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Semiconductor Device In Which Chip Electrodes Are Connected To Terminals Arranged Along The Periphery Of An Insulative Board - Patent 6013944

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1. Field of the InventionThe present invention generally relates to semiconductor devices and methods for producing semiconductor devices, and particularly, to a package structure of a semiconductor device so a surface-mount type which makes a high-density mountingpossible and a method for producing such a package structure of a semiconductor device. The size of the package is about the same as the size of a semiconductor chip (element) on which a plurality of bumps are provided over the entire surface thereof.Recently, semiconductor chips have been highly integrated so that the size thereof may be reduced in accordance with a reduction in size of an electronic device such as a handy-phone. Accordingly, there are demands for a package for asemiconductor device having a size which is suitable for containing a size-reduced semiconductor device and for a method for producing such a package for a semiconductor device.2. Description of the Related ArtFIG. 1 is a diagram showing a conventional flip-chip type semiconductor device. A flip-chip mounting technique is used to reduce the size of a semiconductor chip and mount it on a board.In FIG. 1, the semiconductor device includes a semiconductor chip 101, a plurality of bumps 102 connected to respective electrodes formed on the semiconductor chip 101, a mounting board 103 on which a plurality of lands for mounting respectivebumps 102 are provided, and a resin 104 for sealing the semiconductor chip 101 and the plurality of bumps 102.As for the structure of the semiconductor device shown in FIG. 1, each of the electrodes formed on the surface of the semiconductor chip 101 is directly connected to the respective land on the mounting board 103 via the corresponding bump 102. Then, the resin 104 is inserted between the semiconductor chip 101 and the mounting board 103 in order to absorb the difference in thermal expansion coefficient therebetween and to protect the surface of the semiconductor chip 101 and the plurality ofb

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