FEI Company Announces Key Management Additions As It Focuses by dpt50088

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									FEI Company Announces Key Management Additions
As It Focuses on Continued Growth and Developing New Markets

HILLSBORO, Ore., July 17 /PRNewswire/ -- FEI Company (Nasdaq: FEIC) today announced the appointment of three new vice
presidents to strengthen the company as it focuses on continued growth and developing new markets: Stephen F. Loughlin,
corporate controller and vice president; Michel Epsztein, senior vice president, corporate marketing; and David O'Brien, senior
vice president and chief information officer.

Stephen Loughlin joins FEI as corporate controller and vice president having most recently held the position of CFO and vice
president of finance and administration at RadiSys Corporation. He has also held senior finance positions at Sequent
Computer Systems and Wang Laboratories and is a graduate of Boston College. At the same time, Mark Allred was promoted
to the position of corporate treasurer.

Michel Epsztein assumes the newly created role of senior vice president, corporate marketing at FEI. He will drive the
company's efforts in expanding FEI's microelectronics market opportunities and building new markets. Epsztein was most
recently president of RVSI Vanguard, a semiconductor assembly equipment maker. He has also held various senior
management positions at Schlumberger, including vice president and general manager of the company's Test Systems ATE
division. Epsztein holds an MSEE degree from the National Upper School for Aeronautics in Toulouse, France.

David O'Brien, senior vice president and chief information officer joins FEI from Credence Systems Corporation, where he was
most recently CIO. At Credence he also held various senior vice president positions in information technology, marketing and
engineering. O'Brien holds a Master of Science degree from Stanford University and a Bachelor of Arts from Harvard.

"We are very pleased to announce these executive additions as we move forward, look beyond the current semiconductor
downturn, and endeavor to continue the significant growth we have accomplished," said Vahe Sarkissian, FEI's president and
chief executive officer. "We are committed to strengthening our company and our management team as we continue to focus
on expansion and developing new opportunities for FEI."

Michel Epsztein will report directly to Vahe Sarkissian. Stephen Loughlin and David O'Brien will report to Jack Hodgson, FEI's
senior vice president and chief financial officer.

About FEI Company:

FEI is the 3D innovator and leading supplier of Structural Process Management™ solutions to the world's technology leaders in
the fields of semiconductors, data storage, structural biology and industry. Its range of industry-leading DualBeam™ and single
column focused ion and electron beam products enables manufacturers and researchers to keep pace with technology shifts
and develop next generation technologies and products. The Company's products allow advanced three-dimensional
metrology, device editing, trimming and structural analysis for management of sub-micron structures including those found in
integrated circuits, high density magnetic storage devices, industrial materials, chemical compounds, and biological structures.
FEI solutions deliver enhanced production yields, lower costs and faster time to market-critical benefits in highly competitive
markets. Headquartered in Hillsboro, Oregon, FEI has more than 1,600 employees worldwide, with additional development and
manufacturing operations located in Peabody, Massachusetts; Eindhoven, The Netherlands; and Brno, Czech Republic. FEI's
Internet site can be accessed at http://www.feicompany.com .

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SOURCE FEI Company
Web site: http: //www.feicompany.com
CONTACT: Jack Hodgson, Executive Vice President & Chief Financial Officer, +1-503-640-7537, or Dan Zenka, APR,
Corporate Communications Manager, or dzenka@feico.com, or +1-503-844-2695, both of FEI Company

								
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