Process Engineer Resume Sample by mplett

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Enjoy this expertly developed sample resume with complimentary cover letter strategies included. Unlike most resume samples you will find, this one is a completely editable Word document, which means you can revise this resume as needed to suit your needs while keeping the stylish format in tact.

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									                                             JESSE KENDALL
             123 Elm Street ▪ Miami, FL 33183 ▪ Home: 305-555-5555 ▪ Cell: 305-444-4444 ▪ jkendall@notmail.com

                      ENGINEERING MANAGEMENT ▪ PROCESS IMPROVEMENT
Senior manager with over 20 years of comprehensive production engineering, project leadership, and facilities
management experience within a variety of industries. Extensive knowledge of plant equipment and processes.
Experienced in statistical data collection, statistical process control (SPC), 5S, and lean manufacturing principals.
Strategic thinker reputed for driving business goals while controlling costs and improving efficiencies. Troubleshooter
recognized for incisive analytical abilities. Results oriented innovator, accomplished in leveraging both technological
solutions and human capital.


                                                 AREAS of EXPERTISE
     Problem Resolution                    Semiconductor Fabrication                          Staff Leadership
     Technical Requirements                Technology Deployment                              Systems Analysis
     Project Management                    Improvement Techniques                             Quality Systems
     Lean Manufacturing                    Strategic and Tactical Planning                    Validation Engineering


                                             PROFESSIONAL EXPERIENCE

SENIOR PROCESS ENGINEER, ABC Incorporated, Miami, FL                                                  20xx to 20xx
Developed and directed preventative maintenance program for an automotive textile manufacturer specializing in
molded soft trim, interior components, and commercial textiles. Supervised two engineers and a technician. Prepared
and implemented all capital budget projects, including cost reduction plans. Oversaw tool design and utilization for
both die cut and 3-D compression molding. Instituted SPC tracking and process controls for thermoforming, cutting,
and molding equipment.

Delivered Results:
        Saved $75,000 per year in fiber costs by designing and installing online weight monitoring system to control
         fabric weight.
          Upgraded drying equipment and two fabric production lines to reduce down time and improve quality. Each
           capital project was worth more than $500,000 and provided over 30% annual return on investment.
          Managed program that won the Honda 100% On Time Delivery Award and the Supplier Quality Award in
           recognition of zero defect delivery for two consecutive years.
          Expertly engineered, installed, and directed the process of thermoforming four Honda parts; process
           included the design of molding and cutting tools.

SENIOR PROCESS ENGINEER, BCD Corporation, Miami, FL                                                           20xx to 20xx
200 mm Wafer Lithography (20xx – 20xx): Served as process equipment owner for the Tokyo Electron-ACT12 spin
and developer equipment. Played a key role in engineering operations by developing strategic plans and setting
priorities on a daily basis. Looked for major contributors, set clear expectations, and provided effective solutions.

Delivered Results:
        Improved process control health from 88% to 100% by driving the process to target within a few weeks.
          Significantly reduced the rework rate from 5% to 1.7%; exceeded a goal of <2% within eight weeks.

Process Engineer, 200 mm Wafer C4-ETCH (20xx – 20xx): Demonstrated technical knowledge and problem solving
in the areas of safety, quality, cost, and output, including implementation of high-precision maintenance. Created and
developed a system to control chemistry consumption. Partnered with the group leader on strategic module planning
and provided coverage for tactical meetings. Directed planning, inventory management, design of experiments, and
pilot execution. Led the P861-Virtual Factory Fab-Wide C4-Etch Shared Learning Forum. Co-managed and mentored
eight technicians and junior engineers.
                                   JESSE KENDALL, PAGE 2 OF 2
             123 Elm Street ▪ Miami, FL 33183 ▪ Home: 305-555-5555 ▪ Cell: 305-444-4444 ▪ jkendall@notmail.com

Delivered Results:
        Enhanced machine uptime from 83% to 93% for the Etch-Wet Benches and GAS from 92% to 97% through
         process control systems, design of experiments, and implementing maintenance action plans.
         Improved the quality and lowered overall production costs by leading key projects in qualifying reticle
          modification, alternative cleaners, and new bulk cleaner delivery system.
         Avoided a $2 million loss for Intel by extending the shelf life of a chemical cleaner.

Process Engineer, 200 mm C4 Lithography (20xx – 20xx): Developed a new photoresist thickness C4 process for
spin, develop, and exposure for NPI (Clarksboro), a key product for Intel. Increased throughput for wire bond product
through the entire P861-VF by improving CD and REG. Led evaluation of a new developer vendor for the C4-LITHO
process; served as a process and equipment expert with the C4 SVG, KAR, and MCL (spin, develop, expose, and
mask clean), respectively.

Delivered Results:

         Reduced the rework rate from 3% to 1.9% and the scrap rate to a minimum level by finding the source of
            the problem, documenting, and implementing preventive maintenance procedures.
         Increased capacity by 300% through overcoming significant challenges such as alignment.
         Saved $1.3 million by reducing the inspection rate and cost avoidance of buying a new inspection tool.



PROCESS ENGINEER, CDE Automotive, Miami, FL                                                                20xx to 20xx
Initiated, reengineered, and implemented processes to improve productivity of the airlay automotive textile production
line. Tracked process improvements and developed systems to monitor downtime.

Delivered Results:
         Increased line availability (up time) 12% within four months by working closely with cross-functional teams
            to identify, analyze, and address the largest causes of down time.
         Developed an effective die changing, storage, and repair procedure to reduce change over time.
         Reduced down time by designing resin/fiber extraction device that eliminated the amount of cleaning
            required on the airlay feed section.


                                                      EDUCATION
                                         M.S., Chemical Engineering (20xx)
                            Concentration: Electrolytic Plating, Graduated with High Honors

                                       B.S., Chemical Engineering (20xx)
        Concentration: Environmental Engineering, Recipient of the AIChE Academic Excellence Award (20xx)

                                         XYZ Institute of Technology, Miami, FL

                                                        TRAINING

                             Manager of Choice, Situational Leadership, Levels I & II
                  Automated Wet System Training, Design of Experiments, Process Control Systems
                          PCB-Lithography, PCB Defects Reduction, Lean Manufacturing

                                      Seminar: Management Growth for Engineers

                                                   TECHNICAL SKILLS
     Gauge of Reproducibility and Repeatability (GR&R), Pareto Analysis, Process Capability (Cpk), Gantt Charts
                      Proficient in Microsoft Office (Word, Excel, PowerPoint), JMP, Minitab
Creating a Compelling Cover Letter
A powerfully written cover letter is necessary to land most interviews and ensure job search success. When an
advertised position creates a pile of 100+ resumes, it becomes the responsibility of the hiring personnel to shortlist the
applications. Resumes without cover letters are usually the first to go, followed by the ones with poorly written cover
letters. Avoid this fate by following these effective strategies:


Address your cover letter appropriately:
Be sure that you get the name of the hiring manager before sending your resume, and address the letter to that
individual. The proper greeting will be either “Dear Mr. (Smith),” or “Dear Ms. (Smith).” Avoid using Miss or Mrs., and
do not address your letter to “Dear Sirs,” as it is considered inappropriate. If you are unsure of your contact’s gender,
address them by their first and last name, as in “Dear Pat Smith,” to avoid an embarrassing mistake. If you don’t know
the name of the hiring manager, simply use the greeting “Dear Hiring Manager,”– it’s clear, to the point, and gender
neutral.


Get to the point in your opening paragraph:
One of the most common interviewing questions employers ask is “Why should I hire you among other candidates?”
Provide an answer to that question right off the bat in your opening paragraph. This is a very important section
because it is the first thing the employer will read. It must be powerful and make an immediate impact. Be sure sell
yourself and your unique abilities. Do not use a generic opening paragraph that can apply to any Tom, Dick or Harry.
Every line should sell you, so use aggressive language here and throughout the rest of your cover letter. For example,
instead of writing “My background is in finance management, making me well-suited for your advertised Corporate
Finance Director position.” you can write “A background in finance management and a proven record of developing
effective strategies that drive revenue, growth and shareholder value make me a strong candidate for your advertised
Corporate Finance Director position.”


Show your interest and sell your accomplishments in the body of the letter:
In this section, you need to show your interest in the job and the company. Research is a key ingredient to a
successful job search. The more you are able to demonstrate your interest and knowledge about a company, the
better your chances are to secure an interview. Get to know the company’s mission and new corporate initiatives, and
tell them how you can help them meet their objectives or resolve their problems. Praise the company for public
recognitions or recent accomplishments. The employer will surely take notice of your active interest.
Use “I” and “my” sparingly. Try not to use these words more than six times in your cover letter. You need to focus on
what you will bring to the company and how you will help them improve their profitability. Too much use of the word “I”
will also make your letter look elementary and poorly written.
For executive-level candidates and professionals with substantial achievements, a bullet point format is often the most
effective and efficient way to highlight accomplishments. If you fall into this category, be sure to keep the bullet point
statements unique and fresh. Do not copy and paste the exact same phrases from the resume as it will make you look
lazy. All sentences and achievements transferred from the resume should be rephrased.


Close your letter with a strong paragraph:
In the closing paragraph, you need to address several issues. At the very least, you need to ask for the interview and
provide contact information. This is also the ideal place to mention your salary requirements (if the employer insists on
it), or your desire to relocate.
To demonstrate your drive and interest, mention that you will call within a week to follow up. This is a great way to
ensure the resume was successfully received, and it creates an opportunity to establish a dialog. However, do not
mention this in your cover letter if you do not intend to follow up.

In summation, an aggressive and dynamic cover letter will help you stand out among the competition. Remember that
the goal is to market yourself – not to compose a dull biography.

								
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