3701 E. University Dr., Phoenix, AZ 85034; Phone: 602-431-6020; FAX: 602-431-6021
Buyout & Start-up of FlipChip International, LLC
Bob Forcier
President & CEO
Flip Chip International
Session 2: Alliances and Acquisitions
Global Business Council (GBC)
Summer Conference 2004
Abstract
This paper will review the buyout and start-up of FlipChip International, LLC. The acquisition
was a creative way to accelerate a start-up venture and provide a win-win for both the seller and
buyer.
In February 9, 2004, RoseStreet Labs, LLC announced the acquisition of substantially all of the
assets of Flip Chip Technologies, LLC from Kulicke and Soffa Industries. RoseStreet Labs,
LLC completed the acquisition through its newly formed subsidiary FlipChip International,
LLC. The assets acquired include the advanced semiconductor bumping facility in Phoenix,
Arizona, as well as the intellectual property of Flip Chip Technologies, LLC.
This presentation will review the extensive capital formation activities required to complete the
acquisition and to continue ongoing operations. Also, a discussion on the importance of
positive relationships between the buyer and seller and the key milestones required for the
acquisition.
A detailed description of all parties will be reviewed. Kulicke & Soffa is the world's leading
supplier of wire bonding equipment in the semiconductor assembly market. Flip Chip
Technologies, LLC has been a leading supplier of merchant wafer bumping services, wafer scale
packaging (WSP) services, and advanced flip chip electronic materials for the semiconductor
industry on a global basis since its inception in 1997. RoseStreet Labs, LLC is privately held
and an advanced supplier of products and services for wireless infrastructure in the life science
and homeland security markets. FlipChip International, LLC is a wholly owned subsidiary of
RoseStreet Labs, LLC. Detailed contributions of the key financial partners and legal partners
will be explored.
The paper will review the plans for the newly formed company. Under the newly formed
FlipChip International, LLC, flip chip services and products will continue to be expanded
through additional capacity, R&D investments, and new advanced material products including
solders, nano-materials and dielectrics.
The start-up market assumptions will be reviewed in the presentation. For example, flip chip
techniques continue to gain market share in a number of markets including next generation cell
3701 E. University Dr., Phoenix, AZ 85034; Phone: 602-431-6020; FAX: 602-431-6021
phones, PDA’s, medical diagnostics and therapeutics, homeland security, and defense products
because of the substantial reduction in form factor, increase in performance, and reduction of
total product cost.
Finally, a global analysis of the how flip chip technologies fit into the semiconductor packaging
technology and product roadmaps will be presented and reviewed.
Biography
Bob Forcier is President & CEO of FlipChip International, LLC and RoseStreet Labs, LLC in
Phoenix, Arizona. Bob has over 30 years experience in advanced electronic materials,
interconnects and wireless technologies. Mr. Forcier has held several senior management and
marketing positions. His last positions were Senior Vice-President of OEM Marketing for Park
Electrochemical Corporation (PKE-NYSE) and President of Neltec, Inc. in Tempe, Arizona.
Bob has successfully started three companies and executed several international business
transactions in the last 10 years. Bob is the inventor of numerous Intellectual Property positions
in the interconnect arena including System-In-Package (SIP) and wireless sensors. Mr. Forcier
has published over fifty technical publications and one book on manufacturing technology.
Bob lives in Mesa, Arizona with his wife Marsha.