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CYNTHIA A

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CYNTHIA A Powered By Docstoc
					EDUCATION:
                   Doctor of Philosophy in Electrical Engineering                August 1993
                   University of California, Davis
                   Dissertation title: Bond and Etch-back Silicon on Insulator (SOI)

                   Master of Science in Electrical and Electronic Engineering May 1989
                   California State University, Sacramento

                   Bachelor of Science in Chemical Engineering                   December 1982
                   University of California, Davis

ACADEMIC
EXPERIENCE: Professor                                                            Aug. 1993-present
            Department of Electrical and Electronic Engineering
            California State University, Sacramento

                      * Solid-state electronics (band structure, effective mass, recombination
                      mechanisms, ...)
                      * Semiconductor device physics (regular and advanced)
                      * Technology of semiconductor devices and integrated circuits


RESEARCH
INTERESTS:

Professor Colinge’s research interests broadly include all aspects of wafer bonding. Her group is
currently working on polymer bonding for 3-D circuit integration and low-temperature plasma
bonding.



PUBLICATIONS, PRESENTATIONS, PATENTS, BOOKS

NOTE: My name was changed from C.A. Desmond to C.A. Colinge in 1999

Charles E Hunt, Cynthia A Desmond, Dino R Ciarlo and William J Bennett, "Direct
Bonding of Micromachined Silicon Wafers for Laser Diode Heat Exchanger
Applications", Journal of Micromechanics and Microengineering 1 (1991) pp152-156

C. E. Hunt, M. L. Green, D. Brasen, C.A. Desmond, and S. N. Farrens, “Rapid-Thermal
Chemical Vapor Deposition (RTCVD) of Si1-x-yGex by Strain Compensated Epitaxial
Etch Stop Layers for Thin-Film Bonded”, Electronic Materials Conference, Boulder, CO
June 19-21, 1991
P. P. Pronko, A.W. McCormick, A.K. Rai, C.E. Hunt and C.A. Desmond, "Materials
Properties and Carrier Recombination Lifetimes in Thin Epi-Less Bond-Etch Silicon On
Insulator (EL-BESOI)", IEEE SOI Technology Conference (Oct. 1-3, 1991) Vail, CO.

Charles E Hunt, Cynthia Desmond, "Thinning of Bonded Wafers: Etch-Stop
Approaches", Proc. of the First International Symposium on Semiconductor Wafer
Bonding Science, Vol 92-7, Electrochemical Society’s Fall Meeting,(Oct. 13-18, 1991),
Phoenix, AZ. Invited Paper

 S.N. Farrens, B. Roberds, M.C. Boettcher, M.S. Ismail, R.W. Bower, C.A. Desmond,
and C.E. Hunt, "Mechanical Testing of Bonded Silicon On Insulator Wafers", Proc.
Materials Research Society, Vol.239B, MRS Fall Meeting, (1991), Boston, MA.

Cynthia A. Desmond, Charles E Hunt, "The Effects of Process-Induced Defects on the
Chemical Selectivity of Highly-Doped Boron Etch Stops", Proc. of the Second
International Symposium on Semiconductor Wafer Bonding Science, Vol 93-29, The
ECS Spring Meeting, (1993), Honolulu, Hawaii

Cynthia A. Desmond, Charles Hunt, Shari Farrens, "The Effects of Process-Induced
Defects on the Chemical Selectivity of Highly-Doped Boron Etch Stops", Journal of the
Electrochemical Society, 141 (1994) pp 177-184

Cynthia A. Desmond, Charles E. Hunt, and S.D. Collins, "P+ Removal Techniques for
Thin-Film BESOI", Sixth International Symposium on Silicon-On-Insulator, The ECS
Spring Meeting, Vol. 94-11, (1994), San Francisco, CA.

Cynthia A. Desmond, Charles E. Hunt, and Tom Wetteroth, "Characterization of Thin-
Film BESOI Using a CVD Si-Ge-B Etch Stop",Seventh International Symposium on
Silicon Materials Science and Technology, The ECS Spring Meeting, (1994) , Vol. 94-
11, San Francisco, CA.

Cynthia Desmond, David Franz, Richard Mlcak, "Fabrication of a High-Sensitivity
Pressure Sensor with Nitride Membranes and Single Crystal Piezoresistors Using Wafer
Bond and Etch Back", Third International Symposium on Semiconductor Wafer Bonding
Science, Vol. 95-7, The ECS Spring Meeting, (1995), Reno, Nevada

Karl Hobart, Fritz Kub, Cynthia Desmond, "Electrical Characterization of Vacuum
Bonded Si P-N Junctions", Symp. on Semiconductors on Insulators - Fundamentals and
Technology , The MRS Spring Meeting, [1996], San Francisco, CA.

Cynthia Desmond, "Silicon Wafer Bonding as a Device Option", Interfaces: Physics and
Chemistry for Optical and Electronic Materials, Defense Sciences Research Council
Workshop, July 19, 1996, La Jolla, CA. Invited Talk

Cynthia Desmond and P. Abolghasem, "Applications of Wafer Bonding to Non-
Electronic Microstructures", Fourth International Symposium on Semiconductor Wafer
Bonding Science, Vol 97-36, The ECS Fall Meeting, (1997), Paris, France, pp. 95-105
Invited Paper

Cynthia Desmond, Karl Hobart, Fritz Kub, George Campisi, Marcus Weldon, "Low-
Temperature Atmospheric Silicon-Silicon Wafer Bonding for Power Electronic
Applications" Fourth International Symposium on Semiconductor Wafer Bonding
Science, Vol 97-36, The ECS Fall Meeting, pp. 459-465, (1997), Paris, France

Cynthia Desmond, Pedram Abolghasem, Jerry Olup, James Folta, Glenn Jernigan,
"Analysis of Nitride Bonding for MEMS Applications", Fourth International Symposium
on Semiconductor Wafer Bonding Science, Vol 97-36, The ECS Fall Meeting, pp. 171-
178, (1997), Paris, France

F.J. Kub, K.D. Hobart, C.A. Desmond, "Electrical Characteristics of Low Temperature
Direct Silicon-Silicon Bonding for Power Device Applications", Fourth International
Symposium on Semiconductor Wafer Bonding Science, Vol 97-36, The ECS Fall
Meeting, pp. 466-472, (1997), Paris, France

K.Hobart, F. Kub, C.A. Desmond, M. Twigg, and G. Jernigan, "Si-Si PN Junctions
Fabricated by Wafer Bonding in Ultra-High Vacuum" Fourth International Symposium
on Semiconductor Wafer Bonding Science, Vol 97-36, The ECS Fall Meeting, pp. 409-
416, (1997), Paris, France

F. Kub, K. Hobart, and C. Desmond, "Low Temperature Direct Silicon-Silicon Bonding
for Power Device Applications", Proceedings of the Government Microcircuit
Applications Conference, GOMAC '97, 10-13 March 1997, Riviera Hotel, Las Vegas,
Nevada, p. 441.

K.D. Hobart, M.E. Twigg, F.J. Kub, C.A. Desmond, "Characterization of Si pn junctions
fabricated by direct wafer bonding in ultra-high vacuum" Appl. Phys Letters, 72 (9),
March 1998. p.1095-7

C.A. Desmond-Colinge, "Applications of Wafer Bonding", TMS The Minerals, Metals
and Materials Society’s First International Workshop on Wafer Bonding and Compliant
Substrates, Puerto Rico, Feb. 1998 Invited Talk

C.A. Desmond-Colinge, "Silicon Wafer Bonding Applications", U.S.-Finland Workshop
on Microstructuring Science and Technology, Finland, August 5-7, pp. 51-54, 1998
Invited Talk

C.A. Desmond-Colinge, "Wafer Bonding for Micro-Electro-Mechanical Systems',
Perspectives, Science and Technologies for Novel Silicon on Insulator Devices, NATO
Science Series, Vol 73, pp. 269-280, Kiev, Ukraine, October, 1998 Invited Paper
C.A. Desmond-Colinge, U. M. Gösele "Wafer Bonding and Thinning Technologies"
published in The Bulletin, a special edition of the MRS Journal, December, 1998, pp. 30-
34 (Invited Journal Article)

C.A. Colinge, "Wafer Bonding for 3-D Applications", TMS The Minerals, Metals and
Materials Society’s Second International Workshop on Wafer Bonding and Compliant
Substrates, Orlando, Florida October, 1999 (Invited Talk)

C.A. Desmond-Colinge, G. Ayele, "A Comparison of Large Area Power Electronic
Devices Fabricated by Diffusion and Wafer Bonding", Fifth International Symposium on
Semiconductor Wafer Bonding Science, Vol 99-35, The ECS Fall Meeting, pp. 453-458,
Honolulu, HI, 1999

C. Colinge, "SOI for Harsh Environment Applications in the USA", Third NATO
International Workshop on Advanced Research, Kiev, Ukraine, October, 2000 (Invited
Talk)

C. Colinge, B. Roberds, B. Doyle, “Silicon layer transfer using wafer bonding and
debonding” TMS The Minerals, Metals and Materials Society’s Third International
Workshop on Wafer Bonding and Compliant Substrates, Lake Tahoe, CA, USA, 22-25
Jan. 2001

K.D. Hobart, F.J. Kub, G. Ayele, C.A. Colinge, “Transfer of Semiconductor Films Using
Dry Bonding Processes”, TMS The Minerals, Metals and Materials Society’s Third
International Conference on Alternative Substrate Technology, Lake Tahoe, CA, USA,
22-25 Jan. 2001

C. Colinge, B. Roberds, B. Doyle, “Silicon layer transfer using wafer bonding and
debonding”, Journal of Electronic Materials, vol.30, (no.7), TMS; IEEE, July 2001.
p.841-4. Invited Journal Paper

K.D. Hobart, F.J. Kub, D. Pattanayak, D. Piccone, M. Patel, D. Hits, R. Rodrigues, G.
Ayele, G.; C.A. Colinge, “A 6 kV thyristor fabricated by direct wafer bonding”,
Proceedings of the 13th International Symposium on Power Semiconductor Devices &
ICs”, IEEE International Power System Device Meeting '01, Osaka, Japan, 4-7 June
2001. Tokyo, Japan: Inst. Electr. Eng. Japan, 2001. p.211-14.

J.T. Park, C.A. Colinge, and J.P. Colinge, “Comparison of gate structures for short-
channel SOI MOSFETs”, Proceedings of the IEEE International SOI Conference, pp.
115-116 , 2001

C.A. Colinge, B. Roberds, “Silicon layer transfer using a sacrificial polymer layer”,
Franco-Swedish Workshop on SOI, March 8-9, 2001, Grenoble, France Invited Talk

Cynthia Colinge, Jos´e Bahia, Brian Roberds, “ Layer Transfer of Silicon Using Polymer
and TEOS Bonding”, The Materials Research Society’s Spring Meeting, April, 2001, San
Francisco, California., Abstract No.17.5
C.A. Colinge, M.C. Shaw, and K.D. Hobart, “A Comparison of Interfacial Fracture
Energy of Bonded Wafers Using a Micromechanics Indentation Approach and Crack
Propagation Technique”, Sixth International Symposium on Semiconductor Wafer
Bonding Science, Vol 2001-27, The ECS Fall Meeting, pp. 84-91, San Francisco,
California, September 2-7, 2001

Anke Sanz-Velasco, Petra Amirfeiz, Stefan Bengtsson, Cindy Colinge, “Wafer Bonding
Using Oxygen Plasma Treatment in RIE and ICP RIE”, Sixth International Symposium
on Semiconductor Wafer Bonding Science, Vol 2001-27, The ECS Fall Meeting, pp. 31-
40, San Francisco, California, September 2-7, 2001

J.P. Colinge, J.T. Park and C.A. Colinge, “SOI Devices for Sub-0.1_m Gate Lengths”,
IEEE 23rd International Conference on Microelectronics, May 12-15, 2002, Nis,
Yugoslavia

Cindy Colinge, Stefan Bengtsson, Petra Amirfeiz, Anke Sanz-Velasco, “The Effects of
Plasma Bonding on The Electrical Characteristics of The Bond Interface”, TMS The
Minerals, Metals and Materials Society’s 2002 Electronic Materials Conference, Santa
Barbara, California, June 25-29, 2002

Cindy Colinge, Stefan Bengtsson, Petra Amirfeiz, Anke Sanz-Velasco “Analysis of CV
Characteristics of Plasma Bonded Wafers”, TMS The Minerals, Metals and Materials
Society’s Fourth International Conference on Compliant and Alternative Substrate
Technology, Sept. 15-19, 2002 Cancun, Mexico

Anke Sanz-Velasco, Petra Amirfeiz, Stefan Bengtsson, Cindy Colinge, “Room
Temperature Wafer Bonding Using Oxygen Plasma Treatment in ICP RIE and RIE”,
Journal of The Electrochemical Society, Vol. 150, No. 2, pp. G155–G162, February 2003

K. Hobart, F. Kub, C. Colinge, G. Ayele, “UV/Ozone Activation Treatment for Wafer
Bonding”, Seventh International Symposium on Semiconductor Wafer Bonding Science,
Technology, and Applications, Vol. 2003-19, p. 137, 2003 April 27-May 2, 2003, Paris,
France

C. Colinge, K. Hobart, “Low-temperature uv only wafer bonding” Fifth International
Conference on Alternative Substrate Technology, Grenoble, France, 22-25 Mar. 2004
Invited Talk

C. Colinge, “A review of low-temperature wafer bonding”, Fourth NATO International
Workshop on Advanced Research, Kiev, Ukraine, April 20-25, 2004 Invited Talk

H. Dang, S. Holl, C. Colinge, K. Hobart, “Ultraviolet activation in nitrogen for low-
temperature bonding”, Eighth International Symposium on Semiconductor Wafer
Bonding Science, Technology, and Applications, Vol. 2005-02, The ECS Meeting,
Quebec City, Canada, May 2005
BOOKS:

      "Physics of Semiconductor Devices", C.A. Colinge, J.P. Colinge and F. Van de
       Wiele, Erudition Books, 345 pages, 2000 (ISBN 1-58692-041-3)

      "Physics of Semiconductor Devices", C.A. Colinge and J.P. Colinge, Kluwer
       Academic Publishers, USA, May 2002 (ISBN 1-4020-7018-7)

PATENT:

United States Patent 6,638,835 , October 28, 2003, Brian Roberds, Cindy Colinge, Brian
Doyle
Assignee: Intel, “Method for bonding and debonding films using a high-temperature
polymer”

				
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