The Effect of Pre-Aging on the Electromigration of Flip-Chip SnAg Solder Joints

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The Effect of Pre-Aging on the Electromigration of Flip-Chip SnAg Solder Joints Powered By Docstoc
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Description: By controlling the annealing conditions, solder bumps with various IMC thicknesses can be fabricated. Since electromigration failure occurs in the chip side of the solder joints, the thickness of the Ni^sub 3^Sn^sub 4^ layer on the substrate end will not be discussed in this paper. The Ni^sub 3^Sn^sub 4^ layer was 1.96 m on the chip side before aging. Figure Ia through c show the cross-sectional SEM images for the solder bumps after the solid-state aging at 170C for 0 h, 5 h, and 50 h.
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