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					                                                                                               1
            Trends in development of breakthrough technologies in 2001-2010,
        investment volumes for their implementation and market capacity forecast
                           INVESTMENTS, TARGET ACCORDING TO THE GOVERNMENT
Investments,               PROGRAM (197,8 KK USD)                                 Market capacity,
  KK USD                   INVESTMENTS, REAL AND EXPECTED (197,8 KK USD)           billion USD
 100                       MARKET CAPACITY, billion USD                                     500
100
 90                                                                                         450
90
 80                                                                                         400
80
                                                                                            350
70
 70

60
 60                                                                                         300      Ряд
50
 50                                                                          95             250      Ряд
                                                                                    405

40
 40        85                     78                           315
                                                                                            200      Ряд
30
 30
                                            210           53                                150

20
 20
                23   122               26
                                                                                            100
                                                     20
10
 10                                                                     15                   50
  0
  0                                                                                           0
                μм
        1,2-0,8 1              0,8-0,5 μм
                                       2                  μм
                                                  0,5-0,353          0,35-0,25μм
                                                                              4
        2001-2003              2004-2005          2006-2007           2008-2010

                                                                                   2004
                                                                                              2
  Design rules for semiconductor products and sales share in
                      the world market        Market capacity , $
            Силовая automobile electronics 80%
            Power and и автомобильная электроника 80%                        10 432 000 000
             Промышленная и оборонная техника 80%
            Industrial and military equipment 80%                            11 736 000 000
            Бытовая электроника 70%
            Consumer electronics 70%                                         19 397 000 000
>1мкм        Телекоммуникации 60%
            Telecommunications 60%                                           11 247 000 000
                                     Computer engineering 30% 30%
                                     Вычислительная техника                  5 868 000 000
                  Мобильная
                  Mobile 10% связь 10%
                                                                             1 956 000 000
                   Персональные компьютеры 10%
                   Personal computers 10%
                                                                             4 890 000 000
1мкм

                           Силовая automobile electronics 20%
                           Power and и автомобильная электроника 20%         2 608 000 000
                           Промышленная и оборонная техника 20%
                          Industrial and military equipment 20%              2 934 000 000
                                   Бытовая электроника 30%
                                   Consumer electronics 30%                  8 313 000 000
<1мкм    Телекоммуникации 40%
        Telecommunications 40%                                               7 498 000 000
            Computer engineering 70% 70%
            Вычислительная техника                                           13 692 000 000
            Мобильная
            Mobile 90% связь 90%                                             17 604 000 000
             Персональные компьютеры 90%
            Personal computers 90%                                           44 010 000 000
        0                20                40            60            80   100


                                                                                      2004
                                                                                                                             3
Production volumes
in years, $x109
                                                                                        World tendency in the
                                                                                        market development
                                                                                        depending on minimal
                                                                                        design rules


                                                                                 Minimal size of
                                                                                 element




                                                                                   PRODUCTION
                                              Sales volumes

   Life cycle of                                                                     Profitability
   microelectronic                                                            25-40%   15-25%      below 10%

   products
                           research,                           Introduction
                           design/developme
                           nt
                                                                  Introduction growth maturity     drop         Life cycle
                                                                     1-2 years 1 year 3-5 years    2-3 years
                     Fundamental                                                                                stages
                                                              Equipment
                     investigation, design
                                             Costs




                                                              Technologies
                     and research
                                                              Products


                                                                                                               2004
                                                                                   4
                  What do we know about our
                         competitors
                               China
                         Assembly
Started in 1990          IC production – 10 companies
                         (Motorola, AMP, Fairchild, Hitachi, IRM, Lute, NEC,
200 mm – 9 factories    Samsung, Sony, ST, Toshiba)
                         in 6 cities (Suzhou, Shanghai, Tiaujin, Beijing, Wuxi,
150 mm – 10 factories   Shenzhen)
125 mm – 4 factories    1.2 kk USD in 2003, and 15.35 kk USD by 2010, that made
100 mm – 5 factories    44% of the world output
Total: 28 factories              SMIC            1300 K w/year   11 K w/year
                                 Grace           1000 K w/year   83 K w/year
       Production                Hua Hay NEC 700 K w/year        58 K w/year
         volumes                 Otres           400 K w/year    92 K w/year

                                 Total           4100 K w/year 340 K w/year

                                                                     2004
                                                                                                                      5
                            What do we know about our
                                   competitors
                                                       RUSSIA
Joint-stock company “Angstrem”
 Manufacturing capacities :
- CMOS, BiCMOS and MOS ICs with 1.5-2.0 μm design rules on        Joint-stock company “Micron”
100 mm wafers,
                                                                   Manufacturing capacities :
- LSI and VLSI on CMOS and BiCMOS technologies with 0.8 - 1.2
                                                                  - IC on CMOS, BiCMOS and MOS technologies with 1.5-
μm design rules on 150 mm wafers.
                                                                  2.0 μm design rules on 100 mm wafers
Perspective - project FAB-2: production of ICs with 0.25-0.35μm
                                                                  Perspective - project “Set up of modern fabs for
design rules on 200 mm wafers.
                                                                  production of competitive microelectronic products based
                                                                  on advanced technologies" : wafer fabs with 0.5-0.35 μm
                   Estimated market capacity -                    design rules on 200 mm wafers
                        500-800 kk USD
                                                   Import ICs
Russian ICs                                                       Research Institution of System
                                                                  Analysis of the Russian Academy of
                                                                  Science
                                                                  Research Institution of System Analysis of the Russian
    Domestic ICs                                                  Academy of Science has the capacities for production of
      10-15%
                        6-9%    Integral’s ICs
                                                                  ICs with 0.35 μm design rules on 150 mm wafers with
                                                                  up to 500 w/month output)



                                                                                                       2004
                                                                                          6
                                 Our advantages
                                 over competitors

• orientation to development of several basic technological processes (CMOS, bipolar,
BiCMOS) and not to one or two processes as usually
• clean technological module for production of ICs with 0.8 μm design rules
• design center («Belmicrosystems» Design Center) equipped with modern design and
development equipment and able to develop ICs and technological processes with submicron
design rules
• reserve and experience in basic technological operations based on fundamental researches
• cheap skilled labor and specialists
• certification of Quality System for compliance with the requirements of International
Standards ISO 9000
• cheap land and energy
• favorable tax policy


                                                                               2004
                                                                     7
               Problem description
          Morally and physically obsolete equipment
                       Low efficiency

                                      Results

               Limited technological potentials
            Reduction of occupied market segment

                                      Solutions


Necessity of engineering infrastructure and clean rooms for
0.35 μm design rules.
Setting up the production of ICs with 0.35 μm design rules.


                                                              2004
                                                            8

              Project realization
Project constituents:
    Production line modernization (engineering structures,
    clean rooms, etc.);
    Technology transfer (route, list of technological
    operations, list of equipment, technical requirements for
    VLSI design/development);
    Delivery of set of special process and check and
    measurement equipment;
    Personnel training
    Production set up



                                                     2004
                                                                                                   9
      Problems to be solved for the objective achievement
1. Selection of silicon VLSI BiCMOS type with 0,5 μm design rules.
2. Determination of the minimal required and sufficient list of technological operations.
3. Determination of the minimal required and sufficient list of special process equipment and
check and measurement equipment.
4. The same items like items1,2,3, but for VLSI CMOS with 0,35 μm design rules.
5. Purchasing special process equipment and check and measurement equipment.
6. Delivery, installation and start-up of special process equipment and check and measurement
equipment.
7. Preparation of Module 7 clean rooms.
8. Appraisal of Module 7:
      constructions: walls, ceilings, floors,
     vibrocharacterization,
     air preparation: conditioners, filters, recycle system, inspection, control and monitoring
     system,
     water preparation: DI water, recycled water, drinking water, etc.
     drains, cleaning system,
     gas,
     power,
     vacuum,
     Totally 20 power supply units of “REM” factory.
9. Development and implementation of basic technology.
10. Design/development and manufacture of products.
11. Selection and training of personnel.
12. Promotion of products in the market.
13. Switching the production line to the required design rules.

                                                                                     2004
                                                              10

       Project realization options
               Option                   Month   Cost, Mio $

A License technology purchasing          24        29,6
B Development of technology by           57        20,6
  own means
C Obtaining of technology and kit of
  technical documentation from a         36        21,3
  shut-down factory
D Purchasing of unlicensed
  technology from a group of             26        22,0
  foreign specialists under a special
  contract




                                                       2004
                                                                                                                                                      11

DEVELOPMENT OF NEW TECHNOLOGIES
        – development of technologies by own means
        100% cost (20,6 kk USD) 100% development duration (57 months)
        – purchasing the unlicensed technology from a group of foreign specialists under a special contract
        107% cost (22 kk USD) 46% development duration (26 months)

                                                    Options      0       3   6    9 12 15 18 21 24 27 30 33 36 39 42 45 48 51 54 57 60
 Actions
 1. Financial and technical agreement
 2. Technology transfer                                              1        2          3           4
 2а. Development of a preliminary route, list of operations,
 set of equipment                                                                     1 – purchasing the technological process: description,
 4. IC design and foundry-orders for pilot lots                                       route, design rules, spice-parameters
                                                                                      2 – technological process
 3. Purchase and delivery of the equipment set                                        3 – introduction and testing
                                                                                      preparation
 4. Installation, start-up, acceptance according to OEM’s                             4 –technological support
 specification
 5. Personnel training during technological operations
 6. Development of test matrix design and technology
 7. Test matrix production production line technological
 start-up
 8. Research, analysis, extraction of spice parameters of test
 matrix element base
 9. Development of structure and technology of the 1 st IC
 10. Manufacture of engineering lot of the 1st IC
 11. Research, analysis, extraction of spice parameters of
 commercial IC element base, structure and technology
 correction (iteration 1)
 12. Manufacture of commercial IC engineering lot
 13. Commercial IC testing (3000 h)
 14. Testing at customer’s site (2х3000 h)
 15. Start-up of premass (mass) production                                   Loan repayment start                          Loan repayment start




                                                                                                                                               2004
                                                                                                             12

           Full Process Transfer Schedule
                                                                         Implementation                Ramp-up
         Activity                    Preparation phase
                                                                             phase
1. Finalization of technical
annex
2.Transfer of documentation     partner
3.Equipment procurement                              Integral

4.Personnel training                            partner

5.Design of transfer vehicle
                                                  partner   Integral
6.Validation of process steps
                                                                Integral + partner
7.Validation of modules
                                                                       Integral + partner
8.Full process integration
          Process Acceptance                                                  Integral + partner
                                                                                                      Integral
9.Transfer support +
aftercare                                            Transfer support                                 Aftercare




                                                                                               2004
                                                                           13

EXTERNAL APPRAISAL OF THE PROJECT

1. Appraisal of Module 7 and Module 8 clean rooms and utilities made by
Siemens Industrial Building Consultants GmbH:
• the possibility of setting up the production on CMOS technology with
0.35 μm design rule was confirmed;
• the complete list of works aimed at modernization of engineering
systems, including the clean rooms construction, equipment and utilities
was determined;
• the cost of works for Module 7 and Module 8 was evaluated.
2. The appraisal of financial and economical status of State-owned
enterprise «Semiconductor devices Factory» as for 01.10.2003 was made
by Joint-stock company «CONSULTAUDIT»:
• financial and economical status of the enterprise is considered to be
satisfactory;
• in general the enterprise is solvent and financially stable.



                                                                    2004
                                                                                                                                              14
                            REQUIRED SPECIAL PROCESS EQUIPMENT

                                                                                                    Number of
№
                       Operation                   Equipment type          Company, country         equipment   Unit price, k $   Cost, k $
п/п
                                                                                                      units
 1    Photolithography
1.1   Coat/develop                                   DNS80A             Dainnippon screen, Japan        1            588            588
1.2   Step/align                                   NSR 2205i14E2             Nikon, Japan               1            1450           1450
 2    Plasma etch
2.1   Nitride, Poly etch                              TCP 9400            Lam Research, USA             1            400            400
2.2   Plasma asher                                  MATRIX 1108              Matrix, USA                1            300            300
2.3   Oxide etch                                      TCP 9500            Lam Research, USA             2            450            900
2.4   Metal etch                                      TCP 9600            Lam Research, USA             2            500            1000
 3    Implantation                                 Precision 9500xR     Applied Materials, USA          1            1000           1000
 4    Oxidation, diffusion, anneal                     Alpha 8S               TEL, Japan                7            250            1750
 5    RTP                                              AG 8800          Metron Technology, USA          1            180            180
 6    Metal sputtering
6.1   Conductive and barrier layers sputtering   AMT Endura 5500         Applied Materials, USA         1            700            700
6.2   W-CVD and etchback                              P-5000             Applied Materials, USA         1            800            800
 7    Deposition
7.1   Nitride LPCVD                                  Alpha 8S                  TEL, Japan               1            250            250
7.2   Poly LPCVD                                     Alpha 8S                  TEL, Japan               1            250            250
7.3   BPSG deposition                               WJ TEOS 999       Watkins-Jonson Company, USA       1            200            200
 8    Химобработка
8.1   RCA cleaning                               FSI Mercury MP          FSI International, USA         1            400            400
8.2   Etching, nitride stripping                 DNS WS820              Dainnippon screen, Japan        1            300            300
8.3   Photoresist stripping                      FSI Mercury MP          FSI International, USA         1            400            400
8.4   PERP stripping/organic                     SST                     Semitool, Great Britain        1            400            400
                          Amount                                                                       27                          11268

         Equipment type, producer and the equipment cost shall be clarified while signing the contract


                                                                                                                                  2004
                                                                                                                                                                                                                                                      15
             REQUIRED CHECK AND MEASUREMENT EQUIPMENT

№                                      Function                     Equipment type                                                  Company, country                                                                                  Quantity   Цена,                Стоим
                              (technological operation)                                                                                                                                                                                          тыс.$                    т
1.    Wafer inspection (from 0.5 μm   )                                   I       N       S           3           0   0   0           L       e   i       c       a       ,       G           e       r   m       a       n       y      1        4       2       0




2.    Dimension control (SEM) from 0.35 μ  m                                          S           7   0       0       0                   H           i   t   a       c       h       i   ,       J       a   p       a       n          1            7       0




3.    Контроль повторяющихся дефектов                                     KLA 2135                                                  KLA -Tencor, USA                                                                                     1            70
      Advanced photometric and ellipsometric control system (film
4.                                                                   APECS 3000                                                       Leica, Germany                                                                                     1        270
      thickness control)
5.    Small dose control                                            ThermaProbe 400                                                 Thermawave, USA                                                                                      1         20
6.    Resistivity control                                                RS-55                                                      KLA -Tencor, USA                                                                                     1         30
7.    D, p control for epitaxial films                                  ECO-8N                                                        Nicolet, USA                                                                                       1        110
8.    Structure profile control                                      AlphaStep 500                                                  KLA -Tencor, USA                                                                                     1         40
 9.   Control of B and P composition in BPSG                          Rigaku 3620                                                     Rigaku, Japan                                                                                      1        160
10.   Introduced defects control                                     Surfscan 7600                                                  KLA -Tencor, USA                                                                                     1        200
11.   Repeatable defects control (from 0.3μm   )                      L       M               S           I   P       R       O       L       e   i       c       a       ,       G           e       r   m       a       n       y      1        4       8       0




12.   Particle analysis in fluids                                     Model 8014                                                     Hiak Royko, USA                                                                                     3            10
                                                                      SSM-150,                                                    Solid State Measurement,
13. Resistivity and carrier density profiles measurement                                                                                                                                                                                 1            70
                                                                      SSM-2000                                                               USA
                                   Amount                                                                                                                                                                                               15                               1
                                 Total amount                                                                                                                                                                                           42                               1




          Equipment type, producer and the equipment cost shall be clarified while signing the contract




                                                                                                                                                                                                                                      2004
                                                     16

              Our potentials
           All factories of “Integral"

                 200 mm wafers
200 mm – 5000 wafers/month
150 mm – 7500 wafers/month    Total:10500 wafers/month
100 mm – 50000 wafers/month




                                              2004
                                                                                17

                        Economics
                Market of State-owned Enterprise
                «Semiconductor Devices Factory»
• telecommunications - 1.37 kk USD/year (India)
• watch/clock and melody IC (the year 2005) - 6-8 kk USD/year
• calculator IC - 2-3 kk USD/year
• analog, logic ICs, microcontrollers, memory ICs – sales activation and
market expansion
• computer IC – restoring the relations with the companies of Russian defense
establishments, obtaining the status of independent supplier of specific ICs
according to own technical specifications
• net income shall make 11 - 15 kk USD
• net profit makes 5 - 6 kk USD


                                                                    2004
                                                                                   18

        Forecast of financial and economic activity
Project realization will allow to speed up the turnover of floating assets of the
company by 41 day. The total growth of net floating assets will make 14845 k USD
(including current activity of the company - 275 k USD in 2004 at the cost of the
project realization in the period from 2005 till 2011 - 14507 k USD).
Except the growth of net floating capital the own funding sources are as follows:
accumulated depreciation fund makes 4638 k USD and the current depreciation in
2004 makes 1158 k USD ( 204 k USD will be spent for the project realization in 2005) .
Reserve resource of own funds for the project realization means demand balance on
bank accounts of the company on 01.01.2004 to the sum of 42 k USD.
The sum of net income (net profit + depreciation) within the period involved will
increase from 2469 k USD in 2004 up to 13110 k USD in 2001.
The project can be realized, since the sum of accumulated money balance is positive
for every year of the project realization. The total sum of the accumulated balance will
make 17024 k USD with the growth in 2011.


                                                                          2004
                                                                                                                        19
                                                    КАЛЕНДАРНЫЙ ГРАФИК РЕАЛИЗАЦИИ ПРОЕКТА
                                                       Schedule of the project realization
  Этапы осуществления
  Stages of the project          Ед.
                                 Mes.    Всего по
                                          Total
          проекта
  realisation                   измер.
                                 unit    проекту      2003   2004   2005   2006   2007   2008   2009   2010    2011    2012

1. Принятие решения.
1.Making decision.
Разработка бизнес-плана
Business plan development

2. Определение перечня
2.Development the
необходимого оборудования и
required equipment and
поставщиков
suppliers
3. Preparation of the
3. Подготовка площадей area
для установки и монтажа
for the equipment
оборудования
installation
4. Purchasing and delivery
4. Закупка, доставка оборуд,,
таможенные платежи, customs и
of the equipment, уста-новка     тыс.$
                                  K       13238
монтаж
payment, installation
5. Developing of production
5. Освоение производствен-ных
мощностей, наращивание of
capabilities, increase
производственных мощностей
production capacities
       ИТОГО, млн.$:
       Total, Mil.$

6. Obtaining the loan
6. Получение кредита             тыс.$
                                 K        12000

    Loan процентов
7. Выплатаinterest repayment
   по кредиту
                                 тыс.$
                                  K        7200                     1440   1440   1412   1243   915    555      195     -

8. Loan repayment
8. Погашение кредита            тыс. $
                                 K        12000                                    500   2500   3000   3000     3000    -




                                                                                                              2004
                                                                                                                                     20
            Project schedule «Setting up a production line of CMOS IC on 200 mm wafers with 0.5 µm design rule (4000 диаметром 200 мм с
       График проекта "Создание субмикронной пилотной линии по изготовлению КМОП СБИС на пластинах wafers/month)
                                   and pilot 0.5 мкм (1000 пл./мес) и с проектными нормами 0.35 мкм
                     проектными нормамиline of CMOS IC with 0.35 µm design rule (1000 wafers/month)» (1000 пл./мес)"
                                                                                         1 год                                     2 год
                                                                1    2    3    4    5    6     7    8    9   10    11    12    1     2     3
1 Трансфер технологии
1. Technology transfer
1.1 Передача маршрута
1.1 Process flow transfer
1.2 Передача комплекта СТО и КИО
1.2 Equipment set transfer
1.3 Technical операционной тех. документации
1.3 Передачаdocumentation transfer
1.4 Передача SPICE-параметров
1.4 SPICE parameters transfer
1.5 Передача правил проектирования
1.5 Design rules transfer
1.6 Training provided by the технологии
1.6 Обучение у поставщикаsupplier
1.7 Перевод комплекта "трансфера технологии"
1.7 “Technology transfer” kit translation
1.8 Изучение комплекта ТД "трансфера технологии"
1.8 “Technology transfer” kit study
2 Закупка комплекта СТО и КИО
2. Equipment purchase
2.1 Заключение контрактов
2.1 Contract signing
2.2 Транспортировка
2.2 Transportation
2.3 Монтаж
2.3 Installation
2.4 Запуск
2.4 Start up
2.5 Personnel персонала на операциях СТО и
2.5 Обучениеtraining on operations of equipmentКИО
3 Обучение на курсах английского языка
3. English language courses
4. Module модернизация модуля
4 Стройка7иconstruction and upgrading
4.1 Фундаменты
4.1 Foundation
4.2 Деионизованная вода
4.2 DI water
4.3 Газы
4.3 Gases
4.4 Микроклимат
4.4 Microclimate
5. Purchase of wafers for equipment
5 Закупка пластин под запуск СТО start up
6. Purchase of spare parts
6 Закупка расходных материалов
7. Selection of IC, technical specs for design
7 Выбор ИМС, выдача ТЗ на дизайн
8. Development of technology and construction
8 Разработка технологии, конструкции
9. Technical start up of the операций
9 Технологический пускprocess stages
10. Formation of
10 Сбор блоков the blocks
11. Formation of the
11 Сбор маршрута whole route
12. Pilot lot start up
12 Запуск пилотной партии
13. Making the reticles
13 Изготовление комплекта МПО




                                                                                                                        2004
                                                                                             21


                            Expenditures schedule, K$
                     Общие инвестиционные затраты по проекту, тыс. долл.

             14000



             12000


             10000



             8000
тыс. долл.




K$

             6000



             4000


             2000



                0
                     2004   2005   2006   2007   2008     2009   2010   2011          2012
                                                 Годы
                                                  Years


                              1. СОБСТВЕННЫЕ СРЕДСТВА - всего
                               1. Own means - total
                              2.ИНОСТРАННЫЕ КРЕДИТЫ КОММЕРЧЕСКИХ БАНКОВ
                               2. Foreign loans from commercial bancs

                                                                               2004
                                                                                                                                      22

                    Расчет погашения долговых обязательств по “semiconductor Devices Factory,
             Debts repayment at state -owned enterpriseУП «Завод полупроводниковых приборов», K$
                                                               тыс. USD

            16000


            14000


            12000


            10000
K$
 тыс. USD




            8000


            6000


            4000


            2000


               0
                      2005             2006    2007           2008             2009             2010           2011            2012
                                                                      Годы
                                                                     Years

                    сумма основного долга
                      Primary debt sum                сумма основного долга и процентов
                                                       Interest and primary debt sum               погашение основного долга
                                                                                                    Primary debt repayments

                     Loan debt
                    задолженность по кредиту           Interest and primary долга и процентов
                                                      погашения основного debt repayments




                                                                                                                      2004
                   23



Questions



            2004

				
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