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					TM eGrafTM Thermal Interface Materials

Features Advantages & Benefits

New Thermal Interface Materials from a Company with a Long Technical History

• • • • • •

120 + Years of Carbon & Graphite History 120 + Years of High Temperature Processing ISO Certified since 1996 QS-9000 Certified since 2000 World Class R & D Facility in Parma, Ohio, USA Full Thermal Design and Testing Capabilities

BUSINESS CONFIDENTIAL

TM eGrafTM Thermal Interface Material

Comparison vs Competitive Materials • Performance equal to or better than the Best thermal tapes • With HiTherm, performance close to that of the very best Phase Change Material • No Reflow & Rework issues • High Volume / Cost effective manufacturing process allows: Extremely attractive cost / value equation Phase Change - like Performance No reflow & No Rework issues @ Tape Cost !
BUSINESS CONFIDENTIAL

Product Classifications 1/2 1/2
Thermal Greases dispersed thermally conductive ceramic fillers in silicone or hydrocarbon oils to form a paste Gels compounds are converted to a cured rubber film after application at the thermal interface. Initially flow as freely as grease. Elastomers silicone elastomer paste filled with thermally conductive ceramic particles often re-enforced with woven glass fiber or dielectric film for strength
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Product Classifications 2/2
Adhesive Tapes double sided pressure sensitive adhesive films filled with ceramic powder and supported with either aluminum foil or polymide film Phase Change Thixotropic, paste like product which when heated (crossover temperature) turns to liquid, fills voids and returns to a solid. Soft Solders Solders with low melting points and high thermal conductivity
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Product Classification Advantages / Disadvantages
MATERIAL MATERIAL
Thermal Grease Thermal Grease

TYPICAL COMPOUND TYPICAL COMPOUND
AlN, ZnO, Silicon Oil AlN, ZnO, Silicon Oil

ADVANTAGES ADVANTAGES

DISADVANTAGES DISADVANTAGES

High bulk thermal conductivity, Pump out, Separation, High bulk thermal conductivity, Pump out, Separation, Conformability, No cure Migration, Conformability, No cure Migration, Processing/Handability Issues Processing/Handability Issues Good bulk thermal Good bulk thermal conductivity, Conforms before conductivity, Conforms before cure, No pump out or Migration cure, No pump out or Migration Conforms to surface Conforms to surface irregularities, No pump out irregularities, No pump out Processing/Cure needed, Processing/Cure needed, Mositure issues Mositure issues

Gel Gel

Al, Ag, Silicon, olefin Al, Ag, Silicon, olefin

Adhesives Adhesives

Ag filled epoxies Ag filled epoxies

Processing /Cure needed, Processing /Cure needed, Stress at interfaces, ResinStress at interfaces, ResinFiller seperation Filler seperation

Elastomers Elastomers

BN, Alumina, Silicone, BN, Alumina, Silicone, Urethane Rubbers Urethane Rubbers

Very high contact resistance, Very high contact resistance, Good handability, High bulk Good handability, High bulk Need high clamping pressure thermal conductivity, No pump Need high clamping pressure thermal conductivity, No pump out, Gap filling, Film form out, Gap filling, Film form Conforms to surface Conforms to surface irregularities, no cure needed, irregularities, no cure needed, Film Form Film Form High bulk thermal conductivity High bulk thermal conductivity Utilized with carriers, Lower Utilized with carriers, Lower thermal conductivity than thermal conductivity than grease, Technology grease, Technology limitations limitations High stress at Interfaces High stress at Interfaces

Phase Change Phase Change

Polyolefins, Epoxies, Polyolefins, Epoxies, Polyesters, Acrylics, BN, Polyesters, Acrylics, BN, Alumina Alumina Indium, Tin-Silver Indium, Tin-Silver

Soft Solders Soft Solders

BUSINESS CONFIDENTIAL

TM eGrafTM Thermal Interface Material Features

Heat Transfer Performance Superior to most commercial materials in conducting heat inplane and through the thickness Conformability and Resilience Exhibits extremely low thermal contact resistance Thermal Anisotropy Minimizes temperature variation and dampens hot spots Consistent Application Performance Insensitive to service-thermal conditions and assembly process Highly Customizable and Engineered Materials Application/customer-driven product development Proprietary and customized assembly solutions
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Graftech Thermal Interface Materials
Features
Easy Rework No Reflow No Mess vs. Grease & Gel High Volume Capacity High Volume Capacity 700/1200 No Outgassing UL-V90 Anisotropic Tailorable Properties Low pressure = High Perf Edge Seal Compressibility 100% Graphite

Advantages
Ability to Rework No Need Cleaner Work Area Quick Turnaround Lower cost = lower price Higher Purity levels 700/1200 = 400C, HT=250C Insulation & Spreading Higher & Lower densities Simple clip mechanisms No PSA, Easy attachment Sink Flatness less critical Therm & Mech Stable
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Benefits
Easy Repairs Saves Asm’bly cost & time Saves Asm’bly cost & time Lowers Inventory Costs Higher Value Equation Aerospace Compatible Safety Custom Heat management Custom Heat management Lower attachment cost Better Perf & Lower Cost Lowers cost of heatsinks NO Dry Out, won’t degrade

TM 3 grades of eGrafTM Thermal Interface Material 1/2 1/2

Grades 700, 1200 & HiTherm HiTherm newly introduced April 2002 with Significant Improvements in Thermal Conductivity and Contact Resistance. Performance reaches the levels of Greases, Gels and PCM without the mess or rework/reflow issues of greases, gels and PCM All have a thermal conductivity of about 200W/m.k in plane but different thermal conductivity through the thickness Each can be delivered in various thicknesses depending on Customer needs

BUSINESS CONFIDENTIAL

TM 3 grades of eGraf TM Thermal Interface Material 2/2 2/2

eGraf 700 eGraf 700

Thermal conductivity through the thickness ~7W/m.k Thermal conductivity through the thickness ~7W/m.k Available from 0.05" to 0.060" Available from 0.05" to 0.060" Standard thickness : 5,10,15 & 20 mil" Standard thickness : 5,10,15 & 20 mil" Standard rolls 24" wide x 100 feet Standard rolls 24" wide x 100 feet Available in rolls or Die Cut to your drawing (any size or shape up to 600mm x Available in rolls or Die Cut to your drawing (any size or shape up to 600mm x 600mm) 600mm)

eGraf 1200 eGraf 1200

Thermal conductivity through the thickness ~12W/m.k Thermal conductivity through the thickness ~12W/m.k Available from 0.05" to 0.060" Available from 0.05" to 0.060" Standard thickness : 5, 10 & 20 mil" Standard thickness : 5, 10 & 20 mil" Standard rolls 24" wide x 100 feet Standard rolls 24" wide x 100 feet Avail in rolls or Die Cut to your drawing (any size or shape up to 600mm x Avail in rolls or Die Cut to your drawing (any size or shape up to 600mm x 600mm) 600mm)

eGraf HiTherm eGraf HiTherm

Thermal conductivity through the thickness ~16W/m.k Thermal conductivity through the thickness ~16W/m.k Available from 0.03" to 0.010" Available from 0.03" to 0.010" Standard thickness : 3, 5 & 10 mil" Standard thickness : 3, 5 & 10 mil" Standard rolls 24" wide x 100 feet Standard rolls 24" wide x 100 feet BUSINESS CONFIDENTIAL Die Cut to your drawing (any size or shape up to 600mm x 600mm) Die Cut to your drawing (any size or shape up to 600mm x 600mm)

TM eGraf TM 1205 & HT005

Variation of Thermal Resistance with Interface Pressure Variation of Thermal Resistance with Interface Pressure
0.8000 0.8000

0.7000 0.7000

Thermal Resistance (cm2-C/W) Thermal Resistance (cm2-C/W)

0.6000 0.6000

0.5000 0.5000 1205 1205 Hitherm Hitherm Power (1205) Power (1205) Power (Hitherm) Power (Hitherm)

0.4000 0.4000

0.3000 0.3000

0.2000 0.2000

0.1000 0.1000

0.0000 0.0000 0.0 0.0

200.0 200.0

400.0 400.0

600.0 600.0

800.0 800.0

1000.0 1000.0

1200.0 1200.0

Interface Pressure (kPa) Interface Pressure (kPa)
BUSINESS CONFIDENTIAL

Thermal R esistance cm2 °C /W Thermal R esistance cm °C /W

2

0.2 0.2 1 1

0.4 0.4

0.6 0.6

0.8 0.8

1.2 1.2

1.4 1.4

0 0
Hi Therm Hi Therm eGraf 1205 eGraf 1205

TM eGraf TM 1205 & HiTherm vs. Other Material

BUSINESS CONFIDENTIAL
Greas e Greas e Gel Gel Phas e Phas e Change Change Competitiv e Competitiv e Tapes Tapes

Ordering Info & Options
Last 2 digits of p/n refers to the thickness of the material. i.e. 1205 is our grade 1200, 0.005" thick. Available in Rolls - slit sizes from 13mm up to 600mm widths - lengths on non-PSA rolls up to 1,000 feet - lengths on PSA coated rolls up to 100 feet Several options are available : 1. PSA 1 side, add A to the p/n. i.e. 1205A 2. PSA 2 sides, add AA to the p/n. i.e. 1205AA 3. Electrical Insulation, add P to the p/n. i.e. 1205P 4. Edge Seal, add Edge Seal to the p/n : i.e 1205 Edge Seal Contact factory for any Die Cut.
BUSINESS CONFIDENTIAL

TM eGrafTM Thermal Interface Material

Comparison vs Competitive Materials • Performance equal to or better than the Best thermal tapes • With HiTherm, performance close to that of the very best Phase Change Material • No Reflow & Rework issues • High Volume / Cost effective manufacturing process allows: Extremely attractive cost / value equation Phase Change - like Performance No reflow & No Rework issues @ Tape Cost !
BUSINESS CONFIDENTIAL


				
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