Status and Future of Toppans EPL Mask by mirit35

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5th NGL Workshop




       Status and Future of Toppan’s EPL Mask



                                     Hiroshi Sugimura

                                Technical Research Institute
                                 Toppan Printing Co.,Ltd.


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      Technical Issues of EPL Mask Fabrication


                   •    Si Membrane Stress Control
                   •    EB Lithography
                   •    Backside Deep Si Etching
                   •    Si Membrane Trench Etching
                   •    Cleaning
                   •    Inspection and Repair

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                   Issues of Backside Deep Etching


         •   Etching Rate
         •   Etching Rate Uniformity
         •   Selectivity to Stop Layer and Etching Mask
         •   Grillage Side Wall Taper Angle
         •   Grillage Side Wall Roughness


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      Deep Si Dry Etch Technology for Forming Grillage
       Blank Structure                                         Principle of Deep Si Dry Etch
                                                                Bosch Process
                                                                                   Isotropic Etching


                                                                                  Deposition
                                                                                  (Sidewall passivation)


                                                   1130um

                                                                                   Removal of bottom
        4 inch or 8 inch                                                           passivation layer by
                                                    170um                          ion bombardment



                                     Grillage
                                                                                   Isotropic Etching


                                                525 or 725um


                                                                                   Resulting profile




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                   Issues of 2um Trench Etching

                                 •   CD Accuracy
                                 •   CD Uniformity
                                 •   CD Linearity
                                 •   Line Edge Roughness
                                 •   Taper Angle
                                 •   Corner Radius


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                     2um Trench Etching of Front-side (1)

                                                                100nm/250nm




                                                                          Si

                                                 Si

                                     SiO2
                                                                        SiO2
                                      Si
                                                                0.5um

                                      5um


                   Cross Section SEM Photographs of 2um Trench Etching


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                    2um Trench Etching of Front-side (2)
                   SEM Photographs of Top/Bottom View of L&S Mask Patterns

             140 nm L/S               160 nm L/S       180 nm L/S            200 nm L/S



    Top
    View




   Bottom
    View




                                                                               0.5um


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                     2um Trench Etching of Front-side (3)
             SEM Photographs of Top/Bottom View of Isolated Line Mask Patterns

                   160 nm              190 nm          210 nm              235 nm



    Top
    View




   Bottom
    View




                                                                            0.5um


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                                EPL MASK for PREVAIL




               Backside View of Patterned 4 inch Stencil EPL Mask for Prevail

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             Resist Patterns on Wafer by EPL(PREVAIL)
       < 1:1 Line & Space Patterns>   < Isolation Patterns of Memory Device>
                                                        I-Type       W-Type             T-Type
        120nm
                                        100nm
                                         node
        110nm



        100nm                           80nm
                                        node


         90nm

                                        70nm
                                        node
        80nm

                                                                    Resist: NEB22 (Sumitomo Chemical)
                                                                    by Nikon’s POC Exposure System


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  Schedule of EPL Mask Development
             Year                         2001                     2002                  2003                   2004                  2005

                                                 Starting 4 inch Reticle Supply
                                                           Completion of 4 inch Process
      Milestone                                                                                                                Mass Production
                                                                    Starting 8 inch Reticle Supply
                                                                                                Completion of 8 inch Process

      SOI Substrate                  Stress Control



                                    Optimization of       Development of
      EB Lithography                Resist Process        High Resolution Process



                                    Development of                 Development of                 Development of
                      2um Trench    4 inch Process                 8 inch Process                 Manufacturing Process
      Dry Etching
                                                                                                                               Mass Production

                                    Development of                 Development of                 Development of
                      Backside
                                    4 inch Process                 8 inch Process                 Manufacturing Process




      Cleaning                              Development of Cleaning Technology



      Inspection & Repair                             Method and Apparatus Development with SELETE, etc.




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