Lead-free Electronics Workshop - DOC

							                  Lead-free Electronics Workshop
                        December 16, 2004
                          Presenter Bios

Todd W. MacFadden, Mabbett & Associates/Bose Corporation
Todd recently took a position as Component Engineer with Bose Corporation in
Framingham working to ensure RoHS-compliant products. Recently, he has worked with
Mabbett and Associates, Inc. to develop WEEE & RoHS implementation and lead-free
transition programs for the electronics industry in North America and Europe. He worked
for five years at the Toxics Use Reduction Institute (TURI) coordinating the MA Lead-
Free Electronics Research Consortium and the Electronics and Metal Finishing Supply
Chain Initiatives. He is Team Leader for the National Electronics Manufacturers
Initiative (NEMI) Roadmap Committee and has served on the Board of Directors for the
National Pollution Prevention Roundtable. Todd has a Bachelor’s degree in political
science from the University of Colorado at Boulder, and a Master of Science degree in
chemical engineering from the University of Massachusetts Lowell.


Greg Morose, Massachusetts Toxics Use Reduction Institute
Greg is coordinating the efforts of the New England Lead-free Electronics consortium.
He is also conducting alternatives assessments for products containing lead, mercury, and
brominated flame retardants. Previously, Greg was a management consultant with
KPMG Consulting responsible for project management, business process improvement,
and supply chain management projects. Greg has also worked for seven years in the
electronics and computer industry in manufacturing, design, and sales engineering
positions. Greg has a Bachelor’s degree in Mechanical Engineering, a Masters of
Science degree in Environmental Studies, and Masters of Business Administration
degree.


John Sharp, Teradyne
John is the Environmental and Safety Manager for the Connection Systems Division of
Teradyne. He is the past Chair of the IPC Environmental, Health, and Safety Committee.
He has worked for Merix Corporation, CH2M Hill, Texas Eastman Chemical Co., and
Conoco Chemicals, focusing on environmental and safety issues throughout his career.
He has a Bachelor’s degree in Chemical Engineering, a Master’s degree in
Oceanography, a Master’s degree in Environmental Engineering, and is a Professional
Engineer in the fields of Chemical and Environmental Engineering. He is the leader of
the IPC Material Declaration Guideline project, and is a member of the drafting
committees of the Joint Industry Material Composition Declaration Guide and the IPC
Lead-free Labeling Standard.
Helena Pasquito, M/A-COM
Helen has twenty years of experience in many different functional areas including
fourteen years as manufacturing supervisor with the Defense Missile
Components/Systems Group. Helena is a certified instructor in IPC-A-610C
Acceptability of Electronic Assemblies, IPC-A-600 Acceptability of Printed Boards,
IPC/WHMA-A-620 Requirements and Acceptance for Cable and Wire Harness
Assemblies, and IPC/EIA J-STD-001C Requirements for Soldered Electrical and
Electronic Assemblies. She is a member of IPC-A-610 Technical Committee (working
on next revision of the standard), IPC/WHMA-A-620 Space Addendum Task Group,
ESD Assoc., SMTA (Surface Mount Technology Assoc.) and the New England Lead-
Free Electronics Consortium. Helena has a Bachelor’s degree in Business Management
and Human Resources Management from Southern New Hampshire University.


Ronald C. Lasky, Ph.D., P.E., Indium Corporation
Ron is currently a Senior Technologist at Indium Corporation and a Visiting Professor at
Dartmouth College. Prior to these assignments, he had over twenty years experience in
electronic and optoelectronic packaging at IBM, Universal Instruments and Cookson
Electronics. He has authored or edited 5 books on science, electronics, and
optoelectronics and numerous technical papers. Dr. Lasky holds numerous patent
disclosures and is the developer of the several new concepts in SMT processing software
relating to cost estimating, line balancing and process optimization. He is the co-creator
of engineering certification exams in electronic assembly. Ron was awarded the Surface
Mount Technology Association’s Founder’s Award in 2003. He owns four earned
degrees, including a Ph.D. from Cornell University in Materials Science. Ron is also a
licensed professional engineer.


Elsa Kam-Lum, Allegro Microsystems
Elsa is currently working on various initiatives for Allegro Microsystems including the
following: green molding compounds, lead-free task force, and power management
assembly and packaging. Elsa is a member of the NEMI Tin Whiskers Testing Group,
the JEDEC 14.1 Tin Whiskers Measuring Spec Task Force, and the JEDEC 14.3
Qualification Requirements for Tin Whiskers Task Force. Elsa holds 1 patent and is an
author/co-author of several papers. Elsa has a Master’s degree in Chemical Engineering
from MIT, and a Master’s degree in Engineering Management from Northeastern
University.