VTS 23 Cryostats Technical Design Report

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VTS 23 Cryostats Technical Design Report Powered By Docstoc
					                                                                                         Doc. No. TID-N-253
                                         VTS 2&3 Cryostats                               Rev. No. 1.0
                                                                                         Date: Nov. 24, 2009
RRCAT       FNAL
                                     Technical Design Report                             Page 1 of 18




    RAJA RAMANNA CENTRE FOR                            FERMI NATIONAL ACCELERATOR
     ADVANCED TECHNOLOGY                                       LABORATORY
            (RRCAT)                                               (FNAL)




                              VTS 2&3 Cryostats
                            Technical Design Report




 Prepared by:                                         Internally Reviewed by:
 R. Rabehl, FNAL                                      Ruben Carcagno, FNAL
 S. Raghvendra, RRCAT                                 Camille Ginsburg, FNAL
 N. K. Sharma, RRCAT                                  S. C. Joshi, RRCAT
 S. K. Sunahe, RRCAT
 C. Sylvester, FNAL




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                                            VTS 2&3 Cryostats                              Rev. No. 1.0
                                                                                           Date: Nov. 24, 2009
RRCAT         FNAL
                                        Technical Design Report                            Page 2 of 18



                                                  Revision History

Revision     Date       Secti                                  Revision Description
                         on
                         No.
  1.0      11/24/09      All    Initial Release




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                                                                VTS 2&3 Cryostats                                                         Rev. No. 1.0
                                                                                                                                          Date: Nov. 24, 2009
RRCAT              FNAL
                                                         Technical Design Report                                                          Page 3 of 18




 TABLE OF CONTENTS

 1.      SCOPE................................................................................................................................................... 4

 2.      APPLICABLE DOCUMENTS............................................................................................................ 4

 3.      INTRODUCTION ................................................................................................................................ 4

 4.      CRYOSTAT DESCRIPTION ............................................................................................................. 4

 5.      OPERATIONAL OVERVIEW........................................................................................................... 6

 6.      CRYOSTAT DESIGN.......................................................................................................................... 7
      6.1. PROCESS DESIGN ............................................................................................................................ 7
        6.1.1. Differences between VTS1 and VTS2&3................................................................................. 7
        6.1.2. P&IDs..................................................................................................................................... 8
        6.1.3. Cryogenic Valve Sizing........................................................................................................... 8
        6.1.4. Inter-dewar transfer ............................................................................................................... 8
        6.1.5. Valve and Instrument List....................................................................................................... 9
        6.1.6. Relief system valve sizing...................................................................................................... 11
      6.2. MECHANICAL AND MAGNETIC SHIELD DESIGN ......................................................................... 11
 7.      INTEGRATION DESIGN ................................................................................................................. 13
      7.1. PROCESS INTEGRATION DESIGN ................................................................................................. 13
        7.1.1. Integration P&ID ................................................................................................................. 13
        7.1.2. Inter-dewar transfer ............................................................................................................. 13
        7.1.3. Valve and Instrument List..................................................................................................... 13
      7.2. MECHANICAL INTERFACE DESIGN ............................................................................................. 14
        7.2.1. Interface flange..................................................................................................................... 14
        7.2.2. Top Plate assembly............................................................................................................... 16
        7.2.3. Support in pit ........................................................................................................................ 17
 8.      SUMMARY......................................................................................................................................... 17

 9.      DRAWINGS........................................................................................................................................ 18

 10.         REFERENCES ............................................................................................................................... 18




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                                     Technical Design Report                             Page 4 of 18


 1. Scope

 This document describes the VTS 2&3 Cryostats Technical Design, including the design
 of the integration of these cryostats into Fermilab’s Industrial Building 1 (IB1) Test
 Facility.

 2. Applicable Documents

 The basis for design of the Cryostat is the VTS2&3 Functional Requirements
 Specification [1] and the VTS2&3 Technical Requirements Specification [2].

 3. Introduction

 The Fermilab’s ILC/SRF program office has identified the need for expanding the test
 capability of the Industrial Building 1 (IB1) Vertical Cavity Test Facility (VCTF),
 including increased test throughput for 9-cell elliptical TESLA-style cavities and ability
 to test additional cavity types. This expansion requires the addition of two more Vertical
 Test Stands (VTS-2 and VTS-3). The VTS 2&3 Functional Requirements Specification
 [1] describes the functional requirements for expanded SRF cavity testing in the VCTF,
 and the VTS 2&3 Technical Requirement Specification [2] describes the technical
 requirements that the VTS 2&3 Cryostats must satisfy. These two documents provide the
 design input for this report.

 The VTS 2&3 Cryostat project is conducted in collaboration with Indian Institutions. The
 VTS 2&3 Statement of Work [3] references the relevant MOUs and defines the
 institutional responsibilities for this project. This primary Indian Institution involved with
 the VTS 2&3 engineering design effort is the Raja Ramanna Centre for Advanced
 Technology (RRCAT). This design report is a result of contributions from both Fermilab
 and RRCAT. Fermilab’s contributions include process design and IB1 Test Facility
 integration design, while RRCAT’s contributions include mechanical and magnetic shield
 engineering design for the VTS 2&3 Cryostats.

 The design presented in this report is not intended for a built-to-print procurement of the
 cryostats, and it does not include cryostat fabrication details that will be captured in a
 separate procurement specification. The RRCAT mechanical design follows the ASME
 BPV Code Section VIII, Div. 1 and the ANSI B31.3 guidelines. However, just like the
 VTS-1 procurement, it will be the cryostat manufacturer responsibility to develop the
 Code compliant design and associated fabrication drawings and documentation. The
 RRCAT design included in this report will be provided to potential vendors for bidding
 purposes only as reference. Vendor recommended changes to these drawings will be
 evaluated and approved by the collaboration prior to fabrication to ensure that the
 proposed changes do not adversely impact any operational requirements.

 4. Cryostat Description




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                                     Technical Design Report                             Page 5 of 18


 Each VTS 2&3 cryostat assembly includes the 2K liquid helium vessel, the vacuum
 vessel, LN2 cooled shield, top plates and inserts, valves, internal radiation shielding,
 internal and external magnetic shielding, and process instrumentation. These cryostats
 must meet the operational requirements outlined in the Functional Requirements
 Specification [1].

 3-D models of portions of the liquid helium vessel assembly are shown in Figure 1 and
 Figure 2. An example of an insert assembly is shown in Figure 3.




         Figure 1 – View of the Pumping and              Figure 2 – Helium Vessel
         Relief Line                                     Assembly




                      Figure 3 – An example of a VTS2&3 insert assembly



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                                     Technical Design Report                             Page 6 of 18


 Engineering details concerning the Mechanical and Process design for the cryostat is
 provided in section 6.

 5. Operational Overview

 Several operating modes must be accommodated by the cryostat during cavity testing.
 Starting immediately after a test object is installed, there is a check of the o-ring seals,
 followed by several repeated steps of filling the dewar with clean helium at 35 psig and
 then evacuating the helium as a way to remove contamination which was introduce while
 the vessel was at atmospheric pressure, from the system. Only after the contamination is
 at an acceptable level as indicated by the oxygen monitor, does the operator proceed to
 the other modes which include:

     1. LN2 cooldown of cryostat shield
     2. Cool down and hold for 8 hours at 100K for Q disease test
     3. Liquid helium cooldown to 4.5K
     4. Overnight condition
     5. Refill at 4.5K
     6. Refill at 4.5K and cooldown to 2K
     7. Refill at 2K
     8. RF Testing
     9. Warm up from 2K to 290K
     10. Warm up from 4.5K to 290K

 Additional details regarding these modes and the procedures used during each mode can
 be found in the VTS-1 Cryogenic Operating Procedure [4] and the VCTF Cavity Test
 Procedure [5]. VTS2&3 will operate similar to VTS1 but with one additional operating
 mode. This new mode is the inter-dewar transfer of liquid helium form one cryostat to
 another after the end of a test. The details of the inter-dewar transfer are captured later in
 section 6.1.3. A typical energy dissipation plot for an ILC style 9-cell cavity is shown in
 Figure 4. A total energy deposition of 125 kJ corresponds to the vaporization of 37 liters
 of 2 K liquid helium.




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                                                                Technical Design Report                                       Page 7 of 18



                                                                 IlC - TB9ACC012 - Tested 5/15/09
                                                                         Effects of 80W Kinney #1 Pump Limit
                                                150


                                                          Energy Deposited
                  Total Energy Deposited (kJ)

                                                100


                                                                       Close shiedling lid



                                                50




                                                 0
                                                      0   500        1000          1500      2000        2500   3000   3500
                                                                                 Elapsed Time (sec)


             Figure 4 – A typical Energy Dissipation profile in a 9-cell RF Cavity

 6. Cryostat Design

    6.1. Process design

    6.1.1.           Differences between VTS1 and VTS2&3

 Some of the design features of VTS1 are not adopted in the VTS2&VTS3 design. This
 decision is based on operational experience with VTS1, plus the added benefit of
 simplifying the cryostat design. Unlike VTS1, VTS2&3 will not use a J-T heat
 exchanger, phase separator, or a 5K shield, and will have the relief line connection
 relocated away from the top plate. The rationale for elimination of the 5K shield, phase
 separator, and the J-T heat exchanger is in [6], [7], and [8] respectively.

 The 6.9 W calculated increase in the 2 K heat load [6] that accompanies elimination of
 the 5 K shield is 8% of the pumping capacity of a single Kinney pump skid, or 2.7% of
 the pumping capacity of three manifolded Kinney pump skids. This percentage becomes
 even less significant for test configurations where cavities are placed lower in the
 cryostat.

 The phase separator was used to generate 5K gas to cool the 5K intercept in VTS1. Since
 the 5K shield was eliminated for the VTS2&3 cryostats, there is no longer a need for the
 phase separator.

 Based on operational experience with VTS1 and the expected modes of operation for
 VTS2&3 given in [1], the J-T HX has been eliminated from the VTS-2 & 3 cryostat
 design. The cryostat design allows for the accumulation of 180 liters of 2K liquid above



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                                     Technical Design Report                             Page 8 of 18


 the uppermost cavities, enough to perform three typical, cavity tests (Figure 4) with the
 fill valve is closed. In other words, there is no need to control liquid level while the cavity
 is dissipating power. The other calculated benefits from a J-T heat exchanger during
 cooldown and fill are considered marginal.

 The relief line was relocated from the top plate to eliminate the need for LOTO controls
 on the cryogenic valves while a cryostat is at atmospheric conditions.

    6.1.2.        P&IDs

 Three new P&IDs focusing on the new VTS2 and VTS3 cryostats have been generated.

 Drawing 1670.000-ME-418338 is a simplified flow schematic for the cryostat piping and
 top flange interface. Liquid nitrogen enters through a bayonet connection, cools the
 thermal shield, and leaves through a tubing connection. Liquid helium and gaseous
 helium enter through their respective ports and flow to either the top fill valve or the
 bottom fill valve. The helium return from the cryostat is through the pumping line.
 There are three process instrumentation locations: the pumping line (pressure), the liquid
 helium supply (pressure and temperature), and the bottom fill valve inlet (pressure and
 temperature). Measuring process conditions at the bottom fill valve inlet will be useful
 for Q-disease studies where 100 K helium must be supplied to the helium vessel.

 Drawings 1670.000-ME-418351 and 418352 are detailed P&IDs of the VTS2 and VTS3
 cryostat, respectively, and associated piping. The cryostats and external piping are
 identical for VTS2&3, except for additional VTS3 isolation valves and trapped volume
 relief valves to be installed during VTS2 installation in preparation for future VTS3
 installation as discussed in [12].

    6.1.3.        Cryogenic Valve Sizing

 Sizing of the cryostat top and bottom fill valves can be found in [9]. The bottom fill
 valve is sized for initial cool-down and fill, and for system warm-up. The top fill valve is
 sized for concurrent pump-down and fill, 2K refill, and 2 K liquid level control.

 The recommended valve sizes are Cv = 1.2 for the bottom fill valve and Cv = 0.5 for the
 top fill valve. The recommended bottom fill size is the smallest valve that will not limit
 the IB1 liquid helium supply flow rate to VTS2&3 based on VTS1 operational data. The
 recommended top fill valve size provides the required flow rates while providing margin
 for two-phase liquid helium supply conditions.

    6.1.4.        Inter-dewar transfer

 Inter-dewar transfer will allow liquid helium remaining in a cryostat at the conclusion of
 testing to be transferred to another cryostat for cool-down and partial filling. This is a
 required function of the VTS-2 & 3 cryostats as per section 5.1.4.6 of the VTS-2 & 3




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                                     Technical Design Report                             Page 9 of 18


 Cryostats Technical Requirements Specification [2] and the purpose is to optimize the
 liquid helium usage, since the time required to complete a cavity test is relatively short.

 Inter-dewar transfer will require storage of liquid helium in a VTS cryostat at the
 conclusion of testing until a second VTS cryostat is ready to cool down. The 7 W heat
 load due to heat conduction and thermal radiation from the 80K intercept and thermal
 shield will boil away 0.37 g/s of 4.5K liquid when the cryostat is maintained at 4.5K in
 anticipation of inter-dewar transfer to another VTS. This is a volumetric boil-off rate of
 11 l/hr, a rate which will decrease as the liquid level drops. The volume of 4.5K liquid
 helium remaining in VTS2&3 at the conclusion of testing ILC-style 9-cell cavities will be
 at least 1,000 liters. The 7 W heat load will vaporize no more than half of the remaining
 liquid in VTS2 or VTS3 after two days, providing operational margin to prepare a second
 VTS to receive the inter-dewar transfer.

 The process design of each cryostat includes features that will allow liquid to be pushed
 out of the cryostat. A cryostat can be pressurized by adding warm helium gas above the
 liquid bath. The liquid is then pushed from the bottom of the cryostat, through the
 bottom fill valve, and out of the cryostat through the liquid helium supply line. This is
 back-flowing through the same piping used to cool and fill the cryostat.

 Section 7.1.2 of this document addresses inter-dewar transfer in more detail as it relates
 to cryogenic system integration of the multiple cryostats.

    6.1.5.        Valve and Instrument List

 Table 1 is a simplified valve and instrument list with preliminary manufacturers and part
 numbers for the VTS2&3 cryostats. The VTS2 cryostat uses 2900 series tag names, and
 the VTS3 cryostat uses 3000 series tag names.

 All components included in this table are integrated with the cryostats. Components
 related to cryostat integration are tabulated in section 7.1.3 of this document.

           Table 1 Simplified valve and instrument list for the VTS-2 & 3 cryostats.
 VTS-2 tag      VTS-3 tag          Description                Manufacturer      Part Number
 Control Valves
 LCV-2920       LCV-3020           Top fill valve             CPC-Cryolab       CV8-084-CWTR1E-CB
 LCV-2930       LCV-3030           Bottom fill valve          CPC-Cryolab       CV8-084-CWTR1E-CB

 Manual Valves
                                   LHe supply bayonet ball
 HV-2908          HV-3009                                     Nibco             1-12” S-595Y-66
                                   valve
                                   Vacuum vessel pump-
 HV-2948          HV-3048                                     Leybold           28532
                                   down valve
                                   LN2 supply bayonet ball
 HV-2984          HV3084                                      Nibco             1-12” S-595Y-66
                                   valve




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                                     Technical Design Report                              Page 10 of 18


 Safety/Relief Devices
                                   Vacuum vessel parallel
 PSE-2948         PSE-3048                                     Fermilab
                                   plate relief
 PSE-2991         PSE-3091         Secondary rupture disk      BS&B             JRS
 PSE-2996         PSE-3096         Primary rupture disk        BS&B             JRS
                                   LHe supply trapped
 PSV-2908         PSV-3008                                     Circle Seal      M5159B-2M-100
                                   volume relief
                                   LN2 supply trapped
 PSV-2984         PSV-3084                                     Circle Seal      M5159B-2M-100
                                   volume relief
 PSV-2990         PSV-3090         Secondary relief valve      Crosby           3L4 JOS-E-12-S-J
 PSV-2995         PSV-3095         Primary relief valve        Crosby           2K3 JOS-E-12-S-J

 Pressure Transducers
 PT-2910        PT-3010            LHe supply pressure         Sensotec         FPA1BN2Y5B6A14C
 PT-2935        PT-3035            LHe/GHe pressure            Sensotec         FPA1BN2Y5B6A14C
                                   2 K bath pressure (0-100
 PT-2940          PT-3040                                      MKS              230EA00100EB
                                   Torr)
                                   2 K bath pressure (0-
 PT-2941          PT-3041                                      MKS              230EA001000EB
                                   1000 Torr)
                                   Insulating vacuum
 PT-2948          PT-3048                                      Varian           F0472301 (Model 531)
                                   pressure

 Temperature Sensors
 TE-2910-A/B TE-3010-A/B           LHe supply temperature      Lakeshore        Cernox CX-1030-SD
                                   Cryostat bottom
 TE-2912          TE-3012                                      Lakeshore        Cernox CX-1030-SD
                                   temperature
                                   Cryostat mid-bottom
 TE-2913          TE-3013                                      Lakeshore        Cernox CX-1030-SD
                                   temperature
                                   Cryostat mid-top
 TE-2914          TE-3014                                      Lakeshore        Cernox CX-1030-SD
                                   temperature
 TE-2915          TE-3015          Cryostat top temperature    Lakeshore        Cernox CX-1030-SD
                                   LHe/GHe supply
 TE-2935-A/B      TE-3035-A/B                                  Lakeshore        Cernox CX-1030-SD
                                   temperature

 Liquid Level Indicators
                                   Cryostat bottom liquid      American
 LE-2912          LE-3012                                                       135-2 K
                                   level                       Magnetics
                                   Cryostat bottom liquid      American
 LE-2913          LE-3013                                                       135-2 K
                                   level                       Magnetics
                                                               American
 LE-2914          LE-3014          Cryostat top liquid level                    135-2 K
                                                               Magnetics
                                                               American
 LE-2915          LE-3015          Cryostat top liquid level                    135-2 K
                                                               Magnetics

 Heaters
 JXE-2912         JXE-3012         Cryostat heater             Hot Watt

 Lead wires from process instruments will be routed from the cryogenic environment to
 room temperature via 1/4 inch diameter stainless steel tubing and terminated to fittings or
 multi-pin connectors at the 300K surface. Instrumentation tube runs from the helium
 space to 300K are heat-sinked to the 80K surface and are routed uphill from the 2K to the
 300K surface with a minimum tube length of 36 inches.




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                                     Technical Design Report                             Page 11 of 18




    6.1.6.        Relief system valve sizing

 The required relieving capacities for the primary and secondary relief systems have been
 determined using the guidelines given by industry standards such as the Compressed Gas
 Association (CGA) S-1.3, American Petroleum Institute (API), and the ASME BPV
 code.

 A model was developed based on the vent line routing from the cryostats to the relief
 devices as shown in Figure 5. The capacity of the helium relief system design takes into
 account the SRF cavity types and configurations outlined in the VTS2&3 Functional
 Requirements Specification [1]. Details of the model and the analysis can be found in
 [10].

 The primary relief system consists of a 1.5 in rupture disk/1.5 in orifice relief valve
 combination. Each device has a 55 psig (70 psia) set pressure.

 The secondary relief system consists of a 2 in rupture disk/1.9 in orifice relief valve
 combination. Each device has a 65 psig (80 psia) set pressure, which is the MAWP of
 the helium vessel. This system satisfies the maximum relieving requirements, which is
 due to air condensation on the surfaces of two ILC-style 9-cell cavities and the cavity
 pumping line.




                              Figure 5 – Helium Relief piping layout

 From [1], the MAWP of all devices under test is expected to be above 10 psig relative to
 vacuum. Therefore, a 10 psig non-coded relief is being sized for this purpose and will be
 integrated in the relieving system of all cryostats as indicated on the P&IDs.

     6.2. Mechanical and Magnetic Shield Design



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 The mechanical design of the cryostat and the magnetic shielding design were performed
 by RRCAT. The elements designed include the top plate, the liquid helium vessel,
 vacuum vessel assembly, LN2 cooled shield, and magnetic shields (internal and external).
 For the cryostat assembly, the design was done based on the requirements in the ASME
 BPV code and ANSI B31.3 Process Piping code. Magnetic analysis was performed and
 the result of these analyses indicate that the requirements for the field inside the cryostat
 during 2K operation, and the compliance of the cryostat to the ASME code as specified in
 [2] are satisfied.

 Details of the VTS 2&3 cryostats mechanical design, magnetic shield design, and heat
 load calculations are documented in VTS 2&3 Cryostats Engineering Design Report [11].

 The heat load to the 80K and 2K temperature levels of the cryostat from conduction and
 radiation was calculated by RRCAT. A summary of the result of the heat load analysis is
 shown in Table 2.

                      Table 2 - Heat Load Summary (provided by RRCAT)




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 7. Integration Design

     7.1. Process Integration Design

    7.1.1.        Integration P&ID

 A flow schematic for the integration of VTS2&3 with the IB1 cryogenics system has
 been generated (1670.000-ME-418350). This is a high-level flow schematic showing
 process circuits and valving for the vertical test area of IB1, including VMTF and VCTF.
 Instrumentation, trapped volume reliefs, and similar components are not shown on this
 drawing for the sake of clarity and legibility. These details are found on the P&IDs
 referenced from the high-level flow schematic. These P&IDs were developed and
 internally reviewed to address the operational, safety, and integration requirements found
 in [12] and [13]. The final report of the internal P&ID review can be found here [13].

 Integration of VTS2&3 as shown in the high-level flow schematic requires these
 cryostats to interface with the IB1 process circuits. Table 3 provides a summary of these
 circuits and the typical process conditions of each circuit.

                  Table 3 IB1 process circuits for VTS2&3 integration.
       Circuit              Source            Pressure (psia)       Temperature (K)
    Liquid helium     IB1 storage dewar             22                  4.68
   Gaseous helium       IB1 buffer tanks            50                   300
   Liquid nitrogen        IB1 dewar                 65                    93
                          IB1 dewar
   Gaseous nitrogen                                 65                   300
                           vaporizer

    7.1.2.        Inter-dewar transfer

 Provisions have been made to allow liquid helium remaining in a cryostat at the
 conclusion of testing to be transferred to another cryostat for cool-down and partial
 filling. A procedure to accomplish this is outlined in [12]. Also as described in [12], the
 third cryostat can be double-isolated from all active cryogenic circuits. This will provide
 personnel safety in the event this third cryostat is warm with its test insert removed.

 The pressure ratings of each cryostat are identical, and therefore connecting one cryostat
 to another through the inter-dewar transfer piping does not risk over-pressurizing one
 cryostat due to an operational emergency on the second cryostat. For operational
 considerations, interlocks will be implemented to prevent inter-dewar transfer if an
 abnormally high cryostat pressure is present.

    7.1.3.        Valve and Instrument List

 Table 4 is a simplified valve and instrument list with preliminary manufacturers and part
 numbers for integration of the VTS2&3 cryostats as shown on drawing 1670.000-ME-




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                                                                                           Doc. No. TID-N-253
                                         VTS 2&3 Cryostats                                 Rev. No. 1.0
                                                                                           Date: Nov. 24, 2009
RRCAT          FNAL
                                     Technical Design Report                               Page 14 of 18


 418350. The VTS2 cryostat uses 2900 series tag names, and the VTS3 cryostat uses
 3000 series tag names.

           Table 4 Simplified valve and instrument list for the VTS-2 & 3 cryostats.
 VTS-2 tag       VTS-3 tag         Description                 Manufacturer     Part Number
 Actuated Valves
 YCV-2901        YCV-3001          LHe supply (storage         CPC-Cryolab      CV8-084-CWPY1B
                                   dewar) isolation valve
 YCV-2902         YCV-3002         LHe supply (inter-dewar     CPC-Cryolab      CV8-084-CWPY1B
                                   transfer) isolation valve
 YCV-2916         YCV-3016         Helium cool-down            CPC-Cryolab      2116-CWPY1B
                                   return valve
 YCV-2917         YCV-3017         Helium outside vent         Worcester        2-C4466-PM-SWO
                                   valve
 YCV-2918         YCV-3018         Helium compressor           Worcester        2-C4466-PM-SWO
                                   return valve
 YCV-2944         YCV-3044         Pumping line isolation      PHPK             PV-70-40
                                   valve
 YCV-2962         YCV-3062         Cryostat pump-down          Worcester        2-4466T-SWO
                                   isolation valve
 YCV-2964         YCV-3064         Warm helium isolation       Asco             8210G094
                                   valve

 Manual Valves
                                   LHe supply (storage
 --               HV-3001          dewar) isolation valve      CPC-Cryolab      CV8-084-CWPG1M
                                   (redundant)
                                   LHe supply (inter-dewar
 --               HV-3002          transfer) isolation valve   CPC-Cryolab      CV8-084-CWPG1M
                                   (redundant)
                                   Warm helium isolation
 HV-2933          HV-3033                                      Swagelok         SS-8UW-TW
                                   valve
                                   Thermal shield LN2
 HV-2982          HV-3082                                      CPC-Cryolab      CV8-084-CWTY1M
                                   supply isolation valve
                                   Thermal shield LN2
 --               HV-3083          supply isolation valve      CPC-Cryolab      CV8-084-CWTG1M
                                   (redundant)
                                   Thermal shield GN2
 HV-2985          HV-3085                                      Worcester        ½” 4466TSE
                                   vent valve


       7.2. Mechanical Interface Design

      7.2.1.      Interface flange

 Provision for the connection of each cryostat to the cryogenic infrastructure and for the
 room temperature mounting of valves and other process instrumentation is required per
 section 6.2 of the Technical Requirements Specification [1]. Drawing 1670.000-ME-
 418391 captures these requirements on the helium vessel top flange, and a visual
 representation of this is provided in Figure 6.




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                                     Technical Design Report                             Page 15 of 18


 At this interface the connections to actuators for the cryogenic valves, bayonets,
 instrumentation wire termination, pressure taps, pumping line, and gas supply line for the
 inter-dewar transfer operation are made up. This flange is part of the helium vessel
 assembly in addition to functioning as a cover for the vacuum vessel; therefore, its design
 must also be compliant with the ASME BPV code. Additional details regarding the
 mechanical design of this flange can be found in [11].




                                     Figure 6 – Interface Flange

 The function for each nozzle in Figure 6 on the interface flange is captured in Table 5.

                             Table 5 - Cryogenic Interface connections
                         Nozzle       Function
                         A            In-dewar Instrumentation and o-ring seal
                                      pump out
                         B            Instrumentation Wire Terminations
                         C            GN2 Return line
                         D            Cryogenic valve (top fill)
                         E            Helium Gas Supply
                         F            Liquid Helium Supply Bayonet
                         G            Pumping Line
                         H            Relief Line
                         I            Liquid Nitrogen Supply
                         J            Cryogenic valve (top fill)
                         K            Cryostat vacuum pump-out/seal

 Instrumentation mounted on this flange originate from within the cryostat process piping
 or from inside the dewar and include RTDs (Cernox® and Platinum), helium liquid level
 sensors, warm up heater, and pressure sensors. In the case of the heater, liquid level
 sensors and RTDs, the lead wires from these devices will be routed to the connector
 block via tubing. The wires will be terminated using a standard multi pin connector used
 in IB1 and is then installed on the connector block which is machined with the required
 o-ring groove and mounting holes to accept the standard connector. An example of this
 type of connector which has been used successfully on several test stands in IB1 is
 Amphenol PT02H-14-19P.



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                                     Technical Design Report                             Page 16 of 18




    7.2.2.        Top Plate assembly

 The top plate design for VTS 2 & 3 incorporates features for the feed-through of RF
 power and instrumentation signals from a device under test at cryogenic temperature to
 the room temperature instrumentation connector. It also has provisions for support of the
 cavity test insert with payload, and is designed to support the maximum payload weight
 given in section 5.6 of [2].

 Structural details of the mechanical design of the top plate are outlined in section 6.2 of
 this document. The primary differences between the design of the top plates for VTS 1
 and VTS 2 & 3 are the larger number of penetrations (to accommodate the higher
 numbers of cavities to be tested at one time), an increase in size of the penetration for the
 pumping line, a larger penetration dedicated to support of diagnostic instrumentation, and
 elimination of the penetrations for the He vessel relief and 5K shield. The penetrations
 are all designed to include Conflat® flanges as their interface, for ease in installing
 various RF and instrumentation feed-throughs, which can be readily obtained from
 commercial sources.

 A shown in drawing 16700.000-MD-418343, the VTS-2 & 3 top plate design
 incorporates thirteen (13) 2.75 inch Conflat® flanges, one (1) 4 inch Conflat®, and one (1)
 6 inch diameter Conflat®. The 2.75 inch diameter ports are intended for RF power and
 signal cables (using tee or cross fittings to expand capacity), while the 4 inch Conflat is
 intended for diagnostic instrumentation and the 6 inch diameter Conflat is used for the
 cavity vacuum pumping line. In practice a particular port may be outfitted with a
 different feed-through, used for different functions, depending on the test purposes and
 test objects (as documented in section 4 of [1]). An example of this flexibility is given in
 Table 6.




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                                               Technical Design Report                                                 Page 17 of 18


                          Table 6 – Top Plate Instrumentation feed-through Options
       Test Protocol             Signals Needed                 Port # and Use                       Hardware Attached

  Six 1.3GHz 9-cell        24 RF signals                   1-12 for RF signals        1-6 : RF Input cables (single)
  cavities, production
                                                                                       7-12 : 3 RF feedthoughs (“N”-type) and CF
                                                                                       “cross” fitting on each
                           4 Cernox RTD’s                  13 for RTD’s                13: Multipin connector feedthrough, CF-type
  Three 1.3GHz 9-cell      12 RF signals                   1-3, and 7-9 for RF signals 1-3 : RF Input cables (single)
  cavities, production
                                                                                      7-9 : 3 RF feedthoughs (“N”-type) and CF
                                                                                      “cross” fitting on each
                           4 Cernox RTD’s             13 for RTD’s                    13: Multipin connector feedthrough, CF-type
  Two 1.3 GHz cavities,    4-8 RF signals (may or may 1-4 for RF signals              1-2 : RF Input cables (single)
  R&D                      not have HOM’s)
                                                                                      3-4 : 3 RF feedthoughs (“N”-type) and CF
                                                                                      “cross” fitting on each
                           4 Cernox RTD’s                  13 for RTD’s               13: Multipin connector feedthrough, CF-type
                           32 Cernox RTD’s (FTS),          11-12 for RTD’s and SS     11-12: 3 multi-pin connector s mounted on a CF
                           16 Second sound sensors                                    “cross” fitting, on each
  One 1.3 GHz cavity,      Same as for two 1.3 GHz 9-
  R&D                      cell cavities (except half as
                           many RF signals)

  One SSR1 cavity, R&D Same as for one 1.3 GHz 9-
                       cell cavity (maximum of 2
                       RF signals)

  One SSR2 cavity, R&D Same as for one SSR1
                       cavity
  One TSR cavity, R&D Same as for one SSR1
                       cavity


     7.2.3.              Support in pit

 The cryostats will be installed in corresponding vertical shaft located in the main floor of
 the IB1 Test Facility at Fermilab. To suspend the cryostat in this shaft, swivel leveling
 pads will be used. The vacuum vessel flange has provisions for mounting these threaded
 units into tapped holes at six (6) locations equally spaced on a bolt circle diameter of 57
 inches. Part number HVTL-5SS from Reid Tool supply rated for 22000 pounds each is
 the specified leveling pad based on the loads.

 The cryostat assembly as designed fits in the dimensional envelope specified in 5.2 of [2].
 Refer to sheet #2 and #3 of Fermilab drawing 10-1-198 for shaft construction details
 which show the stainless steel ring on which the level pads sit, anchored into the concrete
 structure.

 8. Summary

 In conclusion, this report and associated design references capture the design which
 satisfies requirements of the Functional Requirements Specification and the Technical




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                                         VTS 2&3 Cryostats                                 Rev. No. 1.0
                                                                                           Date: Nov. 24, 2009
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                                     Technical Design Report                               Page 18 of 18


 Requirements Specification for VTS2&3 cryostats. It is the result of a collaborative effort
 among Fermilab and Indian Institutions, and constitutes one of the first deliverables of
 the US-IIFC collaboration. This report will be the basis for preparing the procurement
 documentation for VTS-2 and VTS-3

 9. Drawings

 Drawing number            Rev     Description (lines 2 and 3 from drawing title block)
 1670.000-ME-418351       None     VTS-2 P&ID
 1670.000-ME-418352       None     VTS-3 P&ID
 1670.000-MD-418338         D      VTS 2 - Simplified Flow Schematic
 1670.000-ME-418297          I     VTS-1 P&ID
 1670-ME-304680             G      VMTF P&ID
 1670.000-MD-418339         D      Vertical Cryostat – VTS 2 - Top Flange Interface
 1670.000-ME-418350       None     VTS2&VTS 3 – Integration P&ID
 1670.000-MD-418343         A      VTS2 Top Plate - Weldment
 1670.000-MD-418344         A      VTS2 Top Plate – Machining Details
 10-1-198                  None    IB1 Vertical Test Shafts 2 and 3 – Sections and Details, Sheet 3

 10. References

 [1] VTS 2&3 Functional Requirements Specification, TD-09-023, October 21, 2009
 [2] VTS 2&3 Technical Requirements Specification, TID-N-248, November 13, 2009
 [3] VTS 2&3 Statement of Work, TID-N-249, November 17, 2009
 [4] VTS-1 Cryogenic Operating Procedures, TID-N-168, June 18, 2008
 [5] VCTF Cavity Test Procedure, TID-N-223, August 12, 2009
 [6] VTS 2&3 5K Shield Elimination Justification, TID-N-250, November 19, 2009
 [7] VTS 2&3 Phase Separator Elimination Justification, TID-N-251, November 19, 2009
 [8] VTS 2&3 J-T Heat Exchanger Recommendation, TID-N-245, November 9, 2009
 [9] VTS 2&3 Cryogenic Control Valve Sizing, TID-N-070, July 13, 2009
 [10]VTS 2&3 Relief Device Sizing, TID-N-069
 [11]VTS 2&3 Cryostats – Engineering Design Report, RRCAT/LVCDS/EDN/VTS-
     2/200, November 19, 2009
 [12]VTS 2&3 Cryostats Integration Design Considerations, TID-N-252, November 19,
     2009
 [13]VTS 2&3 P&ID Review - Final Report, November 5, 2009




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