High Performance, Reworkable Phase Change Material
W
Shared by: mercy2beans111
Categories
Tags
heat sink, thermal interface material, phase change, thermal resistance, thermal performance, high performance, thermal management, thermal conductivity, phase change material, phase change materials, bergquist company, thermal interface materials, thermal interface, thermal grease, thermal impedance
-
Stats
- views:
- 8
- posted:
- 1/11/2010
- language:
- English
- pages:
- 1
Document Sample


Leader in EMI Shielding and Thermal Management
TM
THERMFLOW T766
High Performance, Reworkable Phase Change Material
DESCRIPTION
Chomerics’ patent pending THERMFLOW™ T766 phase change
thermal interface material is recommended for applications where
rework is important. The material provides the high performance
properties of typical phase change materials with the added
benefit of easy removal. It consists of a tacky, electrically non-
conductive phase change film on one side of a conformable metal
foil carrier. T766 can be assembled onto a heat sink or heat
spreader, leaving the metal foil exposed. The natural tack of the
phase change polymer holds the T766 to the heat sink while the
foil layer acts as a highly conductive interface between the
component and heat sink and allows a clean break during
disassembly. The foil also eliminates the need for a protective
liner, which simplifies the final assembly process and minimizes
shipping and contamination concerns.
Chomerics is now offering T766 in two thicknesses, 0.0035 inches
and 0.006 inches. This added thickness option allows designers
more flexibility in specifying interface material.
Typical Properties T766 Test Method FEATURES
Conformable Conformable metal foil carrier allows for a
Carrier --- clean break during heat sink disassembly
Metal
CONSTRUCTION
Color (Polymer/Metal) Light Gray/Silver Visual There are no additional liners to protect the
phase change material once it is assembled
Carrier Thickness, inch (mm) 0.001 (0.025) ASTM D374
to the heat sink
0.0025 0.005 Offered in two thicknesses to accommodate
Polymer Thickness, inch (mm) ASTM D374
(0.064) (0.127) a range of applications
0.0035 0.006
Overall Thickness, inch (mm) ASTM D374
(0.089) (0.15) APPLICATION
THERMFLOW T766 material is inherently tacky
Thermal Impedance, °C-in /W 2
ASTM D5470
0.04 on the light gray polymer film side for easy
@ 70ºC, 50 psi modified
attachment to the heat sink or thermal spreader.
Polymer The metal foil side of the material is left exposed
THERMAL
Apparent Thermal 0.7 ASTM D5470 for contact with the electronic component to be
Conductivity, W/m-K Carrier modified cooled. The dry nature of the foil side enables
75 easy removal of the heat sink for rework on the
assembly. T766 pads are supplied kiss-cut on
Phase Change Temperature rolls for easy installation.
51-58 ASTM D3418
Range, °C
Operating Temperature If rework is needed, the T766 pads can be
-60 to +125 --- removed from the heat sink at the light gray
Range, °C
polymer interface using a single-edged razor, and
then cleaning the heat sink surface with
MECH
Specific Gravity 3.0 ASTM D792 isopropanol (IPA) solvent.
North America• 77 Dragon Court, Woburn, MA 01888-4014 TEL +(1) 781-935-4850 FAX +(1) 781-933-4318
www.chomerics.com Europe• Marlow, Bucks, UK TEL +(44) 1628 404000 FAX +(44) 1628 404090
Asia Pacific • Hong Kong TEL +(852) 2 428 8008 FAX +(852) 2 423 8253
South America• São Paulo, Brazil TEL +(55) 11 3917 1099 FAX +(55) 11 3917 0817
NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility
on our part and users should make their own tests to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this
product shall be of standard quality, and except to the extent otherwise stated on Chomerics’ invoice, quotation, or order acknowledgement. We disclaim any and all liability incurred in connection with the use of information contained herein, or
otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing or future patents covering any product or
material or its use.
1/24/2007
Get documents about "