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soldering methodologies

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soldering methodologies

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									Soldering Methodologies

2007-03-30

MEMSIC products are designed to withstand the temperature excursions experienced during hand soldering, reflow soldering, or wave soldering as the following procedures are followed.

1. Manual Soldering. (1) Pb/Sn Solder Sealed LCC-8 packaged devices
MEMSIC’s standard products ending in suffix L , P or Z are Pb/Sn solder sealed packaged devices. For example, MXA2500EL, MXR6999MP. The Pb/Sn solder seal method uses a high temperature Pb/Sn solder to seal the device. The melting point of this solder is approximately +303°C. Thus when manually soldering the device to the board the user should take cautions not to exceed the solder re-flow temperature of the package sealing which would compromise the hermeticity of the seal. We recommend 300°C /10seconds for manual soldering via soldering iron, which is the limit condition. But if we lower the iron temp, surely the time permitted will be longer. For example, at 280°C, the time could be more than 30 seconds and at 250°C, almost no time limit.

High Temperature Solder

Figure 1 When soldering manually or repairing via soldering iron for a Pb/Sn solder sealed LCC-8 packaged device, the time should be limited to less than 10 seconds and the temperature should not exceed 300 °C. If a heat gun is used, the time should be limited to less than 10seconds and the temperature should not exceed 290°C. (2) Au/Sn Solder Sealed LCC-8 packaged devices
MEMSIC’s standard products ending in suffix F or B are Au/Sn solder sealed packaged devices. For example, MXA2312EF. The Au/Sn solder seal method uses Au/Sn solder to seal the device. The melting point of this solder is approximately +280°C. Thus when manually soldering the device to the board the user should take cautions not to exceed the solder re-flow temperature of the package sealing which would compromise the hermeticity of the seal. We recommend 275°C /10seconds for manual soldering via soldering iron, which is the limit condition. But if we lower the iron temp, surely the time permitted will be longer. For example, at 265°C, the time could be more than 30 seconds and at 250°C, almost no time limit. Refer to Figure 1.

When soldering manually or repairing via soldering Iron for an Au/Sn solder sealed LCC-8 packaged device, the time should be limited to less than 10 seconds and the temperature should not exceed 275 °C. If a heat gun is used, the time should be limited to less than 10seconds and the temperature should not exceed 270°C.
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(3) Glass Frit LCC-8 packaged devices
MEMSIC’s standard products ending in suffix V are glass frit packaged devices. For example, MXA2500JV. The glass frit method uses low temperature glass to seal the device. The melting point of this glass is approximately +278°C. Thus when manually soldering the device to the board, the user should take cautions not to exceed +275°C, which would compromise the hermiticity of the seal. We recommend 275°C /10seconds for manual soldering via soldering iron, which is the limit condition. But if we lower the iron temp, surely the time permitted will be longer. For example, at 265°C, the time could be more than 30 seconds and at 250°C, almost no time limit.

Low Temperature Glass

Figure 2 When soldering manually or repairing via soldering Iron for a glass frit LCC-8 packaged device, the time should be limited to less than 10 seconds and the temperature should not exceed 275 °C. If a heat gun is used, the time should be limited to less than 10seconds and the temperature should not exceed 270°C. (4) Seam Seal LCC-8 packaged devices
MEMSIC’s standard products ending in suffixes VL are seam seal packaged devices. For example, MXR7150VL. The seam seal method involves passing a strong current in perimeter of the seal ring which causes it to fuse at the edges and seals the package hermeticaly. This type of sealing is easily identified by a slight golden tint on the edges of the package. This type of package is slightly less susceptible to higher temperature soldering iron in terms of compromising the hermiticity.

Note: Soldering iron temperatures typically run from +300°C to +360°C and can be much higher. Although these temperatures are very high compared to reflow system settings, an experienced operator (using good soldering practices) will not heat the IC die surface to temperatures exceeding +250°C, and is not likely to damage the device. The potential for heating the device above +250°C (with substantial thermal shock) becomes very high given an inexperienced operator, a high temperature, or a large soldering iron. When it is necessary to construct engineering circuit-board prototypes, or to rework printed wiring boards, MEMSIC recommends that only trained, experienced operators be used, and that they be provided with temperature-controlled soldering irons with temp setting following the above requirements.
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2. Re-flow soldering
The re-flow chart bellow is applicable to all MEMSIC standard products.

Fig. 2 Solder reflow timing diagram

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