

                                      Section Manager, Electrical Engineering

“…[CTI has] demonstrated to be extremely competent in all areas treated,
researching and carrying out work activities diligently in all areas … theoretical
analysis, circuit design, system development and testing.”
                                      Manager, Advanced Technology Group


“…work was of high quality and well-documented.”

                                      Senior Lead, Electrical Engineering

“ Our project and also a testing system were successfully completed within
timescale constraints.”

                                      Manager, Development Engineering


“[CTI] has my highest respect for [their] work and I would have no problem
recommending [CTI] for future [projects].”

                                      Director, Engineering Technology

“…highly satisfied with the work [CTI] has done and would recommend [CTI]
for future
[projects].”

                                      Group Leader, Research and Development




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                         13-1




              CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
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Cipher Technologies Inc.

                ANDREW CORPORATION

             Recommendation from Andrew Corp.

   http://cipherlabs.freewebspace.com/portfolio/image101.jpg




                             13-2




                 CIPHER   TECHNOLOGIES INC.
           890 CHERRY VALLEY ROAD SUITE 302
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Cipher Technologies Inc.


            FLIGHTSAFETY INTERNATIONAL


       Recommendation from FlightSafety International


   http://cipherlabs.freewebspace.com/portfolio/image103.jpg




                             13-3




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           890 CHERRY VALLEY ROAD SUITE 302
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          Cipher Technologies Inc.

               ADDITIONAL PROFESSIONAL REFERENCES

Name                            Relationship                Dates

Assem (Sam) Koniali             Engineering Manager         2002 - 2003
Baxter Healthcare Corporation
RL Plastics: RLP-30
Route 120 and Wilson Roads
Round Lake, IL 60073
(847) 270-4013

W. Page Hatch                   Senior Principal Engineer   2002 - 2003
Baxter Healthcare Corporation
RL Plastics: RLP-30
Route 120 and Wilson Roads
Round Lake, IL 60073
(847) 270-4690

Gary Cygan                      Electrical Engineering      2001 - 2002
Electrodynamics, Inc.           Manager
1200 Hicks Road
Rolling Meadows, IL 60008
(847) 259-0740

Greg Butler                     Director of Engineering     2001 - 2002
Electrodynamics, Inc.
1200 Hicks Road
Rolling Meadows, IL 60008
(847) 259-0740

Russell Andrey                  EE Section Manager          2001 - 2002
Electrodynamics, Inc.
1200 Hicks Road
Rolling Meadows, IL 60008
(847) 259-0740

Jeffrey Schroeder              Engineering Manager          2000 - 2001
Zebra Technologies Corporation
333 Corporate Woods Parkway
Vernon Hills, IL 60061
(847) 793-2758
                                    13-4


                         CIPHER   TECHNOLOGIES INC.
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         Cipher Technologies Inc.


Name                           Relationship              Dates

Eugene Wineinger                Team Leader              2000
Motorola AIEG
Autobody, Chassis & Sensors Div
4000 Commercial Avenue
Northbrook, IL 60062-1840
(847) 480-5237

Phil Desmond                    Section Manager          2000
Motorola AIEG
Autobody, Chassis & Sensors Div
4000 Commercial Avenue
Northbrook, IL 60062-1840
(847) 480-5000

Steve Turner                    Group Leader             1996 – 1999
Motorola AIEG
Autobody, Chassis & Sensors Div
4000 Commercial Avenue
Northbrook, IL 60062-1840
(847) 480-5000




                                   13-5




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                          14


                    SELECTED

                 PHOTOGRAPHS




                         14-0




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              Photograph of Printed Circuit Board

   http://cipherlabs.freewebspace.com/portfolio/image089.jpg




                   14-1. PRINTED CIRCUIT




              Photograph of Test Lab Developed

   http://cipherlabs.freewebspace.com/portfolio/image107.jpg




                       14-2. TEST LAB



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                          15


                  CERTIFICATES

                         AND

                  RECOGNITION
                         OF
              COMMUNITY SERVICE




                         15-0



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                      Reprint of MSEE Diploma

      http://cipherlabs.freewebspace.com/portfolio/image109.gif




    15-1 Master of Science Diploma in Electrical Engineering MSEE




Certificate from the American Society of Quality Control: ASQC - CQE


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   15-2 Certificate from the American Society of Quality Control: CQE




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 Cipher Technologies Inc.

Provisional Teaching Certificate: Community Colleges of Arizona

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15-3 Provisional Teaching Certificate Community Colleges of Arizona




     ACT-SO Program Volunteer: Maricopa County Chapter

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     15-4 ACT-SO Program Volunteer Maricopa County Chapter




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                          16


         PROFESSIONAL AFFILIATIONS




                         16-0




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                   IEEE Membership for 2005

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                 16-1   IEEE Membership for 2005




               IEEE Standards Membership for 2005

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        16-2     IEEE Standards Association Membership




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   IEEE Vehicular Technology Society Membership for 2005

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           16.3 IEEE Vehicular Technology Society




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                          17



            CONTACT INFORMATION




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                          17-0


         We look forward to serving you!

        Contact us through the World Wide Web:

     mailto: Ctiadmin@ciphertechnologiesinc.com

                           or

                   visit our web site

            www.ciphertechnologiesinc.com



                   Call or write to us:

              CTI ADMINISTRATION

              Telephone: (847) 680-9147



               Facsimile: (847) 680-3538

                Mobile: (224) 715-2473




                 Business Address:

            CIPHER TECHNOLOGIES INC.

                    SUITE NO. 302

             890 CHERRY VALLEY ROAD




              CIPHER   TECHNOLOGIES INC.
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         VERNON HILLS, ILLINOIS 60061-0026


              Thank you for your time.

                       The Staff

   Your comments and suggestions are always welcome!




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