Diamond Breakage on CMP Pad Conditioner
Ping-Hsiao Liu1, James C. Sung*,1,2,3, Kai-Hung Hsu1, Michael Sung4
Address: KINIK Company, 64, Chung-San Rd., Ying-Kuo, Taipei Hsien 239, Taiwan, R.O.C.
National Taipei University of Technology, Taipei 106, Taiwan, R.O.C. KINIK Company, 64, Chung-San Rd., Ying-Kuo, Taipei Hsien 239, Taiwan, R.O.C. 3 National Taiwan University, Taipei 106, Taiwan, R.O.C. 4 Advanced Diamond Solutions, Inc., 351 King Street Suite 813, San Francisco, CA 94158, U.S.A.
Abstract Diamond grits may be thermally weakened during the high temperature cycle of brazing. This weakening may exhibit as diamond breakage. During the dressing action, taller diamond grits are more likely to break due to the higher stress present. Key Words: diamond brazing, diamond breakage, CMP pad conditioner